New Color Laser Microscope

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Tobias Pearson
6 years ago
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1 Color Laser 3D Profile Microscope VK-8550 New Color Laser Microscope with Infinite Focusing Depth and Ultra-Deep Color Image C O L O R L A S E R 3 D P R O F I L E M I C R O S C O P E V K

Capabilities beyond conventional microscopes The VK-8550 converts an observed shape into a measurement "I wish I could see the world at the nm level in the same way that I look into my optical

2 Capabilities beyond conventional microscopes The VK-8550 converts an observed shape into a measurement "I wish I could see the world at the nm level in the same way that I look into my optical microscope." Such a wish can now be realized with Keyence's color laser microscope. Innovative new technology provides infinite depth of field ideal for both magnified observation and profile measurement. You can easily see the structure in the nm level which was impossible with conventional microscopes. "Ultra-deep" color image magnified up to 16,000x Observation is available at magnifications from 50x to 16,000x. Our original "ultra-deep" color images allow you to quickly check for corrosion of metal or a defective LCD, which could not be recognized with monochrome pictures. Images with overall focus enable previously impossible evaluation as well as easy estimation, ensuring more efficient analysis work. True-to-life color images reduce eye strain caused by numerous observation/measurement tasks. Paint powder for cars/ultra-deep monochrome image (2000x) Ultra-deep color image original to VK-8550 (2000x) Images that cannot be seen with metallurgical microscopes or SEMs Gold bumps(1000x) Electrical/electronics industry Image from conventional microscopes PDP rib(1000x) Electrical/electronics industry Image from conventional microscopes TFT(2000x) Electrical/electronics industry Image from conventional microscopes Ultra-deep color image Ultra-deep color image Ultra-deep color image 3D image 3D image 3D image

3 Profile analysis using ultra-deep color images which is impossible with SEMs The profile analysis application software (VK-H1WE) allows profile analysis with high accuracy (resolution: 0.01 µm). Profile analysis application software: VK-H1WE Profile measurement function The VK-H1WE enables the analysis of ultra-deep color images based on precise, quantified data. The speed and accuracy of profile analysis is a significant improvement over the conventional observation methods. semiconductor bumps You can measure the profile of the target surface (height, width or angle) by specifying a horizontal, vertical or free line [µm] 50.00µm Line roughness measurement function copper foil on PC boards You can measure the roughness of the target surface(ra, Ry or Rz) by specifying a horizontal, vertical or free line. Surface roughness measurement function plated surfaces The roughness of the target can be measured across the specified area µm2.00µm DCL 0 BCL 255 Slope ± [µm]66.077[µm] calibration None Smoothing average Simple Average height-difference measurement function PDP rib You can measure the difference between the average heights of specified areas. Surface area/volume measurement function 1. via holes on laminated PC boards The surface area/ volume of a specified area can be measured. Average step: Area A: Area B: 1.47[µm] [µm2] [µm2] Measurement result Surface area[µm2] 1: Cumulative value: Volume[µm3]

4 Specifications Color Laser 3D Profile Microscope VK Dimensions Model Controller: VK-8550/Microscope unit: VK-8510 Magnification on 15-inch monitor Magnification of objective lens 10x 20x 50x 100x Observation/measurement range Color Horizontal:µm Vertical :µm Monochrome Horizontal:µm Vertical :µm Working distance(mm) No. of aperture Range of height measurement(mm) 7 Minimum resolution for height measurement(µm) Repeatability in height direction σ(µm) Minimum resolution for horizontal measurement(µm) Repeatability in horizontal direction 3σ(µm) * * 2 Display resolution Color 962 x 729 Monochrome 1024 x 768 For color video 1024 x 768 x 8 bit x 3 Frame memory For monochrome video 1024 x 768 x 8 bit For height 1024 x 768 x 20 bit Color 6 Hz Frame ratio Monochrome 9 Hz Line or film thickness 1000 Hz Optical zoom 2x 4x Digital zoom 2x 3x Semiconductor laser Laser beam light source for measurement Waveform 685 nm Maximum output 0.45 mw Class FDA Class II IEC Class 2 Lamp 50W halogen lamp Light source for observation Service life 2000 hours(average) Color temperature 3000 K(max.) Image pickup element 1/3-inch color CCD image sensor Gain Adjustable Camera Shutter speed Adjustable White balance 3200K/AUTO/MANUAL/PUSHSET Y-gamma Provided Maximum sample size Height 28 mm* 3 Size 318mm in diameter, Overall observation available* 4 Z stage Stroke 28 mm X-Y stage Stroke 70 x 70 mm Withstand load 5 kg θ stage Rotation 360 o Output(video) Analog RGB 1024 x 768 pixels, 60.6Hz(vertical), 48.4Hz(horizontal) Output(SCSI) Conforming to SCSI-ll Micro-mini 50-pin Output(AC) AC output 2 channels, 2A max. Power supply Power supply 100 to 240 VA ±10% Current consumption 300 VA max. Weight Microscope unit Approx. 22 kg* 5 Controller Approx. 9.5 kg 1. Obtained when a height difference of 2 µm for a standard target is measured with the 100x objective lens. 2. Obtained when a pattern of 1 µm in width is measured with the 100x objective lens using the automatic width measurement function. 3. When the spacer or other aid is used, a sample 100 mm or more in height can be measured. 4. A 12-inch (300-mm) wafer can be placed on the stage for overall observation. When the spacer is used, wafers of 20-inches (500-mm) or more in diameter can also be measured. 5. Total weight of the measuring head and the base. When the head is removed, it weighs approximately 8.5 kg. * For export information, contact your nearest KEYENCE office. Microscope unit VK Controller VK-8550 Remote control console ø4.5, Cable length:1.5m 42 ø ø head M depth: M depth: Warning FDA Class II IEC Class 2 CAUTION CAUTION Do not touch objective lens or revolving nosepieces during measurement or when carrying the product. Do not place anything on the stage when setting the origin point of the objective lens. Set the stage to lowest level when setting the origin point of the objective lens. LASER RADIATION- DO NOT STARE INTO BEAM SEMICONDUCTOR LASER 685nm MAXIMUM OUTPUT 0.45mW CLASS II LASER PRODUCT AVOID EXPOSURE LASER RADIATION IS EMITTED FROM THIS APERTURE. CAUTION Do not touch objective lens or revolving nosepieces during measurement or when carrying the product. Do not place anything on the stage when setting the origin point of the objective lens. Set the stage to lowest level when setting the origin point of the objective lens. AVOID EXPOSURE Laser radiation is emitted from this aperture. LASER RADIATION DO NOT STARE INTO BEAM Wavelength 685nm Maximum output 0.45mW Pulse duration Continuous CLASS 2 LASER PRODUCT IEC A2/2001

Measurement Principles An Ultra-deep image with overall focus is achieved by using an ultra-small pin hole and precise linear scale.

01 µm by reliably moving the lens in the Z-axis direction. The combination of these two sophisticated engineering designs provides the z-axis (height measurement) data.

Keyence s innovative technology successfully joins the image consisting of the light intensity of the reflected laser beam with the color data obtained at each focal position.

5 Measurement Principles An Ultra-deep image with overall focus is achieved by using an ultra-small pin hole and precise linear scale. The ultra-small pin hole mechanism ensures accurate detection of the focal position. The precise linear scale built into the lens moving mechanism achieves a traceability of 0.01 µm by reliably moving the lens in the Z-axis direction. The combination of these two sophisticated engineering designs provides the z-axis (height measurement) data. The data is then overlaid with a realistic color image taken with the color CCD camera at each focal position. Thus an ultra-deep image is created. Keyence s innovative technology successfully joins the image consisting of the light intensity of the reflected laser beam with the color data obtained at each focal position. Color CCD camera Half mirror Half mirror X-Y optical scanning system Half mirror Source of white light for illumination Laser beam source Condenser lens Pin hole Light-receiving element Object lens Target Precise linear scale built into the lens moving mechanism 0.01 µm resolution in the Z-axis direction 700,000 steps of memory for Z-axis measurement (20-bit process) Long-life laser beam source Pin-hole confocal principle Giving top priority to accuracy, the VK-8550 Series uses an ultra-small pin hole which only passes light when proper focus is achieved. Compared with conventional methods which use a CCD pixel as the detector, the VK pin hole method can eliminate noise such as outof-focus surfaces or light leakage. You can achieve the proper focus position and easily measure targets, such as film thickness and transparent targets, which were difficult with conventional methods. Ultra-deep color image of Solder Bump (2000x) The original optical technology using the confocal principle ensures an image with overall focus.

6 Option Color Laser 3D Profile Microscope VK User-friendly compact design and simple operation Large LCD/PDP panels can also be measured Various functions are packed in a compact body. The unit requires only a small area on a desktop, so that it can be installed in a laboratory crowded with many pieces of equipment. The removable measuring head enables more flexible observation and measurement. Special stage for large samples Integrating the measuring head into a special system enables non-destructive observation/ measurement of any part of a larger target such as a large LCD glass panel. On-line operation is also available by using command communication with the special DLL. Removable measuring head for various targets The stage accommodating large samples enables overall observation of even a 12-inch (300-mm) wafer. When the optional spacer is used When the optional spacer is not used If a target cannot be placed on a normal stand, it can easily be positioned by using the removable measuring head and the spacer or other aid. Even a photocopier drum or a roller can be observed nondestructively. System configuration Spacer for Microscope unit (Model: OP-38162) Remote control console Personal computer (commercially-available) Monitor Profile analysis/automatic width measurement application software for VK (Model: VK-H1WE) Mouse Microscope unit VK-8510 Controller VK-8550 Display application software for VK Specifications are subject to change without notice. CALL TOLL FREE TO CONTACT YOUR LOCAL OFFICE Fax : KEYENCE CORPORATION OF AMERICA Corporate Office 50 Tice Blvd., Woodcliff Lake, NJ Phone: Fax: keyence@keyence.com Regional offices California Florida Georgia N.California Los Angeles Tampa Atlanta Illinois Chicago Indiana Indianapolis Massachusetts Boston Michigan Detroit Michigan Minnesota Missouri New Jersey Grand Rapids Minneapolis St. Louis New Jersey North Carolina Ohio Oregon Charlotte Cincinnati Cleveland Portland Pennsylvania Philadelphia Tennessee Nashville Knoxville Texas Dallas Virginia Washington Richmond Seattle KEYENCE CANADA INC Meyerside Drive, #301, Mississauga, Ontario L5T 2N5 CANADA Phone: Fax: keyence@keyence.com KA KEYENCE CORPORATION, 2005 VK85-KA-C-E Printed in Japan

High-Accuracy Surface Scanning Method

NEW Surface Scanning Laser Confocal Displacement Meter LT-9000 Series High-Accuracy Surface Scanning Method First in the world High resolution of 0.0004 Mil (0.01 µm); 10 times higher than conventional