Surface Mount. MANUAL ASSEMBLY and rework for surface mount

Transcription

1 Surface Mount MANUAL ASSEMBLY and rework for surface mount For over 40 years, PACE has provided products, procedures, and training for assembling and repairing the most advanced electronics. Our primary focus is, and has always been, on developing controlled processes which recognize practical human abilities and provide consistent, high quality results. PACE products and technology have been adopted worldwide by industry and government alike. PACE provides the broadest range of Assembly, Repair and Fume Extraction products to meet your company's needs, whether working to ISO-9000, Military, IPC, or your own Internal Specifications. Our products are fully backed with extensive Training and Applications Support. We invite you to contact your local authorized PACE Distributor or PACE directly for the most up-to-date information on assembly/ rework techniques, products, applications and training. PACE, Incorporated 9893 Brewers Court Laurel, Maryland USA Tel: Toll Free: PACE (7223) Fax: PACE Europe Ltd. Sherbourne House, Sherbourne Drive Tilbrook, Milton Keynes MK7 8HX United Kingdom Tel: Fax: Tel: PACE (7223) Fax: P/N , Rev. B

2 FORWARD APPLICABILITY OF THIS DOCUMENT This document is a compilation of general information and process guides (i.e., procedures) for the Manual TERMS Assembly AND and Rework DEFINITIONS of Surface Mount Components. These process guides are based on years of experience of technicians and training experts worldwide representing the best industry practices. As their name suggests, each process guide takes the user step-by-step through an installation or removal process for a specific surface mount component using a particular piece of equipment and technique. In most cases, there is a variety of methods for removing or installing the same component. Simply select and use the process guide which best suits your organization s individual requirements. INDUSTRY STANDARDS AND ISO 9000 For over 40 years, PACE, Incorporated, along with other industry experts, has taken a leadership role in the creation and maintenance of standards for the electronic assembly industry. These standards focus on end product acceptability requirements such as what characteristics (lead/land alignment, solder fillets, etc.) a soldered component and assembly must have to be acceptable. In contrast, PACE Process Guides take a how to approach to manual electronic assembly and rework, and are 100% consistent with the most stringent end product acceptability requirements, specifications, workmanship and equipment standards as well as procedural guidelines found in the latest revisions of IPC-7711/7721, ANSI/J-STD-001, ANSI/IPC-A-610 and other international standards. So whatever level of end product acceptability requirements your organization follows, PACE Process Guides will show you how to get there in a safe, efficient manner. PACE Process Guides are presented in a concise, self-contained, pictorial form that s easy to understand and is ideal for helping you document in-house training programs, assembly and rework processes and quality assurance procedures to meet the requirements of ISO We hope that you find Manual Assembly and Rework for Surface Mount a useful document and once again look forward to receiving your comments and suggestions. Eric S. Siegel Co-Chairman ii 1997, 2001 PACE Incorporated. Manual Assembly and Rework For Surf ace Mount Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

3 TABLE OF CONTENTS Title Page and Contact Information i. TERMS AND DEFINITIONS Forward ii. Table of Contents iii. Process Guide Locator v. Disclaimer and User License Agreement 1 GENERAL (Tab) 2 SCOPE 2 PROCESS GOALS AND GUIDELINES 3 INTRODUCTION 3 NON-DESTRUCTIVE COMPONENT REMOVAL 4 Surface Mount Components 4 Thru-hole Components 4 SURFACE MOUNT LAND PREPARATION 5 HIGH-RELIABILITY COMPONENT INSTALLATION/REPLACEMENT 5 Surface Mount Components 5 Thru-hole Components 6 PRIMARY HEATING METHODS 6 CONDUCTIVE (BY CONTACT) HEATING METHODS 6 Continuously Heated Devices 7 Pulse Heated Devices 8 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: iii

4 TABLE OF CONTENTS CONVECTIVE HEATING METHODS 9 PRE-HEATING AND AUXILIARY HEATING METHODS 10 VISION SYSTEMS & SURFACE MOUNT COMPONENT PLACEMENT 11 HEALTH, SAFETY AND THE ENVIRONMENT 12 COMPONENT IDENTIFICATION 13 HANDPIECE AND TIP IDENTIFICATION 17 TERMS AND DEFINITIONS 18 GENERAL PROCESS GUIDES 36 Surface Mount Land Preparation (Genereal) Surface Mount Land Preperation (Fine Pitch) Thru-hole Desoldering (Flat Lead Component) Tip Selection Tip Preparation and Maintenance Sodr-X-Tractor Maintenance Solder Extraction Troubleshooting REMOVAL (Tab) Process Guides for Surface Mount Component Removals INSTALLATION (Tab) Process Guides for Surface Mount Component Installations iv Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

5 PROCESS GUIDE LOCATOR BGA Process Guide Number REMOVAL (tab) Dual ThermoPik (DTP-80) Conductive TF 2000 Convective ThermoFlo System (TF 500/700) Convective R-BGA-00-A R-BGA-50-A R-BGA-70-A INSTALLA ALLATION (tab) TF 2000 Convective I-BGA-50-A ThermoFlo System (TF 500/700) Convective I-BGA-70-A CHIP COMPONENT REMOVAL AL (tab) PS-80 Handpiece Flux Application ThermoTweez (TT-65) Flux Application Flux Application ThermoJet (TJ-70) Bottom Termination R-CHP-00-A R-CHP-10-A R-CHP-11-A R-CHP-20-A ThermoFlo Unit (TF 200) Convective R-CHP-70-A Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: v

6 PROCESS GUIDE LOCATOR INSTALLA ALLATION (tab) ThermoJet (TJ-70) Solder Paste Process Guide Number I-CHP-00-A ThermoFlo Unit (TF 200) Convective LCCC I-CHP-70-A REMOVAL (tab) ThermoTweez (TT-65) Flux Application PLCC R-LCC-02-A REMOVAL AL (tab) ThermoTweez (TT-65) Bridge Fill Solder Wrap Flux Application ThermoFlo Unit (TF 200) Convective R-PLC-00-A R-PLC-01-A R-PLC-02-A R-PLC-70-A INSTALLA ALLATION (tab) PS-80 Handpiece Wire Solder Mini-Wave Point to Point ThermoJet (TJ-70) Solder Paste I-PLC-00-A I-PLC-01-A I-PLC-02-A I-PLC-10-A vi Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

7 PROCESS GUIDE LOCATOR QFP (FLATP TPACK) Process Guide Number REMOVAL (tab) ThermoPik (TP-65) Bridge Fill Solder Wrap Flux Application ThermoTweez (TT-65) Bridge Fill Solder Wrap Flux Application Dual ThermoPik (DTP-80) Bridge Fill Solder Wrap Flux Application PS-80 Handpiece Bridge Fill Solder Wrap Flux Application SX-80 Handpiece Flux Applicaiton Solder Wrap Bridge Fill ThermoFlo Unit (TF 200) Convective R-QFP-00-A R-QFP-01-A R-QFP-02-A R-QFP-10-A R-QFP-11-A R-QFP-12-A R-QFP-20-A R-QFP-21-A R-QFP-22-A R-QFP-30-A R-QFP-31-A R-QFP-32-A R-QFP-60-A R-QFP-61-A R-QFP-62-A R-QFP-70-A INSTALLA ALLATION (tab) PS-80 Handpiece Mini-Wave Point to Point I-QFP-00-A I-QFP-01-A Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: vii

8 PROCESS GUIDE LOCATOR ThermoJet (TJ-70) Solder Paste SOCKET REMOVAL (tab) Process Guide Number I-QFP-10-A PS-80 Handpiece Bridge Fill Solder Wrap Flux Application SOIC R-SKT-00-A R-SKT-01-A R-SKT-02-A REMOVAL AL (tab) PS-80 Handpiece Flux Application Solder Wrap Bridge Fill ThermoTweez (TT-65) Flux Application Solder Wrap Bridge Fill ThermoFlo Unit (TF 200) Convective SOT R-SOI-00-A R-SOI-01-A R-SOI-02-A R-SOI-10-A R-SOI-11-A R-SOI-12-A R-SOI-70 REMOVAL (tab) PS-80 Handpiece Flux Application R-SOT-00-A ThermoTweez (TT-65) Flux Application R-SOT-10-A viii Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

9 PROCESS GUIDE LOCATOR ThermoJet (TJ-70) Flux Application Process Guide Number R-SOT-20-A TSOP REMOVAL (tab) SX-80 Handpiece Flux Application Solder Wrap Bridge Fill R-TSP-00-A R-TSP-01-A R-TSP-02-A Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ix

10 DISCLAIMER AND LIMITED USER LICENSE Disclaimer Although the information contained in this document represents some of the best commercial practices in use today, it is advisory only and its use or adaptation is entirely at the sole risk of the user. PACE, Incorporated disclaims all liability of any kind regarding the use, application and adaptation of the information contained in this document. Users are also solely responsible for protecting themselves against any and all claims or liabilities for patent infringement. Limited User License PACE, Incorporated hereby grants the purchaser a royalty-free, non-exclusive license to copy limited portions of this document and to incorporate such portions within works produced by purchaser provided that: (1) no substantive change is made to the content of the copied portions, including any changes to the copyright notice, drawings and the manner in which PACE, INCORPORATED or any of its trademarks is identified on and in the copied portions, and (2) the copied portions of this document and works incorporating the same are distributed solely for the private internal use of the purchaser and purchaser s employees only at the site of first use of the original document. This document may not be copied in its entirety, and no copied portions of this work and works incorporating the same may be distributed to any third party without first obtaining the express, written approval of an officer of PACE, INCORPORATED to do so. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 1

11 GENERAL SCOPE The general information and process guides in this document are for the manual assembly and rework of surface mount components. More specifically, this document contains manual, high-reliability installation procedures for a wide variety of surface mount components which are applicable to assembly (new-build) or rework situations. Also included are non-destructive removal procedures for a wide variety of surface mount components which are equally applicable to production rework or field repair situations. Misaligned, poorly soldered, damaged or faulty components can be removed and replaced using these procedures. The component installation and removal procedures contained herein focus on manual conductive (e.g., a soldering iron), and manual or semi-automated convective (e.g., hot air pencil, convective workstation) heating methods. This general section provides information which is applicable to every surface mount assembly and rework process guide. This includes information on: Process Goals and Guidelines Non-destructive Component Removal Solder Extractor Trouble Shooting Chart Surface Mount Land Preparation High-reliability Component Installation/Replacement Primary Heating Methods Pre-Heating and Auxiliary Heating Methods Vision Systems and Surface Mount Component Placement Selecting Optimum Process of Manual Assembly/Rework Health, Safety and the Environment Also included are sections on: Component Identification Handpiece Identification Terms and Definitions Finally, there are general process guides covering important subjects such as: Land Preparation Thru-hole Desoldering Thru-hole Soldering Tip Selection Tip Preparation and Maintenance Sodr-X-Tractor Maintenance 2 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

12 GENERAL WE HIGHLY RECOMMEND THAT YOU BECOME FAMILIAR WITH THIS GENERAL SECTION FIRST BEFORE PROCEEDING AS IT CONTAINS IMPORTANT BACKGROUND INFORMATION FOR EVERY PROCESS GUIDE CONTAINED IN THIS DOCUMENT! PROCESS GOALS AND GUIDELINES INTRODUCTION Each assembly/rework method has certain advantages and disadvantages depending on the particular Surface Mount Device (SMD) {lead/terminations design, size, body material, etc.}, component mounting site {adjacent components, access, substrate type, thermal mass, etc.} and the skill of the operator. For this reason, it is advisable to select a method which is likely to be the most appropriate based on the following Process Goals and Guidelines, and your organization s own particular requirements. In the three basic processes of Non-destructive Component Removal, Surface Mount Land Preparation and High-reliability Component Installation/Replacement, the fundamental Process Goals and Guidelines are as follows: Non-destructive Process - During any assembly or rework process, no damage or degradation should occur to the board (both substrate and circuit elements), adjacent components, and the component to be installed or removed. This damage may be either mechanical, thermo/mechanical or purely thermal in nature and may result in either immediate failure, degradation in performance over time (latent failure) or a reduction in reliability. EOS/ESD damage must also be avoided by using proper workstations, procedures and equipment controls. Controllable, Reliable and Repeatable Process - The process can be employed, and when necessary, modified by a trained operator in a repetitive fashion with consistently acceptable results. Process Appropriate to Particular Application - The process (or modification thereof) employed is appropriate to the particular application based on the relevant guidelines described below. Operator Friendly Process - An operator of average ability can, with proper training and practice, become acceptably proficient in employing, and when required, modifying the process to suit any particular requirements of a given task. Efficient/Economical Process - The process can be economically and easily set up and carried out at multiple locations in a production or repair environment with minimal training and set-up time. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 3

13 GENERAL NON-DESTRUCTIVE COMPONENT REMOVAL The particular process goals and guidelines for non-destructive component removal are as follows: Surface Mount Components - Pre-/auxiliary heat assembly and/or component if required - Evenly apply heat in a rapid, controllable fashion to achieve complete, simultaneous reflow (melt) of all solder joints - Avoid thermal and/or mechanical damage to component, board, adjacent components and their joints - Immediately remove component from board before any solder joint re-solidifies - Prepare lands for replacement component Thru-hole Components Desoldering component one joint at a time using continuous vacuum method - Pre-/auxiliary heat assembly and/or component if required - Heat joint in a rapid, controllable fashion to achieve complete solder reflow - Avoid thermal and/or mechanical damage to component, board, adjacent components and their joints - Apply vacuum during lead movement to cool joint and free lead Desoldering component using solder fountain method - Reflow all joints in solder fountain - Remove old component and either immediately replace with new component, or clear thru-holes for component replacement later 4 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

14 GENERAL SURFACE MOUNT LAND PREPARATION Surface mount land preparation should be performed prior to the installation/replacement of a new surface mount component. Avoidance of thermal and/or mechanical damage to the land and substrate is critical. The two primary steps include: - Remove Old Solder This may be performed with a soldering iron and braided solder wicking material, or with a continuous vacuum Flo Desoldering technique employing a solder extractor and a special Flo-D-Sodr tip which allows reflow and vacuum removal of the old solder to occur continuously. -Clean lands Old flux residues left over after the removal of old solder are cleaned in this step prior to adding new solder. -Add New Solder This step is part of the Component Installation process and is accomplished by either prefilling (pretinning) the lands (by reflowing wire solder with a soldering iron or some other heating method), or by applying solder paste (cream) with a dispenser prior to (or after) the component is placed on the land pattern. The quantity of solder applied is critical to achieving acceptable joints. For instance, acceptable J-lead solder joints require much more solder than acceptable gull wing lead solder joints. HIGH-RELIABILITY COMPONENT INSTALLATION The particular Process Goals and Guidelines for safe, high-reliability component installation are as follows: Surface Mount Components - Prefill lands or apply solder paste - Align and place component to lands (tack if necessary) - Apply solder paste to lead/land area if not applied prior to component placement - Pre-/auxiliary heat assembly and/or component if required Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 5

15 GENERAL -Pre-dry applied solder paste -Reflow solder joints (individually, in groups or all together) with concentrated targeted heat in a rapid, controllable manner while maintaining lead/land alignment. Joints should remain at target temperature (above melting point of solder alloy) for proper time to achieve optimal intermetallic formation. -Avoid thermal and/or mechanical damage to component, board, adjacent components and their joints. -Clean and inspect Thru-hole Components -Insert new component into board -Pre-/auxiliary heat assembly and/or component if required -Solder joints (individually, in groups or all together) with concentrated targeted heat in a rapid, controllable manner. Joints should remain at target temperature (above melting point of solder alloy) for proper time to achieve optimal intermetallic formation. -Avoid thermal and/or mechanical damage to component, board, adjacent components and their joints -Clean and inspect PRIMARY HEATING METHODS Primary heating methods are those principally responsible for achieving solder reflow during a component installation or removal process. These are to be distinguished from methods used for pre-heating and auxiliary heating which are employed in addition to primary heating methods in particular situations as described in the PRE-HEATING AND AUXILIARY HEATING section. CONDUCTIVE HEATING METHODS Handheld conductive heating devices generally fall into one of two categories: Continuously Heated Devices and Pulse Heated Devices, each with their own potential advantages and precautions. 6 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

16 GENERAL Continuously Heated Devices Continuously heated devices such as soldering irons, thermal tweezers and thermal pick devices may be held at selected idle tip temperatures prior to use. Continuously heat devices generally (but not always) employ tinnable tips to optimize heat transfer to the work. Virtually all soldering irons and continuous vacuum solder extractors used for thru-hole component installation and removal, respectively are continuously heated devices. For surface mount component installation and removal, continuously heated devices offer the following potential advantages: -Effective at transferring a large amount of heat to a targeted area rapidly -Can control amount of heat delivery with tip temperature and dwell time -Can safely access hard-to-reach places and confine heat to limited areas with proper tip design, selection and use -Substrate and adjacent components stay cooler during surface mount component installation or removal With continuously heated conductive heating devices, the following guidelines and precautions should be observed: -Must utilize a high-efficiency, closed-loop temperature controlled heating handpiece that has sufficient thermal output to keep up with thermal load of the work and duty cycle of the application -Tip temperature can drop below desired level during heavy, continuous use if handpiece has insufficient thermal output - Must establish good thermal linkage between tip and joint(s), and use appropriate tip geometry (shape) and for effective heat transfer - Usually not effective on components whos solder joints are not accesible, e.g., BGA's (Ball Grid Arrays) and chip components with bottom only terminations. -Tip and work must be free of oxides and contaminates, and tip must be tinned for effective heat transfer -Use of external flux or addition of additional solder sometimes necessary to achieve effective heat transfer -For surface mount component removal, must often have precise match between tip and component geometry for effective heat transfer to all joints Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 7

17 GENERAL -Contact may disturb component lead-to-land alignment, especially during SMD installation or realignment operations -May transfer heat too rapidly for use with solder paste or sensitive components - May obstruct view during alignment and reflow and interfere with joint formation during solder solidification Pulse Heated Devices Pulse heated devices such as LapFlo type tools, resistance tweezers and other handheld devices produce heat directly in the tip or the work with high current, low voltage power. They are useful for surface mount installation and removal, cup terminal soldering and auxiliary heating of connector pins during removal. These devices generally employ low mass, non-tinnable tips which can remain in contact with solder joints as they cool thereby facilitating proper surface mount component alignment. Pulse heated devices offer the following potential advantages: -Effective at transferring a large amount of heat to a targeted area rapidly -Slim design tips can safely access tight places and confine heat to a limited area -Can control amount of heat delivery with power setting and dwell time -Low mass tips heat up and cool down rapidly -Non-tinnable tips can contact surface mount joint cold, heat to reflow and remain in contact during solder re-solidification to stabilize component alignment -More gradual heat -up works better with solder paste than continuously heated devices -Can correct minor lead non-coplanarity during gull wing SMD installation With pulse heated devices, the following guidelines and precautions should be observed: -Less effective means to control heat delivery since handheld devices are generally not temperature controlled -Must establish good thermal linkage with joints for effective heat transfer (this is more difficult since tips are generally non-tinnable) -Improper contact may disturb component lead-to-land alignment 8 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

18 GENERAL -If used for SMD installation of gull wing components, may produce unacceptable residual stress in some stiff leads if not coplanar with lands CONVECTIVE HEATING METHODS Convective heating methods are generally found in devices such as semi-automated benchtop workstations, high powered, handheld hot air guns and nozzle-focused hot air jet handpieces. Convective heating devices are primarily used for surface mount component installation and removal and offer the following potential advantages: -Can be used to effectively install and remove components whose solder joints are not directly accessible by conductive heating methods, e.g., BGAs (Ball Grid Arrays) and chip components with bottom only terminations. -Non-contact process which, if used correctly, will not disturb joints or obstruct view -Can often be used to re-align slightly skewed (misaligned) surface mount components without having to remove first -External flux or tinning generally not necessary to aid thermal transfer -Leaves less residue and solder than conductive heating methods for surface mount component removal -For surface mount component removal, match between nozzle and component geometry less critical -Works well with solder paste under most conditions -Can control amount of heat delivery with: -Gas/Air temperature -Gas/air flow rate -Distance of nozzle from work -Nozzle design -Dwell time -Well designed, powerful convective heating devices provide continuous output of heated gas/air at a desired set temperature irrespective of the thermal load of the work and duty cycle of the application Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 9

19 GENERAL With convective heating devices, the following guidelines and precautions should be observed: -Must properly focus and control heated gas/air flow to minimize errant heating of substrate, adjacent components and their joints -Must adequately control exit gas/air velocity (via pressure or flow rate) to avoid: -Displacement of applied solder paste -Disturbing the lead/land alignment of surface mount components during installation or re-alignment, and to -Minimize errant heating -Heated air flow inefficient means of primary heat delivery when compared to conductive heating methods PRE-HEATING AND AUXILIAR UXILIARY HEATING METHODS There are two principal reasons for pre-heating and auxiliary heating during component installation and removal. First, pre-heating is required when there is present a risk of thermal shock in the substrate, components or both. The goal here is to first ramp up the assembly and/or component at an acceptably safe rate until it reaches a target temperature at which the assembly (or component) is thermally soaked or evenly heated thereby eliminating dangerous temperature gradients which could produce immediate damage, degradation over time or reduction of reliability. For avoidance of thermal shock, the rate of ramp up can be critical. For example many ceramic chip capacitor manufacturers have traditionally recommended that pre-heating occur at a rate of no greater than about 2-5 degrees C/sec. until a given minimum temperature is reached. Second, pre-heating/auxiliary heating is required when the primary heating method (during a omponent installation or removal procedure) cannot bring all of the solder joint(s) completely up to proper reflow temperature at all or in an acceptably rapid period of time due to heat sinking by nearby portions of the substrate, circuit elements and adjacent components. The goal here is to bring the assembly (or a ortion thereof) up to a sufficient (yet safe) temperature at which the rate of heat sinking is low enough so that the primary heating device can effect proper solder reflow in an acceptable period of time. 10 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

20 GENERAL For example, bottom side pre-heating is often used to speed up a BGA installation or removal process since the primary heat source typically delivers heat (usually convective) only through the top of the component body and it would otherwise take too long before enough heat passes through to the joints to produce reflow. For thru-hole desoldering on heavy multilayer boards with internal ground planes, auxiliary heating (typically a soldering iron tip or pulse heated tool on the component side of the lead) is often used since the tip of the solder extractor may not be able to deliver enough heat to completely reflow the joint prior to activating the vacuum. In some cases, as with PGAs (Pin Grid Arrays), the component side of a lead is often not accessible to traditional auxiliary heating, so bottom side pre-heating is often the only option. Pre-heating is typically accomplished from the bottom side of the circuit assembly by either a temperature controlled conductive heating plate, a controlled convective heating device, or a system which combines both conductive and convective heating. Again, controlling both the rate of temperature ramp up as well as the soak temperature at which the assembly is held during the primary reflow process is critical to avoiding damage and optimizing the component installation or removal process. VISION SYSTEMS AND SURFACE MOUNT COMPONENT PLACEMENT As high lead count, fine pitch SMDs become commonplace, the task of properly aligning and placing these devices during manual SMT rework becomes more challenging. Appropriate vision systems with sufficient magnification, resolution, field of view and working distance are critical for viewing alignment of component leads to lands and monitoring joint reflow during SMD installation. Proper component handling systems which can adequately establish and maintain X, Y, Z and THETA positioning are also essential for successful alignment and placement during fine pitch SMD installation. Vision systems come in various forms including large lenses, stereo microscopes, trinocular microscopes and CCTV (video) systems. While microscopes and lenses are generally perfectly adequate and economical, CCTV systems offer greater ease of use and less operator fatigue, particularly with very fine pitch SMDs. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 11

21 GENERAL Component Identification HEALTH, SAFETY AND THE ENVIRONMENT Technicians in the electronics industry can be exposed to a wide variety of potentially hazardous chemicals, particularly solder fumes, and exposure to such fumes can often exceed recommended allowable occupational health and safety regulations. In addition, the release of fumes or disposal of these substances must comply with environmental regulations. The MSDS (Material Safety Data Sheet) which accompanies virtually all solders (wire and paste), fluxes and cleaners is a good source of information for recommended measures to protect worker health and safety. Local exhaust fume extraction systems, personal protection equipment, environmental emissions control equipment, and hazardous materials training are necessary and essential components of an effective health, safety and environmental protection program. Increasing importance is being placed on a commitment to comply with health and safety regulations and prevent pollution. The ISO series of Environmental Management Standards will enable companies to demonstrate improvements in environmental performance and establish mechanisms to determine the effectiveness of their programs. Typical examples of Fume Extraction Products 12 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

22 COMPONENT IDENTIFICATION BGA's: Ball Grid Arrays BGA Top View BGA Bottom View Chip Components SM49 Crystal Molded Crystal Chip Resistor Tantalum Capacitor MELF Ceramic Capacitor Ferrite Bead Molded Inductor Potentiometers Trimmer Capacitors Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 13

23 COMPONENT IDENTIFICATION Connectors LCCC's: Leadless Ceramic Chip Carriers LCCC-28 LCCC PGA's: Pin Grid Arrays PGA (Pin Grid Array) PLCC's: Plastic Leaded Chip Carriers PLCC-68 PLCC Oscillator PLCC Socket Adapter 14 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

24 COMPONENT IDENTIFICATION QFP's: Quad Flat Packs QFP-64 QFP-100 QFP-80 QFP-80 QFP-84 BQFP-100 QFP-134 SOIC's: Small Outline Integrated Circuit SOIC-8 SOIC-14 SOIC-16 SOICL-16 VSOP-40 SOICL-20 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 15

25 COMPONENT IDENTIFICATION SOJ's: Small Outline J-lead SOLJ-16 SOJ-20 DRAM SOLJ's: Small Outline Large J-lead SOLJ-24 SOLJ SOT's: Small Outline Transistor SOT-23 D2PAK SOT-143 SOT TSOP's: Thin Small Outline Package TSOP-20 Type I TSOP-40 Type II 16 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

26 HANDPIECE & TIP IDENTIFICATION PACE Part Number: PACE Part Number: P1 PS-80 Handpiece TT-65 ThermoTweez Handpiece PACE Part Number: P1 PACE Part Number: P1 DTP-80 Dual ThermoPik Handpiece TJ-70 ThermoJet Handpiece PACE Part Number: P1 PACE Part Number: P1 TP-65 ThermoPik Handpiece SX-80 Handpiece Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 17

27 TERMS AND DEFINITIONS A TERMS AND DEFINITIONS Activated rosin flux - A mixture of rosin and small amounts of organic-halide or organic-acid activators. Activator (flux) - A substance that improves the ability of a flux to remove surface oxides from surfaces being joined. Air flow - The continuous rate of air discharge during convection soldering (e.g., slpm - standard liters/ minute, cfm - cubic feet/minute). (See also Air pressure. ) Air pressure - The volume of air applied to a surface during convection soldering, measured as force per unit of air (e.g., bar - one million dynes/cm 2, psi - pounds/square inch). (See also Air flow. ) Annular ring - The portion of conductive material completely surrounding a hole. Aqueous flux - See Water-soluble organic flux. Aspect ratio - The ratio of the length or depth of a hole to its preplated diameter. Auxiliary heating - The heating of a large thermal mass solder joint by assisting the primary heat source with a secondary source of heat. The secondary source is usually in the form of a soldering iron, thermal tweezer, hot air pencil or heating surface (convective or conductive). Axial lead - Lead wire extending from a component or module body along its long axis. B Bake out - Subjecting an assembly to an elevated temperature in order to remove moisture and unwanted gasses prior to sealing or soldering. Ball Grid Array (BGA) - The generic term for leadless surface mount technology packages with bottom side terminations. The terminations normally consist of solder balls or columns which are reflowed using controlled-collapse soldering techniques. Base material - The insulating material upon which a conductive pattern may be formed. Base metal - See Basis metal. Basis metal - A metal upon which coatings are deposited. Bifurcated solder terminal - A solder terminal with a slot or slit opening through which one or more wires are placed prior to soldering. Aspect Ratio Assembly - A number of parts, subassemblies, or other similar combinations joined together. (Note: This term can be used in conjunction with other terms, e.g., Printed Wiring Assembly. ) ASTM - American Society for Testing and Materials. Bifurcated solder terminal 18 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

28 TERMS AND DEFINITIONS Bridge fill - A thermal enhancement step used in surface mount component removal procedures where the component leads are deliberately bridged together with solder to achieve rapid, simultaneous reflow of all joints. Bumpered quad flatpack (BQFP) - The generic term for surface mount technology packages with leads on four sides and a molded plastic chip carrier. The carrier is distinguishable by the bumpers located on each of the four corners which serve to protect the gull-wing leads and assist with proper alignment. BQFP s are manufactured to American JEDEC standards. (See also Plastic quad flatpack and Quad flatpack. ) C Castellation - A recessed metalized feature on the edge of a leadless chip carrier that is used to interconnect conducting surface or planes within or on the chip carrier. Celsius (Centigrade) ( C) - The temperature scale that represents the freezing point of water at 0 C and boiling at 100 C at sea level. Conversion formula: C = [( F)-32]/1.8. (See also Fahrenheit ( F). ) Ceramic - Inorganic, nonmetallic, clay- or glasslike material, the final characteristics of which are produced by subjecting to high temperatures. Ceramic package - See Cerpack. Cerpack - A flatpack composed of a ceramic base and lid, a stamped-metal lead frame, and frit glass that is used to secure the structure. Certification - The verification that specified training or testing has been performed and that required proficiency or parameter values have been attained. Chip component - A passive component such as a resistor or capacitor. They are usually made of ceramic material with metalized end caps which provide a solderable contact. The part is normally designated by a four digit number that represents the part size. It is important to know if the part is sized in millimeters or inches a 1210 (US) measures.12" x.10" (3.2mm x 2.5mm) while a 1210 (Japan) measures 1.2mm x 1.0mm (.05" x.04"), these parts would NOT be interchangeable. Circuit board - See Printed board. Circuitry - Electrically conductive elements and devices that have been interconnected to perform a desired electrical function. Coefficient of thermal expansion (CTE) - The linear dimensional change of a material per unit change in temperature. (See also Thermal expansion mismatch. ) Cold solder connection - A solder connection that exhibits poor wetting and often characterized by a grayish porous appearance. This may be due to either excessive impurities in the solder, inadequate cleaning prior to soldering, or the insufficient application of heat during the soldering process. Conductive Heating - The manner in which heat is transferred from a soldering tip or other conductive heating tool to the work during soldering or rework. Factors affecting the rate of conductive heating include: 1) the nature of the surfaces (e.g., absence of oxidides, residues, etc.) 2) the geometry or shape of the soldering tip, 3) the surface contact area between the tip and the work, and 4) the average temperature of the tip. The transfer of heat from a hot body to a cool body by way of contact. (See also "Heat Transfer") Conductor - A single electrically conductive path in a circuit pattern. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 19

29 TERMS AND DEFINITIONS TERMS AND DEFINITIONS Conductor spacing - The observable distance between adjacent edges of isolated conductive patterns in a conductor layer. (Compare "Pitch.") Convection - The transfer of heat via gas (e.g., nitrogen) or air movement. (See also "Convective Heating.") Convective Heating - The transfer of heat through the movement of gas or air; the manner in which heat is transferred to the work when using a convective workstation or hot air pencil during soldering or rework. Factors affecting the rate of convective heating include: Gas (air) flow rate Gas (air) temperature Proximity to the work (See also "Heat Transfer") Conductor spacing Conformal coating - An environmentally protective covering that conforms to the configuration of the objects coated when it is applied to a completed printed board assembly. Connector - A device used to provide mechanical connect/disconnect service for electrical terminations. Contact angle, (soldering) - The angle at which the solder fillet meets the basis metal. A small contact angle indicates good wetting whereas a large contact angle may indicate poor wetting. Crazing - An internal condition that occurs in reinforced laminate base material where glass fibers are separated from the resin at the weave intersections. (This condition manifests itself in the form of connected white spots or crosses that are below the surface of the base material. It is usually related to mechanically-induced stress.) (See also Measling. ) Cup solder terminal - A cylindrical solder terminal with a hollow opening into which one or more wires are soldered. Cup solder terminal Contact angle, (soldering) Controlled-collapse soldering - The making of solder connections by controlling the height of solder balls or columns on a component (e.g., flip-chip, ball grid array) during reflow in an assembly operation. 20 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

30 TERMS AND DEFINITIONS D Defect - Any non-conformance to specified requirements by an assembly or product. Dewetting - A condition that results when molten solder coats a surface and then recedes to leave irregularly-shaped mounds of solder that are separated by areas that are covered with a thin film of solder and with the basis metal not exposed. Double-sided assembly - A packaging and interconnecting structure with components mounted on both sides. Double-sided printed board - A printed board with a conductive pattern on both sides. Dross - Oxide and other contaminants that form on the surface of molten solder. F Fahrenheit ( F) - The temperature scale that represents freezing point of water at 32 F and boiling at 212 F at sea level. Conversion formula: F = [1.8x( C)]+32. (See also Celsius (Centigrade) ( C). ) Fine-pitch technology (FPT) - Surface mount assembly technology with component leads or terminations on less than mm (0.025 inch) centers. (See also "Pitch.") FlatPack ack - A rectangular component package that has two or more rows of gull wing shaped leads extending from each of the sides of its body that are parallel to the base of its body. (See also "Quad FlatPack (QFP)".) Dry solder connection - A term sometimes used to describe a defective joint due to non-wetting, insufficient solder, disturbance, a fracture or some other defect. Dwell time - Time duration from the first point of contact of the heat source to the workpiece until the heat source is removed. E Edge connector contact - A printed contact on or near any edge of a printed board that is used specifically to mate with an edge-board connector. EIA - Electronics Industry Association EIAJ - Electronics Industry Association of Japan Flat pack Flexible printed wiring - A patterned arrangement of printed wiring that uses a flexible base material with or without a flexible cover lay. Flip chip - A leadless monolithic, circuit element structure that electrically and mechanically interconnects to a base material through the use Eutectic solder - A term used to describe an alloy that has no plastic range. (e.g., Sn63/Pb37, Sn96/Pb4) Excess solder connection - A solder connection that is characterized by the complete obscuring of the surfaces of the connected metals and/or by the presence of solder beyond the connection area. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 21

31 TERMS AND DEFINITIONS Flo Desoldering - Removal of old solder from multiple surface mount lands using continuous solder TERMS extraction; AND used during DEFINITIONS land preparation prior to replacement of a new component. G Glass transition temperature (T g ) - The temperature at which an amorphous (formless) polymer, or the amorphous regions in a partially-crystalline polymer, changes from being in a hard and relatively-brittle condition to being a viscous or rubbery condition. Ground - A common reference point for electrical circuit returns, shielding, or heat sinking. Continuous Flo Desoldering Flux - A chemically and physically active compound that, when heated, promotes the wetting of a base metal surface by molten solder by removing minor surface oxidation and other surface films and by protecting the surfaces from re-oxidation during a soldering operation. Flux activation temperature - The temperature at which flux becomes active enough to remove oxides from the metals being joined. Flux activity - The degree or efficiency with which a flux promotes the wetting of a surface with molten solder. Flux cored solder - A wire or ribbon of solder that contains one or more continuous flux-filled cavities along its length. Flux residue - A flux-related contaminant that is present on or near the surface of a solder connection. FR4 - Designation of the EIA for a fire retardant epoxy resin-glass cloth laminate. By common usage, the resin for such a laminate. The most common boards in current use are made of FR4 and commonly referred to as such. Frit glass - A melted glass composition, ground up and used in thick-film compositions as the portion of the composition that melts upon firing to seal and provide adhesion of the parts. Gull wing lead - See "Lead." H Haloing - Mechanically-induced fracturing or delamination, on or below the surface of a base material, that is usually exhibited by a light area around holes or other machined features. Heat - A form of energy associated with the motion of atoms or molecules in matter (material). The three basic components which determine the quantity of heat in a body are: Mass - the amount of material in the body. Specific Heat - the heat holding capacity of the material. Temperature - the "hotness" or "coldness" of the body as measured in C or F. Temperature alone is not a good indicator of quantity of heat! A cup of boiling water (100 C) feels "hotter" than a bathtub full of room temperature water (22 C), but the bathtub contains much more heat since it holds so much more water. In soldering and rework, a given quantity of heat (not just temperature!) must be transferred into the work in a rapid, yet controllable manner to properly accomplish a particular solder reflow or pre-/auxiliary heating task. (See also "Heat transfer.") Heat sink - A mechanical device that is made of a high thermal conductivity material that dissipates heat generated by a component or assembly. 22 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

32 TERMS AND DEFINITIONS Heat Transfer - The movement of heat energy from one body to another via conduction (by physical TERMS contact), AND convection DEFINITIONS (by gas/air movement) or by radiation (radiant heat like sunshine). Hook solder terminal - A solder terminal with a curved feature around which one or more wires are wrapped prior to soldering. Hand soldering and rework methods in which a heated tip transfers heat into the work by contact are examples of conductive heating. Surface mount soldering and rework with a convective workstation or hot air pencil which transfers heat into the work by the flow of heated gas or air is an example of convective heating. Production reflow soldering in an Infrared (IR) oven is an example of radiant heating. The efficacy (efficiency) of any heat transfer process is determined by the rate of temperature rise in the work (i.e., how quickly proper solder reflow temperature is reached during component installation.) (See also "Conductive heating", "Convective heating" and "Infrared (IR) heating.") Heatability - The physical characteristics of the work which determine how, when, where and how much heat must be applied to achieve safe effective solder reflow during a component installation or removal process. Characteristics include: mass or amount of component or substrate materials to be heated (i.e., size of the component), the thermal properties of the material (i.e., ceramic or plastic), the proximity of ground planes and the physical layout of the assembly (e.g., the size and number of connected circuit pathways through which heat can flow). Hence, every individual component substrate and component mounting site has its own particular "heatability." Heat rate recognition - A workpiece indicator which shows how fast heat is flowing into the joint. This is typically the observed rate at which solder melts. (See also "Workpiece Indicator (WPI)") Hook solder terminal Hybrid circuit - An insulating base material with various combinations of interconnected film conductors, film components, semiconductor dice, passive components and bonding wire that form an electronic circuit. I Icicle - See Solder projection. Inclusions - Foreign particles, metallic or nonmetallic, that may be entrapped in an insulating material, conductive layer, plating, base material, or solder connection. Infrared (IR) heating - The transfer of heat by radiant energy (like sunshine) to the work during reflow soldering. IR heating is typically used in combination with convective heating in a Convective/IR oven. (See also "Heat transfer.") Insufficient solder connection - A solder connection that is characterized by the incomplete coverage on one or more of the surfaces of the connected metals and/or by the presence of incomplete solder fillets. Interfacial connection - A conductor that connects conductive patterns on both sides of a printed board (e.g., a plated through-hole or via). Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 23

33 TERMS AND DEFINITIONS Interlayer connection - A conductor that connects conductive patterns on internal layers of a multilayer printed board (e.g., a plated-through hole or via). Ionic cleanliness - The degree of surface cleanliness with respect to the number of ions or weight of ionic matter per unit square of surface. J-lead - See "Lead." JEDEC - Joint Electron Device Engineering Council J Jumper wire - A discrete electrical connection that is part of the basic or modified conductive pattern formed on a printed circuit board. K Land preparation - The act of renewing or preparing a land (or land pattern) for the receipt of a new surface mount component. The procedure normally involves the removal of all old solder, cleaning and renewal of the solderable surface. Leaching metalization - The loss or removal of a basis metal or coating during a soldering operation. Leadless ceramic chip carrier (LCCC) - A ceramic chip carrier whose external connections (castellations) consist of metalized terminations that are an integral part of the component body. Leadless chip carrier (LCC) - See Leadless ceramic chip carrier (LCCC). Lead - A length of insulated or uninsulated metallic conductor that is used for electrical interconnections. A metallic conductive portion of a component or wire used for electrical interconnections. Known wn Good Board - A correctly fabricated (and often assembled) PCB that serves as a standard unit or assembly by which others can be compared. L Land - A portion of a conductive pattern that is usually used for making surface mount electrical connections. Land grid array (LGA) - See "Ball Grid Array (BGA)". Lead (Gull wing) Land pattern - A combination of lands used for the mounting, interconnection and testing of a particular component. Lead (J-lead) QFP Land Pattern 24 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

34 TERMS AND DEFINITIONS Lead preparation - The work performed on the leads of a component prior to installation. This work may involve formation of the component lead to the desired configuration, lead trimming, cleaning and tinning. Lifted Land - A land that has fully or partially separated (lifted) from the base material. M Mealing - A condition in the form of discrete spots or patches that reveals a separation at the interface between a conformal coating and a base material on the surface of a printed board, on the surface of an attached component, or both. Measling - A condition that occurs in laminated base material in which internal glass fibers are separated from the resin at the weave intersection. (This condition manifests itself in the form of discrete white spots or crosses that are below the surface of the base material. It is usually related to thermally-induced stress.) (See also Crazing. ) Meniscograph - An instrument used to measure solderability using the wetting balance method (time from buoyancy to downward, or wetting, pull). Metalization - A deposited or plated thin metallic film that is used for its protective and/or electrical properties. Mini-Wave Tip Mini-Wave Soldering Minimum electrical spacing - The minimum allowable distance between adjacent conductors, at a given voltage and altitude, that is sufficient to prevent dielectric breakdown, corona, or both, from occurring between the conductors. Modification - The change in the functional characteristics of a product (e.g., printed board or printed board assembly) in order to satisfy new acceptance requirements. (See also Repair and Rework. ) Mother board - A printed board assembly that is used for interconnecting arrays of plug-in electronic modules. Multichip module (MCM) - A microcircuit module consisting primarily of closely-spaced integrated circuit dice. Metalized electrode face (MELF) - A small cylindrical part with a solderable terminal on each end. These packages are more commonly found on boards of European or Japanese manufacture. (See also Chip component. ) Mini-Wave soldering - A specialized form of transfer soldering that makes use of controlled heat, surface tension and externally applied flux to mimic the wave soldering operation during manual surface mount soldering and rework. Mini-Wave soldering is typically used to install multileaded SMD's. The Mini-Wave tip is filled with solder which is then passed over a row of surface mount leads and lands supplying just the right amount of solder to form proper joints. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 25

35 TERMS AND DEFINITIONS N TERMS AND DEFINITIONS Nick - A cut or notch in a wire or in the edge of a conductor. Noble Metal - Designation for an especially corrosion resistant metal, such as gold. Nonactivated ated flux - A natural or synthetic-resin flux without activators. Nonfunctional land - A land that is not connected electrically to the conductive pattern on its layer. Nonionic contaminant - A residue that does not readily ionize (dissolve) in water. Pad - See Annular Ring. P Para-aramid - The generic term that describes fibers that are made from wholly-aromatic polyamide, amide polymers in which at least 85% of the amide linkages are directly attached to two benzene rings at the para position of the polymer chain. Paste (Gel) flux - A flux formulated in the form of a paste (gel) to facilitate its application. Perforated (pierced) solder terminal - A flat-metal solder terminal with an opening through which one or more wires are placed prior to soldering. Nonpolar solvent ent - A liquid this is not ionized to the extent that it is electrically conductive, that can dissolve non-polar compounds (i.e., hydrocarbons and resins), and cannot dissolve polar compounds (e.g., inorganic salts). Nonwetting (solder) - The partial adherence of molten solder to a surface that it has contacted and basis metal remains exposed. O Offset fset land - A land that is intentionally not in physical contact with its associated component hole or terminal area. Organic contamination - A type of contamination derived from an organic substance. Outgassing - The gaseous emission from a printed board, component or solder joint when a printed board assembly is exposed to heat, to a reduced pressure, or both. Perforated (pierced) solder terminal Phenolic laminate - A relatively low cost resin board laminate constructed from phenol and formaldehyde which may also include paper or cloth as a filler. Pinhole - A small hole that penetrates from the surface of a solder connection to a void of indeterminate size within the solder connection. Overheated solder connection - A solder connection that is characterized by solder surfaces that are dull, chalky, grainy, and porous or pitted. Oxide - The non-metallic, non-solderable material that forms on a solderable surface that may affect soldering operations by preventing the proper formation of a solder joint. Oxides are normally removed by chemical or mechanical cleaning operations as well as the use of flux during soldering operations. 26 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

36 TERMS AND DEFINITIONS Prefill - The addition of solder to a land (or land pattern) as part of a prepatory step that precedes component installation. The solder may or may not be reflowed as part of the prefill operation. Pre-heat - A preliminary process during which the work is heated at a predetermined rate from ambient temperature to a desired elevated temperature. Pitch Pitch - The nominal center-to-center distance of adjacent conductors in a conductor layer. Compare "Conductor Spacing" Plastic Leaded Chip Carrier (PLCC) - A plastic bodied chip carrier whose external connections consist of J-lead terminations located around all four sides. Plastic Quad FlatPack ack (PQFP) - A plastic bodied chip carrier with gull wing leads located around all four sides. (See also Bumpered quad flatpack and Quad FlatPack (QFP).") Polar matter - A substance that can dissolve in water and other polar solvents. Polar solvent ent - A liquid that is ionized to the extent that it is electrically conductive, can dissolve polar compounds (i.e., inorganic salts) but cannot dissolve nonpolar compounds (e.g., hydrocarbons and resins ). Polyamide - A flame retardant laminate offering outstanding heat resistance and excellent electrical properties, but with a high water absorption rate. Preferred solder connection - A solder connection that is smooth, bright and feathered-out to a thin edge indicating proper solder flow and wetting action. Also, no bare metal is exposed within the solder connection and there are no sharp protrusions or evidence of contamination (e.g., embedded foreign material). Pre-heating - The raising of the temperature of the work (i.e., board, assembly, component, etc.) above ambient temperature in order to reduce the risk of thermal shock and to reduce dwell time during the primary heating process. Primary side - That side of a packaging and interconnecting structure that is so defined on the master drawing. (It is usually the side that contains the most complex or the largest number of components.) Printed board - The general term for a printed circuit or printed wiring board. (This includes singlesided, double-sided and multilayer boards with rigid, flexible and rigid-flex base materials.) Printed board assembly - The generic term for an assembly that uses a printed board for component mounting and interconnecting purposes. Printed circuit - A conductive pattern that is composed of printed components, printed wiring, or a combination thereof, that is formed in a predetermined arrangement on a common base. (This is also a generic term that is used to describe a printed board that is produced by any number of techniques.) Printed circuit board - A printed board that provides both point-to-point connections and printed components in a predetermined arrangement on a common base. (See also Printed wiring board. ) Printed circuit board assembly - An assembly that uses a printed circuit board for component mounting and interconnecting purposes. Printed component - A part (e.g., inductor, resistor, capacitor, or transmission line) that is formed as part of the conductive pattern of a printed board. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 27

37 TERMS AND DEFINITIONS TERMS AND DEFINITIONS Printed wiring - A conductive pattern that provides pointto-point connections, but not printed components, in a predetermined arrangement on a common base. (See also Printed circuit. ) Printed wiring board - A printed board that provides point-to-point connections, but not printed components, in a predetermined arrangement on a common base. (See also Printed circuit board. ) Printed wiring board assembly - An assembly that uses a printed wiring board for component mounting and interconnecting purposes. Pulse soldering - Soldering with heat generated by a pulsing high current/low voltage tool which reflows a solder joint through physical contact. Q Quad flatpack (QFP) - The generic term for surface mount technology packages with leads on four sides. The most common lead configurations are gull wing. QFP packages are dimensioned in millimeters or inches. (See also Bumpered quad flatpack and Plastic quad flatpack. ) There are many variations (which may be vendor or country related) of the QFP package with their own designations. These include: CERQUAD Ceramic quad flat pack CQFP Ceramic multilayer quad flat pack MQFP Metric quad flat pack MQUAD Metal quad flat pack ( Olin Corp.) PQFP Plastic quad flat pack SQFP Shrink quad flat pack TAPEPAK Molded carrier ring ( National Semiconductor) TQFP Thin quad flat pack VQFP Very quad flat pack R Radiation - The transfer of heat by way of electromagnetic energy; the manner in which the sun, infrared ovens and heat lamps transfer heat. Rebond - A termination made at, on top of, or adjacent to, the location of a prior bond. Reflow soldering - The joining of mating surfaces that have been tinned and/or have solder between them by placing them together, heating them until the solder fuses (reflows) and allowing them to cool in the joined position. Reliability - The probability that a device or assembly will function properly for a definite period of time under the influence of specific environmental and operational conditions. Repair(ing) - The act of restoring the functional characteristics of a defective or damaged product (e.g., printed board or printed board assembly) without necessarily restoring the appearance or compliance with applicable drawings or specifications. Replacing a damaged trace or lifted land are examples of repair. (See also Modification and Rework. ) Residue - Any visual or measurable form of process-related contamination. Resin - A natural or synthetic resinous material. (See also Rosin and Synthetic resin. ) Resin flux - A resin and small amounts of organic activators in an organic solvent. Resist - A coating material that is used to mask or protect selected areas of a pattern form the action of an etchant, plating, solder, etc. Resistance soldering - Soldering by a combination of pressure and heat generated by passing a high current through two mechanically-joined conductors. 28 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

38 TERMS AND DEFINITIONS Rework(ing) - The act of repeating one or more manufacturing operations, or performing alternative techniques in order to bring a product (e.g., printed board or printed board assembly) into compliance with applicable drawings and specifications. Removal, replacement or realignment of components (after the primary manufacturing operation) are examples of rework. Rigid board - A patterned arrangement of printed wiring that uses a rigid base material. Rigid-flex printed board - A printed board with both rigid and flexible base materials. Rosin - A hard, natural resin, consisting of abietic and primaric acids and their isomers, some fatty acids, and terpene hydrocarbons, that is extracted from pine trees and subsequently refined. Rosin flux - Rosin in an organic solvent or rosin as a paste with activators. Rosin solder connection - A solder connection that has practically the same appearance as does a cold solder connection, but that also shows evidence of entrapped rosin separating the surfaces to be joined. (See also Cold solder connection. ) S Saponifier ier - An aqueous organic- or inorganic-base solution with additives that promote the removal of rosin and/or water soluble flux. Semiconductor - A solid material (e.g., silicon) that has a resistivity that is midway between that of a conductor and an insulator. Shelf life - The length of time a material, substance or product can be stored, under specific environmental conditions, while it meets all applicable specification requirements and remains suitable for its intended use. Single Inline Memory Module (SIMM) - A small hybrid memory module usually consisting of a 3.5" x 0.75" FR4 board with a number of surface mounted memory chips that is used in many computers and printers. Single-inline package (SIP) - A component package with one straight row of pins or wire leads. Single-sided assembly - A packaging and interconnecting structure with components mounted only to one side. (See also Double-sided assembly. ) Single-sided printed board - A printed board with a conductive pattern on only one side. Slump - The distance a substance (e.g., solder paste) moves after it has been applied and cured (dried). Small Outline Integrated Circuit (SOIC) - A small rectangular circuit package usually consisting of a plastic body with gull wing (or J-leads) and usually extending from each of the long sides. The lead count typically runs from 8 to 56 leads (The surface mount equivalent of a dual in-line package (DIP).) There are many variations (which may be vendor or country related) of the SOIC package with their own designations. These include: SOIC-L or SOL Small outline Large SOIC-M or SOM Small outline Medium SOJ Small outline J-lead SOLJ Small outline Large J- lead SOP Small outline package (Japanese) SSOP Shrink small outline package (Japanese) TSOP Thin small outline package VSOP Very small outline package (Japanese) Small Outline Transistor (SOT) T) - A small chip-like component that may have a plastic or ceramic body style. They typically consist of two gullwing leads extending from one of the long sides and a third lead extending from the other long side. The package usually contains a transistor or diode. Solder - A metal alloy with a melting temperature that is below 427 C (800 F). Eutectic Sn63/Pb37 solder melts at 183 C (361 F). Solder ball - A small sphere of solder adhering to a laminate, resist, or conductor surface. (This generally occurs after wave solder or reflow soldering.) Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 29

39 TERMS AND DEFINITIONS TERMS AND DEFINITIONS Solder bridge - The unwanted formation of a conductive path of solder between conductors. A quantity of molten solder between a conductive heating tool (i.e., a soldering iron tip) and the solder joint(s) to improve heat transfer into the work. (See "Thermal enhancement") Solder bump - A round ball of solder used to make interconnections between a component (e.g., flip chip, land grid array) and a base material during controlled-collapse soldering. Solder coat - A layer of solder that is applied directly from a molten solder bath to a conductive pattern. Solder connection - An electrical/mechanical connection that employs solder for the joining of two or more metal surfaces. Solder contact - A type of connector contact whose nonmating end is in the form of a hollow cylinder, cup, eyelet or hook that can be soldered to a wire in contact within it. Solder embrittlement - The reduction in mechanical properties of a solder fillet (metal) as a result of local penetration of solder along grain boundaries. Solder fillet - A normally-concave surface of solder that is at the intersection of the metal surfaces of a solder connection. Solder heat bridge - Solder added to the point of contact between the soldering tip and the work in order to increase the contact area and thereby maximize heat transfer during soldering. Solder paste (cream) - Finely-divided particles of solder, with additives to promote wetting and to control viscosity, tackiness, slumping, drying rate, etc., that are suspended in a paste (cream) flux. Solder preform - solder-wire rings, stampings, and spheres which are available (or can be formed from workstation material) in a wide variety of shapes to conform to component geometry. Like solder paste, solder preforms are positioned in the joint area and heated to reflow during an assembly operation. Solder projection - An undesirable protrusion (e.g., icicle) of solder from a solidified solder joint or coating. Solder resist - A resist material or coating that provides protection form the action of solder. Solder side - The side opposite the component (primary) side of a single-sided assembly. (See also "Primary side.") Solder spatter - Extraneous fragments of solder with an irregular-shape. Solder terminal - An electrical/mechanical connection device that is used to terminate a discrete wire or wires by soldering. (See also Bifurcated solder terminal, Cup solder terminal, Hook solder terminal, Perforated (pierced) solder terminal, and Turret solder terminal. ) Solder webbing - A continuous film or curtain of solder that is parallel to, but not necessarily adhering to, a surface that should be free of solder. Solder wicking - The capillary movement of solder between metal surfaces, (e.g., strands of wire). Solderability - The ease with which solder can adhere to a basis metal surface such as a component lead, termination or circuit board conductor. The presence of contamination, oxides and residues interferes with solderability. (See also Contact angle" and "Wetting.") Soldering - The joining of metallic surfaces with solder and without the melting of the base material. Soldering flux - See Flux. Soldering iron tip - The end portion of a soldering iron that is used for the application of the heat that melts (reflows) the solder. Solvent - A non-reactive liquid substance that is capable of dissolving another substance. 30 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

40 TERMS AND DEFINITIONS Solvent cleaning - The removal of organic and inorganic soils using a blend of polar and nonpolar organic solvents. Specific Heat - The heat holding capacity of a substance; the ratio of the amount of heat required to raise a unit of mass of a substance a unit of temperature, to the amount of heat required to raise the same unit of mass of water the same unit of temperature. Spread - The distance a substance (e.g., solder paste) moves after it has been applied at ambient conditions. Step soldering - The making of solder connections by sequentially using solder alloys with successively-lower melting temperatures. Stress relief - The portion of a component lead or wire lead that is formed in such a way as to minimize mechanical stresses after the lead is terminated. Substrate - See Base material. Supported hole - A hole in a printed board that has its inside surfaces plated or otherwise reinforced. Surface Insulation Resistance (SIR) - The electrical resistance of an insulation material between a pair of conductors which may be measured to determine the state of cleanliness. Surface Mount Component (Device) (SMC/SMD) - A leaded or leadless component (device) that is capable of being attached to a surface conductor of a printed board. Surface Mount Technology (SMT) - The electrical connection of components to the surface of a conductive pattern that does not utilize component holes. Surface tension - The natural, inward, molecular attraction force that inhibits the spread of a liquid at its interface over a solid material. Synthetic activated ated flux - A highly activated organic flux whose post-soldering residues are soluble in halogenated solvents. Synthetic resin - A synthetic organic material or a chemically-treated natural resin that is capable of being mixed in water. T Tack ack and Wrap - A thermal enhancement step used in surface mount component removal where flux cored solder is first tacked to one of the corner leads and then wrapped all the way around the component at the lead/land junction. During component removal, this solder reflows helping to achieve rapid, simultaneous reflow of all joints. Tack and Wrap SIR Test Pattern (inside PLCC 68 pattern) Tape automated bonding (TAB) - A fine-pitch technology that provides interconnections between die and base materials with conductors that are on a carrier tape. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 31

41 TERMS AND DEFINITIONS TERMS AND DEFINITIONS Temperature - The measure of the degree of hotness or coldness of a body expressed in degrees ( ) Celsius or Fahrenheit. (See also Celsius, Fahrenheit and Heat. ) Tenting - The covering of holes in a printed board and the surrounding conductive pattern with a resist that is usually a dry film. Terminal - A metallic device that is used for making electrical connections. (See also Solder terminal. ) Terminal area - See Land. Test Coupon - A portion of quality conformance test circuitry that is used for a specific test, or group of related tests, in order to determine the acceptability of a product. Thermal coefficient of expansion (TCE) - See Coefficient of thermal expansion (CTE). Thermal conductivity - The property of a material that describes the rate at which heat will be conducted through a unit area of the material for a given driving heat source. Thermal enhancement - The addition of molten solder, wire solder or flux between a conductive (or convective) heating tool and the work in order to improve heat transfer into the work. (See also "Thermal linkage", "Bridge fill" and "Tack and Wrap" and "Solder Heat Bridge".) Thermal expansion mismatch - The absolute difference between the thermal expansion of two components or materials. (See also Coefficient of thermal expansion (CTE). ) Thermal linkage - The temporary mating of the surfaces to be soldered with the source of heat in a manner to rapidly assist the flow of heat from the heat source to the parts. This is normally achieved by the use of a solder heat bridge or a flux bridge at the time that the heat source is applied to the connection area. (See also "Solder Heat Bridge","Tack and Wrap", "Bridge Fill" and "Thermal Enhancement.") Thermal shock - 1. [components, boards] Immediate or latent damage caused by the exposure to sudden, large changes in temperature. 2. [soldering tip] The sudden change of the temperature of a soldering tip (e.g., wiping on a damp sponge) to expel oxides from the tip surface; the final step in tip cleaning prior to use. Thermal thru-put - The rate at which heat can be produced by a heating device and applied to the work as evidenced in the rate of temperature rise of the work. (See also "Heat Transfer.") Thermocouple - Sensing devices made of two dissimilar metals which, when heated, generate a DC voltage that can be used in measuring temperatures. Tinning - The application of molten solder to a basis metal in order to increase its solderability. Tip ip offset fset constant - A number entered into the power supply to ensure that the set tip temperature entered into the control unit is reflected at the working surface of the heated tip. (See also Tip temperature offset and True tip temperature. ) Tip temperature offset - The difference in temperature that exists between the measured temperature at the handpiece heater and the working surface of a heated soldering tip. (See also Tip offset constant and True tip temperature. ) Tombstoned component - A defect condition where a leadless device has only one of its metalized terminations soldered to a land and has the other metalized termination elevated above and not soldered to its land. Trace - See Conductor. Track - See Conductor. Transfer soldering - The use of a soldering iron to transfer a measured amount of solder, in the form of a ball, chip, or disc, to a solder connection. True tip temperature - The actual measured temperature (e.g., by an embedded thermocouple) at the working surface of a soldering tip. (See also Tip offset constant and Tip temperature offset. ) 32 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

42 TERMS AND DEFINITIONS Turret solder terminal - A round post-type stud (standoff) solder terminal with a groove or grooves around which one or more wires are wrapped prior to soldering. W Water ater-soluble organic flux - An organic-chemical soldering flux that is soluble in water. Turret solder terminal U Wave soldering - A process where an assembled printed board is brought in contact with the surface of a continuously flowing and circulating mass of solder. Wettablity - The ease with which a specific metal or alloy can be wetted by solder. Wetting (solder) - The formation of a relatively uniform, smooth, unbroken and adherent film of solder to a basis metal. (See also "Contact angle" and "Solderability.") Wetting balance - An instrument that is used to measure wetting performance and solderability. Ultrasonic cleaning - Immersion cleaning that is done by passing high frequency sound waves through a cleaning medium to cause micro-agitation. V Vapor apor-phase soldering - A reflow soldering method in which hot vapor condenses on the parts to be soldered (giving up its heat of vaporization) and causing solder reflow. Very ery large-scale integration (VLSI) - Integrated circuits with more than 80,000 transistors on a single die that are interconnected with conductors that are mm or less in width. Via - A plated-through hole that is used as an interlayer connection, but in which there is no intention to insert a component lead or other reinforcing material. Wicking - The capillary absorption of a liquid along the fibers of a material. (See also Solder wicking. ) Wire ire solder - A wire or ribbon of solder that may or may not contain one or more continuous flux-filled cavities along its length. (See also Flux cored solder. ) Workpiece Indicator (WPI) - The reaction of the workpiece to the actions being performed on it; reactions that are discernible to the human senses of sight, touch and sound. (See also "Heat Rate Recognition".) X X-axis - The horizontal or left-to-right direction in a two dimensional system of coordinates. (This axis is perpendicular to the Y-axis.) Visual examination - The qualitative observation of physical characteristics with the unaided eye or within stipulated levels of magnification. Void - The absence of any substances in a localized area. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 33

43 TERMS AND DEFINITIONS Y TERMS AND DEFINITIONS Y-axis - The vertical or bottom-to-top direction in a two dimensional system of coordinates. (This axis is perpendicular to the X-axis.) Z Z-axis - The up-down direction in a three dimensional system of coordinates that is perpendicular to both the X- and Y-axis. References: 1. Terms and Definitions for Interconnecting and Packaging Electronic Circuits, ANSI/IPC-T-50, IPC Standard, Institute for Interconnection and Packaging Electronic Circuits 2. Electronic Materials Handbook - Volume 1 - Packaging, ASM International 3. The American Heritage Dictionary of the English Language, Houghton Mifflin Company 4. PACE Inc., Laurel, MD 34 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

44 Process Guide G-BGA-00-A The following process can be performed with an SX-80 Handpiece SX-80 Handpiece EQUIPMENT REQUIRED BGA Component and PCB Land Preparation PACE PAR T NUMBER ART PACE SensaTemp Power Supply with Vacuum Capability SX-80 Handpiece P1 SX-80 Tip and Tool Stand P1 Endura Flo-D-Sodr Tip Tip Tool P1 OPTIONAL EQUIPMENT ➀ Apply Flux ➁ Tin Tip ➂ Position Tip N/A MA TERIALS MATERIALS Flux Locally Obtained Cleaner Locally Obtained Solder Locally Obtained PROCEDURE 1. Remove conformal coating as required and clean work area of any contamination, oxides, residues or fluxes. 2. Start with a tip temperature of 315º C (600º F) and adjust as necessary. 3. Install Endura Flo-D-Sodr tip into the SX-80 Solder Extractor using the tip tool. 4. Apply flux as needed to the land areas on the PCB and component. ➀ 5. Clean and thermally shock the tip with a damp sponge. 6. Tin the bottom of the tip. ➁ 7. Lower the tip, perpendicular to the PCB, contacting the lands at a corner portion of the array with a very light pressure. ➂ 8. Allow solder to melt at the point of contact, apply vacuum and slowly sweep the tip over the remaining lands on the array. ➃ 9. Lift the tip from the array upon completion. ➄ ➃ Melt Solder and Apply Vacuum ➄ Lift Handpiece 10. Repeat steps 7-9 for the land pattern on the component 11. Re-Tin the tip with solder and return the SX-80 Solder Extractor to its tip and tool stand. 12. Clean lands on array pattern as required for component placement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 35

45 G-BGA-00-A ENDURA DESOLDERING TIPS Allows all 1/8"" shank Micro Tips to be used with the SX-80 Handpiece. Outside Diameter Inside Diameter Par art Thermo-Drive 2.03mm (0.080") 0.76mm (0.030") P5 Thermo-Drive 2.29mm (0.090") 1.02mm (0.040") P5 Thermo-Drive 3.05mm (0.120") 1.52mm (0.060") P5 Thermo-Drive 5.1mm (0.200") 2.29mm (0.090") P5 Thermo-Drive, Flathead (0.110") x (0.190") (0.050") x (0.090") P5 Extended Reach Thermo-Drive 2.29mm (0.090") 0.76mm (0.030") P5 Extended Reach Thermo-Drive 2.54mm (0.10") 1.02mm (0.040") P5 Extended ReachThermo-Drive 3.05mm (0.120") 1.52mm (0.060") P5 Precision 1.79mm (0.070") 0.50mm (0.020") P5 Precision 2.03mm (0.080") 0.76mm (0.030") P5 Precision 2.29mm (0.090") 1.02mm (0.040") P5 Precision 2.79mm (0.110") 1.52mm (0.060") P5 Precision 3.55mm (0.140") 2.29mm (0.090") P5 36 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

46 Process Guide G-BGA-01-A The following process can be performed with a PACE TF 2000 TF 2000 BGA Component Profiling EQUIPMENT REQUIRED PACE PAR ART NUMBER PACE TF BGA Nozzle As Applicable Thermocouple P1 OPTIONAL EQUIPMENT Thermocouple Meter MATERIALS Flux Locally Obtained Cleaner Locally Obtained ➀ Thermocouple PROCEDURE 1. Determine the highest thermal mass location or area of the component array pattern. Look for large conductors, ground or voltage planes or interlayer connected vias as examples. 2. Select an appropriate thermocouple type, size and connector to use with the TF 2000 or with a hand held thermocouple meter. ➀ 3. Position the thermocouple end in contact with the soldered connection. This can be accomplished by positioning the thermocouple in place on the component side of the PCB or by drilling and installing from the opposite side of the PCB. ➁ 4. Secure the thermocouple in place using tape or equivalent method. 5. Plug the thermocouple into the Reflow station section of the TF 2000 or the hand held meter. ➂ 6. Refer to process guide G-BGA-02-A for the steps to align the component or, use an existing, previously installed component. 7. Index the sliding shaft holder to the far left position. 8. Lower the nozzle so that if possible it completely surrounds the component and is in gentle contact with the PCB surface. ➃ 9. Select the profile development tab on the TF 2000 software. 10. Enter the approximate starting times and temperatures to achieve the following profile. NOTE: This may require several attempts. However, it is critical to allow the FCB and component to cool to ambient temperature prior to proceeding; ➄ a. A preheat temperature of approximately 100ºC at a ramp rate from ambient temperature of no greater than 3ºC per second. b. A soak temperature of approximately 140º C- 160º C for a period of seconds and a ramp rate of no greater than 3º C per second. c. A reflow temperature of approximately 200º C. d. A cool down rate of no greater than 3º C per second. 11. Once these parameters are met, save the profile PACE Incorporated. Manual Assembly and Rework For Surface Mount Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 37 ➁ ➂ ➃ ➄ Thermocouple Position Connect Thermocouple Nozzle Position Develop Profile

47 G-BGA-01-A TF 2000 Nozzles Dimensions Maximum Size of Component* Part Number 8mm x 8mm (0.31" x 0.31") 5mm x 5mm (0.19" x 0.19") mm x 11mm (0.35" x 0.43") 6mm x 8mm (0.24" x 0.31") mm x 15.7mm (0.44" x 0.62") 8.2mm x 12.7mm (0.32" x 0.5") mm x 12mm (0.47" x 0.47") 9mm x 9mm (0.35" x 0.35") mm x 13mm (0.51" x 0.51") 10mm x 10mm (0.39" x 0.39") mm x 16mm (0.63" x 0.63") 13mm x 13mm (0.51" x 0.51 ) mm x 18mm (0.71" x 0.71") 15mm x 15mm (0.59" x 0.59") mm x 20mm (0.79" x 0.79") 17mm x 17mm (0.67" x 0.67") mm x 26mm (1.02" x 1.02") 23mm x 23mm (0.90" x 0.90") mm x 30mm (1.18" x 1.18") 27mm x 27mm (1.06" x 1.06") mm x 38mm (1.53" x 1.53") 35mm x 35mm (1.37" x 1.37") mm SQ mm x 8mm MM x 12.7mm mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ LQFP, 22mm SQ LQFP, 16mm SQ LQFP, 30mm SQ LQFP, 9mm SQ LQFP, 12mm SQ LQFP, 26mm SQ Nozzle, LQFP, 16mm x 22mm Nozzle, LQFP, 14mm SQ Nozzle, 14mm x 22mm Nozzle, 50mm SQ Nozzle, 60mm SQ Nozzle, 40mm SQ Nozzle, 25mm SQ Nozzle 19mm SQ Nozzle, 16.5mm x 8mm Nozzle, 33mm SQ Nozzle, 21mm x 25mm Nozzle, 29mm SQ Nozzle, 31mm SQ Nozzle, 42mm SQ Nozzle, Conn, 16mm x 13mm Nozzle, Conn, 27mm x 13mm Nozzle, Conn, 30mm x 12mm Nozzle, Conn, 19mm x 8mm Nozzle, 56mm x 17mm Nozzle, w/ Baffle 28mm x Nozzle, 13mm x 10mm * Nozzles can also be used on components smaller than "Max Size". Custom nozzles can be ordered by contacting PACE. 38 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

48 Process Guide G-BGA-02-A The following process can be performed with a PACE TF 2000 TF 2000 BGA Component Alignment and Placement EQUIPMENT REQUIRED PACE PAR ART NUMBER PACE TF OPTIONAL EQUIPMENT N/A MATERIALS Flux Cleaner (as needed) Locally Obtained Locally Obtained ➀ Select "Optics" Tab PROCEDURE 1. On the PC, open the TF 2000 software. 2. Select the "Optics" tab to activate the optics view. ➀ 3. Index the sliding shaft holder of the TF 2000 to the far right position. 4. Adjust the board holder to accommodate the PCB and tighten as necessary. 5. Extend the optics housing to its fully extended position. 6. Position the PCB so that the desired land pattern is centered in the optics window of the TF 2000 software. 7. Increase the size of the land pattern image using the 'wide' slide on the optics tab. 8. Activate the vacuum and attach the component roughly centered to the vacuum pickup. ➁ 9. Adjust the device and PCB lights as necessary so both surfaces are in clear view. 10. Adjust the focus of both the device and PCB. 11. Using the X, Y & Theta adjustments, align the component with the land pattern on the PCB. ➂ 12. Return the optics housing to it's original position. 13. Apply flux as needed to the PCB land pattern. ➃ 14. Lower the placement apparatus to the board surface and allow the component to contact the land pattern. ➄ 15. Release the vacuum. 16. Return the placement apparatus to the raised and locked position. 17. Refer to process guide I-BGA-50-A for steps to install the component. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➁ ➂ ➃ ➄ Attach Component to Vacuum Pick Adjust X, Y and Theta Apply Flux Place Component on PCB 39

49 G-BGA-02-A TF 2000 Nozzles Dimensions Maximum Size of Component* Part Number 8mm x 8mm (0.31" x 0.31") 5mm x 5mm (0.19" x 0.19") mm x 11mm (0.35" x 0.43") 6mm x 8mm (0.24" x 0.31") mm x 15.7mm (0.44" x 0.62") 8.2mm x 12.7mm (0.32" x 0.5") mm x 12mm (0.47" x 0.47") 9mm x 9mm (0.35" x 0.35") mm x 13mm (0.51" x 0.51") 10mm x 10mm (0.39" x 0.39") mm x 16mm (0.63" x 0.63") 13mm x 13mm (0.51" x 0.51 ) mm x 18mm (0.71" x 0.71") 15mm x 15mm (0.59" x 0.59") mm x 20mm (0.79" x 0.79") 17mm x 17mm (0.67" x 0.67") mm x 26mm (1.02" x 1.02") 23mm x 23mm (0.90" x 0.90") mm x 30mm (1.18" x 1.18") 27mm x 27mm (1.06" x 1.06") mm x 38mm (1.53" x 1.53") 35mm x 35mm (1.37" x 1.37") mm SQ mm x 8mm MM x 12.7mm mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ LQFP, 22mm SQ LQFP, 16mm SQ LQFP, 30mm SQ LQFP, 9mm SQ LQFP, 12mm SQ LQFP, 26mm SQ Nozzle, LQFP, 16mm x 22mm Nozzle, LQFP, 14mm SQ Nozzle, 14mm x 22mm Nozzle, 50mm SQ Nozzle, 60mm SQ Nozzle, 40mm SQ Nozzle, 25mm SQ Nozzle 19mm SQ Nozzle, 16.5mm x 8mm Nozzle, 33mm SQ Nozzle, 21mm x 25mm Nozzle, 29mm SQ Nozzle, 31mm SQ Nozzle, 42mm SQ Nozzle, Conn, 16mm x 13mm Nozzle, Conn, 27mm x 13mm Nozzle, Conn, 30mm x 12mm Nozzle, Conn, 19mm x 8mm Nozzle, 56mm x 17mm Nozzle, w/ Baffle 28mm x Nozzle, 13mm x 10mm * Nozzles can also be used on components smaller than "Max Size". Custom nozzles can be ordered by contacting PACE. 40 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

50 Process Guide G-BGA-03-A The following process can be performed with a PACE Component Stenciling Tool Kit Solder Paste and Flux Stenciling EQUIPMENT REQUIRED Component Stenciling Tool Kit PACE PAR ART NUMBER As Applicable OPTIONAL EQUIPMENT N/A MATERIALS Flux Solder Paste Cleaner Locally Obtained Locally Obtained Locally Obtained ➀Position Component PROCEDURE 1. Clean and prepare components as outlined in Process Guide G-BGA-00-A. 2. Select the appropriate sized stencil kit. 3. Position the component, top side down, into the stenciling kit base. Ensure the component release tab is retracted to allow the component to lay flush. ➀ 4. Install the stencil onto the corner posts on the stenciling kit base. ➁ 5. Ensure the stencil sits flush to the component surface and the I/O balls enter the stencil appertures. 6. Apply a bead of paste flux or solder paste as applicable along one side of the stencil on one edge of the appertures. 7. Using the squeegee, draw the paste flux or solder paste across the stencil in a smooth and steady motion. ➂ 8. Ensure all excess paste flux or solder paste is removed from the appertures of the stencil. 9. Remove the stencil from the component in one steady motion. ➃ 10. Place the top of the stenciling kit onto the corner posts of the base. 11. Turn the stenciling kit upside down and retract the component release tab. ➄ 12. With the stenciling kit still upside down, remove the stenciling kit base. ➄ ➁ ➂ ➃ Position Stencil Apply Solder Paste or Flux Remove Stencil Remove Base Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 41 ➄

51 G-BGA-03-A Component Stencil Kits Optional Stencils Component Stenciling Tool Kit, 35mm Component Stenciling Tool Kit, 35mm Component Stenciling Tool Kit, 27mm Component Stenciling Tool Kit, 27mm Component Stenciling Tool Kit, 23mm Component Stenciling Tool Kit, 23mm Component Stenciling Tool Kit, 17mm Component Stenciling Tool Kit, 17mm Component Stenciling Tool Kit, 15mm Component Stenciling Tool Kit, 15mm Component Stenciling Tool Kit, 13mm Component Stenciling Tool Kit, 13mm x 10mm Component Stenciling Tool Kit, 12mm CSP Component Stenciling Tool Kit, 11mm x 8mm CSP Component Stenciling Tool Kit, 40mm Component Stenciling Tool Kit, 40mm w/ Pedestal Top Component Stenciling Tool Kit, 25mm Component Stenciling Tool Kit, 25mm Stencil, 35mm x 388 Stencil, 35mm x 456 Stencil, 35mm x 313 Stencil, 35mm x 352 Stencil, 35mm x 480 Stencil, 27mm x 352 Stencil, 27mm x 316 Stencil, 27mm x 225 Stencil, 27mm x 256 Stencil, 27mm x 272 Stencil, 27mm x 292 Stencil, 27mm x 324 Stencil, 27mm x 328 Stencil, 27mm x 336 Stencil, 23mm x 169 Stencil, 23mm x 288 Stencil, 23mm x 324 Stencil, 23mm x 208 Stencil, 23mm x 256 Stencil, 23mm x 484 Stencil, 17mm x 208 Stencil, 17mm x 256 Stencil, 15mm x 156 Stencil, 15mm x 160 Stencil, 15mm x 196 Stencil, 15mm x 196 Stencil, 13mm x 144 Stencil, 13mm x 64 Stencil, 12mm x 144 Stencil, 12mm x 160 Stencil, 11mm x 8 x 72 Stencil, 40mm x 503 Stencil, 40mm x 432 Stencil, 25mm x 357 Stencil, 25mm x 360 Component Stenciling Tool Kit, 19mm Component Stenciling Tool Kit, 19mm Socket Component Stenciling Tool Kit, 16.5mm x 8mm CSP Component Stenciling Tool Kit, 33mm Component Stenciling Kit, 22mm x 14mm Component Stenciling Tool Kit, 4mm LCC Component Stenciling Tool Kit, 31mm Component Stenciling Tool Kit, 31mm Component Stenciling Tool Kit, 8mm x 10mm Stencil, 19mm x 225 Stencil, 19mm x 52 Stencil, 16.5 x 8 x 52 Stencil, 33mm x 503 Stencil, 14 x 22 x 119 Stencil, 4mm x 24 Stencil, 4mm x 28 Stencil, 31mm x 304 Stencil, 31mm x 329 Stencil, 31mm x 316 Stencil, 8mm x P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P PACE Incorporated. Manual Assembly and Rework For Surface Mount 42 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

52 Process Guide G-FLO-00-A Surface Mount Land Preparation (General) Endura Flo-D-Sodr Tip SX-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability SX-80 Handpiece SX-80 Tip & Tool Stand P P1 Flo-D-Sodr Tip Tip Tool OPTIONAL EQUIPMENT P1 PACE Prep-Set TM System (solder pot) , FPO 0003 or MATERIALS (approved by your organization) Flux-cored Solder Flux Cleaner Tissue/Wipes PROCEDURE 1. Remove conformal coating (if any) and clean work area of any contamination, oxides, residues or fluxes. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install Flo-D-Sodr tip into the SX-80 using Tip Tool. 4. Apply flux to all land areas. ➀ 5. Thermal shock tip with damp Sponge in the SX-80 Tip & Tool Stand. 6. Tin bottom of tip with solder or use Prep-Set. ➁ 7. Lower tip at right angles to PCB, contacting land(s) at end of row with tip.➂ 8. Confirm solder melt of contacted land(s), apply vacuum and slowly sweep tip over remaining lands in row, successively melting and extracting excess solder. ➃ 9. Lift tip at end of the row, hold vacuum for an additional 5 seconds to clear all molten solder from the heater chamber. ➄ 10. Repeat steps 7-9 for remaining rows. ➀ ➁ ➂ ➃ Flux Lands Tin Tip Position Tip Melt solder and Apply Vacuum FPO 11. Re-tin tip end with solder and return the SX-80 to its Tip & Tool Stand. 12. Clean lands as required for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 43 ➄ Lift Handpiece

53 G-FLO-00-A ENDURA PRECISION FLO-D-SODR TIPS Allows all 1/8"" shank Micro Tips to be used with the SX-80 Handpiece. Tip Outside Diameter Inside Diameter Par art Flo-D-Sodr, Precision 1.78mm (0.070") 0.50mm (0.020") P5 Flo-D-Sodr, Precision 2.03mm (0.060") 0.76mm (0.030") P5 Flo-D-Sodr, Precision 2.29mm (0.090") 1.02mm (0.040") P5 44 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

54 Process Guide G-FLO-01-A Surface Mount Land Preparation (Fine Pitch) Endura Precision Flo-D-Sodr Tip SX-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability SX-80 Handpiece P1 SX-80 Tip & Tool Stand Endura Precision Flo-D-Sodr Tip See chart on back ➀ Install Tip Tip Tool P1 OPTIONAL EQUIPMENT - N/A MATERIALS (approved by your organization) Flux ➁ Flux Lands Cleaner PROCEDURE 1. Remove conformal coating (if any) and clean work area of any contamination, oxides, residues or fluxes. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install the Precision Flo-D-Sodr Tip into SX-80 using Tip Tool.➀ 4. Apply flux to all land areas. ➁ 5. Lower tip to PCB contacting land(s) at end of rom with tip.➂ 6. Confirm solder melt of contacted land(s), apply vacuum and sweep tip along the length of land (or group of lands) to extract excess solder. ➃ Repeat for remaining lands in row. 7. Lift tip after extracting last land(s) in row and hold vacuum for an additional 5 seconds to clear all molten solder from the heater chamber. ➄ 8. Repeat steps 5-9 for remaining rows. 9. Return SX-80 to its Tip & Tool Stand. ➂ ➃ Position Tip Melt solder and Apply Vacuum FPO 10. Clean lands as required for component replacement. JAN201 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 45 ➄ Lift Handpiece

55 G-FLO-01-A ENDURA PRECISION FLO-D-SODR TIPS Allows all 1/8"" shank Micro Tips to be used with the SX-80 Handpiece. Tip Outside Diameter Inside Diameter Par art Flo-D-Sodr, Precision 1.78mm (0.070") 0.50mm (0.020") P5 Flo-D-Sodr, Precision 2.03mm (0.060") 0.76mm (0.030") P5 Flo-D-Sodr, Precision 2.29mm (0.090") 1.02mm (0.040") P5 46 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

56 Process Guide G-THR-00-A Thru Hole Desoldering (Flat Lead Component) Endura ThermoDr modriv ive Tip SX-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability SX-80 Handpiece P1 SX-80 Tip & Tool Stand P1 ThermoDrive Tip See chart on back Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Flux Cleaner Tissue/Wipes ➀ ➁ Install Tip Position Tip PROCEDURE 1. Remove conformal coating (if any) and clean work area of any contamination, oxides, residues or fluxes. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install ThermoDrive Tip into the SX-80 using Tip Tool. ➀ 4. Thermal shock tip on damp sponge from Tip & Tool Stand. 5. Tin tip with solder or use Prep-Set. 6. Lower tip, contacting solder connection at right angles. ➁ 7. Confirm complete solder melt of joint through to the component side. ➂ 8. Move lead back and forth (flat leads) or in a circle (round leads) and apply vacuum while continuing lead movement. ➃ 9. Lift tip from lead and hold vacuum for an additional 2 seconds to clear all molten solder from heater chamber. ➄ 10. Repeat for all other solder connections, skipping adjacent joints to minimize heat build up. When all joints have been desoldered, the component should lift easily. If not, see the "Solder Extraction Troubleshooting" Process Guide. 11. Re-tin tip end with solder and return the SX-80 to its Tip & Tool Stand. 12. Clean lands as required for component replacement. FPO Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 47 ➂ Complete Solder Melt ➃ ➄ Move Lead and Apply Vacuum Continue ue Vacuum/ Lift Handpiece

57 G-THR-00-A ENDURA DESOLDERING TIPS Allows all 1/8"" shank Micro Tips to be used with the SX-80 Handpiece. Outside Diameter Inside Diameter Par art Thermo-Drive 2.03mm (0.080") 0.76mm (0.030") P5 Thermo-Drive 2.29mm (0.090") 1.02mm (0.040") P5 Thermo-Drive 3.05mm (0.120") 1.52mm (0.060") P5 Thermo-Drive 5.1mm (0.200") 2.29mm (0.090") P5 Thermo-Drive, Flathead (0.110") x (0.190") (0.050") x (0.090") P5 Extended Reach Thermo-Drive 2.29mm (0.090") 0.76mm (0.030") P5 Extended Reach Thermo-Drive 2.54mm (0.10") 1.02mm (0.040") P5 Extended ReachThermo-Drive 3.05mm (0.120") 1.52mm (0.060") P5 Precision 1.79mm (0.070") 0.50mm (0.020") P5 Precision 2.03mm (0.080") 0.76mm (0.030") P5 Precision 2.29mm (0.090") 1.02mm (0.040") P5 Precision 2.79mm (0.110") 1.52mm (0.060") P5 Precision 3.55mm (0.140") 2.29mm (0.090") P5 48 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

58 Process Guide G-THR-01-A Thru Hole Desoldering (Round Lead Component) Endura ThermoDr modriv ive Tip SX-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability SX-80 Handpiece P1 SX-80 Tip & Tool Stand P1 ThermoDrive Tip See chart on back Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Flux Cleaner Tissue/Wipes ➀ ➁ Install Tip Position Tip PROCEDURE 1. Remove conformal coating (if any) and clean work area of any contamination, oxides, residues or fluxes. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install ThermoDrive Tip into the SX-80 using Tip Tool. ➀ 4. Thermal shock tip on damp sponge from Tip & Tool Stand. 5. Tin tip with solder or use Prep-Set. 6. Lower tip, contacting solder connection at right angles. ➁ 7. Confirm complete solder melt of joint through to the component side. ➂ 8. Move lead in in a circle (round leads) or back and forth (flat leads) and apply vacuum while continuing lead movement. ➃ 9. Lift tip from lead and hold vacuum for an additional 2 seconds to clear all molten solder from heater chamber. ➄ 10. Repeat for all other solder connections, skipping adjacent joints to minimize heat build up. When all joints have been desoldered, the component should lift easily. If not, see the "Solder Extraction Troubleshooting" Process Guide. 11. Re-tin tip end with solder and return the SX-80 to its Tip & Tool Stand. 12. Clean lands as required for component replacement. ➄ Continue ue Vacuum/ Lift Handpiece Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 49 ➂ ➃ F P O Complete Solder Melt Move Lead and Apply Vacuum FPO

59 G-THR-01-A ENDURA DESOLDERING TIPS Allows all 1/8"" shank Micro Tips to be used with the SX-80 Handpiece. Outside Diameter Inside Diameter Par art Thermo-Drive 2.03mm (0.080") 0.76mm (0.030") P5 Thermo-Drive 2.29mm (0.090") 1.02mm (0.040") P5 Thermo-Drive 3.05mm (0.120") 1.52mm (0.060") P5 Thermo-Drive 5.1mm (0.200") 2.29mm (0.090") P5 Thermo-Drive, Flathead (0.110") x (0.190") (0.050") x (0.090") P5 Extended Reach Thermo-Drive 2.29mm (0.090") 0.76mm (0.030") P5 Extended Reach Thermo-Drive 2.54mm (0.10") 1.02mm (0.040") P5 Extended ReachThermo-Drive 3.05mm (0.120") 1.52mm (0.060") P5 Precision 1.79mm (0.070") 0.50mm (0.020") P5 Precision 2.03mm (0.080") 0.76mm (0.030") P5 Precision 2.29mm (0.090") 1.02mm (0.040") P5 Precision 2.79mm (0.110") 1.52mm (0.060") P5 Precision 3.55mm (0.140") 2.29mm (0.090") P5 50 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

60 Process Guide G-TIP-00-A Tip Selection Selection of the proper tip for any assembly, rework or repair procedure is critical to the success of the operation. The most critical factors to consider during tip selection are discussed below. 1. SURFACE MOUNT COMPONENT REMOVAL: Tips for SMT removal applications must fit over (or around) the component body, and contact all the solder joints at once, to achieve simultaneous reflow. When all the solder joints reflow completely, the component can be removed safely. ➀ "Thermal enhancement" techniques such as a "Solder bridge" enhance the "Thermal linkage" between the tip and the solder joints. SOIC PLCC 2. THRU-HOLE AND SINGLE POINT SURFACE MOUNT SOLDERING: Tips for thru-hole and general purpose, single point soldering must be selected to maximixe the effective heat transfer between the tip and the solder joint. Thermal capacity can be maximized by selecting the shortest, thickest tip with the largest surface contact area which appropriately fits the work. ➁ When soldering, angle the tip to the joint so there is maximum surface contact area. The use of a Solder bridge to enhance Thermal linkage will also improve heat transfer.➂ The tip must be kept clean and freshly tinned and the work must be clean of oxides and other residues. ➀ QFP Surface Mount Removals 3. TIP ACCESS & VISIBILITY: In all applications, the tip selected must easily contact the joint(s) without touching the board substrate, adjacent components or other solder joints. Longer, thinner, surface mount and thru-hole tips allow the operator to more easily access and view the solder joint during soldering for better process control. However, such tips generally have much less heat transfer ability than shorter, thicker tips. 4. TIP TEMPERATURE: Use the lowest tip temperature which will achieve rapid, complete, yet controllable melt of the solder joint(s). Begin with a temperature of 316 C (600 F) and adjust as necessary to suit the particular application, operator skill level and your organization s internal requirements. Lower tip temperatures reduce the risk of damage and increase tip life without sacrificing productivity. ➁ Maximize Heat Transf ansfer er Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 51 ➂ Maximize e Surface Contact Area

61 Process Guide G-TIP-01-A Tip Preparation and Maintenance Proper tip preparation and maintenance will insure optimum results and increase tip life. This includes cleaning and tinning of single point and surface mount tips. Why should you spend the time to perform proper tip preparation and maintenance? Proper tip care and maintenance allows you to use the lowest possible operating temperatures with maximum heat transfer, thereby reducing the possibility of PCB damage. This will result in high quality repairs and extended tip life, which will save money on replacement tips and increase productivity by reducing maintenance down-time. Cleaning/Tinning Procedure: Tip Cleaning/Tinning: Proper cleaning and tinning of a tip will remove oxidation and increase heat transfer to the solder joint(s). This layer of solder on the working end of the tip also protects the plated surface beneath and extends tip life. The following procedure provides general guidelines for tip cleaning and tinning. 1. Install the tip in the handpiece. Allow time for the tip to reach the selected temperature (316 C/600 F recommended). ➀ ➁ Cleaning Tips Using Sponge Tool Wire Solder Tinning Single Point oint Tips Wire Solder 2. Remove all solder dross and flux residues from the tip by wiping the tip on a moistened sponge. Wiping of the tip on a dry or debris-filled sponge may contaminate the tip and ultimately the pcb. The PACE Tip Maintenance Station (P/N ) is essential for the proper preparation and maintenance of surface mount removal tips. The Sponge Tool and Fiber Tool from the Tip Maintenance Station should be used to effectively remove any heavy accumulations of flux or solder residue. (refer to ➀) Wire Solder 3. Using a large gauge, flux core wire solder, tin the tip end in the following manner. a) Single Point Tips (refer to ➁) - Place a small amount of solder on each surface of the tip end. Wipe off excess solder (except Mini-Wave tip). b) Surface Mount Removal & Flat Blade Tips (refer to ➂) - Place a bead of solder along the length of the bottom edge of each tip blade. c) Chip & SOT Tips (refer to ➂) - Place a bead of solder along the inside edges of the tip end. Wire Solder 4. Place the handpiece in its Tip & Tool Stand. NOTE: See page 2 of this Process Guide for details on other factors affecting tip life and performance. Tinning ➂ Surface Mount Tips Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 52

62 G-TIP-01-A Besides tip cleaning and tinning, the following factors also have a critical affect on tip life and performance. Tip Temper emperature: Always use the lowest tip temperature required to perform the soldering/desoldering operation to minimize the possibility of heat damage to the PCB. PACE recommends the use of a starting tip temperature of 316 C (600 F). The operator should then adjust the temperature as necessary to perform the required operation. High tip temperatures will increase the rate of tip oxidation and will require more frequent tinning. Tip life will also decrease as the tip temperature is increased. Tip Reconditioning (with Procedure): Tips can be reconditioned using a solder bath. This will remove heavy oxidation from the surface of a tip that you may not be able to remove using the standard tinning procedure. If the plated surface of the tip has not deteriorated: 1. Insure that the selected solder bath is at desired temperature (316 C/600 F recommended). PACE recommends use of one of its Prep-Set systems with an installed Pot-Tip. 2. Install the tip to be reconditioned in a handpiece set at a temperature of 316 C (600 F) or as required. 3. Dip the end of the tip into a flux approved for use by your company. Refer to ➂. 4. Dip the working end of the tip into the solder bath ➂. 5. Lift the tip from the solder bath. Usage of Flux/Flux Types: The use of mildly activated rosin fluxes when soldering and desoldering removes oxidation from the work and increases thermal transfer between the tip and the solder joint(s). Lower tip temperatures can then be used which will result in longer tip life with less chance of pcb damage. No-clean and water soluble fluxes are more corrosive and will adversely affect tip life. In many cases, the tip life expectancy using no-clean fluxes will be half of the life expectancy with rosin fluxes. 53 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

63 SX-70 Sodr-X-Tractor Maintenance Process Guide M-SXT-00-A -00-A Sodr-X-Tractor Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability SX-70 Sodr-X-Tractor P1 SX-70 Tip & Tool Stand Tip Tool P1 Bristle Brush Wire Brush, 3/16" Wire Brush, 1/8" Sodr-X-Tractor Tip Cleaning Kit Pliers MATERIALS (approved by your organization) Filter Element VisiFilter Element Flux-cored Solder Cleaner Mineral Oil (optional) PROCEDURE ➀ ➁ Clean Tip Clean Large Heater Bore 1. Set a tip temperature of 315 C (600 F). 2. Hold Sodr-X-Tractor up at an angle for all handpiece cleaning procedures. 3. If required, use pliers to hold one of the Tip Cleaners from the Sodr-X-Tractor Tip Cleaning Kit and clean the tip bore. Apply vacuum while cleaning tip. ➀ 4. Hold vacuum on for 5 seconds after removal of tip cleaner. ➂ Clean Small Heater Bore 5. Remove tip installed into Sodr-X-Tractor using Tip Tool. 6. (Once daily) Using pliers to hold the biggest of the two brushes (3/16"), clean the wider portion of heater bore (front, first inch). Apply vacuum while cleaning heater. ➁ 7. (Once daily) Using pliers to hold the remaining smaller brush (1/8"), clean the rear portion of heater. Apply vacuum while cleaning heater. ➂ ➃ Remove e Chamber 8. Apply vacuum for 5 seconds after removal of smaller brush from heater. 9. Remove end cap assembly with Solder Collection Chamber from handpiece. ➃ FPO 10. Remove "S" Baffle and Felt Filter Element from solder collection chamber using Bristle Brush. ➄ Discard filter element. (Continued on back) and Filter Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 54 ➄ Remove e S Baffle

64 M-SXT-00-A -00-A (Continued) 11. Clean solder collection chamber and "S" baffle using bristle brush and Cleaner (Optional) Place one drop of Mineral Oil on bristle brush to apply a very thin film on "S" baffle and inside solder collection chamber. 6 Clean S Baffle 13. Re-assemble solder collection chamber with "S" baffle and new filter element Insert end cap assembly onto solder collection chamber with "S" baffle and new filter element and install into Sodr-X-Tractor Inspect for proper seating of solder collection chamber on front and rear seals. 9 7 Re-assemble le Chamber 16. Install tip into Sodr-X-Tractor using tip tool. 17. (Once daily) Separate VisiFilter and replace filter element. ➉ 18. Snap VisiFilter together and reinstall on power supply in vacuum port. 8 Reassemble le Handpiece 19. Cover tip end with solder. Actuate vacuum to confirm vacuum at tip. (If not, check fittings, hoses, filter, etc.) 20. Re-tin tip with solder and return Sodr-X-Tractor to its Tip & Tool Stand. 9 Check k Front Seal ➉ Replace Element 55 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

65 Process Guide M-SXT-01-A -01-A Solder Extraction Troub roubleshooting During thru-hole solder extraction procedures or surface mount land preparation using a solder extractor, there are several key factors that may cause poor performance or inconsistent results. Use the following table to troubleshoot the problem. For details on how to perform most of the corrective actions below, refer to the "SX-70 Sodr-X-Tractor Maintenance" Process Guide (M-SXT-00-A) or the PACE SX-70 Video Manual. All corrective actions taken to solve problems in observation #1 can be verified by performing the "Tip Vacuum" test on the PACE Process Monitor. Observation Possible Cause Corrective Action 1. Loss of vacuum at the tip or solder not effectively extracted into the collection chamber. a. Tip clogged a. Clean bore of hot tip with PACE tip cleaners. b. Heater clogged or contaminated with oxidation. c. VisiFilter filled with flux residue (VisiFilter may also be discolored if rosin flux is being used). d. Collection chamber filled with solder. e. Collection chamber not properly seated on front and/or rear seals. f. Vacuum hoses clogged, kinked or hose connections not properly seated. b. While hot, clean heater bore with wire brushes. c. Replace fixed VisiFilter or replace filter element in replaceable VisiFilter. d. Clean chamber, replace felt filter, clean and re-install s-baffle. e. Remove chamber, inspect seals and replace or reinstall. f. Check hose connections, clear hoses, and replace if necessary. Note: If some solder remains in the thru-hole(s) after the extraction process, the solder joint(s) must first be re-filled with solder. ➀ Only then should another extraction be attempted. This will maximize heat transfer and help prevent damage to the pcb. ➀ Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 56

66 M-SXT-01-A -01-A Observation Observation Possible Possible Cause Cause Corrective Corrective Action Action 2. Complete solder melt does not occur or takes too long. a. Oxidation or residue on tip. a. Clean tip on damp sponge and tin (if applicable). b. Tip may be worn or damaged as a result of regular use. b. Replace tip. c. Wrong tip is being used. c. Replace tip. Choose a tip with an i.d. that fits around the component leads and an o.d. that does not overhang the thru-hole pads. 3. Tip-to-ground resistance out of specification. d. Oxidation or residue on solder joints. e. High mass pcb requires preheating (see "GENERAL" section for details on preheating). f. High mass pcb or solder joint requires auxiliary heating (see "GENERAL" section for details on auxiliary heating). Oxidation build-up on tip or inside heater. d. Clean pcb with an approved cleaner and retry the application. e. Utilize a preheater such as the PACE HeatWave to effectively preheat the pcb area being reworked. ➁ f. Utilize a soldering iron or pulse heated tool on the component side of the lead to effectively melt the solder before actuating the vacuum. Clean tip and heater bore and re-measure resistance. ➂ ➁ ➂ 57 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

67 BGA Removal Process Guide R-BGA-00-A BGA Removal Tip Dual ThermoPik Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability DTP-80 Dual ThermoPik P1 DTP-80 Tip &Tool Stand BGA Removal Tip See chart on back Tip and Vacuum Cup Tool P1 OPTIONAL EQUIPMENT ➀ Install Tip MATERIALS (approved by your organization) Cleaner PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. ➁ Install Vacuum Cup 2. Start with a tip temperature of 371 C (700 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip. (see chart on back) 4. Install BGA Removal Tip and vacuum cup into Dual ThermoPik using Tip and Vacuum Cup Tool. ➀&➁ ➂ Position Tip 5. Lower tip and contact component.➂ 6. Confirm complete solder melt of ALL joints.➃ 7. Actuate vacuum and lift component from PCB. ➄ ➃ Melt All Joints 8. Release component onto a heat resistant surface. 9. Return Dual ThermoPik to its Tip & Tool Stand. 10. Prepare lands for component replacement. Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 58 ➄

68 R-BGA-00-A BGA REMOVAL TIPS DESCRIPTION TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F BGA mm x 22.4mm (0.88" x 0.88") Application BGA mm x 33.8mm (1.33" x 1.33") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

69 Process Guide R-BGA-50-A The following process can be performed with a PACE TF 2000 TF 2000 BGA Component Removal EQUIPMENT REQUIRED PACE PAR ART NUMBER PACE TF BGA Removal Nozzle As Applicable OPTIONAL EQUIPMENT N/A MATERIALS N/A ➀ Install Nozzle PROCEDURE 1. Select and transfer the appropriate removal profile. If a profile does not exist, see process guide G-BGA-01-A for profile development. 2. Install appropriate nozzle on the TF ➀ ➁ Position Component 3. Adjust board holder to accommodate the PCB and tighten as necessary. 4. Index the sliding shaft holder to the far left position under the reflow head assembly. 5. Position the component to be removed under the nozzle. ➁ ➂Activ Activate ate "Cycle Start" t" 6. Lower the nozzle so that if possible it completely surrounds the component and is in gentle contact with the PCB surface. 7. Activate the profile cycle by depressing the "Cycle Start" button. ➂ 8. Approximately 10 seconds prior to the end of the cycle, activate the vacuum by depressing the vacuum button. ➃ ➃ Activate "Vacuum" 9. Upon completion of the cycle and retraction of the nozzle, immediately lift the component off the board using the vacuum wand. ➄ 10. Allow the PCB and component to cool. Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 60 ➄

70 R-BGA-50-A TF 2000 Nozzles Dimensions Maximum Size of Component* Part Number 8mm x 8mm (0.31" x 0.31") 5mm x 5mm (0.19" x 0.19") mm x 11mm (0.35" x 0.43") 6mm x 8mm (0.24" x 0.31") mm x 15.7mm (0.44" x 0.62") 8.2mm x 12.7mm (0.32" x 0.5") mm x 12mm (0.47" x 0.47") 9mm x 9mm (0.35" x 0.35") mm x 13mm (0.51" x 0.51") 10mm x 10mm (0.39" x 0.39") mm x 16mm (0.63" x 0.63") 13mm x 13mm (0.51" x 0.51 ) mm x 18mm (0.71" x 0.71") 15mm x 15mm (0.59" x 0.59") mm x 20mm (0.79" x 0.79") 17mm x 17mm (0.67" x 0.67") mm x 26mm (1.02" x 1.02") 23mm x 23mm (0.90" x 0.90") mm x 30mm (1.18" x 1.18") 27mm x 27mm (1.06" x 1.06") mm x 38mm (1.53" x 1.53") 35mm x 35mm (1.37" x 1.37") mm SQ mm x 8mm MM x 12.7mm mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ LQFP, 22mm SQ LQFP, 16mm SQ LQFP, 30mm SQ LQFP, 9mm SQ LQFP, 12mm SQ LQFP, 26mm SQ Nozzle, LQFP, 16mm x 22mm Nozzle, LQFP, 14mm SQ Nozzle, 14mm x 22mm Nozzle, 50mm SQ Nozzle, 60mm SQ Nozzle, 40mm SQ Nozzle, 25mm SQ Nozzle 19mm SQ Nozzle, 16.5mm x 8mm Nozzle, 33mm SQ Nozzle, 21mm x 25mm Nozzle, 29mm SQ Nozzle, 31mm SQ Nozzle, 42mm SQ Nozzle, Conn, 16mm x 13mm Nozzle, Conn, 27mm x 13mm Nozzle, Conn, 30mm x 12mm Nozzle, Conn, 19mm x 8mm Nozzle, 56mm x 17mm Nozzle, w/ Baffle 28mm x Nozzle, 13mm x 10mm * Nozzles can also be used on components smaller than "Max Size". Custom nozzles can be ordered by contacting PACE. 61 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

71 Process Guide R-BGA-70-A ThermoFlo BGA Nozzle ThermoFlo System BGA Removal EQUIPMENT REQUIRED PACE ThermoFlo System (115V) (230V) BGA Vented Alignment Nozzle See chart on back PACE Rubber Pad OPTIONAL EQUIPMENT N/A MATERIALS (approved by your organization) N/A ➀ Position Component PROCEDURE 1. Set ThermoFlo to 400 C (750 F). Set blower speed to 3. Adjust temperature/ time cycle as necessary. Timed or Program mode should be used for this procedure. 2. Install BGA Vented Alignment nozzle onto ThermoFlo handpiece and raise nozzle to highest position. ➁ Lower Nozzle 3. Loosen adjustment knobs and place circuit board into ThermoFlo Work Holder. 4. Position component to be removed under nozzle. ➀ 5. Lower nozzle until it is slightly above the component. ➁ 6. Check alignment and make adjustments as needed. 7. Adjust vacuum pik to proper height so that the vacuum cup touches the component body as the nozzle comes around the component. ➂ Nozzle To o BGA 8. Lower nozzle over component and commence reflow cycle. ➂ 9. Five seconds prior to the completion of the heat cycle (assuming proper cycle time in Timed or Program modes), the vacuum will automatically activate. The nozzle (with component attached to vacuum cup) can then be raised from the PCB. ➃ 10. Allow board to cool prior to board removal from Workpiece Holder. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 62 ➃ Raise Nozzle & BGA

72 R-BGA-70-A Availab ailable le ThermoFlo Nozzles Box BGA Part Alignment Nozzles Component Size Numbers Templates BGA-204/225/256/ 27mm x 27mm (1.1" x 1.1") /292/320/ BGA-169/168 23mm x 23mm (0.91" x 0.91") BGA-313/352 35mm x 35mm (1.38" x 1.38") BGA mm x 13mm (0.51" x 0.51") BGA-121/196 15mm x 15mm (0.59" x 0.59") BGA mm x 17.75mm (0.64" x 0.70") BGA mm x 14.97mm (0.53" x 0.59") BGA mm x 10.42mm (0.41" x 0.41") BGA-40/ mm x 13.21mm (0.47" x 0.52") BGA mm x 8.90mm (0.34" x 0.35") BGA-292/357/361 25mm x 25mm (0.99" x 0.99") BGA-421/432/736 40mm x 40mm (1.57" x 1.57") BGA mm x 42.5mm (1.67" x 1.67") BGA-240/304/432 31mm x 31mm (1.22" x 1.22") BGA mm x 17mm (0.67" x 0.67") BGA-252/255/256 21mm x 21mm (0.83" x 0.83") BGA-479/493/ mm x 37.5mm (1.48" x 1.48") BGA-96/121 19mm x 19mm (0.75" x 0.75") BGA-240/324 32mm x 32mm (1.26" x 1.26") BGA-256/400 29mm x 29mm (1.14" x 1.14") BGA mm x 16mm (0.63" x 0.63") BGA mm x 14mm (0.87" x 0.55") BGA mm x 19.25mm (0.76" x 0.76") BGA mm x 18.5mm (0.73" x 0.73") BGA mm x 26.4mm (1.04" x 1.04") BGA mm x 30mm (1.18" x 1.18") BGA mm x 32.3mm (0.98" x 1.27") BGA mm x 43mm (1.69" x 1.69") BGA mm x 44mm (1.73" x 1.73") BGA mm x 32.5mm (1.28" x 1.28") BGA mm x 22mm (0.87" x.87") BGA mm x 33mm (1.29" x 1.29") BGA mm x 47.5mm (1.87" x 1.87") BGA mm x 25mm (0.83" x 0.98") Micro BGA mm x 5.6mm (0.31" x 0.22") Micro BGA mm x 6.40mm (0.31" x 0.25") Custom-designed nozzles can be manufactured to meet your exacting specifications 63 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

73 Chip Component Removal Process Guide R-CHP-00-A Flux Application Chip Removal Tip PS-80 Handpiece EQUIPMENT REQUIRED PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install the Chip Removal Tip into Sodr-Pen using the Tip Tool. 4. Apply flux to all lead/land areas. ➀ 5. Remove old solder from tip with Fiber Tool from Tip Maintenance Station. 6. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 7. Apply solder to inside of tip forming a crown or use Prep-Set. ➁ 8. Lower tip over component until Tip contacts solder joints. ➂ & ➃ 9. Confirm solder melt and lift component from PCB. ➃ & ➄ (Surface tension of the tip should lift the component form the board. If this does not occur, use of tweezers to lift the component is optional) 10. Release component from tip by wiping on a heat resistant surface. 11. Re-tin tip with solder and return the PS-80 to its Tip & Tool Stand. 12. Prepare lands for component replacement. PACE PART NUMBER PACE SensaTemp power supply PS-80 Handpiece PS-80 Tip & Tool Stand P P1 Surface Mount Removal Tip See chart on back Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or Tweezers MATERIALS (approved by your organization) Flux-cored Solder Flux Cleaner ➀ ➁ ➂ ➃ Apply Flux FPO Tin Tips Position Tip Melt All Joints Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 64 ➄ Lift Component

74 R-CHP-00-A SURFACE MOUNT REMOVAL TIP DESCRIPTION (suggested application) TIP SIZE A X B PART NUMBER B A Chip Component 2.36mm x 2.03mm (0.093" x 0.080") B A 3.56mm x 2.03mm (0.14" x 0.08") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

75 Chip Component Removal Process Guide R-CHP-10-A Flux Application Chip Removal TIps ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp power supply TT-65 ThermoTweez P1 TT-65 Tip & Tool Stand Surface Mount Removal Tips see chart on back Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT N/A MATERIALS (approved by your organization) Flux Cleaner PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. ➀ ➁ Flux Component Clean Tip 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip. (see chart on back) 4. Install and align Chip Removal Tips into ThermoTweez. ➂ Position Tip 5. Apply flux to the component terminations. ➀ 6. Clean any residue from tips with Fiber Tool from Tip Maintenance Station. ➁ 7. Lower tips over component and gently tweeze handpiece contacting ALL solder joints.➂ & ➃ ➃ Melt All Joints 8. Confirm complete solder melt of ALL ALL joints and lift component from PCB. ➃ & ➄ 9. Release component onto a heat resistant surface. 10. Return ThermoTweez to its Tip & Tool Stand. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 66 ➄ Lift Component

76 R-CHP-10-A SURFACE MOUNT REMOVAL TIPS DESCRIPTION TIP SIZE (A) PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F Angled Chip Component (vertical) 0.76mm (0.03") Vertical Chip Component (vertical) 2.00mm (0.08") A Chip Component (vertical) 4.1mm (0.16") A Application Chip Component (vertical) Small SOIC 6.4mm (0.25") SOT Component 45 Angle Chip Component 2.54mm (0.10") Thin-Walled Chip Component (vertical) 0.76mm (0.03") Thin-Walled Chip Component (vertical) 2.0mm (0.08") A Thin-Walled Chip Component (vertical) 4.1mm (0.16") Thin-Wall: Chip Component & 6.4mm Thickness = 0.43mm (0.017") Small SOIC (vertical) (0.25") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

77 Chip Component Removal Process Guide R-CHP-11-A Flux Application 1/64" Angled Fine Point Conical Tip ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp power supply TT-65 ThermoTweez P1 TT-65 Tip & Tool Stand /64" Angled Fine Point Conical Chip Component Tip Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT N/A MATERIALS (approved by your organization) Flux Cleaner PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. ➀ ➁ Flux Component Clean Tip 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary 3. Install and align tips into ThermoTweez. 4. Apply flux to the component terminations. ➀ ➂ Position Tip 5. Clean any residue from tips with Fiber Tool from Tip Maintenance Station. ➁ 6. Lower tips over component and gently tweeze handpiece contacting ALL solder joints. ➂ & ➃ 7. Confirm complete solder melt of ALL joints and lift component from PCB. ➃ & ➄ 8. Release component onto a heat resistant surface. ➃ Melt All Joints 9. Return ThermoTweez to its Tip & Tool Stand. 10. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 68 ➄ Lift Component

78 Chip Removal Process Guide R-CHP-20-A Bottom Ter ermination only Mini ThermoJet Tip Mini ThermoJet Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Pressure Capability TJ-70 Mini ThermoJet P1 TJ-70 Tip & Tool Stand Mini ThermoJet Tip see chart on back Tip Tool Tweezers OPTIONAL EQUIPMENT N/A MATERIALS (approved by your organization) Flux Cleaner Tissue/wipe ➀ Flux Component PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a heater temperature of 427 C (800 F) and adjust as necessary. 3. Install Mini ThermoJet Tip into ThermoJet Handpiece using Tip Tool. 4. Apply flux to component terminations. ➀ 5. Starting at MINIMUM, adjust pressure output (on power supply) so hot air scorches a tissue from approximately 0.5cm (0.2") away. ➁ 6. Direct hot air over component with tip at a distance of.5cm (.2") to achieve solder melt. ➂ 7. Confirm complete solder melt of ALL joints and lift component from PCB. ➃ 8. Release component onto a heat resistant surface. ➁ ➂ Adjust Pressure Melt All Joints 9. Return ThermoJet to its Tip & Tool Stand. 10. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 69 ➃ Lift Component

79 R-CHP-20-A TIP DESCRIPTION TIP SIZE PART NUMBER Small, Straight, Single Jet Tip Small, Curved Single Jet Tip SOT/Chip Component Tip (dual-jet) A = 3.56mm (0.14") SOIC Tip (dual-jet) A = 4.32mm (0.17") A SOICL Tip (dual-jet) A = 9.40mm (0.37") A = 7.11mm (0.28") B = 1.88mm (0.074") Flat End Tip A B A = 6.10mm (0.24") B = 1.88mm (0.074") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

80 Process Guide R-CHP-70-A THERMOFLO SINGLE JET NOZZLE F P O ThermoFlo Unit CHP Removal EQUIPMENT REQUIRED PACE ThermoFlo Unit (115V) (230V) QFP QuickFit Nozzle See chart on back PACE Rubber Pad Pace PV-65 Pik-Vac Wand P1 OPTIONAL EQUIPMENT Tweezers Locally Obtained MATERIALS (approved by your organization) Cleaner Locally Obtained Flux Locally Obtained ➀ F P O Flux Component PROCEDURE 1. Set temperature, blower speed and cycle time controls to the required settings to optimize performance. Manual or Timed modes are typically used for this procedure. F P O 2. Install QuickFit Nozzle into the ThermoFlo handpiece. (Use Rubber Pad if nozzle is hot) ➁ Adjust Blower Speed 3. Apply flux to component leads. (optional) ➀ 4. Starting at blower speed one, adjust blower speed (on power supply) until air scorches a tissue from approximately 0.5cm (0.2") away. ➁ 5. Position nozzle over component to be removed. (Distance from component is variable on air blower speed and temperature selection) ➂ Melt All Joints 6. Commence reflow cycle and move handpiece as necessary to obtain complete solder melt of all leads. ➂ 7. Confirm complete solder of all joints. ➂ F P O 8. Remove component using Pik-Vac Wand or Tweezers. ➄ Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 71 ➃

81 R-CHP-70-A Shape of Jet Tube Curved, Round Curved, Round Curved, Round Straight, Round Straight, Round Straight, Round Nozzle Size (Nominal) 3.0mm dia. (0.1" dia.) 5.0mm dia. (0.2" dia.) 8.0mm dia. (0.3" dia.) 3.0mm dia. (0.1" dia.) 5.0mm dia. (0.2" dia.) 8.0mm dia. (0.3" dia.) Part Number Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

82 LCCC Removal Process Guide R-LCC-02-A Flux Application LCCC Removal Tips ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply TT-65 ThermoTweez P1 TT-65 Tip &Tool Stand LCCC Removal Tips ThermoTweez (TT-65) Tip Alignment Tool Tip Tool See chart on back P P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , MATERIALS (approved by your organization) 0003 or Flux-cored Solder Flux Cleaner FPO PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tips. (see chart on back) 4. Install and align LCCC Removal Tips into ThermoTweez (using Tip Alignment Tool for LCCC tips 21.6mm x 21.6mm). 5. Apply flux to all solder joints. ➀ 6. Remove old solder from tips with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station. 8. Tin inside edges of tips with solder or use Prep-Set. ➁ 9. Tweeze handpiece contacting ALL 10. Confirm solder melt of ALL ALL solder joints with tips. ➂ & ➃ ALL joints and lift component from PCB. ➃ & ➄ 11. Release component onto a heat resistant surface. 12. Re-tin tips with solder and return ThermoTweez to its Tip & Tool Stand. 13. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 73 ➀ ➁ ➂ ➃ ➄ FPO Apply Flux Tin Tips Position Tips Melt All Joints Lift Component

83 R-LCC-02-A THIN-WALLED THIN-WALLED SURFACE SURFACE MOUNT MOUNT REMOVAL TIPS DESCRIPTION TIP SIZE PART TIP OFFSET CONSTANT DIGITAL SYSTEMS (suggested application) (A x B) NUMBER C F 6.6mm x 6.6mm Tip (0.26" x 0.26") P Removal Tips for 7.11mm x 7.11mm Motorola Pager LCCC Packages and Small, (0.28" x 0.28") P Fine-Pitch PQFPs 7.87mm x 7.87mm P (0.31" x 0.31") A B 8.13mm x 8.13mm Wall Thickness = P Application.64mm (0.025") (0.32" x 0.32") 9.16mm x 8.89mm Standard Height = P (0.40" x 0.35") 7mm (0.275") LCCC 13.2mm x 13.2mm P (0.52" x 0.52") LCCC REMOVAL TIPS DESCRIPTION (suggested application) TIP SIZE (A x B) PART NUMBER 6.6mm x 6.6mm Removal Tips for LCCC Tip Packages and Small, (0.26" x 0.26") P Fine-Pitch PQFPs 8.89mm x 6.35mm P Wall Thickness =.64mm (0.025") (0.35" x 0.25") 8.89mm x 8.89mm P (0.35" x 0.35") A B Reduced Height = 5.1mm (0.2") 21.6mm x 21.6mm P Application for high mass boards (0.85" x 0.85") LCCC 74 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

84 PLCC Removal Process Guide R-PLC-00-A Bridge Fill PLCC Removal Tips ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply TT-65 ThermoTweez P1 TT-65 Tip &Tool Stand PLCC Removal Tips See chart on back ThermoTweez (TT-65) Tip Alignment Tool P1 PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 Mini-Wave Tip Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Bridge Fill Tin Tips PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tips. (see chart on back) 4. Install and align PLCC Removal Tips into ThermoTweez (using Tip Alignment Tool for PLCC 44 pin count and above). 5. Melt solder to form a solder bridge fill joining all component leads using the PS-80 with Mini-Wave Tip installed. ➀ 6. Remove old solder from PLCC tips with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station. 8. Tin inside edges of tips with solder or use Prep-Set. ➁ 9. Lower tips over component and tweeze handpiece contacting ALL solder joints with tips. ➂ & ➃ 10. Confirm solder melt of ALL joints and lift component from PCB. ➃ & ➄ 11. Release component onto a heat resistant surface. 12. Re-tin tips with solder and return ThermoTweez to its Tip & Tool Stand. 13. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 75 ➂ ➃ ➄ Position Tips Melt All Joints Lift Component

85 R-PLC-00-A PLCC PLCC (or PQFP) (or PQFP) Removal Removal Tip Tip DESCRIPTION TIP SIZE PART TIP OFFSET CONSTANT DIGITAL SYSTEMS (including lead count) A x B NUMBER C F 8.64mm x 5.84mm PLCC-18 TIP (0.34" x 0.23") A B PLCC-20 PLCC-28 PLCC-28R PLCC mm x 6.86mm (0.27" x 0.27") 9.4mm x 9.4mm (0.37" x 0.37") 12.4mm x 7.4mm (0.49" x 0.29") 12.2mm x 9.65mm (0.48" x 0.38") PLCC mm x 14.5mm Application PQFP-84 (0.57" x 0.57") PLCC mm x 17.0mm PLCC PQFP-100 (0.67" x 0.67") The ThermoTweez can also remove leadless components (LCCCs) if sized correctly. PLCC-68 PQFP-132 PLCC-84 PQFP-160 PLCC mm x 21.9mm (0.86" x 0.86") 26.9mm x 26.9mm (1.06" x 1.06") 32.5mm x 32.5mm (1.28" x 1.28") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

86 PLCC Removal Process Guide R-PLC-01-A Solder Wrap PLCC Removal Tips ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply TT-65 ThermoTweez P1 TT-65 Tip &Tool Stand PLCC Removal Tips See chart on back ThermoTweez (TT-65) Tip Alignment Tool P1 PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 1/16" Chisel Tip Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored solder Cleaner PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tips. (see chart on back) 4. Install and align PLCC Removal Tips into ThermoTweez (using Tip Alignment Tool for PLCC 44 pin count and above). 5. Tack solder to one of the corner component leads using the PS-80 with 1/16" Chisel Tip installed. ➀ 6. Wrap solder around the four sides of component. 7. Terminate solder at the end of last side using Sodr-Pen. 9. Remove old solder from PLCC removal tips with Fiber Tool from Tip Maintenance Station. 10. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station. 11. Tin inside edges of tips with solder or use Prep-Set. ➁ 12. Lower tips over component and tweeze handpiece contacting ALL solder joints with tips. ➂ & ➃ 13. Confirm solder melt of ALL ALL joints and lift component from PCB. ➃ & ➄ 14. Release component onto a heat resistant surface. 15. Re-tin tips with solder and return ThermoTweez to its Tip & Tool Stand. 16. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 77 ➀ ➁ ➂ ➃ ➄ FPO Tac ack k & Wrap Solder Tin Tips FPO Position Tips Melt All Joints Lift Component

87 R-PLC-01-A PLCC (or PQFP) Removal Tip DESCRIPTION TIP SIZE PART TIP OFFSET CONSTANT DIGITAL SYSTEMS (including lead count) A x B NUMBER C F 8.64mm x 5.84mm PLCC-18 TIP (0.34" x 0.23") A B PLCC-20 PLCC-28 PLCC-28R PLCC mm x 6.86mm (0.27" x 0.27") 9.4mm x 9.4mm (0.37" x 0.37") 12.4mm x 7.4mm (0.49" x 0.29") 12.2mm x 9.65mm (0.48" x 0.38") PLCC mm x 14.5mm Application PQFP-84 (0.57" x 0.57") PLCC mm x 17.0mm PLCC PQFP-100 (0.67" x 0.67") The ThermoTweez can also remove leadless components (LCCCs) if sized correctly. PLCC-68 PQFP-132 PLCC-84 PQFP-160 PLCC mm x 21.9mm (0.86" x 0.86") 26.9mm x 26.9mm (1.06" x 1.06") 32.5mm x 32.5mm (1.28" x 1.28") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

88 PLCC Removal Process Guide R-PLC-02-A Flux Application PLCC Removal Tips ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply TT-65 ThermoTweez P1 TT-65 Tip &Tool Stand PLCC Removal Tips See chart on back ThermoTweez (TT-65) Tip Alignment Tool P1 Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux Flux-cored Solder Cleaner ➀ ➁ FPO Apply Flux Tin Tips PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tips. (see chart on back) 4. Install and align PLCC Removal Tips into ThermoTweez (using Tip Alignment Tool for PLCC 44 pin count and above). 5. Apply flux to component lead/land areas. ➀ 6. Remove old solder from tips with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station. 8. Tin inside edges of tips with solder or use Prep-Set. ➁ 9. Lower tips over component and tweeze handpiece contacting ALL solder joints with tips. ➂ & ➃ 10. Confirm solder melt of ALL ALL joints and lift component from PCB. ➃ & ➄ 11. Release component onto a heat resistant surface. 12. Re-tin tips with solder and return ThermoTweez to its Tip & Tool Stand. 13. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 79 ➂ ➃ ➄ Position Tips Melt All Joints FPO Lift Component

89 R-PLC-02-A PLCC (or PQFP) Removal Tip DESCRIPTION TIP SIZE PART TIP OFFSET CONSTANT DIGITAL SYSTEMS (including lead count) A x B NUMBER C F 8.64mm x 5.84mm PLCC-18 TIP (0.34" x 0.23") A B PLCC-20 PLCC-28 PLCC-28R PLCC mm x 6.86mm (0.27" x 0.27") 9.4mm x 9.4mm (0.37" x 0.37") 12.4mm x 7.4mm (0.49" x 0.29") 12.2mm x 9.65mm (0.48" x 0.38") PLCC mm x 14.5mm Application PQFP-84 (0.57" x 0.57") PLCC mm x 17.0mm PLCC PQFP-100 (0.67" x 0.67") The ThermoTweez can also remove leadless components (LCCCs) if sized correctly. PLCC-68 PQFP-132 PLCC-84 PQFP-160 PLCC mm x 21.9mm (0.86" x 0.86") 26.9mm x 26.9mm (1.06" x 1.06") 32.5mm x 32.5mm (1.28" x 1.28") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

90 Process Guide R-PLC-70-A THERMOFLO NOZZLE ThermoFlo Unit PLCC Removal EQUIPMENT REQUIRED PACE ThermoFlo Unit (115V) (230V) QFP QuickFit Nozzle See chart on back PACE Rubber Pad OPTIONAL EQUIPMENT N/A MATERIALS (approved by your organization) Cleaner Locally Obtained Flux Locally Obtained ➀ Flux Component F P O PROCEDURE 1. Set air blower speed, temperature and cycle time controls to the required settings to optimize performance. 2. Install QuickFit Nozzle onto the ThermoFlo. Place PCB assembly onto the Work Holder. (optional) 3. Apply flux to component leads. (optional) ➀ 4. Position nozzle over component. 5. Adjust Vacuum Pik to proper height so the vacuum cup is at the bottom edge of the ThermoFlo nozzle. Activate vacuum at this time. ➁ 6. Lower nozzle over component to a point where the bottom of the nozzle is.76mm mm (.030" -.050") above the PCB. ➂ 7. Commence reflow cycle and observe solder melt of all leads. ➃ 8. After complete solder reflow: In Manual mode, press the vacuum switch and raise the nozzle (with component attached to vacuum cup) from the PCB. ➄ In Timed (or Program) mode, the vacuum will automatically activate 5 seconds prior to cycle completion. The nozzle and component can then be raised from the PCB. ➄ 9. Return ThermoFlo handpiece to cubby. ➁ ➂ ➃ Adjust Vacuum Cup F P O Lower Nozzle Melt All Joints 10. Allow board to cool prior to board removal from Work Holder. Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 81 ➄

91 R-PLC-70-A Component Type PLCC-18 PLCC-20 PLCC-28 PLCC-32 PLCC-44 PLCC-52 PLCC-68 PLCC-84 PLCC-100 QFP-80/100 QFP-64/80 QFP-132 QFP-160 QFP-208 QFP-240 BQFP-132 TQFP-32 TQFP-120 BQFP-100 BQFP-84 Nozzle Size (Nom.) A x B 8.8mm x 12.2mm (0.34" x 0.48") 10.4mm x 10.4mm (0.41" x 0.41") 12.9mm x 12.9mm (0.51" x 0.51") 12.7mm x 15.5mm (0.50" x 0.61") 18.0mm x 18.0mm (0.71" x 0.71") 20.6mm x 20.6mm (0.81" x 0.81") 25.4mm x 25.4mm (1.0" x 1.0") 30.5mm x 30.5mm (1.2" x 1.2") 38.1mm x 38.1mm (1.5" x 1.5") 18.3mm x 24.1mm (0.72" x 0.95") 17.0mm x 17.0mm (0.67" x 0.67") 27.9mm x 27.9mm (1.1" x 1.1") 33.0mm x 33.0mm (1.3" x 1.3") 30.5mm x 30.5mm (1.2" x 1.2") 35.6mm x 35.6mm (1.4" x 1.4") 27.1mm x 27.1mm (1.07" x 1.07") 11.5mm x 11.5mm (0.45" x 0.45") 15.5mm x 15.5mm (0.61" x 0.61") 23.5mm x 23.5mm (0.92" x 0.92") 21.0mm x 21.0mm (0.83" x 0.83") Part Numbe r Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

92 QFP Removal Process Guide R-QFP-00-A Bridge Fill QFP Removal Tip ThermoPik Handpiece Equipment Required PACE Par art t Number PACE SensaTemp Power Supply With Vacuum Capability TP-65 ThermoPik P1 TP-65 Tip & Tool Stand QFP Removal Tip See chart on back PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 Mini-Wave Tip Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Bridge Fill Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip (see chart on back). 4. Install QFP Removal Tip into ThermoPik using Tip Tool. 5. Install vacuum cup onto vacuum pick tube of ThermoPik. 6. Melt solder to form a solder bridge fill joining all component leads using the PS-80 with Mini-Wave Tip installed. ➀ 7. Remove old solder from tip with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 9. Tin bottom edge of tip with solder or use Prep-Set. ➁ 10. Gently lower tip over component, contacting ALL leads. ➂&➃ 11. Confirm solder melt of ALL joints, actuate vacuum and lift component from PCB. ➃ & ➄ 12. Release component onto a heat resistant surface. 13. Re-tin tip with solder and return ThermoPik to its Tip & Tool Stand. 14. Prepare lands for component replacement. Position Tip Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 83 ➂ ➃ ➄ Melt All Joints

93 R-QFP-00-A TIP DESCRIPTION TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F FlatPack Tip 15.5mm x 21.6mm (0.61" x 0.85") A B FlatPack Tip PQFP-68 Tip (bumper pack) PQFP-64/80 Tip (non-bumper pack) 16.8mm x 22.9mm (0.66" x 0.90") 15.7mm x 15.7mm (0.62" x 0.62") 15.7mm x 15.7mm (0.62" x 0.62") APPLICATION 18.3mm x 18.3mm PQFP-84 Tip FlatPack (0.72" x 0.72") PQFP-100 Tip 20.8mm x 20.8mm (0.82" x 0.82") PQFP-132 Tip 25.9mm x 25.9mm (1.02" x 1.02") PQFP mm x 29.2mm (1.15" x 1.15") NOTE The ThermoPik will also remove "bumper-pack" components. PQFP-208 Tip 30.2mm x 30.2mm (1.19" x 1.19") All dimensions are nominal, inside diameters. Consult your local authorized PACE distributor for sizes not listed. PQFP-160 Tip PQFP-196 Tip 31.0mm x 31.0mm (1.22" x 1.22") 36.3mm x 36.3mm (1.43" x 1.43") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

94 QFP Removal Process Guide R-QFP-01-A Solder Wrap QFP Removal Tip ThermoPik Handpiece Equipment Required PACE Par art t Number PACE SensaTemp Power Supply With Vacuum Capability TP-65 ThermoPik P1 TP-65 Tip & Tool Stand QFP Removal Tip See chart on back PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 1/16" Chisel Tip Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip (see chart on back). 4. Install vacuum cup onto vacuum pick tube of ThermoPik. 5. Install QFP Removal Tip into ThermoPik using Tip Tool. 6. Tack solder to one of the corner component leads using the PS-80 with 1/16" Chisel Tip installed. Wrap solder around the four sides of component. Terminate solder at the end of last side using Sodr-Pen. ➀ 7. Remove old solder from QFP tip with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 9. Tin bottom edge of the tip with solder or use Prep-Set. ➁ 10. Gently lower tip over component, contacting ALL the leads. ➂ & ➃ 11. Confirm solder melt of ALL joints, actuate vacuum and lift component from printed circuit board. ➃ & ➄ 12. Release component onto a heat resistant surface. 13. Re-tin tip with solder and return ThermoPik to its Tip & Tool Stand. 14. Prepare lands for component replacement. Tac ack k & Wrap ap Solder Tin Tip Position Tip Melt All Joints Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 84 ➀ ➁ ➂ ➃ ➄

95 R-QFP-01-A TIP DESCRIPTION TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F FlatPack Tip 15.5mm x 21.6mm (0.61" x 0.85") A B FlatPack Tip PQFP-68 Tip (bumper pack) PQFP-64/80 Tip (non-bumper pack) APPLICATION 18.3mm x 18.3mm PQFP-84 Tip FlatPack (0.72" x 0.72") 16.8mm x 22.9mm (0.66" x 0.90") 15.7mm x 15.7mm (0.62" x 0.62") 15.7mm x 15.7mm (0.62" x 0.62") PQFP-100 Tip 20.8mm x 20.8mm (0.82" x 0.82") PQFP-132 Tip 25.9mm x 25.9mm (1.02" x 1.02") PQFP mm x 29.2mm (1.15" x 1.15") NOTE The ThermoPik will also remove "bumper-pack" components. PQFP-208 Tip 30.2mm x 30.2mm (1.19" x 1.19") All dimensions are nominal, inside diameters. Consult your local authorized PACE distributor for sizes not listed. PQFP-160 Tip PQFP-196 Tip 31.0mm x 31.0mm (1.22" x 1.22") 36.3mm x 36.3mm (1.43" x 1.43") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

96 QFP Removal Process Guide R-QFP-02-A Flux Application QFP Removal Tip ThermoPik Handpiece Equipment Required PACE Par art t Number PACE SensaTemp Power Supply With Vacuum Capability TP-65 ThermoPik P1 TP-65 Tip & Tool Stand QFP Removal Tip See chart on back Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner Flux PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip (see chart on back). 4. Install QFP Removal Tip into ThermoPik using Tip Tool. 5. Install vacuum cup onto vacuum pick tube of ThermoPik. 6. Apply flux to component lead/land areas. ➀ 7. Remove old solder from QFP tip with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 9. Tin bottom edge of the tip with solder or use Prep-Set. ➁ 10. Gently lower tip over component, contacting ALL the leads. ➂ & ➃ 11. Confirm solder melt of ALL joints, actuate vacuum and lift component from printed circuit board. ➃ & ➄ 12. Release component onto a heat resistant surface. 13. Re-tin tip with solder and return ThermoPik to its Tip & Tool Stand. ➀ ➁ ➂ ➃ FPO Flux Component Tin Tip Position Tip Melt All Joints 14. Prepare lands for component replacement. Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 86 ➄

97 R-QFP-02-A TIP DESCRIPTION TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F FlatPack Tip 15.5mm x 21.6mm (0.61" x 0.85") A B FlatPack Tip PQFP-68 Tip (bumper pack) PQFP-64/80 Tip (non-bumper pack) APPLICATION 18.3mm x 18.3mm PQFP-84 Tip FlatPack (0.72" x 0.72") 16.8mm x 22.9mm (0.66" x 0.90") 15.7mm x 15.7mm (0.62" x 0.62") 15.7mm x 15.7mm (0.62" x 0.62") PQFP-100 Tip 20.8mm x 20.8mm (0.82" x 0.82") PQFP-132 Tip 25.9mm x 25.9mm (1.02" x 1.02") PQFP mm x 29.2mm (1.15" x 1.15") NOTE The ThermoPik will also remove "bumper-pack" components. PQFP-208 Tip 30.2mm x 30.2mm (1.19" x 1.19") All dimensions are nominal, inside diameters. Consult your local authorized PACE distributor for sizes not listed. PQFP-160 Tip PQFP-196 Tip 31.0mm x 31.0mm (1.22" x 1.22") 36.3mm x 36.3mm (1.43" x 1.43") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

98 QFP Removal Process Guide R-QFP-10-A Bridge Fill QFP Removal Tips ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply TT-65 ThermoTweez P1 TT-65 Tip &Tool Stand QFP Removal Tips See chart on back ThermoTweez (TT-65) Tip Alignment Tool P1 PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 Mini-Wave Tip Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Bridge Fill Tin Tips PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tips. (see chart on back) 4. Install and align QFP Removal Tips into ThermoTweez (using Tip Alignment Tool for QFP 84 pin count and above). 5. Melt solder to form a solder bridge fill joining all component leads using the PS-80 with Mini-Wave Tip installed. ➀ 6. Remove old solder from tips with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station. 8. Tin bottom edges of tips with solder or use Prep-Set. ➁ 9. Lower tips over component and tweeze handpiece, contacting ALL leads with tips. ➂ & ➃ 10. Confirm solder melt of ALL joints and lift component from PCB. ➃ & ➄ 11. Release component onto a heat resistant surface. 12. Re-tin tips with solder and return ThermoTweez to its Tip & Tool Stand. 13. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 88 ➂ ➃ ➄ Position Tips Melt All Joints Lift Component

99 R-QFP-10-A PLCC PLCC (or PQFP) (or PQFP) Removal Removal Tip Tip DESCRIPTION TIP SIZE PART TIP OFFSET CONSTANT DIGITAL SYSTEMS (including lead count) (including lead count) A x B NUMBER C F Removal Tips PQFP mm x 14.5mm (0.57" x 0.57") PQFP mm x 17.0mm (0.67" x 0.67") A B PQFP mm x 21.9mm (0.86" x 0.86") Standard Wall thickness = 1.3mm (0.050") PQFP mm x 26.9mm (1.06" x 1.06") PQFP mm x 41.7mm (1.64" x 1.64") A B Wall thickness = 0.64mm (0.025") on 3 tips, part numbers , & PQFP-80/ mm x 22.9mm (0.66" x.090") Application TQFP mm x 13.2mm (0.52" x 0.52") TQFP-80/ mm x 11.2mm (0.44" x 0.44") PQFP mm x 41.7mm (1.64" x 1.64") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

100 QFP Removal Process Guide R-QFP-11-A Solder Wrap QFP Removal Tips ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply TT-65 ThermoTweez P1 TT-65 Tip &Tool Stand QFP Removal Tips See chart on back ThermoTweez (TT-65) Tip Alignment Tool P1 PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 1/16" Chisel Tip Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ Tac ack k & Wrap Solder ➁ Tin Tips PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tips. (see chart on back) 4. Install and align QFP Removal Tips into ThermoTweez (using Tip Alignment Tool for QFP 84 pin count and above) 5. Tack solder to one of the corner component leads using the PS-80 with 1/16" Chisel Tip installed. Wrap solder around the four sides of component. Terminate solder at end of last side using Sodr-Pen. ➀ 6. Remove old solder from QFP tips with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station. 8. Tin bottom edges of tips with solder or use Prep-Set. ➁ 9. Lower tips over component and tweeze handpiece, contacting ALL leads with tips. ➂ & ➃ 10. Confirm solder melt of ALL joints and lift component from PCB. ➃ & ➄ 11. Release component onto a heat resistant surface. 12. Re-tin tips with solder and return ThermoTweez to its Tip & Tool Stand. 13. Prepare lands for component replacement. Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 90 ➂ ➃ ➄ Position Tips Melt All Joints

101 R-QFP-11-A PLCC PLCC (or PQFP) (or PQFP) Removal Removal Tip Tip DESCRIPTION TIP SIZE PART TIP OFFSET CONSTANT DIGITAL SYSTEMS (including lead count) (including lead count) A x B NUMBER C F Removal Tips PQFP mm x 14.5mm (0.57" x 0.57") PQFP mm x 17.0mm (0.67" x 0.67") A B PQFP mm x 21.9mm (0.86" x 0.86") Standard Wall thickness = 1.3mm (0.050") PQFP mm x 26.9mm (1.06" x 1.06") PQFP mm x 41.7mm (1.64" x 1.64") A B Wall thickness = 0.64mm (0.025") on 3 tips, part numbers , & PQFP-80/ mm x 22.9mm (0.66" x.090") Application TQFP mm x 13.2mm (0.52" x 0.52") TQFP-80/ mm x 11.2mm (0.44" x 0.44") PQFP mm x 41.7mm (1.64" x 1.64") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

102 QFP Removal Process Guide R-QFP-12-A Flux Application QFP Removal Tips ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply TT-65 ThermoTweez P1 TT-65 Tip &Tool Stand QFP Removal Tips See chart on back ThermoTweez (TT-65) Tip Alignment Tool P1 Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored solder Cleaner Flux ➀ Flux Component ➁ Tin Tips PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tips. (see chart on back) 4. Install and align QFP Removal Tips into ThermoTweez (using Tip Alignment Tool for QFP 84 pin count and above). 5. Apply flux to component lead/land areas. ➀ 6. Remove old solder from tips with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station. 8. Tin bottom edges of tips with solder or use Prep-Set. ➁ 9. Lower tips over component and tweeze handpiece, contacting ALL leads with tips. ➂ & ➃ 10. Confirm solder melt of ALL joints and lift component from PCB. ➃ & ➄ 11. Release component onto a heat resistant surface. 12. Re-tin tips with solder and return ThermoTweez to its Tip & Tool Stand. ➂ ➃ Position Tips Melt All Joints 13. Prepare lands for component replacement. Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 92 ➄

103 R-QFP-12-A PLCC PLCC (or PQFP) (or PQFP) Removal Removal Tip Tip DESCRIPTION TIP SIZE PART TIP OFFSET CONSTANT DIGITAL SYSTEMS (including lead count) (including lead count) A x B NUMBER C F Removal Tips PQFP mm x 14.5mm (0.57" x 0.57") PQFP mm x 17.0mm (0.67" x 0.67") A B PQFP mm x 21.9mm (0.86" x 0.86") Standard Wall thickness = 1.3mm (0.050") PQFP mm x 26.9mm (1.06" x 1.06") PQFP mm x 41.7mm (1.64" x 1.64") A B Wall thickness = 0.64mm (0.025") on 3 tips, part numbers , & PQFP-80/ mm x 22.9mm (0.66" x.090") Application TQFP mm x 13.2mm (0.52" x 0.52") TQFP-80/ mm x 11.2mm (0.44" x 0.44") PQFP mm x 41.7mm (1.64" x 1.64") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

104 QFP Removal Process Guide R-QFP-20-A Bridge Fill QFP Removal Tip Dual ThermoPik Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability DTP-80 Dual ThermoPik P1 DTP-80 Tip &Tool Stand QFP Removal Tip See chart on back PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 Mini-Wave Tip Tip and Vacuum Cup Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Bridge Fill Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip. (see chart on back) 4. Install QFP Removal Tip and vacuum cup into Dual ThermoPik using Tip and Vacuum Cup Tool. 5. Melt solder to form a solder bridge fill joining all component leads using the PS-80 with Mini-Wave Tip installed. ➀ 6. Remove old solder from QFP tip with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 8. Tin bottom edges of tip with solder or use Prep-Set. ➁ 9. Lower tip over component, contacting ALL leads with tip. ➂ & ➃ 10. Confirm solder melt of ALL joints, actuate vacuum and lift component from PCB. ➃ & ➄ 11. Release component onto a heat resistant surface. 12. Re-tin tip with solder and return Dual ThermoPik to its Tip & Tool Stand. 13. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 94 ➂ ➃ ➄ Position Tip Melt All Joints Lift Component

105 R-QFP-20-A PQFP REMOVAL TIP DESCRIPTION TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F PQFP mm x 21.1mm (0.83" x 0.83") PQFP mm x 26.2mm (1.03" x 1.03") PQFP mm x 29.2mm (1.15" x 1.15") A B PQFP mm x 29.7mm (1.17" x 1.17") Application PQFP 160/ mm x 30.7mm (1.21" x 1.21") PQFP mm x 33.8mm (1.33" x 1.33") PQFP mm x 36.1mm (1.42" x 1.42") PQFP mm x 42.4mm (1.67" x 1.67") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

106 QFP Removal Process Guide R-QFP-21-A Solder Wrap QFP Removal Tip Dual ThermoPik Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability DTP-80 Dual ThermoPik P1 DTP-80 Tip &Tool Stand QFP Removal Tip See chart on back PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 1/16" Chisel Tip Tip and Vacuum Cup Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Tac ack k & Wrap Solder Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip. (see chart on back) 4. Install QFP Removal Tip and vacuum cup into Dual ThermoPik using Tip and Vacuum Cup Tool. 5. Tack solder to one of the corner component leads using the PS-80 with 1/16" Chisel Tip installed. Wrap solder around the four sides of component. Terminate solder at end of last side using Sodr-Pen. ➀ 6. Remove old solder from QFP tip with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 8. Tin bottom edges of tip with solder or use Prep-Set. ➁ 9. Lower tip over component contacting ALL leads with tip. ➂ & ➃ 10. Confirm solder melt of ALL joints, actuate vacuum and lift component from PCB. ➃ & ➄ 11. Release component onto a heat resistant surface. 12. Re-tin tip with solder and return Dual ThermoPik to its Tip & Tool Stand. 13. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 96 ➂ ➃ ➄ Position Tip Melt All Joints Lift Component

107 R-QFP-21-A PQFP REMOVAL TIP DESCRIPTION TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F PQFP mm x 21.1mm (0.83" x 0.83") PQFP mm x 26.2mm (1.03" x 1.03") A B PQFP 144 PQFP mm x 29.2mm (1.15" x 1.15") 29.7mm x 29.7mm (1.17" x 1.17") Application PQFP 160/ mm x 30.7mm (1.21" x 1.21") PQFP mm x 33.8mm (1.33" x 1.33") PQFP mm x 36.1mm (1.42" x 1.42") PQFP mm x 42.4mm (1.67" x 1.67") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

108 QFP Removal Process Guide R-QFP-22-A Flux Application QFP Removal Tip Dual ThermoPik Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability DTP-80 Dual ThermoPik P1 DTP-80 Tip &Tool Stand QFP Removal Tip See chart on back Tip and Vacuum Cup Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored solder Cleaner Flux ➀ ➁ Flux Component Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip. (see chart on back) 4. Install QFP Removal Tip and vacuum cup into Dual ThermoPik using Tip and Vacuum Cup Tool. 5. Apply flux to component lead/land areas. ➀ 6. Remove old solder from tip with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 8. Tin bottom edges of tip with solder or use Prep-Set. ➁ 9. Lower tip over component contacting ALL leads with tip. ➂ & ➃ 10. Confirm solder melt of ALL joints, actuate vacuum and lift component from PCB. ➃ & ➄ 11. Release component onto a heat resistant surface. 12. Re-tin tip with solder and return Dual ThermoPik to its Tip & Tool Stand. ➂ ➃ Position Tip Melt All Joints 13. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: 98 ➄ Lift Component

109 R-QFP-22-A PQFP REMOVAL TIP DESCRIPTION TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F PQFP mm x 21.1mm (0.83" x 0.83") PQFP mm x 26.2mm (1.03" x 1.03") PQFP mm x 29.2mm (1.15" x 1.15") A B PQFP mm x 29.7mm (1.17" x 1.17") Application PQFP 160/ mm x 30.7mm (1.21" x 1.21") PQFP mm x 33.8mm (1.33" x 1.33") PQFP mm x 36.1mm (1.42" x 1.42") PQFP mm x 42.4mm (1.67" x 1.67") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

110 QFP Removal Process Guide R-QFP-30-A Bridge Fill QFP Removal Tip PS-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 QFP Removal Tip See chart on back Mini-Wave Tip Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or Tweezers MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Bridge Fill Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install Mini-Wave Tip into the PS-80 using Tip Tool. 4. Melt solder to form a solder bridge fill joining all component leads using the PS-80 with Mini-Wave Tip installed. ➀ 5. Replace Mini-Wave Tip in the PS-80 with QFP Removal Tip. 6. Enter Tip Offset Constant for the selected tip (see chart on back). 7. Remove old solder from QFP tip with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 9. Tin bottom and inside edges of tip with solder or use Prep-Set. ➁ 10. Lower tip over component contacting ALL leads with tip. ➂ & ➃ 11. Confirm solder melt of ALL joints and lift component from PCB. ➃ & ➄ (Surface tension of the tip should lift the component form the board. If this does not occur, use of tweezers to lift the component is optional) 12. Release component from tip by wiping on a heat resistant surface. 13. Re-tin tip with solder and return the PS-80 to its Tip & Tool Stand. Melt All Joints 14. Prepare lands for component replacement. ➄ Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ Position Tip

111 R-QFP-30-A SURFACE MOUNT REMOVAL TIP DESCRIPTION TIP SIZE PART TIP OFFSET CONSTANT DIGITAL SYSTEMS (suggested application) A X B NUMBER C F PQFP mm x 8.4mm (0.33" x 0.33") A B Application PQFP-44/ mm x 11.7mm (0.46" x 0.46") PQFP mm x 12.7mm (0.46" x 0.5") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

112 QFP Removal Process Guide R-QFP-31-A Solder Wrap QFP Removal Tip PS-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 QFP Removal Tip See chart on back 1/16" Chisel Tip Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or Tweezers MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Tac ack k & Wrap Solder Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install 1/16" Chisel Tip into Sodr-Pen using Tip Tool. 4. Tack solder to one of the corner component leads using the PS-80 with chisel tip installed. Wrap solder around the four sides of component. Terminate solder at the end of last side using the PS-80. ➀ 5. Replace chisel tip in the PS-80 with QFP Removal Tip. 6. Enter Tip Offset Constant for the selected tip (see chart on back). 7. Remove old solder from QFP tip with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 9. Tin bottom and inside edges of tip with solder or use Prep-Set. ➁ 10. Lower tip over component contacting ALL ALL leads with tip. ➂ & ➃ 11. Confirm solder melt of ALL (Surface tension of the tip should lift the component form the board. If this does not occur, use of tweezers to lift the component is optional) ALL joints and lift component from PCB. ➃ & ➄ 12. Release component from tip by wiping on a heat resistant surface. 13. Re-tin tip with solder and return the PS-80 to its Tip & Tool Stand. Position Tip 14. Prepare lands for component replacement. ➄ Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ Melt All Joints

113 R-QFP-31-A SURFACE MOUNT REMOVAL TIP DESCRIPTION TIP SIZE PART TIP OFFSET CONSTANT DIGITAL SYSTEMS (suggested application) A X B NUMBER C F PQFP mm x 8.4mm (0.33" x 0.33") A B PQFP-44/ mm x 11.7mm (0.46" x 0.46") Application PQFP mm x 12.7mm (0.46" x 0.5") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

114 QFP Removal Process Guide R-QFP-32-A Flux Application QFP Removal Tip EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply PS-80 Handpiece PS-80 Tip & Tool Stand P P1 QFP Removal Tip See chart on back Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or Tweezers MATERIALS (approved by your organization) Flux-cored Solder Flux Cleaner PROCEDURE PS-80 Handpiece 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install QFP Removal Tip into the PS-80 using Tip Tool. 4. Enter Tip Offset Constant for the selected tip. (see chart on back) 5. Apply flux to all lead/land areas. ➀ 6. Remove old solder from tip with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 8. Tin bottom and inside edges of tip with solder or use Prep-Set. ➁ 9. Lower tip over component contacting ALL ALL leads with tip. ➂ & ➃ 10. Confirm solder melt of ALL (Surface tension of the tip should lift the component form the board. If this does not occur, use of tweezers to lift the component is optional) ALL joints and lift component from PCB. ➃ & ➄ 11. Release component from tip by wiping on a heat resistant surface. 12. Re-tin tip with solder and return the PS-80 to its Tip & Tool Stand. ➀ ➁ ➂ ➃ Apply Flux Tin Tip Position Tip Melt All Joints 13. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➄ Lift Component

115 R-QFP-32-A SURFACE MOUNT REMOVAL TIP DESCRIPTION TIP SIZE PART TIP OFFSET CONSTANT DIGITAL SYSTEMS (suggested application) A X B NUMBER C F PQFP mm x 8.4mm (0.33" x 0.33") A B PQFP-44/ mm x 11.7mm (0.46" x 0.46") Application PQFP mm x 12.7mm (0.46" x 0.5") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

116 QFP Removal Process Guide R-QFP-60-A Flux Application TQFP Removal Tip SX-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability SX-80 Handpiece P1 SX-80 Tip & Tool Stand P1 TQFP Removal Tip See chart on back Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , FPO 0003 or MATERIALS (approved by your organization) Flux-cored Solder Flux Cleaner ➀ ➁ Apply Flux Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip. (see chart on back) 4. Install TQFP Removal Tip and vacuum cup into the SX-80 using Tip Tool. 5. Apply flux to all lead/land areas. ➀ 6. Remove old solder from TQFP tip with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 8. Tin inside and bottom edges of tip with solder or use Prep-Set. ➁ 9. Lower tip over component contacting ALL ALL leads with tip. ➂ & ➃ 10. Confirm solder melt of ALL joints, apply vacuum and lift component from PCB. ➃ & ➄ 11. Release component from tip by wiping on a heat resistant surface. 12. Re-tin tip with solder and return the SX-80 to its Tip & Tool Stand. 13. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ ➄ Position Tip Melt All Joints FPO Lift Component

117 R-QFP-60-A PIK-TIPS TQFP REMOVAL TIP DESCRIPTIO N TIP SIZE PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F TQFP mm x 8.2mm (0.322" x 0.322") TQFP mm x 8.7mm (0.344" x 0.344") A B TQFP mm x 12.0mm (0.472" x 0.472") APPLICATION TQFP mm x 12.0mm (0.472" x 0.472") TQFP TQFP mm x 13.2mm (0.520" x 0.520") TQFP-80/ mm x 15.3mm (0.604" x 0.604") TQFP mm x 21.6mm (0.85" x 0.85") P TQFP mm x 22.1mm (0.87" x 0.87") P PQFP-80/ mm x 22.9mm (0.66" x 0.90") P Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

118 QFP Removal Process Guide R-QFP-61-A Solder Wrap TQFP Removal Tip SX-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability SX-80 Handpiece P1 SX-80 Tip & Tool Stand TQFP Removal Tip See chart on back PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 1/16" Chisel Tip Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , FPO 0003 or MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Tac ack k & Wrap Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip. (see chart on back) 4. Install TQFP Removal Tip and vacuum cup into the SX-80 using Tip Tool. 5. Tack solder to one of the component corner leads using the PS-80 with 1/16" Chisel Tip installed. ➀ 6. Wrap solder around the four sides of component. 7. Terminate solder at the end of last side using the PS Remove old solder from TQFP tip with Fiber Tool from Tip Maintenance Station. 9. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 10. Tin inside and bottom edges of tip with solder or use Prep-Set. ➁ 11. Lower tip over component contacting ALL ALL leads with tip. ➂ & ➃ 12. Confirm solder melt of ALL joints, apply vacuum and lift component from PCB. ➃ & ➄ 11. Release component from tip by wiping on a heat resistant surface. 12. Re-tin tip with solder and return the SX-80 to its Tip & Tool Stand. 13. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ ➄ Position Tip FPO Melt All Joints FPO FPO Lift Component

119 R-QFP-61-A PIK-TIPS TQFP REMOVAL TIP DESCRIPTIO N TIP SIZE PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F TQFP mm x 8.2mm (0.322" x 0.322") TQFP mm x 8.7mm (0.344" x 0.344") A B TQFP mm x 12.0mm (0.472" x 0.472") APPLICATION TQFP mm x 12.0mm (0.472" x 0.472") TQFP TQFP mm x 13.2mm (0.520" x 0.520") TQFP-80/ mm x 15.3mm (0.604" x 0.604") TQFP mm x 21.6mm (0.85" x 0.85") P TQFP mm x 22.1mm (0.87" x 0.87") P PQFP-80/ mm x 22.9mm (0.66" x 0.90") P Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

120 QFP Removal Process Guide R-QFP-62-A Bridge Fill TQFP Removal Tip SX-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability SX-80 Handpiece P1 SX-80 Tip & Tool Stand P1 TQFP Removal Tip See chart on back PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 Angled Single Sided Chisel Tip Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , FPO 0003 or MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Bridge Fill Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip. (see chart on back) 4. Install TQFP Removal Tip and vacuum cup into the SX-80 using Tip Tool. 5. Melt solder to form a solder bridge fill joining all component leads using the PS-80 with Angled Single Sided Chisel Tip installed. ➀ 6. Remove old solder from TQFP tip with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 8. Tin inside and bottom edges of tip with solder or use Prep-Set. ➁ 9. Lower tip over component contacting ALL ALL leads with tip. ➂ & ➃ 10. Confirm solder melt of ALL joints, apply vacuum and lift component from PCB. ➃ & ➄ 11. Release component from tip by wiping on a heat resistant surface. 12. Re-tin tip with solder and return the SX-80 to its Tip & Tool Stand. Position Tip 13. Prepare lands for component replacement. ➄ Lift Component 1997 PACE Incorporated. Manual Assembly and Rework For Surface Mount Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ Melt All Joints FPO

121 R-QFP-62-A PIK-TIPS TQFP REMOVAL TIP DESCRIPTIO N TIP SIZE PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F TQFP mm x 8.2mm (0.322" x 0.322") TQFP mm x 8.7mm (0.344" x 0.344") TQFP mm x 12.0mm (0.472" x 0.472") TQFP-40 APPLICATION A B TQFP TQFP mm x 12.0mm (0.472" x 0.472") 13.2mm x 13.2mm (0.520" x 0.520") TQFP-80/ mm x 15.3mm (0.604" x 0.604") TQFP mm x 21.6mm (0.85" x 0.85") P TQFP mm x 22.1mm (0.87" x 0.87") P PQFP-80/ mm x 22.9mm (0.66" x 0.90") P Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

122 Process Guide R-QFP-70-A THERMOFLO NOZZLE ThermoFlo Unit EQUIPMENT REQUIRED PACE ThermoFlo Unit (115V) (230V) QFP QuickFit Nozzle See chart on back PACE Rubber Pad OPTIONAL EQUIPMENT N/A MATERIALS (approved by your organization) Cleaner Locally Obtained Flux Locally Obtained QFP Removal ➀ ➁ Flux Component Adjust Vacuum Cup PROCEDURE 1. Set air blower speed, temperature and cycle time controls to the required settings to optimize performance. Manual or Timed modes are typically used for this procedure. 2. Install QuickFit Nozzle onto the ThermoFlo handpiece. Place PCB assembly onto the Work Holder. (optional) 3. Apply flux to component leads. (optional) ➀ 4. Position component to be removed under nozzle. 5. Adjust Vacuum Pik to proper height so the vacuum cup is at the bottom edge of the ThermoFlo nozzle. Activate vacuum at this time. ➁ 6. Lower nozzle over component to a point where the bottom of the nozzle is.76mm mm (.030" -.050") above the PCB. ➂ 7. Commence reflow cycle and observe solder melt of all leads. ➃ 8. After complete solder reflow: In Manual mode, press the vacuum switch and raise the nozzle (with component attached to vacuum cup) from the PCB. ➄ In Timed (or Program) mode, the vacuum will automatically activate 5 seconds prior to cycle completion. The nozzle and component can then be raised from the PCB. ➄ 9. Return ThermoFlo handpiece to cubby. 10. Allow board to cool prior to board removal from Work Holder. Lower Nozzle Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ ➄ Melt All Joints Lift Component

123 R-QFP-70-A Component Type PLCC-18 PLCC-20 PLCC-28 PLCC-32 PLCC-44 PLCC-52 PLCC-68 PLCC-84 PLCC-100 QFP-80/100 QFP-64/80 QFP-132 QFP-160 QFP-208 QFP-240 BQFP-132 TQFP-32 TQFP-120 BQFP-100 BQFP-84 Nozzle Size (Nom.) A x B 8.8mm x 12.2mm (0.34" x 0.48") 10.4mm x 10.4mm (0.41" x 0.41") 12.9mm x 12.9mm (0.51" x 0.51") 12.7mm x 15.5mm (0.50" x 0.61") 18.0mm x 18.0mm (0.71" x 0.71") 20.6mm x 20.6mm (0.81" x 0.81") 25.4mm x 25.4mm (1.0" x 1.0") 30.5mm x 30.5mm (1.2" x 1.2") 38.1mm x 38.1mm (1.5" x 1.5") 18.3mm x 24.1mm (0.72" x 0.95") 17.0mm x 17.0mm (0.67" x 0.67") 27.9mm x 27.9mm (1.1" x 1.1") 33.0mm x 33.0mm (1.3" x 1.3") 30.5mm x 30.5mm (1.2" x 1.2") 35.6mm x 35.6mm (1.4" x 1.4") 27.1mm x 27.1mm (1.07" x 1.07") 11.5mm x 11.5mm (0.45" x 0.45") 15.5mm x 15.5mm (0.61" x 0.61") 23.5mm x 23.5mm (0.92" x 0.92") 21.0mm x 21.0mm (0.83" x 0.83") Part Numbe r Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

124 PLCC Socket Removal Process Guide R-SKT-00-A -00-A Bridge Fill PLCC Socket Removal Tip PS-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply PS-80 Handpiece PS-80 Tip & Tool Stand P P1 PLCC Socket Removal Tip See chart on back Mini-Wave Tip Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install Mini-Wave Tip into the PS-80 using Tip Tool. 4. Melt solder to form a solder bridge fill joining all component leads using Sodr-Pen with Mini-Wave Tip installed. ➀ 5. Enter Tip Offset Constant for the selected tip (see chart on back). 6. Replace Mini-Wave Tip in the PS-80 with PLCC Socket Removal Tip. 7. Remove old solder from tip with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 9. Tin the outside and bottom edges of tip with solder or use Prep-Set. ➁ 10. Fully insert tip into component contacting ALL 11. Confirm solder melt of ALL ALL leads with tip. ➂ & ➃ ALL joints and lift component from PCB. ➃ & ➄ 12. Release component from tip by wiping on a heat resistant surface. 13. Re-tin tip with solder and return the PS-80 to its Tip & Tool Stand. ➀ ➁ ➂ ➃ Bridge Fill Tin Tip Position Tip Melt All Joints 14. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➄ Lift Component

125 R-SKT-00-A -00-A PLCC SOCKET REMOVAL TIP DESCRIPTION TIP SIZE PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F PLCC-20 SOCKET 8.6mm x 8.6mm (0.34" x 0.34") PLCC-28 SOCKET 11.4mm x 11.4mm (0.45" x 0.45") A APPLICATION B PLCC-32 SOCKET PLCC-44 SOCKET 14.0mm x 11.4mm (0.55" x 0.45") 16.5mm x 16.5mm (0.65" x 0.65") SOCKET PLCC-52 SOCKET 19.1mm x 19.1mm (0.75" x 0.75") PLCC-68 SOCKET 24.1mm x 24.1mm (0.95" x 0.95") PLCC-84 SOCKET 29.2mm x 29.2mm (1.15" x 1.15") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

126 PLCC Socket Removal Process Guide R-SKT-01-A -01-A Solder Wrap PLCC Socket Removal Tip PS-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply PS-80 Handpiece PS-80 Tip & Tool Stand P P1 PLCC Socket Removal Tip See chart on back 1/16" Chisel Tip Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install 1/16" Chisel Tip into the PS-80 using Tip Tool. 4. Tack solder to an inside corner lead using the PS-80 with chisel tip installed. Wrap solder around leads inside component. Terminate solder at last lead using Sodr-Pen. ➀ 5. Enter Tip Offset Constant for the selected tip (see chart on back). 6. Replace chisel tip in the PS-80 with PLCC Socket Removal Tip. 7. Remove old solder from tip with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 9. Tin outside and bottom edges of tip with solder or use Prep-Set. ➁ 10. Fully insert tip into component contacting ALL 11. Confirm solder melt of ALL ALL leads with tip. ➂ & ➃ ALL joints and lift component from PCB. ➃ & ➄ 12. Release component from tip by wiping on a heat resistant surface. 13. Re-tin tip with solder and return the PS-80 to its Tip & Tool Stand. ➀ ➁ ➂ ➃ Tac ack k & Wrap FPO Tin Tip Position Tip Melt All Joints 14. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➄ Lift Component

127 R-SKT-01-A -01-A PLCC SOCKET REMOVAL TIP DESCRIPTION TIP SIZE PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F PLCC-20 SOCKET 8.6mm x 8.6mm (0.34" x 0.34") PLCC-28 SOCKET 11.4mm x 11.4mm (0.45" x 0.45") PLCC-32 SOCKET 14.0mm x 11.4mm (0.55" x 0.45") A B APPLICATION PLCC-44 SOCKET 16.5mm x 16.5mm (0.65" x 0.65") SOCKET PLCC-52 SOCKET 19.1mm x 19.1mm (0.75" x 0.75") PLCC-68 SOCKET 24.1mm x 24.1mm (0.95" x 0.95") PLCC-84 SOCKET 29.2mm x 29.2mm (1.15" x 1.15") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

128 PLCC Socket Removal Process Guide R-SKT-02-A -02-A Flux Application PLCC Socket Removal Tip PS-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply PS-80 Handpiece PS-80 Tip & Tool Stand P P1 PLCC Socket Removal Tip See chart on back Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Apply flux to inside lead/land areas. ➀ 4. Enter Tip Offset Constant for the selected tip (see chart on back). 6. Install PLCC Socket Removal Tip into the PS-80 using Tip Tool. 7. Remove old solder from tip with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 9. Tin outside and bottom edges of tip with solder or use Prep-Set. ➁ 10. Fully insert tip into component contacting ALL 11. Confirm solder melt of ALL ALL leads with tip. ➂ & ➃ ALL joints and lift component from PCB. ➃ & ➄ 12. Release component from tip by wiping on a heat resistant surface. 13. Re-tin tip with solder and return the PS-80 to its Tip & Tool Stand. ➀ ➁ ➂ ➃ Apply Flux FPO Tin Tip Position Tip Melt All Joints 14. Prepare lands for component replacement. Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➄

129 R-SKT-02-A -02-A PLCC SOCKET REMOVAL TIP DESCRIPTION TIP SIZE PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F PLCC-20 SOCKET 8.6mm x 8.6mm (0.34" x 0.34") PLCC-28 SOCKET 11.4mm x 11.4mm (0.45" x 0.45") PLCC-32 SOCKET 14.0mm x 11.4mm (0.55" x 0.45") A APPLICATION B PLCC-44 SOCKET 16.5mm x 16.5mm (0.65" x 0.65") SOCKET PLCC-52 SOCKET 19.1mm x 19.1mm (0.75" x 0.75") PLCC-68 SOCKET 24.1mm x 24.1mm (0.95" x 0.95") PLCC-84 SOCKET 29.2mm x 29.2mm (1.15" x 1.15") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

130 SOIC Removal Process Guide R-SOI-00-A Flux Application SOIC Removal Tip PS-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 SOIC Removal Tip See chart on back Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or Tweezers MATERIALS (approved by your organization) Flux-cored Solder Flux Cleaner ➀ ➁ Apply Flux Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip. (see chart on back) 4. Install SOIC Removal Tip into the PS-80 using Tip Tool. 5. Apply flux to all lead/land areas. ➀ 6. Remove old solder from tip with Fiber Tool from Tip Maintenance Station. 7. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 8. Tin bottom and inside edges of tip with solder or use Prep-Set. ➁ 9. Lower tip over component contacting ALL 10. Confirm solder melt of ALL ALL leads with tip. ➂ & ➃ ALL joints and lift component from PCB. ➃ & ➄ (Surface tension of the tip should lift the component from the board. If this does not occur, use of tweezers to lift the component is optional) 11. Release component from tip by wiping on a heat resistant surface. 12. Re-tin tip with solder and return the PS-80 to its Tip & Tool Stand. 13. Prepare lands for component replacement. Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ ➄ Position Tip Melt All Joints FPO

131 R-SOI-00-A TIP (and application) DESCRIPTION TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F SOIC - 8 (JEDEC) 5.05mm x 5.08mm (0.199" x 0.200") SOIC - 8 (EIAJ) 6.25mm x 4.83mm (0.246" x 0.190") SOIC - 14 (JEDEC) 5.05mm x 8.99mm (0.199" x 0.354") SOIC - 14 (EIAJ) 5.56mm x 9.14mm (0.219" x 0.360") SOIC - 16 (JEDEC) 5.05mm x 10.2mm (0.199" x 0.404") A B SOIC - 16 (EIAJ) 7.42mm x 9.91mm (0.292" x 0.390") SOICL - 16 (JEDEC) 9.37mm x 10.7mm (0.369" x 0.423") APPLICATION SOICL - 20 (JEDEC) 9.37mm x 13.3mm (0.369" x 0.522") SOIC SOICL - 20 (EIAJ) 6.83mm x 13.0mm (0.269" x 0.510") SOICL - 24 (JEDEC) 9.37mm x 15.8mm (0.369" x 0.624") SOICL - 24 (EIAJ) 10.6mm x 15.0mm (0.416" x 0.590") SOICL - 28 (JEDEC) 9.37mm x 18.4mm (0.369" x 0.723") SOICL - 28 (EIAJ) 10.6mm x 17.5mm (0.416" x 0.690") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

132 SOIC Removal Process Guide R-SOI-01-A Solder Wrap SOIC Removal Tip PS-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 SOIC Removal Tip See chart on back 1/16" Chisel Tip Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or Tweezers MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Tac ack k & Wrap Solder Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install 1/16" Chisel Tip into the PS-80 using Tip Tool. 4. Tack solder to one of the corner component leads using Sodr-Pen with chisel tip installed. Wrap solder around component leads forming a U shape. Terminate solder at last lead using the PS-80. ➀ 5. Enter Tip Offset Constant for the selected tip (see chart on back). 6. Replace Mini-Wave Tip in the PS-80 with SOIC Removal Tip. 7. Remove old solder from SOIC tip with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 9. Tin bottom and inside edges of tip with solder or use Prep-Set. ➁ 10. Lower tip over component contacting ALL ALL leads with tip. ➂ & ➃ 11. Confirm solder melt of ALL (Surface tension of the tip should lift the component from the board. If this does not occur, use of tweezers to lift the component is optional) ALL joints and lift component from PCB. ➃ & ➄ 12. Release component from tip by wiping on a heat resistant surface. 13. Re-tin tip with solder and return the PS-80 to its Tip & Tool Stand. Position Tip 14. Prepare lands for component replacement. ➄ Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ FPO Melt All Joints

133 R-SOI-01-A TIP (and application) DESCRIPTION TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F SOIC - 8 (JEDEC) 5.05mm x 5.08mm (0.199" x 0.200") SOIC - 8 (EIAJ) 6.25mm x 4.83mm (0.246" x 0.190") SOIC - 14 (JEDEC) 5.05mm x 8.99mm (0.199" x 0.354") SOIC - 14 (EIAJ) 5.56mm x 9.14mm (0.219" x 0.360") A B SOIC - 16 (JEDEC) SOIC - 16 (EIAJ) 5.05mm x 10.2mm (0.199" x 0.404") 7.42mm x 9.91mm (0.292" x 0.390") SOICL - 16 (JEDEC) 9.37mm x 10.7mm (0.369" x 0.423") APPLICATION SOICL - 20 (JEDEC) 9.37mm x 13.3mm (0.369" x 0.522") SOIC SOICL - 20 (EIAJ) 6.83mm x 13.0mm (0.269" x 0.510") SOICL - 24 (JEDEC) 9.37mm x 15.8mm (0.369" x 0.624") SOICL - 24 (EIAJ) 10.6mm x 15.0mm (0.416" x 0.590") SOICL - 28 (JEDEC) 9.37mm x 18.4mm (0.369" x 0.723") SOICL - 28 (EIAJ) 10.6mm x 17.5mm (0.416" x 0.690") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

134 SOIC Removal Process Guide R-SOI-02-A Bridge Fill SOIC Removal Tip PS-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 SOIC Removal Tip See chart on back Mini-Wave Surface Mount Installation Tip Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or Tweezers MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Bridge Fill Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install Mini-Wave Tip into the PS-80 using Tip Tool. 4. Melt solder to form a solder bridge fill joining all component leads using the PS-80 with Mini-Wave Tip installed. ➀ 5. Enter Tip Offset Constant for the selected tip (see chart on back). 6. Replace Mini-Wave Tip in the PS-80 with SOIC Removal Tip. 7. Remove old solder from SOIC tip with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 9. Tin bottom and inside edges of tip with solder or use Prep-Set. ➁ 10. Lower tip over component contacting ALL ALL leads with tip. ➂ & ➃ 11. Confirm solder melt of ALL (Surface tension of the tip should lift the component from the board. If this does not occur, use of tweezers to lift the component is optional) ALL joints and lift component from PCB. ➃ & ➄ 12. Release component from tip by wiping on a heat resistant surface. 13. Re-tin tip with solder and return the PS-80 to its Tip & Tool Stand. Position Tip 14. Prepare lands for component replacement. ➄ Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ Melt All Joints

135 R-SOI-02-A TIP (and application) DESCRIPTION TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F SOIC - 8 (JEDEC) 5.05mm x 5.08mm (0.199" x 0.200") SOIC - 8 (EIAJ) 6.25mm x 4.83mm (0.246" x 0.190") SOIC - 14 (JEDEC) 5.05mm x 8.99mm (0.199" x 0.354") SOIC - 14 (EIAJ) 5.56mm x 9.14mm (0.219" x 0.360") SOIC - 16 (JEDEC) 5.05mm x 10.2mm (0.199" x 0.404") A B SOIC - 16 (EIAJ) 7.42mm x 9.91mm (0.292" x 0.390") SOICL - 16 (JEDEC) 9.37mm x 10.7mm (0.369" x 0.423") APPLICATION SOICL - 20 (JEDEC) 9.37mm x 13.3mm (0.369" x 0.522") SOIC SOICL - 20 (EIAJ) 6.83mm x 13.0mm (0.269" x 0.510") SOICL - 24 (JEDEC) 9.37mm x 15.8mm (0.369" x 0.624") SOICL - 24 (EIAJ) 10.6mm x 15.0mm (0.416" x 0.590") SOICL - 28 (JEDEC) 9.37mm x 18.4mm (0.369" x 0.723") SOICL - 28 (EIAJ) 10.6mm x 17.5mm (0.416" x 0.690") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

136 SOIC Removal Process Guide R-SOI-10-A Flux Application SOIC Removal Tips ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply TT-65 ThermoTweez P1 SOIC Removal Tips See chart on back Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Flux Cleaner ➀ ➁ Align Tips Apply Flux PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tips. (see chart on back) 4. Install SOIC Removal Tips into ThermoTweez using Tip Tool. 5. Place Fiber Tool or Sponge Tool from Tip Maintenance Station between tips to align parallel and tighten set screws using Tip Tool. ➀ 6. Apply flux to all lead/land areas. ➁ 7. Remove old solder from tips with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station. 9 Tin bottom and inside edges of tips with solder or use Prep-Set. ➂ 10. Lower tips over component and tweeze handpiece contacting ALL leads with tips. ➃ & ➄ 11. Confirm solder melt of ALL joints and lift component from PCB. ➃ & ➄ 12. Release component from tips by wiping on a heat resistant surface. 13. Re-tin tips with solder and return ThermoTweez to its Tip & Tool Stand. 14. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ ➄ Tin Tips FPO Melt All Joints Lift Component

137 R-SOI-10-A Tips SOIC REMOVAL TIPS TIP SIZE (A) 6.4mm (0.25") PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F mm (0.3") A 10.2mm (0.4") mm (0.5") A 17.8mm (0.7") mm (0.8") mm (1.0") A 31.8mm (1.25") Application 38.1mm (1.5") mm (2.0") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

138 SOIC Removal Process Guide R-SOI-11-A Solder Wrap SOIC Removal Tips ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply TT-65 ThermoTweez P1 TT-65 Tip & Tool Stand SOIC Removal Tips See chart on back PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 1/16" Chisel Tip Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ FPO Align Tips Tac ack k & Wrap ap PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tips. (see chart on back) 4. Install SOIC Removal Tips into ThermoTweez using Tip Tool. 5. Place Fiber Tool or Sponge Tool from Tip Maintenance Station between tips to align parallel and tighten set screws using Tip Tool. ➀ 6. Tack solder to one of the corner component leads using the PS-80 with 1/16" Chisel Tip installed. Wrap solder around component leads forming a U shape. Terminate solder at last lead using Sodr-Pen. ➁ 7. Remove old solder from SOIC tips with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station. 9. Tin bottom and inside edges of tips with solder or use Prep-Set. ➂ 10. Lower tips over component and tweeze handpiece contacting ALL leads with tips. ➃ & ➄ 11. Confirm solder melt of ALL joints and lift component from PCB. ➃ & ➄ 12. Release component from tips by wiping on a heat resistant surface. 13. Re-tin tips with solder and return ThermoTweez to its Tip & Tool Stand. 14. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ ➄ Tin Tips Melt All Joints Lift Component

139 R-SOI-11-A Tips SOIC REMOVAL TIPS TIP SIZE (A) 6.4mm (0.25") PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F mm (0.3") A 10.2mm (0.4") mm (0.5") A 17.8mm (0.7") mm (0.8") mm (1.0") A 31.8mm (1.25") Application 38.1mm (1.5") mm (2.0") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

140 SOIC Removal Process Guide R-SOI-12-A Bridge Fill SOIC Removal Tips ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply TT-65 ThermoTweez P1 TT-65 Tip & Tool Stand SOIC Removal Tips See chart on back PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 Mini-Wave Tip Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Align Tips Bridge Fill PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tips. (see chart on back) 4. Install SOIC Removal Tips into ThermoTweez using Tip Tool. 5. Place Fiber or Sponge Tool from Tip Maintenance Station between tips to align parallel and tighten set screws using Tip Tool. ➀ 6. Melt solder to form a solder bridge fill joining all component leads using the PS-80 with Mini-Wave Tip installed. 7. Remove old solder from SOIC tips with Fiber Tool from Tip Maintenance Station. ➁ 8. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station. 9. Tin bottom and inside edges of tips with solder or use Prep-Set. ➂ 10. Lower tips over component and tweeze handpiece contacting ALL leads & with tips. ➃ 11. Confirm solder melt of ALL joints and lift component from PCB. ➃ & ➄ 12. Release component from tips by wiping on a heat resistant surface. 13. Re-tin tips with solder and return ThermoTweez to its Tip & Tool Stand. 14. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ ➄ Tin Tips FPO Melt All Joints Lift Component

141 R-SOI-12-A Tips SOIC REMOVAL TIPS TIP SIZE (A) 6.4mm (0.25") PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F mm (0.3") A 10.2mm (0.4") mm (0.5") A 17.8mm (0.7") mm (0.8") mm (1.0") A 31.8mm (1.25") Application 38.1mm (1.5") mm (2.0") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

142 Process Guide R-SOI-70-A THERMOFLO NOZZLE ThermoFlo Unit SOIC Removal EQUIPMENT REQUIRED PACE ThermoFlo Unit (115V) (230V) QFP QuickFit Nozzle See chart on back PACE Rubber Pad OPTIONAL EQUIPMENT N/A MATERIALS (approved by your organization) Cleaner Locally Obtained Flux Locally Obtained ➀ Apply Flux PROCEDURE 1. Set air blower speed, temperature,and cycle time controls to the required settings to optimize performance. 2. Install QuickFit Nozzle onto the ThermoFlo handpiece. Place PCB assembly onto the Work Holder. (optional) 3. Appy flux to component leads. (optional) ➀ 4. Position nozzle over component to be removed. 5. Adjust Vacuum Pik to proper height so the vacuum cup is at bottom edge of ThermoFlo nozzle. ➁ 6. Lower nozzle over component to a point where the bottom of the nozzle is.76mm mm (.030" -.050") above the PCB. ➂ 7. Commence reflow cycle and observe solder melt of all leads. ➃ 8. After complete solder reflow: In Manual mode, press the vacuum switch and raise the nozzle (with component attached to vacuum cup) from the PCB. ➄ In Timed (or Program) mode, the vacuum will automatically activate 5 seconds prior to cycle completion. The nozzle and component can then be raised from the PCB. ➄ 9. Return ThermoFlo handpiece to cubby. ➁ ➂ ➃ Adjust Vacuum Cup F P O Lower Nozzle Melt All Joints 10. Allow board to cool prior to board removal from Work Holder. Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➄

143 R-SOI-70-A F P O Component Type SOIC- 8 (JEDEC) SOIC-14/16 (JEDEC) SOICL-16 (JEDEC) SOICL-20 (JEDEC) SOICL-24 (JEDEC) SOICL-28 (JEDEC) SOICL-32 (JEDEC) SOJ-40/42 (JEDEC) TSOP-48 (Type I) TSOP-32/40/50 (Type II) Jet Spacing (A) 3.8mm (0.15") 3.8mm (0.15") 7.6mm (0.3") 7.6mm (0.3") 7.6mm (0.3") 7.6mm (0.3") 11.68mm (0.46") 11.42mm (0.45") 18.6mm (0.73") 10.4mm (0.41") Jet Length ( B) Part Numbe r 5.1mm (0.20") 10.4mm (0.41") 10.4mm (0.41") 12.9mm (0.51") 15.5mm (0.61") 18.0mm (0.71") 20.83mm (0.82") 27.17mm (1.07") 12.8mm (0.50") 21.35mm (0.84") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

144 SOT Removal Process Guide R-SOT-00-A -00-A Flux Application FPO SOT Removal Tip PS-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 SOT Removal Tip Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , or Tweezers MATERIALS (approved by your organization) Flux-cored Solder Flux Cleaner ➀ ➁ Apply Flux Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Install SOT Removal Tip into the PS-80 using Tip Tool. 4. Apply flux to all lead/land areas. ➀ 5. Remove old solder from tip with Fiber Tool from Tip Maintenance Station. 6. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 7. Tin bottom edges of tip with solder or use Prep-Set. ➁ 8. Lower tip over component contacting ALL 9. Confirm solder melt of ALL ALL leads with tip. ➂ & ➃ ALL joints and lift component from PCB. ➃ & ➄ (Surface tension of the tip should lift the component form the board. If this does not occur, use of tweezers to lift the component is optional) 10. Release component from tip by wiping on a heat resistant surface. ➂ ➃ Position Tip Melt All Joints 11. Re-tin tip with solder and return the PS-80 to its Tip & Tool Stand. 12. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➄ Lift Component

145 SOT Removal Process Guide R-SOT-10-A -10-A Flux Application SOT Removal Tips ThermoT motweez Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply TT-65 ThermoTweez P1 TT-65 Tip &Tool Stand SOT Removal Tips See chart on back ➀ Apply Flux Tip Tool P1 Tip Maintenance Station OPTIONAL EQUIPMENT N/A MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➁ Clean Tips PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tips. (see chart on back) 4. Install and align SOT Removal Tips into ThermoTweez using Tip Tool. 4. Apply flux to all lead/land areas. ➀ 6. Clean residue from tips with damp Sponge Tool from Tip Maintenance Station. ➁ 7. Lower tips over component and Gently tweeze handpiece contacting ALL leads with tips. ➂ & ➃ 8. Confirm solder melt of ALL joints and lift component from PCB. ➃ & ➄ 9. Release component from tips by wiping on a heat resistant surface. 10. Return ThermoTweez to its Tip & Tool Stand. ➂ ➃ Position Tips Melt All Joints 11. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➄ Lift Component

146 R-SOT-10-A -10-A SURFACE MOUNT REMOVAL TIPS DESCRIPTION TIP SIZE (A) PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F Angled Chip Component (vertical) 0.76mm (0.03") Vertical Chip Component (vertical) 2.00mm (0.08") A Chip Component (vertical) 4.1mm (0.16") A Application Chip Component (vertical) Small SOIC 6.4mm (0.25") SOT Component 45 Angle Chip Component 2.54mm (0.10") Thin-Walled Chip Component (vertical) 0.76mm (0.03") Thin-Walled Chip Component (vertical) 2.0mm (0.08") A Thin-Walled Chip Component (vertical) 4.1mm (0.16") Thin-Wall: Chip Component & 6.4mm Thickness = 0.43mm (0.017") Small SOIC (vertical) (0.25") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

147 SOT Removal Process Guide R-SOT-20-A -20-A Flux Application Mini ThermoJet Tip EQUIPMENT REQUIRED ThermoJet Handpiece PACE PART NUMBER PACE SensaTemp Power Supply with Pressure capability TJ-70 Mini ThermoJet P1 TJ-70 Tip &Tool Stand Mini ThermoJet Tip See chart on back ➀ Apply Flux Tip Tool Tweezers P1 OPTIONAL EQUIPMENT N/A MATERIALS (approved by your organization) Cleaner Tissue/wipe PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. ➁ Adjust Air Pressure 2. Start with a heater temperature of 427 C (800 F) and adjust as necessary. 3. Install Mini ThermoJet Tip into ThermoJet using the Tip Tool. 4. Apply flux to all lead/land areas. ➀ 5. Starting at MINIMUM, adjust pressure output (on power supply) so hot air scorches a tissue from approximately 0.5cm (0.2") away. ➁ 6. Direct hot air over component with tip at a distance of.5cm (.2") to achieve solder melt. 7. Confirm complete solder melt of ALL joints. ➂ ➂ Melt All Joints 8. Grasp component with tweezers and lift away from PCB. 9. Release component from tweezers on a heat resistant surface. ➃ 11. Return ThermoJet to its Tip & Tool Stand. FPO 12. Prepare lands for component replacement. Lift Component 1997 PACE Incorporated. Manual Assembly and Rework For Surface Mount Tel. (301) Fax (301) INTERNET: ➃

148 R-SOT-20-A -20-A TIP DESCRIPTION TIP SIZE PART NUMBER Small, Straight, Single Jet Tip Small, Curved Single Jet Tip SOT/Chip Component Tip (dual-jet) A = 3.56mm (0.14") SOIC Tip (dual-jet) A = 4.32mm (0.17") A SOICL Tip (dual-jet) A = 9.40mm (0.37") A = 7.11mm (0.28") B = 1.88mm (0.074") Flat End Tip A B A = 6.10mm (0.24") B = 1.88mm (0.074") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

149 TSOP Removal Process Guide R-TSP-00-A Flux Application TSOP Removal Tip SX-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Source With Vacuum Capability SX-80 Handpiece P1 SX-80 Tip & Tool Stand P1 TSOP Removal Tip See chart on back Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , FPO 0003 or MATERIALS (approved by your organization) Flux-cored Solder Flux Cleaner ➀ ➁ Apply Flux Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip. (see chart on back) 4. Install vacuum cup to Pik-Tip tube using Tip Tool. 5. Install TSOP Removal Tip into the SX-80 using Tip Tool. 6. Apply flux to all lead/land areas. ➀ 7. Remove old solder from tip with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 9. Tin inside and bottom edges of tip with solder or use Prep-Set. ➁ 10. Lower tip over component contacting ALL ALL leads with tip. ➂ & ➃ 11. Confirm solder melt of ALL joints, apply vacuum and lift component from PCB. ➃ & ➄ 12. Release component from tip by wiping on a heat resistant surface. 13. Re-tin tip with solder and return the SX-80 to its Tip & Tool Stand. 14. Prepare lands for component replacement. ➄ Lift Component Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ Position Tip Melt All Joints FPO

150 R-TSP-00-A PIK-TIPS TSOP REMOVAL TIP DESCRIPTION TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F TSOP mm x 12.7mm (0.320" x 0.500") A B APPLICATION TSOP-32 TSOP mm x 19.3mm (0.320" x 0.760") 9.9mm x 19.3mm (0.390" x 0.760") TSOP TSOP mm x 19.3mm (0.560" x 0.760") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

151 TSOP Removal Process Guide R-TSP-01-A Solder Wrap TSOP Removal Tip SX-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability SX-80 Handpiece P1 SX-80 Tip & Tool Stand P1 TSOP Removal Tip See chart on back PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 1/16" Chisel Tip Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , FPO 0003 or MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Tac ack k & Wrap Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip. (see chart on back) 4. Install vacuum cup to Pik-Tip tube using Tip Tool. 5. Install TSOP Removal Tip into the SX-80 using Tip Tool. 6. Tack solder to a end component lead using the PS-80 with 1/16" Chisel Tip installed. 7. Position solder over the leads and terminate at end of row using the PS-80 with chisel tip. Repeat this process on other side of component. ➀ 8. Remove old solder from TSOP tip with Fiber Tool from Tip Maintenance Station. 9. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 10. Tin bottom and inside edges of tip with solder or use Prep-Set. ➁ 11. Lower tip over component contacting ALL ALL leads with tip. ➂ & ➃ 12. Confirm solder melt of ALL joints, apply vacuum and lift component from PCB. ➃ & ➄ 13. Release component from tip by wiping on a heat resistant surface. 14. Re-tin tip with solder and return the SX-80 to its Tip & Tool Stand. 15. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ ➄ Position Tip Melt All Joints FPO Lift Component

152 R-TSP-01-A TSOP REMOVAL TIP DESCRIPTIO PIK-TIPS TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F TSOP mm x 12.7mm (0.320" x 0.500") A B APPLICATION TSOP-32 TSOP mm x 19.3mm (0.320" x 0.760") 9.9mm x 19.3mm (0.390" x 0.760") TSOP TSOP mm x 19.3mm (0.560" x 0.760") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

153 TSOP Removal Process Guide R-TSP-02-A Bridge Fill TSOP Removal Tip SX-80 Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Vacuum Capability SX-80 Handpiece P1 SX-80 Tip & Tool Stand P1 TSOP Removal Tip See chart on back PS-80 Handpiece P1 PS-80 Tip & Tool Stand P1 Angled Single Sided Chisel Tip Tip Maintenance Station Tip Tool P1 OPTIONAL EQUIPMENT PACE Prep-Set TM System (solder pot) , FPO 0003 or MATERIALS (approved by your organization) Flux-cored Solder Cleaner ➀ ➁ Bridge Fill Tin Tip PROCEDURE 1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues. 2. Start with a tip temperature of 315 C (600 F) and adjust as necessary. 3. Enter Tip Offset Constant for the selected tip (see chart on back). 4. Install vacuum cup to Pik-Tip tube using Tip Tool. 5. Install TSOP Removal Tip into the SX-80 using Tip Tool. 6. Melt solder to form a solder bridge fill joining all component leads using the PS-80 with Angled Single Sided Chisel Tip installed. ➀ 7. Remove old solder from TSOP tip with Fiber Tool from Tip Maintenance Station. 8. Thermal shock tip with damp Sponge Tool from Tip Maintenance Station. 9. Tin inside and bottom edges of tip with solder or use Prep-Set. ➁ 10. Lower tip over component contacting ALL ALL leads with tip. ➂ & ➃ 11. Confirm solder melt of ALL joints, apply vacuum and lift component from PCB. ➃ & ➄ 12. Release component from tip on a heat resistant surface. 13. Re-tin tip with solder and return the SX-80 to its Tip & Tool Stand. 14. Prepare lands for component replacement. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➂ ➃ ➄ Position Tip Melt All Joints FPO Lift Component

154 R-TSP-02-A TSOP REMOVAL TIP DESCRIPTIO PIK-TIPS TIP SIZE A X B PART NUMBER TIP OFFSET CONSTANT DIGITAL SYSTEMS C F TSOP mm x 12.7mm (0.320" x 0.500") A B APPLICATION TSOP-32 TSOP mm x 19.3mm (0.320" x 0.760") 9.9mm x 19.3mm (0.390" x 0.760") TSOP TSOP mm x 19.3mm (0.560" x 0.760") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

155 Process Guide I-BGA-50-A The following process can be performed with a PACE TF 2000 TF 2000 BGA Component Installation EQUIPMENT REQUIRED PACE PAR ART NUMBER PACE TF BGA Nozzle As Applicable OPTIONAL EQUIPMENT N/A ➀ Transf ansfer er Profile MATERIALS Flux Cleaner Locally Obtained Locally Obtained PROCEDURE 1. Before you begin, refer to process guide G-BGA-02-A for the proper component alignment steps prior to proceeding. ➁ Install Nozzle 2. Select and transfer the appropriate installation profile. If a profile does not exist, refer to process guide G-BGA-01-A to develop a new profile. ➀ 3. Install the appropriate nozzle on the TF 2000 reflow head assembly. ➁ 4. Index the sliding shaft holder to the far left position under the reflow head assembly. ➂ ➂ Index Sliding Shaft Holder to the Left 5. Lower the nozzle so that if possible it completely surrounds the component and is in gentle contact with the PCB surface. ➃ 6. Activate the installation profile by depressing the "Cycle Start" button. ➄ 7. Upon completion of the reflow cycle, allow the PCB and component to cool prior to removing the PCB from the PCB holder. ➃ Nozzle Position 8. Clean as required. Activate "Cycle Start" t" Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➄

156 I-BGA-50-A TF 2000 Nozzles Dimensions Maximum Size of Component* Part Number 8mm x 8mm (0.31" x 0.31") 5mm x 5mm (0.19" x 0.19") mm x 11mm (0.35" x 0.43") 6mm x 8mm (0.24" x 0.31") mm x 15.7mm (0.44" x 0.62") 8.2mm x 12.7mm (0.32" x 0.5") mm x 12mm (0.47" x 0.47") 9mm x 9mm (0.35" x 0.35") mm x 13mm (0.51" x 0.51") 10mm x 10mm (0.39" x 0.39") mm x 16mm (0.63" x 0.63") 13mm x 13mm (0.51" x 0.51 ) mm x 18mm (0.71" x 0.71") 15mm x 15mm (0.59" x 0.59") mm x 20mm (0.79" x 0.79") 17mm x 17mm (0.67" x 0.67") mm x 26mm (1.02" x 1.02") 23mm x 23mm (0.90" x 0.90") mm x 30mm (1.18" x 1.18") 27mm x 27mm (1.06" x 1.06") mm x 38mm (1.53" x 1.53") 35mm x 35mm (1.37" x 1.37") mm SQ mm x 8mm MM x 12.7mm mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ mm SQ LQFP, 22mm SQ LQFP, 16mm SQ LQFP, 30mm SQ LQFP, 9mm SQ LQFP, 12mm SQ LQFP, 26mm SQ Nozzle, LQFP, 16mm x 22mm Nozzle, LQFP, 14mm SQ Nozzle, 14mm x 22mm Nozzle, 50mm SQ Nozzle, 60mm SQ Nozzle, 40mm SQ Nozzle, 25mm SQ Nozzle 19mm SQ Nozzle, 16.5mm x 8mm Nozzle, 33mm SQ Nozzle, 21mm x 25mm Nozzle, 29mm SQ Nozzle, 31mm SQ Nozzle, 42mm SQ Nozzle, Conn, 16mm x 13mm Nozzle, Conn, 27mm x 13mm Nozzle, Conn, 30mm x 12mm Nozzle, Conn, 19mm x 8mm Nozzle, 56mm x 17mm Nozzle, w/ Baffle 28mm x Nozzle, 13mm x 10mm * Nozzles can also be used on components smaller than "Max Size". Custom nozzles can be ordered by contacting PACE. 146 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

157 Process Guide I-BGA-70-A ThermoFlo BGA Nozzle ThermoFlo System BGA Installation EQUIPMENT REQUIRED PACE ThermoFlo System (115V) (230V) BGA Vented Alignment Nozzle See chart on back PACE Rubber Pad OPTIONAL EQUIPMENT N/A MATERIALS (approved by your organization) Solder Paste or Flux-cored Solder Flux Cleaner PROCEDURE ➀ Align Template 1. Set ThermoFlo to 400 C (750 F). Set blower speed to 3. Adjust temperature/ time cycle as necessary. Timed or Program mode should be used for this procedure. 2. Install BGA Vented Alignment Nozzle onto ThermoFlo handpiece and raise nozzle to highest position. 3. Using flux-cored solder, prefill lands ensuring coplanarity OR apply solder paste evenly. 4. Place prepared circuit board into ThermoFlo Work Holder. 5. Align template to lands. ➀ 6. Lower nozzle and align to template to nozzle. ➁ 7. Raise nozzle and remove template. 8. Apply flux to lands if prefill method was used in step Turn on main vacuum. Insert component into nozzle. 10. Lower nozzle with component to allow BGA solder balls to lightly contact lands or solder paste. ➂ 11. Begin reflow cycle. ➃ Switch main vacuum off after approximately 10 seconds, allowing component to settle onto lands (the vacuum release can be set in the Program mode). ➁ ➂ Align Nozzle Ball/Land Contact 12. Upon completion of the reflow cycle, raise nozzle and allow board to cool prior to removing board from Workpiece Holder. 13. Clean, if required, and inspect. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➃ Begin Reflow

158 I-BGA-70-A Box BGA Part Alignment Nozzles Component Size Numbers Templates BGA-204/225/256/ 27mm x 27mm (1.1" x 1.1") /292/320/ BGA-169/168 23mm x 23mm (0.91" x 0.91") BGA-313/352 35mm x 35mm (1.38" x 1.38") BGA mm x 13mm (0.51" x 0.51") BGA-121/196 15mm x 15mm (0.59" x 0.59") BGA mm x 17.75mm (0.64" x 0.70") BGA mm x 14.97mm (0.53" x 0.59") BGA mm x 10.42mm (0.41" x 0.41") BGA-40/ mm x 13.21mm (0.47" x 0.52") BGA mm x 8.90mm (0.34" x 0.35") BGA-292/357/361 25mm x 25mm (0.99" x 0.99") BGA-421/432/736 40mm x 40mm (1.57" x 1.57") BGA mm x 42.5mm (1.67" x 1.67") BGA-240/304/432 31mm x 31mm (1.22" x 1.22") BGA mm x 17mm (0.67" x 0.67") BGA-252/255/256 21mm x 21mm (0.83" x 0.83") BGA-479/493/ mm x 37.5mm (1.48" x 1.48") BGA-96/121 19mm x 19mm (0.75" x 0.75") BGA-240/324 32mm x 32mm (1.26" x 1.26") BGA-256/400 29mm x 29mm (1.14" x 1.14") BGA mm x 16mm (0.63" x 0.63") BGA mm x 14mm (0.87" x 0.55") BGA mm x 19.25mm (0.76" x 0.76") BGA mm x 18.5mm (0.73" x 0.73") BGA mm x 26.4mm (1.04" x 1.04") BGA mm x 30mm (1.18" x 1.18") BGA mm x 32.3mm (0.98" x 1.27") BGA mm x 43mm (1.69" x 1.69") BGA mm x 44mm (1.73" x 1.73") BGA mm x 32.5mm (1.28" x 1.28") BGA mm x 22mm (0.87" x.87") BGA mm x 33mm (1.29" x 1.29") BGA mm x 47.5mm (1.87" x 1.87") BGA mm x 25mm (0.83" x 0.98") Micro BGA mm x 5.6mm (0.31" x 0.22") Micro BGA mm x 6.40mm (0.31" x 0.25") Custom-designed nozzles can be manufactured to meet your exacting specifications 148 Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

159 Chip Installation Process Guide I-CHP-00-A Solder Paste Mini ThermoJet Tip Mini ThermoJet Handpiece EQUIPMENT REQUIRED PACE PART NUMBER PACE SensaTemp Power Supply With Pressure Capability TJ-70 Mini ThermoJet P1 TJ-70 Tip & Tool Stand Mini Thermojet Tip See chart on back Pik & Paste Liquid Dispensing System Tip Tool Tweezers OPTIONAL EQUIPMENT Manual Solder Paste Dispenser MATERIALS (approved by your organization) Solder Paste Cleaner Solder Paste Dispense Needles Tissue/wipe ➀ Apply Solder ➁ Position Component PROCEDURE 1. Start with a heater temperature of 427 C (800 F) and adjust as necessary. 2. Install Mini Thermojet Tip into ThermoJet Handpiece using Tip Tool. 3. Apply a small bead of solder paste to each land using a dispenser. ➀ 4. Position component onto lands using tweezers. ➁ 5. Starting at MINIMUM, adjust pressure output (on power supply) so hot air scorches a tissue from approximately 0.5cm (0.2") away. ➂ 6. Direct hot air over component with tip at a distance of 2.5cm (1.0") to predry solder paste. ➃ 7. When pre-drying is observed (paste has dull, flat appearance), move tip closer (0.5cm [0.2"]) and heat until complete solder melt is observed. ➄ 8. Return ThermoJet to its Tip & Tool Stand. ➂ ➃ Adjust Pressure Pre-dry Paste 9. Clean, if required, and inspect. Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➄ Melt Joints

160 I-CHP-00-A TIP DESCRIPTION TIP SIZE PART NUMBER Small, Straight, Single Jet Tip Small, Curved Single Jet Tip SOT/Chip Component Tip (dual-jet) A = 3.56mm (0.14") SOIC Tip (dual-jet) A = 4.32mm (0.17") A SOICL Tip (dual-jet) A = 9.40mm (0.37") A = 7.11mm (0.28") B = 1.88mm (0.074") Flat End Tip A B A = 6.10mm (0.24") B = 1.88mm (0.074") Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET:

161 Process Guide I-CHP-70-A THERMOFLO SINGLE JET NOZZLE ThermoFlo Unit CHP Installation EQUIPMENT REQUIRED PACE ThermoFlo Unit (115V) (230V) QFP QuickFit Nozzle See chart on back PACE Rubber Pad Pace PV-65 Pik-Vac Wand P1 OPTIONAL EQUIPMENT Pik & Paste Liquid Dispensing System Tweezers Locally Obtained MATERIALS (approved by your organization) Solder Paste Solder Paste Dispense Needles Cleaner Tissue/wipe ➀ F P O Apply Solder ➁ Position Component PROCEDURE 1. Set temperature, blower speed, and cycle time controls to the required settings to optimize performance. Manual or Timed modes are typically used for this procedure. 2. Install QuickFit Nozzle onto the ThermoFlo handpiece. (Use Rubber Pad if nozzle is hot) 3. Apply a small bead of solder paste to each land using a dispenser. ➀ 4. Position component onto lands using tweezers. ➁ ➂ F P O Adjust Pressure 5. Starting at blower speed one, adjust blower speed (on power supply) until air scorches a tissue from approximately 0.5cm (0.2") away. ➂ 6. Direct hot air over component with nozzle at a distance of 2.5cm (1.0") to pre-dry solder paste. ➃ 7. When pre-drying is observed (paste has dull, flat appearance), move tip closer (0.5cm [0.2"]) and heat until complete solder melt is observed. ➄ ➃ Pre-dry Paste 8. Return ThermoFlo to its cubby. Melt All Joints Tel. 1 (888) 535-PACE (7223) Fax (301) INTERNET: ➄