Acceptability of Electronic Assemblies
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1 IPC-A-610E-2010 Acceptability of Electronic Assemblies Developed by the IPC-A-610 development team including Task Group (7-31b), Task Group Asia (7-31bCN) and Task Group Nordic (7-31bND) of the Product Assurance Committees (7-30 and 7-30CN) of IPC Supersedes: IPC-A-610D - February 2005 IPC-A-610C - January 2000 IPC-A-610B - December 1994 IPC-A-610A - March 1990 IPC-A August 1983 Users of this publication are encouraged to participate in the development of future revisions. Contact: IPC 3000 Lakeside Drive, Suite 309S Bannockburn, Illinois Tel Fax
2 Table of Contents 1 Foreword Scope Purpose Classification Definition of Requirements Acceptance Criteria Target Condition Acceptable Condition Defect Condition Disposition Process Indicator Condition Process Indicator Methodologies Combined Conditions Conditions Not Specified Specialized Designs Terms & Definitions Board Orientation *Primary Side *Secondary Side Solder Source Side Solder Destination Side *Cold Solder Connection Electrical Clearance High Voltage Intrusive Solder *Leaching Meniscus (Component) *Nonfunctional Land Pin-in-Paste Wire Diameter Wire Overwrap Wire Overlap Examples and Illustrations Inspection Methodology Verification of Dimensions Magnification Aids Lighting Applicable Documents IPC Documents Joint Industry Documents EOS/ESD Association Documents Electronics Industries Alliance Documents International Electrotechnical Commission Documents ASTM Technical Publications Handling Electronic Assemblies EOS/ESD Prevention Electrical Overstress (EOS) Electrostatic Discharge (ESD) Warning Labels Protective Materials EOS/ESD Safe Workstation/EPA Handling Considerations Guidelines Physical Damage Contamination Electronic Assemblies After Soldering Gloves and Finger Cots Hardware Hardware Installation Electrical Clearance Interference Heatsinks Insulators and Thermal Compounds Contact Threaded Fasteners Torque Wires Jackpost Mounting IPC-A-610E-2010 April 2010 vii
3 4.3 Connector Pins Edge Connector Pins Press Fit Pins Soldering Wire Bundle Securing General Lacing Lacing Damage Routing Wire Crossover Bend Radius Coaxial Cable Unused Wire Termination Ties over Splices and Ferrules Soldering Soldering Acceptability Requirements Soldering Anomalies Exposed Basis Metal Pin Holes/Blow Holes Reflow of Solder Paste Nonwetting Cold/Rosin Connection Dewetting Excess Solder Solder Balls/Solder Fines Bridging Solder Webbing/Splashes Disturbed Solder Fractured Solder Solder Projections Lead Free Fillet Lift Lead Free Hot Tear/Shrink Hole Probe Marks and Other Similar Surface Conditions in Solder Joints Terminal Connections Swaged Hardware Terminals Terminal Base Pad Gap Terminals Turret Terminals Bifurcated Rolled Flange Flared Flange Controlled Split Solder Insulation Damage Presolder Post-Solder Clearance Flexible Sleeve Placement Damage Conductor Deformation Strand Damage Strand Separation (Birdcaging) Presolder Strand Separation (Birdcaging) Post-Solder Tinning Service Loops Terminals Stress Relief Bundle Lead/Wire Bend Terminals Lead/Wire Placement General Requirements Terminals Solder General Requirements Terminals Turrets and Straight Pins Lead/Wire Placement Solder Terminals Bifurcated Lead/Wire Placement Side Route Attachments Lead/Wire Placement Bottom and Top Route Attachments Lead/Wire Placement Staked Wires Solder Terminals Slotted Lead/Wire Placement Solder viii April 2010 IPC-A-610E-2010
4 6.11 Terminals Pierced/Perforated Lead/Wire Placement Solder Terminals Hook Lead/Wire Placement Solder Terminals Solder Cups Lead/Wire Placement Solder Terminals AWG 30 and Smaller Diameter Wires Lead/Wire Placement Terminals Series Connected Terminals Edge Clip Position Through Hole Technology Component Mounting Orientation Horizontal Vertical Lead Forming Bends Stress Relief Damage Leads Crossing Conductors Hole Obstruction DIP/SIP Devices and Sockets Radial Leads Vertical Spacers Radial Leads Horizontal Connectors Right Angle Vertical Shrouded Pin Headers and Vertical Receptacle Connectors High Power Conductive Cases Component Securing Mounting Clips Adhesive Bonding Adhesive Bonding Nonelevated Components Adhesive Bonding Elevated Components Wire Hold Down Supported Holes Axial Leaded Horizontal Axial Leaded Vertical Wire/Lead Protrusion Wire/Lead Clinches Solder Vertical fill (A) Primary Side Lead to Barrel (B) Primary Side Land Area Coverage (C) Secondary Side Lead to Barrel (D) Secondary Side Land Area Coverage (E) Solder Conditions Solder in Lead Bend Solder Conditions Touching Through-Hole Component Body Solder Conditions Meniscus in Solder Lead Cutting after Soldering Coated Wire Insulation in Solder Interfacial Connection without Lead Vias Board in Board Unsupported Holes Axial Leads Horizontal Axial Leads Vertical Wire/Lead Protrusion Wire/Lead Clinches Solder Lead Cutting after Soldering Jumper Wires Wire Selection Wire Routing Wire Staking Supported Holes Lead in Hole Wrapped Attachment Lap Soldered IPC-A-610E-2010 April 2010 ix
5 8 Surface Mount Assemblies Staking Adhesive Component Bonding Mechanical Strength SMT Leads Damage Flattening SMT Connections Chip Components Bottom Only Terminations Side Overhang (A) End Overhang (B) End Joint Width (C) Side Joint Length (D) Maximum Fillet Height (E) Minimum Fillet Height (F) Solder Thickness (G) End Overlap (J) Rectangular or Square End Chip Components 1, 3 or 5 Side Terminations Side Overhang (A) End Overhang (B) End Joint Width (C) Side Joint Length (D) Maximum Fillet Height (E) Minimum Fillet Height (F) Thickness (G) End Overlap (J) Termination Variations Mounting on Side (Billboarding) Mounting Upside Down Stacking Tombstoning Terminations Terminations Solder Width Terminations Minimum Fillet Height Cylindrical End Cap Terminations Side Overhang (A) End Overhang (B) End Joint Width (C) Side Joint Length (D) Maximum Fillet Height (E) Minimum Fillet Height (F) Solder Thickness (G) End Overlap (J) Castellated Terminations Side Overhang (A) End Overhang (B) Minimum End Joint Width (C) Minimum Side Joint Length (D) Maximum Fillet Height (E) Minimum Fillet Height (F) Solder Thickness (G) Flat Gull Wing Leads Side Overhang (A) Toe Overhang (B) Minimum End Joint Width (C) Minimum Side Joint Length (D) Maximum Heel Fillet Height (E) Minimum Heel Fillet Height (F) Solder Thickness (G) Coplanarity Round or Flattened (Coined) Gull Wing Leads Side Overhang (A) Toe Overhang (B) Minimum End Joint Width (C) Minimum Side Joint Length (D) Maximum Heel Fillet Height (E) Minimum Heel Fillet Height (F) Solder Thickness (G) Minimum Side Joint Height (Q) Coplanarity J Leads Side Overhang (A) Toe Overhang (B) End Joint Width (C) Side Joint Length (D) Maximum Fillet Height (E) Minimum Heel Fillet Height (F) Solder Thickness (G) Coplanarity x April 2010 IPC-A-610E-2010
6 8.3.8 Butt/I Connections Maximum Side Overhang (A) Maximum Toe Overhang (B) Minimum End Joint Width (C) Minimum Side Joint Length (D) Maximum Fillet Height (E) Minimum Fillet Height (F) Solder Thickness (G) Flat Lug Leads Tall Profile Components Having Bottom Only Terminations Inward Formed L-Shaped Ribbon Leads Surface Mount Area Array Alignment Solder Ball Spacing Solder Connections Voids Underfill/Staking Package on Package Bottom Termination Components (BTC) Components with Bottom Thermal Plane Terminations Flattened Post Connections Maximum Termination Overhang Square Solder Land Maximum Termination Overhang Round Solder Land Maximum Fillet Height Specialized SMT Terminations Surface Mount Connectors Jumper Wires SMT Chip and Cylindrical End Cap Components Gull Wing J Lead Castellations Land Component Damage Loss of Metallization Chip Resistor Element Leaded/Leadless Devices Ceramic Chip Capacitors Connectors Relays Transformer Core Damage Connectors, Handles, Extractors, Latches Edge Connector Pins Press Fit Pins Backplane Connector Pins Heat Sink Hardware IPC-A-610E-2010 April 2010 xi
7 10 Printed Circuit Boards and Assemblies Gold Surface Contact Area Laminate Conditions Measling and Crazing Blistering and Delamination Weave Texture/Weave Exposure Haloing and Edge Delamination Burns Bow and Twist Depanelization Conductors/Lands Reduction in Cross-Sectional Area Lifted Pads/Lands Mechanical Damage Flexible and Rigid-Flex Printed Circuitry Damage Delamination Discoloration Solder Wicking Attachment Marking Etched (Including Hand Printing) Screened Stamped Laser Labels Bar Coding Readability Adhesion and Damage Position Using Radio Frequency Identification (RFID) Tags Chlorides, Carbonates and White Residues Flux Residues No-Clean Process Appearance Surface Appearance Solder Mask Coating Wrinkling/Cracking Voids, Blisters, Scratches Breakdown Discoloration Conformal Coating General Coverage Thickness Encapsulation Discrete Wiring Solderless Wrap Number of Turns Turn Spacing End Tails, Insulation Wrap Raised Turns Overlap Connection Position Wire Dress Wire Slack Wire Plating Damaged Insulation Damaged Conductors & Terminals Component Mounting Connector Wire Dress Strain/Stress Relief High Voltage Cleanliness Flux Residues Particulate Matter Appendix A Electrical Conductor Spacing... A-1 Index... Index-1 xii April 2010 IPC-A-610E-2010
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