THROUGH-HOLE SOLDER JOINT WORKMANSHIP STANDARDS CLASS 2 TRAINING CERTIFICATION TEST (DVD-PTH-E) v.1

Transcription

1 This test consists of thirty multiple-choice questions. All questions are from the video: Through- Hole Solder Joint Workmanship Standards (DVD-PTH-E). Use the supplied Answer Sheet and circle the letter corresponding to your selection for each test item. If more than one answer appears to be correct, pick the answer that seems to be the most complete response. Should you wish to change an answer, erase your choice completely. When finished, check to make sure you have answered all of the questions. Turn in the test materials to the instructor. The passing grade for this test is 70% (21 correct answers), or better. Good luck! 1

2 ANSWER SHEET Name: Date: 1 True False 2 Yes No 3 True False 4 Yes No 5 A B C D 6 A B C D 7 Yes No 8 Yes No 9 True False 10 Yes No 11 A B C D 12 A B C D 13 True False 14 True False 15 A B C D 16 A B C D 17 A B C D 18 A B C D 19 A B C D 20 A B C D 21 A B C D 22 A B C D 23 A B C D 24 A B C D 25 A B C D 26 A B C D 27 A B C D 28 A B C D 29 A B C D 30 A B C D 2

3 1. Zero (0) % land coverage on the component side is allowed as long as other requirements are met for the barrel and the solder side of the connection. True or False 2. Does the amount of solder on this component exceed the maximum that is allowed in the lead bend area? Yes or No 3. Two criteria associated with the barrel of the solder connection are vertical fill and excessive solder. True or False 4. Does this solder joint meet the minimum requirement for vertical fill? Yes or No 5. To evaluate vertical fill in a plated-through hole, you must a. look at the solder connection from the component side b. look at the solder connection from the solder side c. look at the solder connection from both the component and solder sides d. none of the above 3

4 6. Circumferential wetting on the solder side defines a. how far around the lead, land and barrel wall the solder wets b. the diameter of the solder joint c. the radius of the solder joint d. the wetting of the circuit board circumference 7. Does this solder joint meet the minimum requirement for circumferential wetting of the lead and barrel on the component side? Yes or No 8. Does this solder joint meet the minimum requirement for the wetting of the lead, land and barrel on the solder side of the connection? Yes or No 4

5 9. The ideal solder fillet will form a contact angle of at least 90 degrees. True or False 10. Even with a contact angle close to 90 degrees, this solder joint is still acceptable. Yes or No 11. A process indicator a. means the product is unacceptable b. will affect the form, fit or function of the end product c. should be used to improve the manufacturing process d. all of the above 12. Even if the lead is not visible on the solder side, it is still considered a process indicator when a. there is evidence of the lead in the hole from the component side b. the lead is not visible due to excess solder on the solder side c. the fillet on the solder side is convex with good wetting d. all of the above 13. A void is an allowable condition as long as minimum soldering requirements have been met. True or False 5

6 14. This soldering defect is always unacceptable. True or False 15. When exposed basis metal on component leads, conductors, or lands occur from nicks, scratches or dents, it is a a. process indicator b. minimum acceptable condition c. defect d. sign to rework the solder connection 16. The following is an example of a. Excess lead protrusion b. Nonwetting c. Solder balls d. Solder projection 6

7 17. The following is an example of a. disturbed solder b. solder projection c. exposed basis metal d. nonwetting 18. The following is an example of a. solder projection b. excess lead protrusion c. corrosion d. target solder joint 7

8 19. The following is an example of a. cracked or fractured solder joint b. excess lead protrusion c. disturbed solder d. nonwetting 20. The following is an example of a. cracked or fractured solder joint b. solder projection c. disturbed solder d. exposed basis metal 8

9 21. The following is an example of a. corrosion b. exposed basis metal c. cracked or fractured joint d. residue 22. The following is an example of a. dewetting b. disturbed solder c. fractured solder joint d. corrosion 9

10 23. The following is an example of a. solder projections b. solder webbing c. disturbed solder d. exposed basis metal 24. The following is an example of a. solder splashes b. disturbed solder c. solder bridging d. solder webbing 10

11 25. The following is an example of a. exposed basis metal b. corrosion c. solder voids d. cracked or fractured joint 26. The following is an example of a. nonwetting b. solder balls c. solder projection d. particulate matter 11

12 27. The following is an example of a. excess lead protrusion b. solder bridging c. exposed basis metal d. solder projection 28. The following is an example of a. solder cavities b. nonwetting c. disturbed solder d. particulate matter 12

13 29. The following is an example of a. residue b. cold solder joint c. nonwetting d. solder splashes 30. The following is an example of a. solder projection b. solder splashes c. particulate matter d. solder balls 13