Acceptability of Electronic Assemblies

Transcription

1 IPC-A-610F with Amendment 1 Acceptability of Electronic Assemblies If a conflict occurs between the English language and translated versions of this document, the English version will take precedence. Developed by the IPC-A-610 development team including Task Group (7-31B), Task Group Asia (7-31BCN), Task Group Nordic (7-31BND), Task Group German Language (7-31BDE) and Task Group India (7-31BIN) of the Product Assurance Committees (7-30 and 7-30CN) of IPC Users of this publication are encouraged to participate in the development of future revisions. Contact: IPC

2 Table of Contents 1 Foreword Scope Purpose Personnel Proficiency Classification Definition of Requirements Acceptance Criteria Target Condition Acceptable Condition Defect Condition Disposition Process Indicator Condition Process Indicator Methodologies Combined Conditions Conditions Not Specified Specialized Designs Terms and Definitions Board Orientation *Primary Side *Secondary Side *Solder Source Side *Solder Destination Side *Cold Solder Connection Electrical Clearance FOD (Foreign Object Debris) High Voltage Intrusive Solder Meniscus (Component) *Nonfunctional Land Pin-in-Paste Solder Balls Wire Diameter Wire Overlap Wire Overwrap Examples and Illustrations Inspection Methodology Verification of Dimensions Magnification Aids Lighting Applicable Documents IPC Documents Joint Industry Documents EOS/ESD Association Documents Electronics Industries Alliance Documents International Electrotechnical Commission Documents ASTM Technical Publications Handling Electronic Assemblies EOS/ESD Prevention Electrical Overstress (EOS) Electrostatic Discharge (ESD) Warning Labels Protective Materials EOS/ESD Safe Workstation/EPA Handling Considerations Guidelines Physical Damage Contamination Electronic Assemblies After Soldering Gloves and Finger Cots Hardware Hardware Installation Electrical Clearance Interference Component Mounting High Power Heatsinks Insulators and Thermal Compounds Contact Threaded Fasteners and Other Threaded Hardware Torque Wires IPC-A-610F with Amendment 1 February 2016 v

3 4.2 Jackpost Mounting Connector Pins Edge Connector Pins Press Fit Pins Soldering Wire Bundle Securing General Lacing Damage Routing Wires and Wire Bundles Wire Crossover Bend Radius Coaxial Cable Unused Wire Termination Ties over Splices and Ferrules Soldering Soldering Acceptability Requirements Soldering Anomalies Exposed Basis Metal Pin Holes/Blow Holes Reflow of Solder Paste Nonwetting Cold/Rosin Connection Dewetting Excess Solder Solder Balls Bridging Solder Webbing/Splashes Disturbed Solder Fractured Solder Solder Projections Lead Free Fillet Lift Lead Free Hot Tear/Shrink Hole Probe Marks and Other Similar Surface Conditions in Solder Joints Terminal Connections Swaged Hardware Terminals Terminal Base to Land Separation Turret Bifurcated Rolled Flange Flared Flange Controlled Split Solder Insulation Damage Presolder Post-Solder Clearance Flexible Sleeve Placement Damage Conductor Deformation Damage Stranded Wire Solid Wire Strand Separation (Birdcaging) Presolder Strand Separation (Birdcaging) Post-Solder Tinning Service Loops Stress Relief Bundle Lead/Wire Bend Lead/Wire Placement General Requirements Solder General Requirements Turrets and Straight Pins Lead/Wire Placement Turret and Straight Pin Solder Bifurcated Lead/Wire Placement Side Route Attachments Lead/Wire Placement Staked Wires Lead/Wire Placement Bottom and Top Route Attachments Solder Slotted Lead/Wire Placement Solder vi February 2016 IPC-A-610F with Amendment 1

4 6.11 Pierced/Perforated Lead/Wire Placement Solder Hook Lead/Wire Placement Solder Solder Cups Lead/Wire Placement Solder AWG 30 and Smaller Diameter Wires Lead/Wire Placement Series Connected Edge Clip Position Through-Hole Technology Component Mounting Orientation Orientation Horizontal Orientation Vertical Lead Forming Bend Radius Space between Seal/Weld and Bend Stress Relief Damage Leads Crossing Conductors Hole Obstruction DIP/SIP Devices and Sockets Radial Leads Vertical Spacers Radial Leads Horizontal Connectors Right Angle Vertical Shrouded Pin Headers and Vertical Receptacle Connectors Conductive Cases Component Securing Mounting Clips Adhesive Bonding Adhesive Bonding Nonelevated Components Adhesive Bonding Elevated Components Other Devices Supported Holes Axial Leaded Horizontal Axial Leaded Vertical Wire/Lead Protrusion Wire/Lead Clinches Solder Vertical Fill (A) Solder Destination Side Lead to Barrel (B) Solder Destination Side Land Area Coverage (C) Solder Source Side Lead to Barrel (D) Solder Source Side Land Area Coverage (E) Solder Conditions Solder in Lead Bend Solder Conditions Touching Through-Hole Component Body Solder Conditions Meniscus in Solder Lead Cutting after Soldering Coated Wire Insulation in Solder Interfacial Connection without Lead Vias Board in Board Unsupported Holes Axial Leads Horizontal Axial Leads Vertical Wire/Lead Protrusion Wire/Lead Clinches Solder Lead Cutting after Soldering Jumper Wires Wire Selection Wire Routing Wire Staking Supported Holes Supported Holes Lead in Hole Wrapped Attachment Lap Soldered IPC-A-610F with Amendment 1 February 2016 vii

5 8 Surface Mount Assemblies Staking Adhesive Component Bonding Mechanical Strength SMT Leads Plastic Components Damage Flattening SMT Connections Chip Components Bottom Only Terminations Side Overhang (A) End Overhang (B) End Joint Width (C) Side Joint Length (D) Maximum Fillet Height (E) Minimum Fillet Height (F) Solder Thickness (G) End Overlap (J) Rectangular or Square End Chip Components 1, 3 or 5 Side Terminations Side Overhang (A) End Overhang (B) End Joint Width (C) Side Joint Length (D) Maximum Fillet Height (E) Minimum Fillet Height (F) Solder Thickness (G) End Overlap (J) Termination Variations Mounting on Side (Billboarding) Mounting Upside Down Stacking Tombstoning Center Terminations Solder Width of Side Termination Minimum Fillet Height of Side Termination Cylindrical End Cap Terminations Side Overhang (A) End Overhang (B) End Joint Width (C) Side Joint Length (D) Maximum Fillet Height (E) Minimum Fillet Height (F) Solder Thickness (G) End Overlap (J) Castellated Terminations Side Overhang (A) End Overhang (B) Minimum End Joint Width (C) Minimum Side Joint Length (D) Maximum Fillet Height (E) Minimum Fillet Height (F) Solder Thickness (G) Flat Gull Wing Leads Side Overhang (A) Toe Overhang (B) Minimum End Joint Width (C) Minimum Side Joint Length (D) Maximum Heel Fillet Height (E) Minimum Heel Fillet Height (F) Solder Thickness (G) Coplanarity Round or Flattened (Coined) Gull Wing Leads Side Overhang (A) Toe Overhang (B) Minimum End Joint Width (C) Minimum Side Joint Length (D) Maximum Heel Fillet Height (E) Minimum Heel Fillet Height (F) Solder Thickness (G) Minimum Side Joint Height (Q) Coplanarity J Leads Side Overhang (A) Toe Overhang (B) End Joint Width (C) Side Joint Length (D) Maximum Heel Fillet Height (E) Minimum Heel Fillet Height (F) Solder Thickness (G) Coplanarity viii February 2016 IPC-A-610F with Amendment 1

6 8.3.8 Butt/I Connections Modified Through-Hole Terminations Solder Charged Terminations Maximum Side Overhang (A) Maximum Toe Overhang (B) Minimum End Joint Width (C) Minimum Side Joint Length (D) Maximum Fillet Height (E) Minimum Fillet Height (F) Solder Thickness (G) Flat Lug Leads Tall Profile Components Having Bottom Only Terminations Inward Formed L-Shaped Ribbon Leads Surface Mount Area Array Alignment Solder Ball Spacing Solder Connections Voids Underfill/Staking Package on Package Bottom Termination Components (BTC) Components with Bottom Thermal Plane Terminations Flattened Post Connections Maximum Termination Overhang Square Solder Land Maximum Termination Overhang Round Solder Land Maximum Fillet Height P-Style Connections Maximum Side Overhang (A) Maximum Toe Overhang (B) Minimum End Joint Width (C) Minimum Side Joint Length (D) Minimum Fillet Height (F) Specialized SMT Terminations Surface Mount Connectors Jumper Wires SMT Chip and Cylindrical End Cap Components Gull Wing J Lead Castellations Land Component Damage Loss of Metallization Chip Resistor Element Leaded/Leadless Devices Ceramic Chip Capacitors Connectors Relays Transformer Core Damage Connectors, Handles, Extractors, Latches Edge Connector Pins Press Fit Pins Backplane Connector Pins Heat Sink Hardware Threaded Items and Hardware IPC-A-610F with Amendment 1 February 2016 ix

7 10 Printed Circuit Non-Soldered Contact Areas Contamination Damage Laminate Conditions Measling and Crazing Blistering and Delamination Weave Texture/Weave Exposure Haloing Edge Delamination, Nicks and Crazing Burns Bow and Twist Depanelization Conductors/Lands Reduction Lifted Mechanical Damage Flexible and Rigid-Flex Printed Circuitry Damage Delamination/Blister Flex Flex to Stiffener Solder Wicking Attachment Marking Etched (Including Hand Printing) Screened Stamped Laser Labels Bar Coding/Data Matrix Readability Labels Adhesion and Damage Position Radio Frequency Identification (RFID) Tags Cleanliness Flux Residues Foreign Object Debris (FOD) Chlorides, Carbonates and White Residues Flux Residues No-Clean Process Appearance Surface Appearance Solder Mask Coating Wrinkling/Cracking Voids, Blisters, Scratches Breakdown Discoloration Conformal Coating General Coverage Thickness Electrical Insulation Coating Coverage Thickness Encapsulation Discrete Wiring Solderless Wrap Number of Turns Turn Spacing End Tails and Insulation Wrap Raised Turns Overlap Connection Position Wire Dress Wire Slack Wire Plating Damaged Insulation Damaged Conductors and Terminals High Voltage Appendix A Electrical Conductor Spacing... A-1 Index... Index-1 x February 2016 IPC-A-610F with Amendment 1

8 1 Acceptability of Electronic Assemblies Foreword The following topics are addressed in this section: 1.1 Scope Purpose Personnel Proficiency Classification Definition of Requirements Acceptance Criteria Target Condition Acceptable Condition Defect Condition Disposition Process Indicator Condition Process Indicator Methodologies Combined Conditions Conditions Not Specified Specialized Designs Terms and Definitions Board Orientation *Primary Side *Secondary Side *Solder Source Side *Solder Destination Side *Cold Solder Connection Electrical Clearance FOD (Foreign Object Debris) High Voltage Intrusive Solder Meniscus (Component) *Nonfunctional Land Pin-in-Paste Solder Balls Wire Diameter Wire Overlap Wire Overwrap Examples and Illustrations Inspection Methodology Verification of Dimensions Magnification Aids Lighting IPC-A-610F with Amendment 1 February

9 1 Acceptability of Electronic Assemblies Foreword (cont.) 1.1 Scope This standard is a collection of visual quality acceptability requirements for electronic assemblies. This standard does not provide criteria for cross-section evaluation. This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, electronic assembly standards contained a more comprehensive tutorial addressing principles and techniques. For a more complete understanding of this document s recommendations and requirements, one may use this document in conjunction with IPC- HDBK-001, IPC-AJ-820 and IPC J-STD-001. The criteria in this standard are not intended to define processes to accomplish assembly operations nor is it intended to authorize repair/modification or change of the customer s product. For instance, the presence of criteria for adhesive bonding of components does not imply/authorize/require the use of adhesive bonding, and the depiction of a lead wrapped clockwise around a terminal does not imply/authorize/require that all leads/wires be wrapped in the clockwise direction. Users of this standard should be knowledgeable of the applicable requirements of the document and how to apply them. Objective evidence of the demonstration of this knowledge should be maintained. Where objective evidence is unavailable, the organization should consider periodic review of personnel skills to determine visual acceptance criteria appropriately. IPC-A-610 has criteria outside the scope of IPC J-STD-001 defining handling, mechanical and other workmanship requirements. Table 1-1 is a summary of related documents. Table 1-1 Summary of Related Documents Document Purpose Design Standard PCB Requirements Specification Number IPC-2220 (Series) IPC-7351 IPC-CM-770 IPC-6010 (series) IPC-A-600 Definition Design requirements reflecting three levels of complexity (Levels A, B, and C) indicating finer geometries, greater densities, more process steps to produce the product. Component and Assembly Process Guidelines to assist in the design of the bare board and the assembly where the bare board processes concentrate on land patterns for surface mount and the assembly concentrates on surface mount and through-hole principles which are usually incorporated into the design process and the documentation. Requirements and acceptance documentation for rigid, rigid flex, flex and other types of substrates. End Item Documentation IPC-D-325 Documentation depicting bare board specific end product requirements designed by the customer or end item assembly requirements. Details may or may not reference industry specifications or workmanship standards as well as customer s own preferences or internal standard requirements. End Item Standards IPC J-STD-001 Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation (test methods), frequency of testing and applicable ability of process control requirements. Acceptability Standard IPC-A-610 Pictorial interpretive document indicating various characteristics of the board and/or assembly as appropriate relating to desirable conditions that exceed the minimum acceptable characteristics indicated by the end item performance standard and reflect various out-of-control (process indicator or defect) conditions to assist the shop process evaluators in judging need for corrective action. Training Programs (Optional) Documented training requirements for teaching and learning process procedures and techniques for implementing acceptance requirements of either end item standards, acceptability standards, or requirements detailed on the customer documentation. Rework and Repair IPC-7711/7721 Documentation providing the procedures to accomplish conformal coating and component removal and replacement, solder resist repair, and modification/repair of laminate material, conductors, and plated-through holes. 1-2 February 2016 IPC-A-610F with Amendment 1