REVISION TO SEMI M , MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300MM WAFERS

Transcription

1 Background Statement for SEMI Draft Document 4481B REVISION TO SEMI M , MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300MM WAFERS Note: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this document. Note: Recipients of this document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, patented technology is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided. Note: The additions are underlined. 1. Ballot history The first document was balloted as document 4481 in cycle 5 of SEMI received one reject with three negatives and one comment; so that Japan silicon wafer committee judged that it would be better to reflect those inputs. In previous ballot document 4481A, the proposal is modified to correspond with those negatives, and no other changes are made: Negative 1. The size and shape of the ID area should be the same for door and for body to avoid confusion by the end user/implementer. Action: Modified to same size and shape for door and for body, 50mm x 40mm TF has confirmed that the readability and cost of reader are not influenced by the modified size/area and shape (rectangular) in reading. Negative 2. The background states laser marking test with 20 rows and 20 columns and 6mm x 6 mm size, on the other hand, proposed specification is 18 rows and 18 columns and 8+/- 2mm square size. For more reliable reading and decoding, would it be best to include this specific method in application notes vs. standard Action: Revised incorporated background and text of the proposed standard: Added some explanation in background Specified marking method in the standard for avoiding confusion or trouble by using other marking method. Otherwise, users are free to use what they want, which would make the standard not useable/consistent with implementation. Negative 3. This standard should more detail re: what is allowed mark content. eg, Action: upper vs. lower case, what special characters are allowed, etc. Restricted to These characters are included in the set designated as "primary upper case alphanumeric" in ISO/IEC Doc.4481 A received negative votes including two issues 1. The phrase that this 2D code is not intended to be used for automation purposes is missing in the document, though it is stated in the background. It was agreed in the San Francisco committee meeting to include the phrase in the Document, either in the body or in note.

2 2. Section (Part of Definition) is including limitations and requirements. They shall be moved to the corresponding sections. Those negatives were judged as related and technically persuasive, so that TF revised the document 4481A to 4481B including item 1, 2 and improvement of wording and terminology. 2. Rationale: <Problem to be addressed by this activity> * Distinguish method of FOSB variety * Specifications for FOSB parts identification <Background> Today, the industry is interested in maximizing 300mm wafer shipping box standardization activity, so that some revisions have been made, as it provides standard users the benefit of utilizing FOSB defined by SEMI M31. On the course of realization of this benefit, silicon suppliers aware FOSB identification needs such as distinguish of FOSB makers, models and version, and traceability need of individual parts of FOSB for improved quality control. JA 300mm Shipping Box TF conducted discussions and experiments, and then found that 2D-codes(Data Matrix Code, 20 rows and 20 columns and 6mm x 6mm size) marked on FOSB body and door with laser beam were successfully readable with a 2D-code reader even on transparent polycarbonate. The TF researched the necessary amount for FOSB ID, and found 2D-codes of 18 rows and 18 columns to be sufficient for this purpose. The readability for the proposed FOSB ID with 2D-code has been examined and confirmed in the experiments. The TF proposes laser marking for this FOSB ID marking method based on the test, and for avoiding confusion or trouble by using other marking method. 2. Scope: Specify 2D-code indications on shell and door of FOSB in order to distinguish FOSB makers, models and version, and traceability. The traceability is intended for traceability of FOSB itself, and not for process control in device process.

3 SEMI Draft Document 4481B Revision to SEMI M : MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 mm WAFERS 1 Purpose 1.1 This standard specifies the front-opening shipping box (FOSB) used to ship 300 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality. NOTE 1: Refer to SEMI silicon wafer related specifications M-series such as SEMI M1 as for a wafer quality. 2 Scope 2.1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. However, this standard has been written so that injection-molded plastic FOSBs can be manufactured in conformance with it, and those can be utilized for maintaining wafers quality during transportation, opening and closing the door. 2.2 This standard assumes that the FOSB is used in the last process in wafer manufacturing, in acceptance and inspection, and in transferring the wafers from the FOSB to a FOUP, FOBIT or open cassette inside an IC manufacturing facility. The FOSB is not intended to be used in IC manufacturing processes. It is recommended that wafers be transferred from the FOSB to a FOUP, FOBIT or open cassette using automated methods. As described in 5.4, the purchaser needs to specify which type of FOSB door is required: 1. Manual door as described in 5.4.1; or 2. Automated shippable door as described in NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use. 3 Referenced Standards and Documents 3.1 SEMI Standards SEMI E1.9 Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers SEMI E15 Specification for Tool Load Port SEMI E15.1 Specification for 300 mm Tool Load Port SEMI E47.1 Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm Wafers SEMI E57 Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers SEMI E62 Provisional Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS) SEMI E119 Provisional Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory Transport of 300mm Wafers SEMI M45 Provisional Standard for 300mm Wafer Shipping System SEMI S8 Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment 3.2 ISO/IEC Standards ISO/IEC International Symbology Specification - Data Matrix NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions. Page 1 Doc. 4481B SEMI

4 4 Terminology 4.1 Definitions bilateral datum a vertical that bisects the wafers and that is perpendicular to both the horizontal and facial datum s (as defined in SEMI E57) box a protective portable container for a carrier and/or substrate(s) carrier an open structure that holds one or more substrates carrier bottom domain volume (below z6 above the horizontal datum ) that contains the bottom of the carrier (as defined in SEMI E1.9) carrier capacity the number of substrates that a carrier holds (as defined in SEMI E1.9) carrier sensing pads surfaces on the bottom of the carrier for triggering optical or mechanical sensors (as defined in SEMI E1.9) carrier side domains volumes (from z6 above the horizontal datum to z15 above the top nominal wafer seating ) that contain the mizo teeth or slots that support the wafer and the supporting columns on the sides and rear of the carrier (as defined in SEMI E1.9) carrier top domain volume (higher than z15 above the top wafer) that contains the top of the carrier (as defined in SEMI E1.9) facial datum a vertical that bisects the wafers and that is parallel to the front side of the carrier (where wafers are removed or inserted). On tool load ports, it is also parallel to the load face specified in SEMI E15 on the side of the tool where the carrier is loaded and unloaded (as defined in SEMI E57) front-opening shipping box (FOSB) a shipping box with a front-opening interface front-opening unified pod (FOUP) a box (that complies with SEMI E47.1) with a non-removable cassette (so that its interior complies with SEMI E1.9) and with a front-opening interface (that mates with a FIMS port that complies with SEMI E62) (as defined in SEMI E47.1) front-opening box for interfactory transport (FOBIT) box for interfactory transport between IC manufacturing sites horizontal datum a horizontal from which projects the kinematic-coupling pins on which the carrier sits. On tool load ports, it is at the load height specified in SEMI E15 and might not be physically realized as a surface (as defined in SEMI E57) minienvironment a localized environment created by an enclosure to isolate the product from contamination and people nominal wafer centerline the line that is defined by the intersection of the two vertical datum s (facial and bilateral) and that passes through the nominal centers of the seated wafers (which must be horizontal when the carrier is placed on the coupling) (as defined in SEMI E57) optical wafer sensing paths lines of sight for optically sensing the positions of the wafers. Several horizontal optical wafer sensing paths are present in between the carrier side domains. In addition, two vertical optical wafer sensing paths are created by rectangular exclusion zones in the front of the carrier top and bottom (as defined in SEMI E1.9) shipping box a protective portable container for a carrier and/or wafer(s) that is used to ship wafers from the wafer suppliers to their customers shipping-box front-opening mechanical interface (SFMI) optional automated-shippable door style for a FOSB that is compatible with SEMI E62, and must be considered characteristics with exceptions as noted in virtual tracking unit an entity (which could be a number of substrates or an individual die or mask group) that the factory floor control system treats as a single unit for tracking purposes (as defined in SEMI E1.9) wafer carrier any cassette, box, pod, or boat that contains wafers (as defined in SEMI E15). Page 2 Doc. 4481B SEMI

5 wafer extraction volume the open space for extracting a wafer from the carrier (as defined in SEMI E1.9) wafer pick-up volume the space that contains entire bottom of a wafer if the wafer has been pushed to the rear of the carrier (as defined in SEMI E1.9) wafer set-down volume the open space for inserting and setting down a wafer in the carrier (as defined in SEMI E1.9) D code placement area an area on the door and another area on top of the shell, where a 2D code can be placed D code a code identifying elements such as maker, model, version and serial number of a FOSB, by using a data matrix ECC200 symbol according to ISO/IEC Requirements 5.1 The FOSB has the following components and sub-components: Key: Required feature Optional feature Rear RFID Tag Placement Volume Door on front Top Manual door (optional) Automated door (optional) 2D code placement area (optional) Holes for latch keys that lock the door to the SFMI interface when the door is unlatched from the box Holes for registration pins Door presence sensing areas Interior Top robotic handling flange (optional) 2D code placement area (optional) Cassette with supports for 13 or 25 wafers Wafer retainer end effector exclusion zone Sides Bottom Ergonomic manual handles (optional) 5 carrier sensing pads 4 Info pads 3 features that mate with kinematic coupling pins and provide a 10 mm lead-in Page 3 Doc. 4481B SEMI

6 3 features that mate with kinematic coupling pins and provide a 15 mm lead-in (optional) Retaining features for manual door (optional) Retaining features for automated-shippable door 5.2 Kinematic Couplings The physical alignment mechanism from the FOSB to the tool load-port (or a nest on a vehicle or in a stocker) consists of features (not specified in this standard) on the top entity that mate with three or six pins underneath as defined in SEMI E57. The three features that mate with the kinematic coupling pins must provide a lead-in capability that corrects a FOSB misalignment of up to r69 in any horizontal direction. 5.3 Inner and Outer Radii All required concave features may have a radius of up to r65 to allow cleaning and to prevent contaminant build-up. All required convex features may also have a radius of up to r66 to prevent small contact patches with large stresses that might cause wear and particles. Note that these limits on the radius of all required features are specified as a maximum (not a minimum) to ensure that the required features are not rounded off too much. The lower bound on the radius is up to the FOSB supplier. Note also that this radius applies to every required feature unless another radius is called out specifically. Here a required feature is an area on the surface of the FOSB supplier. Note also that this radius applies to every required feature unless another radius is called out specifically. Here a required feature is an area on the surface of the FOSB specified by a dimension (or intersections of dimensions) that has a tolerance and not just a maximum or minimum (such as the edges of the robotic handling flange). 5.4 Door It is recommended that the FOSB not be vertical when it is opened or closed. When the FOSB is in a vertical orientation with the door removed, the wafers must be restrained from touching each other by appropriate wafer support design or other retaining techniques Manual Door If chosen, the manual door option requires no automation to open the door. An exclusion zone surrounding the manual door area is specified in the standard. There are several possible techniques for sealing and clamping the manual door that meet user requirements. Therefore, only an exclusion zone surrounding the manual door area is specified in this standard. All features of the door and door retaining mechanism must lie within the exclusion zone illustrated in Figure 1 and must not interfere with other specified features (including the kinematic couplings). Figure 1 and dimensions x81, y50, y81, y82, z47, z48 and z49 define the manual door area and therefore apply only to the manual door option as described in this section. The y81 dimension applies from the horizontal datum to the top surfaces of the FOSB (z47-z48 or z47+z49 at the upper door frame volume specified by y50) Automated-shippable Door If chosen, the automated-shippable door must be designed to mate with a port that conforms to SEMI E62. However, following characteristics of automate-shippable door must be considered Wafer Retaining Structure The slot is usually designed that wafers are suspended in the slot without contacting the surface of the slot for preventing the damage during transportation when FOSB door is closed. It should be noted that wafer position of FOSB is different from that of FOUP when the door is closed due to the wafer retaining structure Rear of Door (y51) For manual door, FOSB has a y51 50 mm to hold wafers in large area at front wafer retainer for keeping wafer quality during transportation. For automated-shippable door, FOSB has a y mm to comply with SEMI E Force with Which the Load Port Presses the Box Door Into the Box (f34: defined by SEMI E62) f34 is related to wafer retaining force though, need to consider door is pulled by latching too. The gap y88 shall be zero (or even can have a slightly negative value compared to the datum measured from in Table 3), when the load port applies a force f34 of 110N or more. Even though, f34 is increased, minimum force applied to wafer would be recommended for eliminating damage to the wafers in dynamic motion for opening and closing the door Latch Key Torque (f30: defined by SEMI E62) The required latch key torque depends on the closing force A FOSB with an automated-shippable door should be able to withstand a force when applied to one of the retaining features of up to 40N (f61) in any direction without negative impact to the intended function of the FOSB (e.g., shell deformation, wafer positions, door closing capabilities). Page 4 Doc. 4481B SEMI

7 Gap(y88) The distance between 1) the FOSB Door Front in the fully seated position when the door is closed on a FOSB containing up to 25 wafers, and 2) the FOSB Door Front at the stage when the latch keys are allowed to be turned. The Gap value is specified by y88 where y88 is added to the measured y52 dimension of the FOSB. T his would result in the dimension of the front of the automated-shippable door from the facial datum being equal to the measured y52 value plus y88 (reference Figure 15). Note: a) The FOSB door may not be pushed to the fully seated position by f34. There might be a gap left of up to y88, especially when a force close to the lower limit of f34 will be applied. Fully seated within this context should be understood as the static position of the FOSB door within the box shell, when the box is completely closed and the box front features are within the limits as defined by y52 of SEMI M31. b) Final closing, which includes a movement of the FOSB door to it s fully seated position, is accomplished by turning latch keys as described in 5.4 of SEMI E62. c) Measured y52 is the physical measurement of the y52 dimension of the FOSB, within the tolerance as specified for y52 in SEMI M31. d) The gap y88 may have a size of up to the maximum value defined in Table 3, when a load port applies the minimum force f34 as defined in SEMI E62 for a FOSB. e) The current size of the gap y88, within the given limits, may depend both from the actual amount of force f34 applied by a load port as well as from the specific design of the FOSB. 5.5 Seal Zones for Door In the Front Opening Shipping Box Automated Door Option the automated box door is on the front side of the box (corresponding to the front side of the carrier where wafers are accessed so the door is perpendicular to the wafers and parallel to the facial datum ). The automated door and the carrier frame must have surfaces that mate with the seal zones defined in SEMI E62. Specifically, the FOSB automated box door option and the carrier frame must have surfaces that made with the seal zones and the reserved spaces for vacuum application (which includes all of the circles bounded by r38 except for the holes for the registrations at the center of each circle) defined in 5 of SEMI E62 (which specifies r38 as well as the seal zone dimensions). These automated door and frame surfaces must be a distance of y52 from the facial datum and must have a flatness of y42. No surface on the automated door may project further from the facial datum than the door seal zone and the reserved spaces for vacuum application. The automated door must also be designed so that when the box is pressed against the FIMS port, both latch keys on the port are inserted to their full length. Furthermore, when the latch keys are turned more than 45 toward the position that unlocks the automated door from the box, the latch key holes on the door must be such that the door is not removable from the latch keys. There are no door seal zone requirements for the manual door option, but a FOSB with the manual door must contain a frame seal zone that meets the frame seal zone requirements specified in this section. 5.6 Wafer Retaining When the FOSB is closed, the wafers must be retained in the FOSB to prevent movement during subsequent handling, including shipping. It should be noted that wafers are typically shipped in a vertical orientation and generally require support from a secondary package. It is recommended that this secondary package be designed to allow for easy removal of the FOSB from the secondary package. Page 5 Doc. 4481B SEMI

8 Figure 1 Manual Door Area 5.7 Wafer Orientation and Numbering The wafers must be horizontal when the FOSB is placed on the coupling, and the wafers slots are numbered in increasing order from bottom to top (so the bottom wafer is wafer number 1, the next wafer up is wafer number 2, etc.). 5.8 Internal Horizontal Dimensions Figure 2 shows a cross-section of the horizontal boundaries of the FOSB side domains (which contain the parts of the FOSB higher than z6 above the horizontal datum and lower than z15 above the top wafer). In this and following figures, the most heavy lines are used for surfaces that have tolerances (not surfaces that have only maximum or minimum dimensions). front side of the FOSB where wafers are accessed x y51 50(manual door) 140(automated door) x x3 125 y1 3 y ± 0.5 mm (6.52 ± y in.) 134 y11 85 wafer setdown and extraction volumes wafer pick-up area left front side domain left rear side domain bilateral datum r 2 = r 3 r2 + 1 r4 170 x2 75 x1 50 y5 120 r1 151 facial datum right front side domain right rear side domain Figure 2 Top View of FOSB Internal Dimensions 5.9 Internal Vertical Dimensions Figures 3 7 show the vertical dimensions of the internal FOSB. Note that z8 (the height of the bottom nominal wafer seating above the horizontal datum ) and z12 (the distance between adjacent nominal wafer seating s) are given as absolute distances with no tolerance. This means that the sum of actual height variations in the FOSB from the kinematic coupling to the supporting features holding each wafer must be contained within the tolerance of z10 with no further stack-up at each higher wafer. The method for meeting this requirement is left up to the FOSB supplier. Table 2 defines all dimensions for Figures 3 7. Page 6 Doc. 4481B SEMI

9 y5 120 facial datum front side of the FOSB where wafers are accessed Figure 3 Side View of FOSB Internal Dimensions horizontal datum z15 13 z6 32 z 12 = 10 z 8 = 44 detail in Figure 6 z z 12 = 10 z 8 = 44 z 6 32 detail in Figure 8 x1 50 x2 75 x3 125 horizontal datum bilateral datum Figure 4 Front View of FOSB Internal Dimensions Page 7 Doc. 4481B SEMI

10 z23 3 r2 = r3 r2 + 1 z11 6 x3 125 z15 13 z12 =10 z10 =±0.5 (height of wafer bottom) Figure 5 Upper Cross-Section at Facial Datum Plane bilateral datum top nominal wafer Wafer Set-Down Volume The open space for the wafer set-down volume consists of a cylindrical section with radius r2 and a main axis parallel to and y1 in front of the nominal wafer centerline. The top of this cylindrical section is z11 above the nominal wafer seating and its bottom is z10 above the nominal wafer seating. The implications for wafer positioning of the tolerance on r2 are as follows. The wafers should be placed in the FOSB within a circle of radius corresponding to the smaller bound on r2 to avoid touching the edge of the wafer to the side of the FOSB. Once the wafer has been placed, the FOSB must not allow a wafer to move outside of a circle of radius corresponding to the larger bound on r2. There are two exceptions to this limit on wafer movement. When the wafer is pushed toward the rear of the FOSB, the location of the wafer is defined by the wafer pick-up volume (see 5.9.3). When the FOSB is gently tilted forward up to 45, the wafers may slide forward, but it is recommended that they not extend further than y20 from the facial datum. This may be accomplished by designing the teeth supporting the wafers to include a wafer stopper at the front that is outside of r2 and under z29 as illustrated in Figure Wafer Extraction Volume The open space for the wafer extraction volume includes a cylindrical section with radius r3 and a main axis parallel to and y1 in front of the nominal wafer center line. The top of this cylindrical section is z11 above the nominal wafer seating and its bottom is z23 above the nominal wafer seating. The wafer extraction volume also includes the extrusion out the front of the FOSB of this cylindrical section and the portion of the wafer set-down volume above z29. The implications for wafer extraction of the definition of dimension r3 (r3 r2 + 1) are as follows. The FOSB must give an extra 1 mm (0.04 in.) of horizontal clearance once the wafer is picked up from wherever it ends up (within the bounds of r2) after transport in the FOSB. Page 8 Doc. 4481B SEMI

11 front side of the FOSB where wafers are accessed Wafer z Figure 6 Features That Prevent Wafer Creep-Out z11 6 z12 = 10 z 10 = ±0.5 x3 125 z12 = 10 z12 = 10 bilateral datum bottom nominal wafer z6 32 z8 = 44 horizontal datum Figure 7 Lower Cross-Section at Facial Datum Plane Page 9 Doc. 4481B SEMI

12 5.9.3 Wafer Pick-Up Volume If a wafer is placed in the wafer set-down volume and is then pushed toward the rear of the FOSB, then the entire bottom of the wafer must be contained in the wafer pick-up volume. However, if the wafer is not pushed toward the rear of the FOSB, then the wafer may only be somewhere within the wafer extraction volume. The wafer pick-up volume is defined by a cylindrical section with radius r1 and a main axis at the nominal wafer centerline. Its top and bottom are the upper and lower tolerance of z10 around the nominal wafer seating Pitch and Capacity Table 1 shows the different options with regard to the wafer pitch (spacing) and the FOSB capacity. Again, no tolerance is given on the wafer pitch (z12), for reasons given in 5.9. Table 1 Pitch and Capacity Options Option Number FOSB Capacity Wafer Pitch (z12) Wafer Clearance (z11) 1 13 wafers 10 mm (0.39 in.) 6 mm (0.24 in.) minimum 2 25 wafers 10 mm (0.39 in.) 6 mm (0.24 in.) minimum Table 2 Internal FOSB Dimensions (Figures 2 7) Symbol Used Figure Number Manual Door Value Specified Auto-door Datum Measured from Boundary or Feature Measured to R mm (5.94 in.) maximum nominal wafer centerline outer edge of wafer pick-up volume R2 2, = 1 0 mm ( in.) Y1 in front of nominal wafer centerline R3 2, 5 r2 + 1 mm (0.04 in.) minimum Y1 in front of nominal wafer centerline encroachment of FOSB side domains on wafer set-down volume encroachment of FOSB side domains on wafer extraction volume R mm (6.69 in.) minimum nominal wafer centerline encroachment of FOSB on end effector exclusion zone between front and rear FOSB side domains X1 2, 4 50 mm (1.97 in.) minimum bilateral datum inside of rear FOSB side domains X2 2, 4 75 mm (2.95 in.) maximum bilateral datum Outside of rear FOSB side domains X3 2, 4, 5, mm (4.92 in.) minimum bilateral datum inside of front FOSB side domains X mm (5.51 in.) minimum bilateral datum interior of FOSB sides between y11 and y49 X mm (6.69 in.) minimum bilateral datum interior of FOSB sides between y49 and y52 Y1 2 3 mm (0.12 in.) maximum facial datum origin of r2 and r3 on bilateral datum Y5 2, mm (4.72 in.) minimum facial datum front of rear FOSB side domains Y mm (3.35 in.) maximum facial datum interior of FOSB sides between x3 and x51 Y20 #1 None 158 mm (6.22 in.) facial datum maximum protrusion of wafers toward the front of the FOSB Y mm (5.28 in.) maximum facial datum interior of FOSB sides between x51 and x52 Y mm (1.97 in.) minimum 140 mm (5.51 in.) minimum facial datum rear of door Page 10 Doc. 4481B SEMI

13 Symbol Used Figure Number Manual Door Value Specified Auto-door Datum Measured from Boundary or Feature Measured to Z6 3, 4, 7 32 mm (1.26 in.) maximum horizontal datum Top of FOSB bottom domain Z8 3, 4, 7 44 mm (1.73 in) horizontal datum Bottom nominal wafer seating Z10 5, 6 0 ± 0.5 mm (0.00 ± 0.02 in.) each nominal wafer seating Z11 5, 6 See Table 1. each nominal wafer seating Z12 3, 4, 5, 6, 7 See Table 1. each nominal wafer seating Z15 3, 4, 5 13 mm (0.51 in.) minimum top nominal wafer seating Z mm (0.12 in.) maximum each nominal wafer seating Z mm (0.028 in.) maximum each nominal wafer seating #1 These dimensions are for optional features. entire bottom of the wafer encroachment of FOSB side domains on clearance above the wafer adjacent nominal wafer seating s Bottom of FOSB top domain Bottom of wafer extraction volume encroachment of FOSB side domains under wafer extraction volume 5.11 External Dimensions Figures 8 12 respectively show the side view, rear view, top view, robotic flange, and bottom view for the FOSB. Table 3 defines all of the dimensions. If an identification tag is used, it must be located at the bottom rear centered on the bilateral datum and must be contained within the maximum outer dimensions of the FOSB. RFID Tag placement volume is defined in Human Handles All handles for use by humans must either be contained within the maximum outer dimensions of the FOSB, be detached when not in use, or be retractable into the maximum outer dimensions when not in use. Although such handles may extend past x53, they must still be contained within x50, y40, and r67. Handles for use by humans (if present) must follow SEMI S8, and they must require the use of both hands (each using a full wrap-around grip, given the minimum clearance requirement in SEMI E15.1). Automation handling features shall not be considered dual purpose unless they are designed to meet SEMI S8 guidelines Automation Handling On the top of the FOSB, there is an optional robotic handling flange for manipulating the FOSB as illustrated in Figure 12. On the bottom of the FOSB, there are optional rails for use with roller conveyors or forklifts. Although they are only required to extend y58 to the left and right, it is recommended that they be as long as possible. Beyond y58, only the lower bound on z43 apply. These optional conveyor rails (defined by x56, x57, and z43) are located on the left and right bottom edges of the front-opening shipping box. The conveyor rails also have vertical cylindrical pin holes for fork lift centering (defined by d65). Page 11 Doc. 4481B SEMI

14 z47 = 210 (330) ± 1 z43 = 2 ± 1 z48 15 (numbers in parentheses are for 25-wafer FOSB, if different) z49 8 y y46 = 71 ± 1 d65 =10±0.5 y58 75 z41 0 z2 2 (at sensor pads) facial datum y44 53 z65 7 Figure 8 Side View of FOSB y y y52 = 165 ± 0.5 mm (6.52 ± 0.02 in.) horizontal datum of box front side of the FOSB where wafers are accessed human handle (optional) (numbers in parentheses are for 25-wafer FOSB, if different) bilateral datum z z 49 8 x46 = 71 ± 1 x44 53 z47 = 210 (330) ± 1 bottom rail x65 = z41 0 z2 2 (at sensor pads) d65 = 10± 0.5 human handle (optional) z65 7 z43 = 2 ± 1 x x (at human handle) x (elsewhere) x56 = (at bottom rail) horizontal datum of box Figure 9 Rear View of FOSB Page 12 Doc. 4481B SEMI

15 y y detail in Figure 12 x x front side of the FOSB where wafers are accessed x (at human handle) x (elsewhere) y51 50 r r y67 = 25 Manual door exclusion zone bilateral datum y52 = ± 0.5 mm (6.52 ± 0.02 in.) y y y81 30 human handle (optional) facial datum Figure 10 Top View of FOSB Page 13 Doc. 4481B SEMI

16 front side of the carrier where wafers are accessed (16x) θ = 45 ± 0.5 orientation notch y41 = 30 ± 1 positio n notch y44 53 x47 58 x42 = 50 ± 1 x41 = 30 ± 1 x69 = 7.6 ± 0.1 α = 60 y68 55 r63 66 d63 = / -0.1 y47 58 y46 = 71 ± 1 y45 =65.3± 1 facial datum bilateral datum x45 = 65.3 ± 1 x44 53 x43 = 50 ± 1 x46 = 71 ± 1 crosssection above β = 45 ± 1 r59 6 x46 = 71 ± 1 x45 = 65.3 ± 1 position notch d63 = / -0.1 z50 5 z47 x69 = 7.6 ± 0.1 = 210 (330) [253 (373)] ± 1 γ = 52 ± 1 z48 15 z49 8 top of box bilateral datum horizontal datum (numbers in parentheses are for 25-wafer boxes, if different) [numbers in square brackets are for removable cassettes, if different] Figure 11 Top Robotic Handling Flange Page 14 Doc. 4481B SEMI

17 y y58 75 bilateral datum info pad C info pad A front side of the FOSB where wafers are accessed x (at human handle) x x56 = ± 0.25 (at bottom rail) x x14 = x13 = 88.5 y19 = 61.1 d65 = 10 ± 0.5 x65 = y10 = y18 = 40.2 y9 = 92.5 y17 = 27.5 x8 = 12.5 r x17 = 17.5 y52 = ± 0.5 mm (6.52 ± 0.02 in.) r x21 = 30 x22 = 70 r r17 10 r y kinematic coupling pin carrier sensing pads (height z2 2 mm) facial datum human handle (optional) info pad D info pad B NOTE: Info pad height (z2, z26) is described in table 3. Figure 12 Bottom View of FOSB 5.14 Retaining Features Figure 13 and 14 show two features on the bottom of the FOSB that may be used for retaining the FOSB onto the kinematic couplings. Retaining features are option for the FOSB with manual door, however those are required for the FOSB with automated-shippable door. This may be needed to prevent the FOSB from being knocked off the kinematic couplings by the action of pushing the FOSB against the front-opening interface. The center retaining feature consists of an oblong slot with a chamber above it. Either retaining feature would only engage after the FOSB is fully seated on the kinematic coupling pins. Either retaining feature must be able to withstand a force in any direction of at least f60. It is recommended that SEMI E15.1 tool load ports be designed to accommodate the minimum hole dimensions of the retaining features to ensure carrier interchangeability. Projections on the tool load ports that mate with the retaining features should also not interfere with the misalignment correction function of the kinematic couplings Sensing Pads As shown in Figure 12, when the FOSB is fully down on the kinematic coupling, the carrier sensing pads must be z2 above horizontal datum. It is recommended that the areas surrounding all of the carrier sensing pads be designed in conjunction with the features that mate with kinematic coupling pins so that a mechanical sensor pin cannot interfere with the lead-in function of the kinematic couplings. Other sensing pads (called info pads and given letter names) communicate information about the carrier. Note that since this is a bottom view, the positions of sensors on a load port will be switched, with the sensor for info pad A on the right and the sensor for info pad B on the left as one faces the tool from the front. Table 3 defines all dimensions RFID Tag Placement Volume Volume where the RFID tag is placed. The entire RFID tag must be placed within the volume defined by x83, y83 (y82 is already used for the front surface of the manual door.) y53, z1 and z83 as shown in Figures 16 and 17. Page 15 Doc. 4481B SEMI

18 5.17 2D Code Placement Area One optional area on the door and another optional area on top of the FOSB shell, where a 2D code can be placed. The 2D code on top of the FOSB shell must be within the lateral boundaries of an area defined by x84, x85, y84 and y85 as defined in Table 3 and shown in Figure 18. The 2D code on the front surface of FOSB door must be within the lateral boundaries defined by x86, x87, z86 and z87 as defined in Table 3 and shown in Figure 19. The 2D codes are not intended to be used for automated reading on fab equipment load ports, since readers would likely conflict with spaces reserved for other purposes D code - A square data matrix with a size of 8±2mm consisting of 18 rows and 18 columns shall be employed on the surface of FOSB with laser marking.. Each data matrix includes information designated as "primary upper case alphanumeric" per ECC200 Symbol of ISO/IEC with a capacity of 25 alphanumerical characters in total. These 25 characters shall contain the following 6 elements: Character 1-2 FOSB maker; See Auxiliary SEMI Document Character 3 Door-Type; Manual (M) or Auto(A) Character 4 Location; Box Shell (B) or Door (D) Character 5-8 Model code as defined by each FOSB maker Character 9 Mold Revision number Character FOSB Serial number Table 3 External FOSB Dimensions and related forces applied to FOSB (Figures 8 19) Symbol Used Figure Number Manual Door Value Specified Auto-Door Datum Measured from Feature Measured to α # bilateral datum centerline of the right and left kinematic grooves in the top robotic handling flange β # ± 1 nominal wafer centerline surface of the center hole in the top robotic handling flange γ # ± 1 bilateral datum or vertical rotated α away from it about nominal wafer centerline angled surface of the kinematic grooves in the top robotic handling flange θ # ± 0.5 either vertical datum sides of position and orientation notches φ ± 0.5 horizontal line on bilateral datum ramp of front retaining feature D63 # / mm ( / in.) D65 8, 9, ± 0.5 mm (0.39 ± 0.02 in.) diameter centered on the nominal wafer centerline diameter centered on the intersection of x65 and the facial datum sides the center hole in the top robotic handling flange at height z47 surface of cylindrical fork-lift pin holes in left and right bottom conveyor rails F60 None 175 N (39.3 lbf.) minimum not applicable force in any direction which both retaining features are able to withstand F61 None not applicable 40 N (8.99 lbf.) maximum not applicable R mm (0.10 in.) minimum line segment along center of carrier sensing pad force that a FOSB should be able to withstand when applied to one of the retaining features in any direction without negative impact to the intended function edge of carrier sensing pad Page 16 Doc. 4481B SEMI

19 Symbol Used Figure Number Manual Door Value Specified Auto-Door Datum Measured from Feature Measured to R mm (0.30 in.) minimum intersection of x21 and y10 edge of info pads A and B R mm (0.39 in.) minimum intersection of x22 and y9 edge of info pads C and D R59 # mm (0.24 in.) maximum not applicable radius on peak of kinematic grooves in the top robotic handling flange R60 13,14 16 ± 0.5 mm (0.63 ± 0.02 in.) nominal wafer center line ends of slot for center retaining feature R61 13,14 16 mm (0.63 in.) minimum nominal wafer center line walls of chamber above slot in center retaining feature R63 # mm (2.60 in.) maximum nominal wafer centerline near end of the right and left kinematic grooves in the top robotic handling flange R mm (0.37 in.) maximum not applicable corners of front retaining feature R65 None 1 mm (0.04 in.) maximum not applicable all concave features (radius) R66 None 2 mm (0.08 in.) maximum not applicable all required convex features (radius) R mm (9.45 in.) maximum Y67 in front of nominal wafer centerline R68 # mm (10.67 in.) maximum R69 None 10 mm (0.4 in.) minimum (required) 15 mm (0.6 in.) (recommended for ergonomic reasons) Not applicable Y67 in front of nominal wafer centerline not applicable any part of FOSB any part of FOSB manual door correctable FOSB misalignment in any horizontal direction X mm (0.49 in.) bilateral datum end of the line segment along center of center carrier sensing pad X mm (3.48 in.) bilateral datum near end of the line segment along center of front carrier sensing pads X mm (4.67 in.) bilateral datum far end of the line segment along center of front carrier sensing pads X mm (0.69 in.) bilateral datum line segment along center of rear carrier sensing pads X mm (1.18 in.) bilateral datum origin of radius r14 at center of info pads A and B X mm (2.76 in.) bilateral datum origin of radius r17 at center of info pads C and D X41 # ± 1 mm (1.18 ± 0.04 in.) X42 # ± 1 mm (1.97 ± 0.04 in.) X43 # ± 1 mm (1.97 ± 0.04 in.) bilateral datum bilateral datum bilateral datum front right orientation notch on robotic handling flange front left orientation notch on robotic handling flange rear orientation notch on robotic handling flange X44 #1 9, mm (2.09 in.) maximum bilateral datum encroachment of FOSB underneath robotic handling flange Page 17 Doc. 4481B SEMI

20 Symbol Used Figure Number Manual Door Value Specified X45 # ± 1 mm (2.57 ± 0.04 in.) X46 #1 9, ± 1 mm (2.80 ± 0.04 in.) Auto-Door Datum Measured from bilateral datum bilateral datum Feature Measured to nearest point of side position and orientation notches on robotic handling flange sides of robotic handling flange X47 # mm (2.28 in.) minimum bilateral datum end of robotic handling flange front and rear X50 9, 10, mm (8.46 in.) maximum bilateral datum furthest reach of human handles X53 9, 10, mm (7.68 in.) maximum bilateral datum FOSB sides (apart from human handles) X56 9, ± 0.25 mm (7.667 ± in.) bilateral datum outside edge of bottom conveyor rails X57 9, mm (7.09 in.) maximum bilateral datum FOSB sides underneath bottom conveyor rails X ± 0.5 mm (0.31 ± 0.02 in.) bilateral datum sides of slot for center retaining feature X mm (1.38 in.) minimum bilateral datum sides of front retaining feature X65 9, mm (7.38 in.) bilateral datum vertical axis of cylindrical fork-lift pin holes in left and right bottom conveyor rails X mm (0.98 in.) minimum bilateral datum sides of volume above ramp on front retaining feature x69 # ± 0.1 mm (0.299 ± in.) X81 # mm (8.46 in.) maximum bilateral datum or vertical rotated α away from it about nominal wafer centerline Not applicable bilateral datum beginning of angled surface of the kinematic grooves in the top robotic handling flange outer edge of manual door X mm bilateral datum edge of RFID tag placement volume x84 # mm bilateral datum edge of 2D code placement area on box shell x85 # mm bilateral datum edge of 2D code placement area on box shell x86 # mm bilateral datum edge of 2D code placement area on door x87 # mm bilateral datum edge of 2D code placement area on door Y mm (3.64 in.) facial datum front end of the line segment along center of rear carrier sensing pads and origin of radius r17 at center of info pads C and D Y mm (4.86 in.) facial datum rear end of the line segment along center of rear carrier sensing pads and origin of radius r14 at center of info pads A and B Page 18 Doc. 4481B SEMI

21 Symbol Used Figure Number Manual Door Value Specified Auto-Door Datum Measured from Feature Measured to Y mm (1.08 in.) facial datum line segment along center of center carrier sensing pad Y mm (1.58 in.) facial datum near end of the line segment along center of front carrier sensing pads Y mm (2.41 in.) facial datum far end of the line segment along center of front carrier sensing pads Y40 #1 8, 10, mm (4.57 in.) maximum facial datum furthest extent of human handles toward the front Y41 # ± 1 mm (1.18 ± 0.04 in.) Y42 None ± 0.5 mm (± 0.02 in.) flatness over each area facial datum facial datum left orientation notch on robotic handling flange surfaces that mate with the seal zones Y44 #1 8, mm (2.09 in.) maximum facial datum encroachment of supports under the outer edge of the robotic handling flange Y45 # ± 1 mm (2.57 ± 0.04 in.) Y46 #1 8, ± 1 mm (2.80 ± 0.04 in.) facial datum facial datum nearest point of front and rear position and orientation notches on robotic handling flange front and rear edge of robotic handling flange Y47 # mm (2.28 in.) minimum facial datum end of robotic handling flange sides Y49 None 134 mm (5.28 in.) maximum facial datum interior of FOSB sides between x51 and x52 Y50 8, mm (5.12 in.) minimum facial datum rear of upper door frame volume Y52 2, 8, 10, ± 0.5 mm (6.52 ± 0.02 in.) at frame seal zones and 166 mm (6.54 in.) maximum elsewhere on box shell ± 0.5 facial datum mm (6.52 ± 0.02 in.) at door and frame seal zones and at reserved spaces for vacuum application and 166 mm (6.54 in.) maximum elsewhere on door or box shell FOSB front Y53 8, 10, mm (7.48 in.) maximum facial datum FOSB rear Y58 8, mm (2.95 in.) minimum facial datum end of left and right conveyor rails Y62 13,14 28 mm (1.10 in.) maximum Y63 13, ± 0.5 mm (1.47 ± 0.02 in.) Y64 13, ± 0.5 mm (1.66 ± 0.02 in.) facial datum facial datum facial datum rear of front retaining feature rear of ramp on front retaining feature front of ramp on front retaining feature Page 19 Doc. 4481B SEMI

22 Symbol Used Figure Number Manual Door Value Specified Y65 13, mm (4.09 in.) minimum Auto-Door Datum Measured from facial datum Feature Measured to front of front retaining feature Y mm (0.98 in.) facial datum origin of r67 on bilateral datum Y68 # mm (2.17 in.) maximum facial datum near end of the front kinematic groove in the top robotic handling flange Y81 # mm (1.18 in.) minimum Y82 # mm (7.52 in.) maximum not applicable facial datum not applicable facial datum rear edge of manual door front surface of manual door Y mm facial datum edge of RFID tag placement volume y84 # mm facial datum edge of 2D code placement area on box shell y85 # mm facial datum edge of 2D code placement area on box shell Y88 15 not applicable 3 mm (0.118 in.) maximum The static position of the box door within the box shell, when the box is completely closed and the box front features are within the limits as defined by y 52 of SEMI M31. Position of box door within the box shell when a force of f 34 is being applied by the load port and the latch keys are not yet turned to closed position Z2 8, 9, 12 2 mm (0.08 in.) maximum horizontal datum bottom of carrier sensing pads and info pads (when down) Z mm (0.35 in.) minimum horizontal datum Bottom of info pads (when up) Z30 none ± 0 mm (4.19 ± 0 in.) for 13-wafer cassette and ± 0 mm (6.56 ± 0 in.) for 25-wafer cassette Z41 8, 9 0 mm (0 in.) minimum Z43 8, 9 2 ± 1 mm (0.08 ± 0.04 in.) Z47 #1 8, 9, ± 1 mm (8.27 ± 0.04 in.) for 13-wafer FOSB and 330 ± 1 mm (12.99 ± 0.04 in.) for 25-wafer FOSB horizontal datum horizontal datum horizontal datum horizontal datum Z48 #1 8, 9, mm (0.59 in.) minimum bottom of robotic handling flange vertical centerline of port Bottom of FOSB Bottom conveyor rails Bottom of robotic handling flange encroachment of FOSB top underneath robotic handling flange Page 20 Doc. 4481B SEMI

23 Symbol Used Figure Number Manual Door Value Specified Auto-Door Datum Measured from Z49 #1 8, 9, 11 8 mm (0.31 in.) maximum bottom of robotic handling flange Z50 # mm (0.20 in.) minimum bottom of robotic handling flange Z ± 0.5 mm (0.31 ± 0.02 in.) Z mm (0.59 in.) minimum Z mm (0.71 in.) minimum Z ± 0.5 mm (0.30 ± 0.02 in.) horizontal datum horizontal datum horizontal datum horizontal datum Feature Measured to top of robotic handling flange and upper door frame volume encroachment of FOSB top underneath the center hole in the top robotic handling flange top of slot in center retaining feature top of chamber above slot in center retaining feature top of front retaining feature top of ramp on front retaining feature Z65 8, 9 7 mm (0.28 in.) minimum horizontal datum upper boundary of cylindrical fork-lift pin holes in left and right bottom conveyor rails Z83 16, mm horizontal datum Edge of RFID tag placement volume z86 # mm horizontal datum edge of 2D code placement area on door z87 # mm horizontal datum edge of 2D code placement area on door #1 These dimensions are for optional features. #2 These dimensions pertain to the manual door only. front retaining feature r y 64 =42.1 ± 0.5 y 63 =37.3 ± 0.5 y62 28 x64 35 x68 25 y center retaining feature x60 =8.0 ± 0.5 r61 16 r60 =16 ± 0.5 bilateral datum facial datum Figure 13 Bottom View of Retaining Features on Bottom of FOSB Page 21 Doc. 4481B SEMI

24 facial datum z 60 =8±0.5 z r (above z 60) r 60 =16±0.5 (below z 60) y y63 =37.3 ±0.5 y64 =42.1 ±0.5 y φ =30 ±0.5 z63 =7.5 ±0.5 horizontal datum of load port Figure 14 Side View of Retaining Features on Bottom of FOSB front side of the FOUP where wafers are accessed z62 18 Measured y52, at the fully seated position Measured y52 + y88 bilateral datum facial datum NOTE: Position of the FOSB door within the FOSB shell when the latch keys are allowed to be turned. The FOSB door may not be fully seated. Figure 15 Top View Displaying FOSB Gap (y88) Page 22 Doc. 4481B SEMI

25 human handle (optional) RFID Tag placement volume z83 =54 z1 0 y83 =151 y facial datum horizontal datum of box Figure 16 FOSB Side View of RFID Tag placement volume bilateral datum human handle (optional) z83 =54 z1 0 x83 =20 RFID Tag placement volume horizontal datum of box Figure 17 FOSB Rear View of RFID Tag placement volume Page 23 Doc. 4481B SEMI

26 x84 = 20 x85 = 70 y84 = 90 y85 = 130 Figure 18 2D code placement area on box shell Page 24 Doc. 4481B SEMI

27 x86 = 32 x87 = 82 bilateral datum z86 = 204 z87= 244 horizontal datum Figure 19 2D code placement area on door 6 Related Documents 6.1 SEMI Standards SEMI E22.1 Cluster Tool Module Interface 300 mm: Transport Module End Effector Exclusion Volume Standard SEMI E63 Mechanical Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface SEMI M28 Specification for Developmental 300 mm Diameter Polished Single Crystal Silicon Wafers NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions. Page 25 Doc. 4481B SEMI