International Conference on Soldering and Reliability

Transcription

1 In conjunction with SMTA Toronto Expo & Tech Forum International Conference on Soldering and Reliability May 14 17, 2013 Workshops: May 14 Conference: May Expo: May 16 Sheraton Toronto Airport Hotel Toronto Ontario, Canada INTRODUCTION Electronic products, particularly consumer products have become more complex with greater circuit density, finer lines and spacings and more functionality. Reliability issues continue to be a major concern for industrial, bio-medical, aerospace and automotive applications and require materials, manufacturing, test and quality engineers and scientists to be creative in planning for the future. Challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies are included. Due to cost considerations, new low silver or silver free alloys are being studied. The use of tailored alloy systems, the variety of alloy choices, and smaller passive components are among the concerns being addressed. Now, a new group of engineers and scientists involved in the design and manufacture of (a) medical devices, and (b) monitoring and control instruments must be ready for the requirements of RoHS recast, also known as RoHS 2. This EU directive officially required that it be made into national laws by January 2, 2013 and these two new categories of electronics must become compliant by July 22, Soldering and reliability professionals need to come together to share their knowledge and their vision for addressing these challenges. KEYNOTE ADDRESS Solder Assembly Solutions for 3D IC Packaging Charles G. Woychik, Ph.D. Director of 3D Technology and Marketing, Invensas Corporation 3D IC packaging is transitioning from the lab to commercial adoption. The arrival of the first commercial 2.5D (silicon interposer) product challenges us to question which parts of the process and supply chain are maturing, and which parts are ripe for reinvention? Invensas has been developing HVM fine-node 2.5D interposer technology in partnership with AllVia, in conjunction with advanced microbumped die that accommodate interconnect schemes exceeding 10,000 I/O. Modeling of the assembly process has been used to evaluate different process flows in order to develop a high yielding, and reliable 3D package design. An overview will be given of this development activity, as well as a brief discussion of the remaining choke-points, those areas in need of reengineering and reinvention. Technical Committee: Laura Turbini, Ph.D. International Reliability Consultant, Program Chair Bev Christian, Ph.D., Blackberry Matthew Kelly, P. Eng, MBA, IBM Corporation Polina Snugovsky, Ph.D., Celestica, Inc. Tim Luke, Alpha

2 International Conference on Soldering and Reliability 1. REGISTRATION INFORMATION l Dr. l Mr. l Ms. l SMTA Member # Name Job Title Company MS/PO Box Address City State/Province Zip/Country Code Country Phone Fax Register before April 12th and SAVE! 2. ReGISTRATION FEE (USD) Workshops Tuesday, May 14 Before 4/12 After 4/12 l SMTA Member $225 $275 l Non-Member $325 $375 Check Workshop Selection: l WS1 l WS2 l WS3 l WS4 Technical Conference (Courses NOT included) Wednesday, May 15 Friday, May 17 Before 4/12 After 4/12 l SMTA Member $450 $550 l Non-Member $550 $650 l Speaker $250 $300 Technical Conference Single Day* Wednesday, May 15 Thursday, May 16 Friday, May 17 Before 4/12 After 4/12 l SMTA Member $250 $275 l Non-Member $275 $300 Check Day Selection: l Wednesday, May 15 l Thursday, May 16 l Friday, May PAYMENT OPTIONS Total Amount Due $ l Check enclosed (USD) l Purchase Order # l MC l VISA l AMEX Credit Card # Expiration Date (MM/YYYY) / Cardholder s Name Billing Address (if different from registration) Address City State/Province Zip/Country Code Country 4. REGISTRATION REGISTRATION Pre-Registration is strongly recommended. There will be no guarantee of space or materials for on-site registrants. FOUR REGISTRATIONS FOR THE PRICE OF THREE If four employees from the SAME company each register for the technical conference OR a tutorial, the fourth registration (of equal or lesser value) is free! Registrations must be submitted together. CANCELLATION Registration fees will be refunded (less a $75 processing fee), if written notice is postmarked two weeks prior to program date. NO SHOWS Registration fee will not be refunded in order to cover expenses incurred. All attendees who are not currently members of SMTA will receive a one-year individual Membership with their registration. Single day registrations will NOT receive a membership. Current individual members will receive a one-year renewed membership (one renewal per year). HOTEL INFORMATION Sheraton Toronto Airport Hotel 81 Dixon Road, Toronto, Ontario M9W 1J5, Canada Tel: ACCOMMODATIONS Rate: $149CND/night + taxes Call to make reservations. Mention group name Surface Mount Technology Association Room block expires on Monday, April 19, 2013

3 5200 Willson Road, Suite 215 Edina, Minnesota PRESORTED STANDARD U.S. POSTAGE PAID TWIN CITIES, MN PERMIT NO In conjunction with SMTA Toronto Expo & Tech Forum International Conference on Soldering and Reliability May 14 17, 2013 Workshops: May 14 Conference: May Expo: May 16 Sheraton Toronto Airport Hotel Toronto Ontario, Canada

4 WORKSHOP SCHEDULE Tuesday, May 14, 2013 Toronto Expo (co-located with ICSR Conference) Thursday, May 16th Don t miss your chance to exhibit at the Toronto Expo! This is unlike most SMTA Expos, as it has a co-located conference! Hundreds of conference and Expo attendees will be eager to network with you. Booth space is limited and always sells out early. Corporate Non-Corporate member Rate Member Rate Early Bird $350 $450 After April 15th $425 $525 Exhibit Package Includes: One 6-foot draped table Two chairs Company sign Lunch Directory listing Attendee list Electricity for an additional $25 per outlet Numerous sponsorship opportunities are available from $125 $2,000 depending on desired exposure level. Visit for more information or contact the Director of Expositions, Seana Wall, at seana@smta.org or WS1: 8:30 a.m. 12:00 p.m. Package-on-Package (PoP) Assembly Material, Process and Reliability Instructor: Jennie S. Hwang, Ph.D., H-Technologies Group As the package-on-package (PoP) becomes one of the prevalent paths to achieve the high-density package and assembly, this course focuses on assembling PoPs. With the objective to improve the production yield and product reliability, the updated, important aspects of materials, techniques, processes and reliability for both Pb-free and SnPb products will be addressed. The parallelism and distinctions between PoPs and BGAs, in particular co-planarity, thermal stability of molding materials and conformal coating, will be outlined. The best practices of assembling PoPs including solder material, PCB assembly processes and rework will be discussed. The course will also deal with the real-world production issues and discuss the PoP solder joint reliability for upper package and lower package, and what it takes to make reliable solder joints. Attendees are encouraged to bring their issues for discussion. The course provides a working knowledge to all who are involved with or interested in PoP assembly including designers, engineers, researchers, managers and business decision makers; also designed for those who desire the broad-based information. WS2: 8:30 a.m. 12:00 p.m. The Challenges of Converting From Leaded to Lead-Free Solder Instructor: Leo Lambert, EPTAC As part of the process of converting from the existing tin/lead technology to the new lead-free technology, there were many variables to consider in making the change over. The materials were not a simple exchange from one alloy to another, higher processing temperatures were necessary to address the metallurgy of the new alloys, laminate materials had to be modified which also added some new issues which needed to be addressed. Conditions like CAF failures within the laminate material was brought up as a concern, as were tin whiskers, higher process temperatures for all components and boards. Additionally the fluxes have to be modified to accommodate the higher temperature, which impacted the need to clean or not to clean, as well as the changes in manual soldering processes and equipment. HighTin alloys were found to be corrosive to any of the environments where it came into contact, hence this also became and area of concern and deliberation. This course will cover the process elements and changes which need to be addressed and monitored in the changeover from Tin/Lead to Leaf-Free, by all who are manufacturing lead-free electronics. Manufacturing engineers and managers, operators and associated supervisors and new people getting into the business will benefit from this course.

5 WS3: 1:30 p.m. 5:00 p.m. BTC (Bottom Termination Components) Assembly Material, Process and Reliability Instructor: Jennie S. Hwang, Ph.D., H-Technologies Group Facing the relentless challenges in SMT manufacturing as a result of the continued developments in packages, this course focuses on the assembly of Bottom Termination Components (BTCs, e.g. QFN, LGA, MLF, SON, DFN). With the objective to improve the production yield and to assure product reliability, the updated, important aspects of materials, techniques, processes and reliability for both Pb-free and SnPb products will be addressed. Various configurations of BTCs in periphery-leaded and solder-ball array packages will be outlined. The best practices of assembling BTCs including solder material, PCB assembly processes and rework will be discussed. The course will also deal with the real-world production issues and discuss the BTC solder joint reliability, and what it takes to make reliable solder joints. Attendees are encouraged to bring their issues for discussion. The course provides a working knowledge to all who are involved with or interested in BTCs assembly including designers, engineers, researchers, and managers; also designed for those who desire the broad-based information. WS4: 1:30 p.m. 5:00 p.m. Advanced PCB Troubleshooting: Cause, Effect and Prevention of PCB Related Defects Instructor: Mike Carano, OMG Electronic Chemicals This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away, carry significant costs. Many are difficult to solve because the root cause may not be readily apparent and multiple factors may contribute. This course will explore the most intricate of these factors and how the interrelationship of both up and downstream processes contribute to scrap product. What effect does drilling have on hole wall quality and the subsequent metalization process? Participants will learn how to recognize problems like this and take corrective action before it is too late. The course will explore a myriad of electrodeposition defects, such as mouse bites, pitting, and domed or crown plating. Solderability and assembly related issues such as outgassing and blow holes will also be discussed. Participants should have some knowledge of the PCB fabrication process. Attendees will learn that these most devastating, yield-reducing defects are often not apparent in their root cause. Participants will see first hand that defects that manifest themselves in one process may have their origin several process steps back. Participants should have some knowledge of the PCB fabrication process. This course will directly benefit those involved in printed circuit board assembly. TECHNICAL PROGRAM May Wednesday, May 15 8:00 a.m. Registration/Continental Breakfast 8:50 a.m. Opening Remarks 9:00 a.m. Keynote: Solder Assembly Solutions for 3D IC Packaging Charles G. Woychik, Ph.D., Invensas Corporation 9:45 a.m. Electroplating of Cu in TSV and Characteristics of Low Alpha Solder Bump Jae Pil Jung, Ph.D., University of Seoul 10:15 a.m. Microalloyed Sn-Cu Lead-free Solder for High Temperature Applications Keith Howell, Nihon Superior 10:45 p.m. Break 1 1:15 a.m. Collaboration Between OEM and EMS to Combat Head on Pillowing (HOP) Defects: AXI Capability for HoP Detection Alex Chan, Alcatel-Lucent 1 1:45 a.m. Collaboration Between OEM and EMS to Combat Head on Pillowing (HOP) Warpage Acceptance Proposal Alex Chan, Alcatel-Lucent 12:15 a.m. Lunch 1:30 p.m. SERDIP Tin Whisker Testing and Modeling: High Temperature/High Humidity Conditions Stephan Meschter, Ph.D., BAE International 2:00 p.m. The Inhibition of Whisker Formation in Electrolytic Tin George Milad, Uyemura International 2:30 p.m. Characterization of Hybrid Conformal Coatings Used for Mitigating Tin Whisker Growth JungHyun Cho, Ph.D., State University of New York Binghamton 3:00 p.m. Break 3:30 p.m. Microstructure and Reliability of Low Ag, Bi-Containing Solder Alloys Eva Kosiba, Celestica, Inc.

6 , :00 p.m. Development of a Suitable Flux Medium for Cleanable and No-Clean Solder Paste Based on Sn-Bi-Ag Alloy Emmanuelle Guene, P.E., Inventec 4:30 p.m. Fracture of Lead-free Solder Joints as a Function of Strain Rate, Local End Geometry and Thickness Amir Nourani, University of Toronto 5:00 p.m. Session Ends Thursday, May 16 8:00 a.m. Registration/Continental Breakfast 8:50 a.m. Opening Remarks 9:00 a.m. Keynote: Condensation Soldering Quality Improvement under Oxidation-free Soldering Conditions Claus Zabel, ASSCON Systemtechnik Elektronik GmbH 9:30 a.m. Void-free Soldering With Vapor Phase Vacuum Technology J. B. Byers, A-Tek LLC 10:00 a.m. Break 1 1:00 a.m. Factors Affecting Stencil Aperture Design for the Next Generation Ultra-Fine Pitch Printing Jeff Schake, DEK Printing Machines, LTD 1 1:30 a.m. The Potential of Stencil Technology Choosing the Right Stencil Options to Maximize Yield and Earnings Harald Grumm, Christian Koenen GMB 12:00 p.m. Stencil Printing Yield Improvement Capabilities Mike Bixenman, DBA, Kyzen Corporation 12:30 p.m. Lunch 1:30 p.m. Statistical Methods for Discriminating Between Tin-Lead and Lead-free Solder Interconnect Failure Data Joseph M. Juarez, Ph.D., Honeywell International 2:00 p.m. NASA DoD Phase 2: Report for SAC 305 and SN100C Copper Dissolution Testing Dave Hillman, Rockwell Collins 2:30 p.m. Process Control and Reliability of Reworked BGA Solder Joint Adrian Hirceaga, Creation Technologies 3:00 p.m. Break 3:30 p.m. Generalizations about Component Flatness at Elevated Temperature Bev Christian, Ph.D., Blackberry 4:00 p.m. General Voiding in Lead-free No-Clean Bottom Terminations Kenneth Kay, Libra Industries 4:30 p.m. Pre-tinning for High Reliability Daniel Egler, Murrietta Circuits 5:00 p.m. Converting Cable Assembly Manufacturing to Lead-free Solder Lynda Anderson, IBM Corporation 5:30 p.m. Session Ends Friday, May 17 8:00 a.m. Registration/Continental Breakfast 8:50 a.m. Opening Remarks 9:00 a.m. Reliability Analysis of Early Life Field Failures in Outdoor Conditions Peter Arrowsmith, Ph.D., Ops A La Carte, LLC 9:30 a.m. Solder Paste Jetting, An Alternative or Add-On Tool for Paste Deposition Nico Coenen, MYDATA 10:00 a.m. Dielectric Material Damage vs. Conductive Anodic Filament (CAF) Formation Paul Reid, PWB Interconnect Solutions 10:30 a.m. Break 10:45 p.m. The Study of Corrosion Behavior of Cu in Sixteen Commercial Beverages by Chemical and Electrochemical Measurement Nancy Wang, Blackberry 1 1:15 a.m. Electronic Grade Coating for Moisture and Corrosion Protection of PCBs and Electronic Components Weixing Hou, 3M Canada 1 1: 45 a.m. Final Comments