Sensors Enabling Smart Systems - Giving Sense to EU Support - Willy Van Puymbroeck - European Commission, DG CONNECT

Transcription

1 Sensors Enabling Smart Systems - Giving Sense to EU Support - Willy Van Puymbroeck - European Commission, DG CONNECT EUROSENSORS 2016, Budapest, 05/09/2016

2 Outline Policy context Digitising European Industry R&D Intensity and Innovation output Competitive Electronics Industry European R&I scene European Electronics Strategy The Hard(ware) Road to Smart Objects HORIZON 2020 project portfolio Framework Programme 7 A selection of success stories Upcoming funding opportunities - (giving sensors EU support) Conclusions

3 Policy Context 10 priorities for Europe #investeu - A new boost for jobs, growth and Investment The 315 billion Investment Plan #DSM - A connected DigitalSingleMarket A Digital Single Market Package

4 Digitising European Industry Rationale Reinforce the EU's competitiveness ensure that every industry in Europe, whichever sector, wherever situated and no matter what size can fully benefit from digital innovations

5 Digitising European Industry EC Communication adopted 19 April 2016 'EU will earmark 500 million, resulting in a 5 billion investment' 'EU will earmark 5 billion, resulting in a 50 billion investment'

6 Policy Context Research & Innovation Source: DG RTD Science, Research and Innovation Performance of the EU

7 A Competitive Electronics Industry: Research and Innovation in Europe European National

8 Horizon 2020 Focus on Electronics Excellence in Science B 17.0 Leadership in Enabling and Industrial Technologies B 24.4 Societal Challenges B 29.7 European Research Council (ERC) Future and Emerging Technologies (FET) including Flagships ICT NMBP ECSEL Joint Undertaking Health, Transport, Energy, Environment

9 A Competitive Electronics Industry - Strategy Delivery of electronic systems solutions demand accelerators Outside (exports) Supply push Europe Demand pull Outside (imports) Doubling the Added Value by supply accelerators

10 The Hard(ware) Road to Next Generation Objects - From nm to cm - nm µm mm cm Nanoelectronics Smart System Integration µ-fluidics "Conventional": CMOS MOSFET Si-Ge, III-V compound SC Nanowires, CNT, Graphene µ-bio-sensors µ-mechanics - MEMS µ- batteries : µ-harvesters µ- Antenna "Non-Conventional": Spintronics Single e- trans 3-D transistor scale) Everything On-CMOS: Photonics, RF "Hybrid": Si chips mounted on flexible substrates "Monolithic": thin film transistors, thin film / large area sensors /labels Plastic electronics TOLAE

11 H2020 Project Portfolio - Nanoelectronics and Smart System Integration Medical Water Food Telecom Low-power electronics Smart System Integration Application specific SSI PROTEUS (Water quality monitoring) SNIFFPHONE (Health screening from exhaled breath) MEDILIGHT (Smart textile and wearable electronics) SocketMaster (Sockets for amputees) MNBS heterogeneous integration & Packaging TIPS (Thermal management in photonic devices) TOP HIT (Micro-transfer printing) smart-memphis (MEMS energy harvester) M3TERA (Micromachined TeraHz systems) Nanonets2Sense (biosensors, functionalised CNT) STREAMS (µfluidic active cooling integration) Thermic in SSI Energy (management /harvesting) Neuromorphic and Quantum computing "Non-conventional" electronics IONS4SET (SET-Single electron transistor/cmos RF/mm) PETMEM (line voltage reduction (with electro-acoustic ) PHRESCO (photonic/cmos) CONNECT (CNT for on-chip interconnect) NeuRAM3 (3-D monolithic FDSOI) MOS-QUITO (cryo-cmos - Quantum) (Beyond CMOS/Spintronics) IoT Nanoelectronics SC equipment/ processes METRO4-3D (3-D nanoprobes) SoC, IC Design GREAT (RF+Sensor / CMOS) manufacturing "Conventional" electronics REMINDER (Si/SiGe & III-V materials / CMOS) INSIGHT (III-V nanowires RF MOSFET amplifiers on Si) IC design SUPERAID7 (7nm design)

12 H2020 first calls: A significant RD&I budget ~ 82 M Smart System Integration Nanoelectronics & beyond Application specific SSI heterogeneous integration & Packaging "Non-conventional" electronics "Conventional" electronics 12 M 16.2 M 28 M 20 M SC equipment/ processes 6 M IC design SSI'16-Munich 9 March HR

13 H2020 Project Portfolio Thin, Organic and Large Area Electronics (TOLAE*) *excluding OLEDs Application-driven HAPPINESS PING LUMENTILE LORIX Haptic interface for automotive Game cards and packaging Lighting and sensing tiles X-ray sensing LOMID OLED-CMOS microdisplays TransFlexTeg Smart windows Optintegral Advertisement Manufacturing ALABO Laser scribing OPV ROLL-OUT R2R automotive, packaging, textile Research & Innovation Action Innovation Action

14 FP7 Success Story - MSP 3D-integrated Multi-Sensor system for Smart Building Management Project duration: 01/09/ /02/2017 Partners: MCL, AMS, APPS, BOS, UOXF, CCS, EVG, FHG, IMEC, ALU-FR, SIEMENS, UCAM, UCL, UNIBS, UWAR, VITO, SAM EU Funding: Flexible 'plug and play' 3-D integration of devices and sensors on CMOS electronic platform chips Achievements: Gas sensors based on nanomaterials Particle sensor Ultraviolet sensor Infrared sensor Visible light sensor Worldwide unique 8 X micro-hotplate array chip with Through- Silicon-Via technology!

15 FP7 Success Story - ACTION ACTION = ACTive Implant for Optoacoustic Natural sound enhancement Project duration: 01/10/ /12/2016 Partners: CSEM, MHH, VTT, SUSS, VERTILAS, STM, MED-EL EU Funding: Optoacoustic stimulation to trigger available residual hair cells Flexible electronics and sensors Achievements: Vertical Cavity Surface Emitting Laser arrays - VCSEL (@ 1550nm): Designed, manufactured and tested Micro-package: Designed, manufactured and tested In-vitro experiments: System generates a sound wave in saline

16 FP7 Success Story - PIEZOMAT High-Resolution Fingerprint Sensing with Vertical Piezoelectric Nanowire MATrices Project duration: 01/11/ /06/2017 Partners: CEA, Fraunhofer, MTA TTK, ULEI, KTU, SPECIFIC POLYMERS, Tyndall, MORPHIO, MTA EK EU Funding: Manufacturing and testing of the Proof of Concept chips Attend the Piezomat workshop on Wednesday! sensors

17 EU R&I support for Sensors Technology over the last 10 years FP7, H2020, ENIAC and ECSEL until projects 404 participants Total costs 467 M EU contribution 154 M Academic 23% Industry 27% ECSEL 20% Unconventional MEMS & materials 16% Sensors & MEMS-based sensors 55% MEMS 29% FP7 44% Research organisations 26% SMEs 24% ENIAC 29% H2020 7%

18 Geographic Location of Participants

19 Specialisation and Size of Investment of Participants MEMS Sensors & MEMS-based sensors Unconventional MEMS & materials

20 Upcoming funding Opportunities Call Closing ICT-31 Micro- and nanoelectronics technologies 25/04/2017 ICT-04 Smart Anything Everywhere 08/11/2016 ICT-30 Photonics KET 25/04/2017 NMBP Cross-cutting KETs for diagnostics at the point-of-care 19/01/ desktop/en/opportunities/index.html

21 Conclusions Europe has significant strengths and a leading position in MEMS/Sensors MEMS/Sensors are of high importance for all industry in Europe and all application areas MEMS/Sensors is a highly competitive area in which excellence in technology (and in manufacturing) has a significant role Increased R&I investment through HORIZON 2020 MEMS/Sensors capabilities are essential capabilities for the Competence Centres that will form the network of Digital Innovation Hubs to foster Digitisation Abundant opportunities

22 THANK YOU DG CONNECT (Communications Networks, Content and Technology): Horizon 2020 on the web:

23 Additional Slides

24 Upcoming funding opportunities ICT-04 Smart Anything Everywhere NMBP-13 Cross-cutting KETs for point-of-care Call Open ICT-31 Micro- and nanoelectronics technologies ICT-30 Photonics KET Closing 8-Nov-2016 (ICT04) 19-Jan-2017 (NMBP-13) 25-April-2017 (ICT-30, ICT-31)

25 Policy Context 10 priorities for Europe EC Juncker Priorities ( ) 1. The investment plan: a new boost for jobs, growth and investment 2. A connected digital single market 3. A resilient energy union with a forwardlooking climate change policy 4. A deeper and fairer internal market with stronger industries 5. A deeper and fairer economic and monetary union 6. A reasonable and balanced free trade agreement with the United States 7. An area of justice and fundamental rights based on mutual trust 8. A new policy on migration 9. Europe as a stronger global actor A New Boost for Jobs, Growth and Investment #investeu 1 The 315 billion Investment Plan /16 A Connected #DigitalSingleMarket #DSM 4 A Digital Single Market Package

26 - ICT-31 (Micro- and nanoelectronics technologies)

27 ICT-31 Micro- and nanoelectronics technologies Scope (RIA, IA and CSA) RIA Research and Innovation Scale the functional performance System solutions Increase functionalities and capabilities 19 M - 100% funding IA Innovation actions Equipment Assessment Experiments 3 M - 70% funding CSA Coordination and Support Actions Sustainable Pan-European event Promoting careers in micro/nanoelectronics Showcase in hardware technologies 1 M - 100% funding SSI'16-Munich 9 March HR

28 ICT-31 Micro- and nanoelectronics technologies Scope of RIA (Scaling, 1/2) 1. Scale the functional performance New approaches Information processing Storage Work on: Materials Processes Device / component architectures System micro-architectures (processors / memory) Security Design Modelling Simulation Nano-characterization Focus Ultra-low power High performance To be considered Integration Systemability Manufacturability SSI'16-Munich 9 March HR

29 ICT-31 Micro- and nanoelectronics technologies Scope of RIA (System solutions, 1/2) 2. System solutions increase functionalities and capabilities 3D sequential integration transistor scale) 3D parallel integration circuit level) Work on: Interconnects (intra-layer and vertical structures) Design 3D design kits and tools Power model Optimisation Prototyping Test methods SSI'16-Munich 9 March HR

30 - NMBP-13 (Cross-cutting KETs for diagnostics at the point-of care

31 NMBP-13 Objective & Requirements Objective: further development into a clinical setting of novel MNBS platforms, techniques and systems that have already been proven in a laboratory setting (laboratory Proof-of-Concept) Focus applications: In vitro/in vivo diagnostics that are deployed at the point of care; Therapy monitoring at the point of care. The work includes: Translation from the pre-clinical phase to early clinical testing, including design and pilot manufacturing in appropriate volume for clinical testing (small series), pre-clinical and early clinical testing. include a business case and exploitation strategy Facilitate clinical data harvesting Demonstrate clear compliance with applicable Good Laboratory /Clinical / Manufacturing Practices Attention to the requirements for Health Technology Assessment (HTA); Standardisation issues; Gender specific issues NMBP-13 ICT-Lisboa 21-Oct HR

32 MNBP-13 RIA Scope RIA - Research & Innovation Actions Novel MNBS Platforms / Techniques / Systems Validation in pre-clinical & clinical test settings: prototyping, design and pilot manufacturing small series manufacturing, pre-clinical and clinical testing, clinical data harvesting Validated in clinical setting, addressing real needs in applications of: In vitro/in vivo diagnostics that are deployed at the point of care; Therapy monitoring at the point of care. NMBP-13 ICT-Lisboa 21-Oct HR

33 NMBP-13 RIA Technology Readiness Level? TRLs 3-4 to 5-6 Activities of direct clinical & industrial relevance Medium time to market - actual system proven in operational environment (competitive manufacturing in the case of key enabling technologies; or in space) - system complete and qualified - system prototype demonstration in operational environment - technology demonstrated in relevant environment (industrially relevant environment in the case of key enabling technologies) - technology validated in relevant environment (industrially relevant environment in the case of key enabling technologies) - technology validated in lab - experimental proof of concept - technology concept formulated - basic principles observed NMBP-13 ICT-Lisboa 21-Oct HR

34 Research & Innovation Actions NMBP-13 RIA - Expected Impact Technologies Progress the development of advanced integrated MNBS based diagnostic health platforms, techniques or systems from the laboratory Proof-of-Concept to the clinical setting; Industry/Economy Establish a world-class European competitive industrial R&D and manufacturing competence in Micro-Nano-Bio Systems integration for healthcare diagnostics applications; Strengthening the industrial value chain and progress to marketisation; Provide affordable systems with unique features that address specific well identified requirements in healthcare; Users/Society Address priority needs in healthcare diagnostics and / or therapy monitoring, for the benefit of patients; Early involvement of regulatory bodies and patients in the new developments NMBP-13 ICT-Lisboa 21-Oct HR

35 - ICT-04 (Smart Anything Everywhere Initiative)

36 ICT : SAE Initiative Scope Innovation Actions Proposals should address 3 aspects 1. Establish a network of competence centres offering one-stop shops for companies that want to experiment with digital technologies inside their products. "Innovation hubs" offering facilities (access to technology platforms) and services for developing innovative products, such as design, manufacturing, rapid prototyping and life-cycle management. 2. Carrying out a critical mass of cross-border experiments bringing together key actors across the full value chain and enable new users to develop novel products or services. 3. Activities to achieve long-term sustainability of one-stop shop/market place services by competence centres and the ecosystem.

37 ICT : SAE Initiative Scope Innovation Actions Experiment descriptions in proposals should include an outline of the initial exploitation plan and business scenario. Proposals have an outline business scenario and activities for the development of a business plan for the competence centres and the marketplace. Investors should be attracted to support business development of SMEs and mid-cap actors Additional Issues: Link to existing and emerging regional or national innovation hubs. Communication and dissemination activities shall make use of established networks reaching out to SMEs, such as Enterprise Europe Network, NCP network,

38 ICT : SAE Initiative Scope Innovation Actions Experiment descriptions in proposals should include an outline of the initial exploitation plan and business scenario. Proposals have an outline business scenario and activities for the development of a business plan for the competence centres and the marketplace. Investors should be attracted to support business development of SMEs and mid-cap actors Additional Issues: Link to existing and emerging regional or national innovation hubs. Communication and dissemination activities shall make use of established networks reaching out to SMEs, such as Enterprise Europe Network, NCP network,

39 Area 3 Advanced micro electronics components and Smart System Integration Goal is to support electronic components, sensors, smart objects and system access to (including Europractice type of actions) advanced design and manufacturing for academia, research institutes and SMEs Rapid prototyping targeting SMEs IA Projects (up to 7 M for area 3) 70% funding

40 ICT : SAE Initiative Area 4 OLAE Building ecosystem in Organic and Large Area Electronics (OLAE) Goal is to help businesses in further maturing, innovating and validating their products with OLAE technologies Focus is on 1. Access to design, technology and prototyping which are mature and ready to use, 2. Application experiments driven by concrete user requirements and business cases Projects (up to 3.5 M for area 4) 70% funding

41 ICT : SAE Initiative Expected Impact Address all of the following impact criteria providing metrics to measure success when appropriate. Innovation in products, processes and business models leading to quantifiable increases in market shares and/or productivity of European companies and/or industrial capacities in Europe, notably for SMEs and mid-caps operating in non tech sectors. Business growth and increase competitiveness of digital technology suppliers, in particular SMEs, able to supply components and systems that may be integrated in various products. Creation of a self-sustainable ecosystem of innovation hubs including ICT suppliers and users supported by services available through a one-stop shop, covering a large number of regions and their smart specialisation.

42 PIEZOMAT High-Resolution Fingerprint Sensing with Vertical Piezoelectric Nanowire MATrices sensors Status: Manufacturing and testing of the Proof of Concept chips (Attend the Piezomat workshop on Wednesday!)

43 MSP 3D-integrated Example Multi-Sensor (3) system for Smart Building Management 3D-integrated Multi-Sensor Achievements: system for Smart Building Management Gas sensors based on nanomaterials sensors Particle sensor Ultraviolet sensor Infrared sensor Visible light sensor Air quality monitoring indoors and outdoors Example: ZnO nanowire array on CMOS! Worldwide unique 8 X micro-hotplate array chip with Through-Silicon-Via technology!

44 ACTION ACTION = ACTive Implant for Optoacoustic Natural sound enhancement Flexible electronics and sensors Main achievements: Vertical Cavity Surface Emiting Laser arrays - VCSEL (@ 1550nm): Designed, manufactured and tested Micropackage: Designed, manufactured and tested In-vitro experiments : System generates a sound wave in saline

45 H2020 Stakeholders participation (only SSI) Higher or Secondary Education Private for Profit Research Organisations Number of participants

46 Millions EU contribution areas 100 Industry SMEs Research organisations Academic MEMS Sensors & MEMS-based sensors Unconventional MEMS & materials

47 Millions EU contribution programmes 80 MEMS Sensors & MEMS-based sensors Unconventional MEMS & materials FP7 H2020 ENIAC ECSEL

48 Millions EU contribution participants 60 MEMS Sensors & MEMS-based sensors Unconventional MEMS & materials Industry SMEs Research organisations Academic

49 Programmes FP7 H2020 ENIAC ECSEL

50 Some observations In 2 years of H2020, already 40% as many projects as in FP7; this topic is well taken up by ECSEL The number of participants over 9 years is balanced among the 4 categories But 65% of funding goes to industry and research organisations, i.e. the topic is market-oriented No more funding of unconventional devices under H2020/ECSEL Focus is now on sensor integration and sensor-based systems