Data Sheet GHIS030A120S-A2

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Transcription:

Buck Chopper with Field Stop Trench IGBT + SiC SBD V CES =1200V I C = 30A @T C = 100 0 C E A G C Features Field StopTrench Fast IGBT - Low voltage drop - Low tail current - Switching frequency up to 50 khz - Low leakage current Chopper SiC Schottky Diode - Zero reverse recovery current - Temperature Independent switching behavior - Positive temperature coefficient on VF Applications Solar inverters AC and DC motor control Power Factor Correction Aerospace Actuators Benefits Outstanding performance at high frequency operation Low switching losses Very rugged Direct mounting to heatsink (isolated package) Low junction to case thermal resistance Easy paralleling due to positive TC of VCEsat RoHS Compliant Absolute Maximum Ratings (T j =25 o C unless otherwise specified) Parameters Symbol Conditions Specifications Units Collector - Emitter Breakdown Voltage V CES 1200 V Continuous Collector Current I C T C = 25 0 C 60 A T C = 100 0 C 30 A Gate-Emitter Voltage V GES ±20 V Pulsed Collector Current ICM 90 A Maximum Power Dissipation P D T C = 25 0 C 340 W T C = 100 0 C 140 W Operating Junction Temperature T J -55 ~ 150 0 C Storage Temperature T STG -55 ~ 150 0 C Page 1 of 9 Rev. 1.1 08/02/2018

Electrical Characteristics (T j =25 o C unless otherwise specified) Parameters Symbol Conditions Min Typ Max Units OFF Zero Gate Voltage Collector Current I CES V CE = 1200V, V GE = 0V -- -- 1 ma Gate-Emitter Leakage Current I GES V CE = 0V, V GE = 20V -- -- ±250 na ON Gate-Emitter Threshold Voltage V GE(TH) V GE = V CE, I C = 30mA 3.5 5.5 7.5 V Collector-Emitter Saturation Voltage V CE(SAT) V CE = 15V, I C = 30A, T J = 25 0 C -- 2.0 2.5 V V CE = 15V, I C = 30A, T J = 125 0 C -- 2.3 -- V DYNAMIC Input Capacitance C IES V CE = 30V, V GE = 0V, f = 1 MHz -- 4000 -- pf Output Capacitance C OES -- 105 -- pf Reverse Transfer Capacitance C RES -- 72 -- pf SWITCHING Turn-On Delay Time t d(on) -- 40 -- ns Rise Time Turn-Off Delay Time t r t d(off) V CE = 600V, I C =30A R G = 10Ω, V GE = 15V -- -- 50 245 -- -- ns ns Fall Time t f Inductive Load, T J =25 0 C -- 70 -- ns Turn-On Switching Energy Loss E ON -- 3.5 -- mj Turn-Off Switching Energy Loss E OFF -- 0.85 -- mj Turn-On Delay Time t d(on) -- 34 -- ns Rise Time t r V CE = 600V, I C =30A -- 27 -- ns Turn-Off Delay Time t d(off) R G = 10Ω, V GE = 15V -- 256 -- ns Fall Time t f Inductive Load, T J =125 0 C -- 142 -- ns Turn-On Switching Energy Loss E ON -- 3.87 -- mj Turn-Off Switching Energy Loss E OFF -- 1.8 -- mj Total Gate Charge Q g V CE = 600V, I C =30A -- 170 255 nc V GE = 15V Gate-Emitter Charge Q ge -- 27 41 nc Gate-Collector Charge Q gc -- 60 90 nc Short Circuit Withstanding Time t sc V CE = 600V, V GE = 15V T J =125 0 C 10 -- -- s Page 2 of 9 Rev. 1.1 08/02/2018

SiC Diode Rating and Characteristics (T j =25 o C unless otherwise specified) Parameters Symbol Conditions Min Typ Max Units Maximum peak repetitive reverse voltage V RRM 1200 -- -- V Maximum Reverse Leakage Current I RM V R = 1200V, T j = 25 0 C -- 4.1 100 A V R = 1200V, T j = 150 0 C -- 606 A Diode Forward Voltage V F I F = 15A, T j = 25 0 C -- 1.5 1.7 V I F = 15A, T j = 150 0 C -- 2.3 -- V Total Capacitive Charge Q C VR=1200 V, IF<IF,max -- 52 -- nc Switching Time t C di F /dt = 200 A/ s, T j = 175 0 C -- -- 10 ns Total Capacitance C V R = 1V, f = 1 MHz -- 895 -- pf V R = 600V, f = 1 MHz -- 52 -- pf V R = 1200V, f = 1 MHz -- 43 -- pf Thermal and Package Characteristics (T j =25 o C unless otherwise specified) Parameters Symbol Conditions Min Typ Max Units Junction to Case Thermal Resistance R THJC IGBT chip -- -- 0.35 0 C/W SiC SBD chip -- -- 0.65 0 C/W Mounting Torque M d 1.5 N-m Terminal Connection Torque M dt 1.3 -- 1.5 N-m Package Weight W t 29 g Isolation Voltage V ISOL I ISOL < 1mA, 50/60 Hz, t=1 min 2500 V Page 3 of 9 Rev. 1.1 08/02/2018

IGBT Characteristics Page 4 of 9 Rev. 1.1 08/02/2018

Page 5 of 9 Rev. 1.1 08/02/2018

Page 6 of 9 Rev. 1.1 08/02/2018

Buck SiC Diode Characteristics Fig. 17 Forward Characteristics Fig. 18 Reverse Characteristics Fig. 19 Power Derating Fig. 20 Current Derating Fig. 21 Capacitance Curve Fig 22 Recovery Charge Page 7 of 9 Rev. 1.1 08/02/2018

SOT-227 Package Outline Revision History Date Revision Notes 6/3/2014 1.0 Initial release 8/2/2018 1.1 Correct the typo in the pin assignment Global Power Technologies Group 20692 Prism Place Lake Forest, CA 92630 TEL (949) 207-7500 FAX (949) 613-7600 E-mail: info@gptechgroup.com Web site: www.gptechgroup.com Page 8 of 9 Rev. 1.1 08/02/2018

Notes RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented March, 2013. RoHS Declarations for this product can be obtained from the Product Documentation sections of www.gptechgroup.com. REACh Compliance REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemi- cal Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future,please contact our office at GPTG Headquarters in Lake Forest, California to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available upon request. This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines, cardiac defibrillators or similar emergency medical equipment, aircraft navigation or communication or control systems, or air traffic control. To obtain additional technical information or to place an order for this product, please contact us. The information in this datasheet is provided by Global Power Technologies Group. GPTG reserves the right to make changes, corrections, modifications, and improvements of datasheet without notice. Page 9 of 9 Rev. 1.1 08/02/2018