BIPOLAR ANALOG INTEGRATED CIRCUIT

Transcription

1 DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µpc4 LOW POWER QUAD OPERATIONAL AMPLIFIER DESCRIPTION The µpc4 is a quad operational amplifier which is designed to operate from a single power supply over a wide range of voltages. Operation from split power supplies is also possible and the power supply current drain is very low. Further advantage, the input commonmode voltage can also swing to ground in the linear mode. EQUIVALENT CIRCUIT (/4 Circuit) FEATURES Internal frequency compensation Wide output voltage swing V to V +.5 V Common Mode input voltage range includes V Wide supply range V to V (Single) ±.5 V to ±5 V (Split) Output short circuit protection PIN CONFIGURATION (Top View) µ A V + 6 µ A 6 µ A OUT µpc4c, 4G 4 OUT4 II IN Q Q Q8 Q Q9 Q4 CC Q Q Q Q7 Q5 5 µ A Q6 Q RSC V OUTPUT II IN V + 4 IN 5 II 6 OUT II4 IN4 V IN 9 II 8 OUT ORDERING INFORMATION µpc4c µpc4g Part Number Package 4-pin plastic DIP ( mil) 4-pin plastic SOP (5 mil) The information in this document is subject to change without notice. Document No. G76EJVDS (rd edition) (Previous No. IC-985) Date Published April 997 N Printed in Japan The mark shows major revised points. 997

2 ABSOLUTE MAXIMUM RATINGS (TA = 5 C) Parameter Symbol Ratings Unit Voltage between V + and V Note V + V. to + V Differential Input Voltage VID ± V Input Voltage Note VI V. to V + V Output Voltage Note VO V. to V + +. V Power Dissipation C Package Note 4 PT 57 mw G Package Note 5 55 mw Output Short Circuit Duration Note 6 Indefinite sec Operating Ambient Temperature TA to +8 C Storage Temperature Tstg 55 to + 5 C Notes. Reverse connection of supply voltage can cause destruction.. The input voltage should be allowed to input without damage or destruction independent of the magnitude of V +. Either input signal should not be allowed to go negative by more than. V. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics.. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. 4. Thermal derating factor is 7.6 mw/ C when operating ambient temperature is higher than 5 C. 5. Thermal derating factor is 5.5 mw/ C when operating ambient temperature is higher than 5 C. 6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage (Split) V ± ±.5 ±5 V Supply Voltage (V = GND) V + V ELECTRICAL CHARACTERISTICS (TA = 5 C, V + = 5 V, V = GND) Parameter Symbol Conditions MIN. TYP. MAX. Unit Input Offset Voltage VIO RS = Ω ± ±7 mv Input Offset Current IIO ±5 ±5 na Input Bias Current Note 7 IB 45 5 na Large Single Voltage Gain AV RL kω 5 V/mV Supply Current ICC RL =, IO = A, All Amplifiers. ma Common Mode Rejection Ratio CMR db Supply Voltage Rejection Ratio SVR 65 db Output Voltage Swing VO RL = kω (Connect to GND) V +.5 V Common Mode Input Voltage Range VICM V +.5 V Output Current (SOURCE) IO SOURCE VIN + = + V, VIN = V 4 ma Output Current (SINK) IO SINK VIN = + V, VIN + = V ma VIN = + V, VIN + = V, VO = mv 5 µa Channel Separation f = khz to khz db Notes 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.

3 TYPICAL PERFORMANCE CHARACTERISTICS (TA = 5 C, TYP.) POWER DISSIPATION 4 V + SUPPLY CURRENT PT - Total Power Dissipation - mw 8 4C 6 4G 4 ICC - Supply Current - ma A ICC + TA = to 7 C TA = C TA - Operating Ambient Temperature - C V + - Supply Voltage - V (V = GND) INPUT OFFSET VOLTAGE 5 INPUT OFFSET VOLTAGE 4 V + = 5 V VIO - Input Offset Voltage - mv TA = 5 C VIO - Input Offset Voltage - mv V + - Supply Voltage - V (V = GND) TA - Operating Ambient Temperature - C INPUT BIAS CURRENT INPUT BIAS CURRENT IB - Input Bias Current - na TA = +5 C IB - Input Bias Current - na V + = +5 V V = GND 4 V + - Supply Voltage - V (V = GND) 5 5 TA - Operating Ambient Temperature - C

4 OUTPUT SINK CURRENT LIMIT V + = 5 V 5 OUTPUT SOURCE CURRENT LIMIT V + VO - Output Voltage - V.. V + / V + IO SINK + VO VO - Output Voltage to V + - V 4 V + / + VO IO SOURCE.... IO SINK - Output Sink Current - ma... IO SOURCE - Output Source Current - ma IO SHORT - Output Short Circuit Current - ma OUTPUT SHORT CIRCUIT CURRENT + IO SHORT AV - Open Loop Voltage Grain - db OPEN LOOP FREQUENCY RESPONSE MΩ VIN. µ F V + + V + / V + = V V + = to 5 V VO TA - Operating Ambient Temperature - C k k k M M f - Frequency - Hz 6 OPEN LOOP VOLTAGE GAIN LARGE SIGNAL FREQUENCY RESPONSE kω AV - Open Voltage Gain - db 8 4 RL = kω RL = kω Vom - Output Voltage Swing - Vp-p 5 5 VIN kω +5 V 7 V + VO kω 4 V + - Supply Voltage - V (V = GND) k 5 k 5 k 5 M f - Frequency - Hz 4

5 COMMON MODE REJECTION RATIO 4 VOLTAGE FOLLOWER PULSE RESPONSE CMR - Common Mode Rejection Ratio - db Output Voltage - V Input Voltage - V RL kω V + = 5 V k k k M f - Frequency - Hz Time - µ s SLEW RATE. SR SR - Slew Rate - V/ µ s.. SR + V ± = ±5 V VO = ± V 5 5 TA - Operating Ambient Temperature - C 5

6 PACKAGE DRAWINGS 4PIN PLASTIC DIP ( mil) A K I L J G H F B C M R D N M NOTES ) Each lead centerline is located within.5 mm (. inch) of its true position (T.P.) at maximum material condition. ) ltem "K" to center of leads when formed parallel. ITEM MILLIMETERS INCHES A. MAX..8 MAX. B.54 MAX.. MAX. C.54 (T.P.). (T.P.) D.5± F. MIN..47 MIN. G.6±..4±. H.5 MIN.. MIN. I 4. MAX..7 MAX. J 5.8 MAX.. MAX. K 7.6 (T.P.). (T.P.) L M N.5. R ~5 ~5 P4C--B- 6

7 4 PIN PLASTIC SOP (5 mil) 4 8 detail of lead end P 7 A H G I J K F E C N B L D M M NOTE Each lead centerline is located within. mm (.5 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A B C D.46 MAX..4 MAX..7 (T.P.) MAX..56 MAX..5 (T.P.) E.±..4±.4 F G H I.8 MAX ± MAX ±..7 J K L.6± M..5 N P S4GM-5-5B, C-4 7

8 RECOMMENDED SOLDERING CONDITIONS When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C55E). Surface mount device µpc4g: 4-pin plastic SOP (5 mil) Process Conditions Symbol Infrared ray reflow Peak temperature: C or below (Package surface temperature), IR-- Reflow time: seconds or less (at C or higher), Maximum number of reflow processes: time. Vapor Phase Soldering Peak temperature: 5 C or below (Package surface temperature), VP5-- Reflow time: 4 seconds or less (at C or higher), Maximum number of reflow processes: time. Wave Soldering Solder temperature: 6 C or below, Flow time: seconds or less, WS6-- Maximum number of flow processes: time, Pre-heating temperature: C or below (Package surface temperature). Partial heating method Pin temperature: C or below, Heat time: seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for partial heating method, or the device will be damaged by heat stress. Through-hole device µpc4c: 4-pin plastic DIP ( mil) Process Wave soldering (only to leads) Partial heating method Conditions Solder temperature: 6 C or below, Flow time: seconds or less. Pin temperature: C or below, Heat time: seconds or less (per each lead.) Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 8

9 REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL IC PACKAGE MANUAL GUIDE TO QUALITY ASSUARANCE FOR SEMICONDUCTOR DEVICES SEMICONDUCTORS SELECTION GUIDE NEC SEMICONDUCTOR DEVICE RELIABILITY/ QUALITY CONTROL SYSTEM - STANDARD LINEAR IC C5E C55E C94X MEI- X679E IEI- 9

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12 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5