BIPOLAR ANALOG INTEGRATED CIRCUIT

Transcription

1 DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µpc71, µpc7 GENERAL PURPOSE L-BAND DOWN CONVERTER ICs DESCRIPTION The µpc71/7 are Silicon monolithic ICs designed for L-band down converter. These ICs consist of double balanced mixer, local oscillator, local oscillation buffer amplifier, IF amplifier, and voltage regulator. The packages are pin SOP or SSOP suitable for high-density surface mount. FEATURES Wide band operation frf =.9 to. GHz Two products in IF output variation are prepared µpc71: Emitter follower output type = Ω constant resistive impedance µpc7: Open collector output type = High impedance output dependent on external inductance. Single-end push-pull IF amplifier suppresses fluctuation in output impedance. Supply voltage: V Low current consumption (µpc71: ICC = 3 ma typ., µpc7: ICC = ma typ.) Packaged in pin SOP or SSOP suitable for high-density mounting ORDERING INFORMATION PART NUMBER PACKAGE PACKAGE STYLE µpc71gr-e1 µpc7gr-e1 µpc71gr-e µpc7gr-e µpc71gv-e1 µpc7gv-e1 pin Plastic SOP ( mil) Embossed tape 1 mm wide. k/reel. Pin 1 indicates pull-out direction of tape. pin Plastic SOP ( mil) Embossed tape 1 mm wide. k/reel. Pin 1 indicates roll-in direction of tape. pin Plastic SSOP (17 mil) Embossed tape mm wide 1 k/reel. Pin 1 indicates pull-out direction of tape. For evaluation sample order, please contact your local NEC office. (Part number for sample order: µpc71gr, µpc7gr, µpc71gv, µpc7gv) Caution electro-static sensitive device The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P111EJVDS (th edition) Date Published October 1999 N CP(K) Printed in Japan The mark shows major revised points. 1996, 1999

2 INTERNAL BLOCK DIAGRAM PIN CONFIGURATION (Top View) 7 6 OSC OSC Buffer OSC base (bypass). OSC base (feedback) 3. OSC collector (coupling). VCC. IF output 6. GND 7. RF input (bypass). RF input Data Sheet P111EJVDS

3 PIN No. SYMBOL PIN VOLT TYP.(V) Function and Explanation Equivalent circuit 1 OSC base (bypass).9 Internal oscillator consists in balance amplifier. pin and 3 pin should be externally equipped with tank resonator circuit in order to oscillate with feedback loop. VCC 3 1 OSC base (feedback).9 1 pin should be grounded through coupling capacitor to.. 3 OSC collector (coupling). 3 pin is defined as open collector. This pin should be coupled through resistor or chock coil in order to adjust Q and be supplied voltage. In case of abnormal oscillation, adjust its Q lower to stabilize the operation. VCC. Supply voltage pin for the IC. IF output µpc71.9 In µpc71, IF amplifier is designed as single-end push-pull amplifier. This pin is assigned for the emitter follower output with Ω constant resistive impedance in wide band. µpc71 µpc7. In µpc7, IF amplifier is designed as balance amplifier. This pin is assigned for the open collector output with high impedance dependent on external inductance. µpc7 6 GND. GND pin for the IC. 7 RF input (bypass). 7 pin and pin are inputs for mixer designed as double balanced type. Either pin can be assigned for input and another for ground. 7 RF input 1. Data Sheet P111EJVDS 3

4 ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATING UNIT TEST CONDITION Supply Voltage VCC 6. V TA = C Power Dissipation PD mw TA = C Note 1 Operating temperature range TA to + C Storage temperature range Tstg 6 to +1 C Note 1: Mounted on 1.6 mm double copper clad epoxy glass board. RECOMMENDED OPERATING RANGE PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply Voltage VCC... V Operating temperature range TA + + C ELECTRICAL CHARACTERISTICS (VCC =. V, TA = + C Note ) PARAMETER SYMBOL µpc71 µpc7 MIN. TYP. MAX MIN. TYP. MAX UNIT TEST CONDITIONS Circuit Current ICC ma no input signal Lower Input Frequency frf1.9.9 GHz fif = to 6 MHz (C71) Upper Input Frequency frf.. GHz fif = DC to 6 MHz (C7) Conversion Gain 1 CG db frf = 9 MHz, fif =. MHz Conversion Gain CG db frf =. GHz, fif =. MHz Noise Figure 1 NF db frf = 9 MHz, fif =. MHz Noise Figure NF db frf =. GHz, fif =. MHz Maximum output power 1 PO(SAT) dbm frf = 9 MHz, fif =. MHz Maximum output power PO(SAT) dbm frf =. GHz, fif =. MHz Note : on test circuit STANDARD CHARACTERISTICS (FOR REFERENCE) (VCC = V, TA = C Note ) PARAMETER REFERENCE VALUES SYMBOL UNIT TEST CONDITIONS µpc71 µpv7 Conversion Gain 3 CG3 19 db frf = 9 MHz, fif = MHz Conversion Gain CG 19 db frf =. MHz, fif = MHz Conversion Gain CG 1 1 db frf = 9 MHz, fif = 79. MHz Conversion Gain 6 CG6 1 1 db frf =. MHz, fif = 79. MHz Conversion Gain 7 CG db frf = 9 MHz, fif = 6 MHz Conversion Gain CG db frf =. MHz, fif = 6 MHz Third Intermodulation Distortion 1 IM dbc frf = 9, 93 MHz, Pin = 3 dbm Third Intermodulation Distortion IM3 3.. dbc frf =.,.3 GHz, Pin = 3 dbm Data Sheet P111EJVDS

5 TYPICAL CHARACTERISTICS (TA = + C) ICC Circuit Current ma CIRCUIT CURRENT vs. SUPPLY VOLTAGE No input signal µ PC71 µ PC VCC Supply Voltage V Pout Output Power dbm +1 + OUTPUT POWER vs. INPUT POWER frf =. GHz µ PC71 1 VCC = V 1 fif = MHz On test circuit µ PC7 Pin Input Power dbm frf = 9 MHz frf =. GHz frf = 9 MHz NF Noise Figure db 1 1 CG Conversion Gain db CONVERSION GAIN AND NOISE FIGURE vs. INPUT FREQUENCY CG µ PC71 µ PC7 µ PC71 µ PC7 VCC = V PRF = 3 dbm POSC = dbm fif = MHz On test circuit NF CG Conversion Gain db CONVERSION GAIN vs. IF FREQUENCY µ PC71 VCC = V POSC = dbm PRF = 3 dbm On test circuit frf =. GHz frf = 9 MHz fin Input Frequency GHz fif IF Frequency MHz IM3 AND OUTPUT POWER vs. INPUT POWER IM3 AND OUTPUT POWER vs. INPUT POWER Pout Output Power dbm 1 3 µpc71 frf1 = 9 MHz frf = 93 MHz fosc = 1.3 GHz frf1 =. GHz frf =.3 GHz fosc =. GHz VCC = V Pout Output Power dbm 1 3 µpc7 frf1 = 9 MHz frf = 93 MHz fosc = 1.3 GHz frf1 =. GHz frf =.3 GHz fosc =. GHz VCC = V Pin Input Power dbm Pin Input Power dbm Data Sheet P111EJVDS

6 OSC-TUNING VOLTAGE vs. OSC FREQUENCY LOWER VCC VOLTAGE IN OSC OPERATION vs. OSC FREQUENCY VTU Tuning Voltage V VCC = V fif = MHz V Oscillation stop (start) Voltage V fosc Oscillation Frequency GHz fosc Oscillation Frequency GHz Fstb Oscillation Frequency Stability MHz µ PC71 OSC FREQUENCY STABILITY vs. µ PC7 OSC FREQUENCY STABILITY vs. OSC FREQUENCY OSC FREQUENCY +6. VCC =. V VCC =. V VCC =. V VCC =. V fosc Oscillation Frequency GHz Fstb Oscillation Frequency Stability MHz VCC =. V VCC =. V VCC =. V VCC =. V fosc Oscillation Frequency GHz 6 Data Sheet P111EJVDS

7 TEST CIRCUIT S.G S.G. 1 1 Ω Ω 1 1 Ω µpc Ω 1 1 Ω Spectrum analyzer. V APPLICATION CIRCUIT FOR REFERENCE 7 kω L L 1SV1 Note 7 Ω 7 Ω µ PC RF IN IF OUT 1 L: φ.3 mm φ. mm 1T. V Note Our varactor diodes are discontinued. For varactor diode, contact other supplier. L: φ. mm, = mm The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet P111EJVDS 7

8 TEST CIRCUIT S.G S.G. 1 1 Ω Ω 1 1 Ω µ PC Ω 1. L L1 1. µ H Ω Spectrum analyzer. V L1: φ. mm φ. mm 3T APPLICATION CIRCUIT FOR REFERENCE 7 kω L L 1SV1 Note 7 Ω 7 Ω µ PC RF IN IF OUT. V Note Our varactor diodes are discontinued. For varactor diode, contact other supplier. L1: φ. mm φ. mm 3T L: φ.3 mm φ. mm 1T L: φ. mm, = mm The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet P111EJVDS

9 PACKAGE DIMENSIONS PIN PLASTIC SOP ( mil) (UNIT: mm) detail of lead end ±. 6. ± ± ± ± MAX..6 ± ± M NOTE Each lead centerline is located within.1 mm of its true position (T.P.) at maximum material condition. Data Sheet P111EJVDS 9

10 PIN PLASTIC SSOP (17 mil) (UNIT: mm) detail of lead end MAX.9 ±. 1. MAX 1. ±.1 3. ±.1.7 ±..6.7 MAX.. ± ± M NOTE Each lead centerline is located within.1 mm of its true position (T.P.) at maximum material condition. 1 Data Sheet P111EJVDS

11 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales officers in case other soldering process is used or in case soldering is done under different conditions. For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C13E). µpc71/ Soldering process Soldering conditions Symbol Infrared ray reflow VPS Wave soldering Partial heating method Peak package s surface temperature: 3 C or below, Reflow time: 3 seconds or below (1 C or higher), Number of reflow process: 3, Exposure limit Note : None Peak package s surface temperature: 1 C or below, Reflow time: seconds or below ( C or higher), Number of reflow process: 3, Exposure limit Note : None Solder temperature: 6 C or below, Flow time: 1 seconds or below, Number of flow process: 1, Exposure limit Note : None Terminal temperature: 3 C or below, Flow time: 3 seconds or below, Exposure limitnote: None IR3--3 VP1--3 WS6--1 Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: C and relative humidity at 6 % or less. Caution Do not apply more than single process at once, except the Partial heating method. Data Sheet P111EJVDS 11

12 NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 9.