SiGe:C LOW NOISE AMPLIFIER FOR GPS/MOBILE COMMUNICATIONS

Transcription

1 DESCRIPTION BIPOLAR ANALOG INTEGRATED CIRCUIT PC8231TK SiGe:C LOW NOISE AMPLIFIER FOR GPS/MOBILE COMMUNICATIONS The PC8231TK is a silicon germanium carbon (SiGe:C) monolithic integrated circuit designed as low noise amplifier for GPS and mobile communications. This device exhibits low noise figure and high power gain characteristics. This device is enabled in the frequency range from 1.5 to 2.4 GHz by modifying the external matching circuit. The package is 6-pin lead-less minimold, suitable for surface mount. This IC is manufactured using our UHS4 (Ultra High Speed Process) SiGe:C bipolar process. FEATURES Low noise : NF = 0.8 db fin = MHz High gain : GP = 20 db fin = MHz Low current consumption : ICC = 3.8 ma VCC = 3.0 V Built-in power-saving function High-density surface mounting : 6-pin lead-less minimold package ( mm) Included very robust bandgap regulator (Small VCC and TA dependence) Included protection circuits for ESD APPLICATION Low noise amplifier for GPS and mobile communications ORDERING INFORMATION Part Number Order Number Package Marking Supplying Form PC8231TK-E2 PC8231TK-E2-A 6-pin lead-less minimold (1511 PKG) (Pb-Free) Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC8231TK-A Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge 6K 8 mm wide embossed taping Pin 1, 6 face the perforation side of the tape Qty 5 kpcs/reel Document No. PU10613EJ01V0DS (1st edition) Date Published April 2006 NS CP(K)

2 PIN CONNECTIONS INTERNAL BLOCK DIAGRAM Pin No. Pin Name 1 INPUT 2 GND 3 Power Save 4 OUTPUT 5 GND 6 VCC 2 Data Sheet PU10613EJ01V0DS

3 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Ratings Unit Supply Voltage VCC TA = +25 C 4.0 V Power-Saving Voltage VPS TA = +25 C 4.0 V Power Dissipation PD TA = +85 C Note 232 mw Operating Ambient Temperature TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Input Power Pin +10 dbm Note Mounted on double-side copper-clad mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC V Operating Ambient Temperature TA C Power Save Turn-on Voltage VPSon 1.6 VCC V Power Save Turn-off Voltage VPSoff V Data Sheet PU10613EJ01V0DS 3

4 ELECTRICAL CHARACTERISTICS (TA = +25 C, VCC = VPS = 3.0 V, fin = MHz, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No Signal (VPS = 3.0 V) ma At Power-Saving Mode (VPS = 0 V) 1 A Power Gain GP Pin = 35 dbm db Noise Figure NF db Input 3rd Order Distortion Intercept Point IIP3 fin1 = MHz, fin2 = MHz 10 dbm Input Return Loss RLin 7 10 db Output Return Loss RLout db Isolation ISL 35 db Gain 1 db Compression Input Power Pin (1 db) 22 dbm TEST CIRCUIT 4 Data Sheet PU10613EJ01V0DS

5 TYPICAL CHARACTERISTICS (TA = +25 C, unless otherwise specified) Remark The graphs indicate nominal characteristics. Data Sheet PU10613EJ01V0DS 5

6 Remark The graphs indicate nominal characteristics. 6 Data Sheet PU10613EJ01V0DS

7 S-PARAMETERS (TA = +25 C, VCC = VPS = 3.0 V, monitored at connector on board) Remark The graphs indicate nominal characteristics. Data Sheet PU10613EJ01V0DS 7

8 APPLIED CIRCUIT EXAMPLE EXTERNAL PARTS CHART Symbol Parts Value GHz Band 1.9 GHz Band 2.14 GHz Band 2.4 GHz Band L1 Chip Inductor nh L2 Chip Inductor nh L3 Chip Inductor nh C1 Chip Capacitor pf C2 Chip Capacitor pf C3 Chip Capacitor pf C4 Chip Capacitor pf C5 Chip Capacitor pf R1 Chip Resistor TYPICAL CHARACTERISTICS (TA = +25 C, VCC = VPS = 3.0 V, unless otherwise specified) Parameter Symbol Reference Value GHz 1.9 GHz 2.14 GHz 2.4 GHz Power Gain GP db Noise Figure NF db Input Return Loss RLin db Output Return Loss RLout db Unit Unit 8 Data Sheet PU10613EJ01V0DS

9 PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm) Data Sheet PU10613EJ01V0DS 9

10 NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) Do not supply DC voltage to INPUT pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. For soldering Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) : 260 C or below Time at peak temperature Time at temperature of 220 C or higher Preheating time at 120 to 180 C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 10 seconds or less : 60 seconds or less : seconds : 3 times : 0.2%(Wt.) or below Wave Soldering Peak temperature (molten solder temperature) : 260 C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120 C or below Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 1 time : 0.2%(Wt.) or below Partial Heating Peak temperature (terminal temperature) : 350 C or below Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 3 seconds or less : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). IR260 WS260 HS Data Sheet PU10613EJ01V0DS