Rod-versus Fiberlaser in Thermal Laser Microprocessing
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- Damian Morrison
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1 Rod-versus Fiberlaser in Thermal Laser Microprocessing 1)Basics Laser Microprocessing 2) Basics: plpssl cwfl 3) Fine cutting: plpssl vs cwfl 3) Welding: plpssl vs cwfl -seam welding -spot welding 4)Drilling: plpssl vs cwfl 5)Summary SwissLaserNet/DU/ _#01
2 LASAG Industrial Lasers Products CW/pulsed Solid State Lasers (lamp pumped, Diode pumped) Beam guiding technologies Beam distribution Beam forming Process accessories Process control Solution for the customer SwissLaserNet/DU/ _#02
3 LASAG Industrial Lasers Laser - Applications (Fine) cutting precision drilling micro-welding Scribing Stents / Hypotubes SwissLaserNet/DU/ _#03
4 LASAG Industrial Lasers Markets Turbines (aero, gas) Medical (implants,instruments) Auto (powertrain) Solar (thermal Absorber) Electronics (contacts) White Ware (coffee machine)) Turbine component (cooling hole) Cracked connecting rod IT-plug Fuel Filter SwissLaserNet/DU/ _#04
5 Lase Microprocessing in Industrial Production System elements for Pre-processing and feeding Beam distribution Handling Beam former Beam guider Laser Laserbeam Processcontrol Processsupport. User surface Control System elements for Post.processing Further handling SwissLaserNet/DU/ _#05
6 Laser Microprocessing: The System Laser technology beamforming (temporal/spacial) Process support Process-Optics Beam distribution Protection Control (process/system) Workpiece (interaction, thermal effects) Positioning Contour movement (CNC) SwissLaserNet/DU/ _#06
7 Disruptive Technologies in Laser Mikroprocessing? Industrial short pulse lasers FL Diode Industrial market requirements: Cost of ownership improvement Process quality, reliability, productivity SwissLaserNet/DU/ _#07
8 Industrial market requirements: Cost of ownership improvement Process quality, reliability, productivity Influence of disruptive FL-cw technology on LPSSL markets FL Macrodrilling Macrocutting Macrowelding Spotwelding Microdrilling Microwelding Microcutting SwissLaserNet/DU/ _#08
9 Basic problem of LPSSL/DPSSL: influence of heat on beam quality Laser Material End mirror Exit mirror 50 M 2 Pump source (Energy) Lampenstrahlung Wall plug efficiency LP<5% / DP15% energy is waisted 1 Average power SwissLaserNet/DU/ _#09
10 Elements of disruptive FL-Technology vs Rod SwissLaserNet/DU/ _#010
11 Fine cutting: pulsed 200 W Nd:YAG cw 200 W Fiberlaser speed (mm/min) CFS 200 (M 2 =1) StS 2000 KLS 246 (M 2 =2 20 /pulse power <7kW)) Thickness (mm) SwissLaserNet/DU/ _#011
12 Example: Metal - Stent LLT Stent Cutter SwissLaserNet/DU/ _#012
13 200W pulsed YAG 200W SM Fiberlaser (fine cutting) Application relevant parameters Beam quality number M 2 CFS 1.2 KLS 2-20 Average power/cw power(w) frequency(khz) <50 <1 Wall plug efficiency (%) < Fine cutting (pulse duration 0.1ms) Average power on workpiece Intensity 50mm Objectiv (BE 1-6)(MW) 10 ->100 > Depth of Focus(mm) Fine cutting St.St 0.5/1/2mm* see diagram *Problems FL :Quality begin of cut /high reflecting metals SwissLaserNet/DU/ _#013
14 Material Processing: Seam-Welding SLS 200-CFS 200 Influence of Brilliance CFS 200 SLS 200(seam) Court. IPG 0.1mm SLS 200(SHADOW) 3kW peak SwissLaserNet/DU/ _#014
15 Spot welding: SHADOW -Microring or single spot FL/LPSSL approach: stiring LPSSL approach: single spot Stepless High Speed Accurate and Discrete One Pulse Welding advantage: Allows spot welding for low power lasers High power(densities) for fast coupling Movement avoids overheating(spattering) disadvantage Needs scanner and time SwissLaserNet/DU/ _#015
16 Influence of Brilliance on deep welding performance Brilliance ~Watt/Spot x cone angle (W/cm 2 sr) IWS(Dresden)/Dt. Kupferinstitut. Material: Cu Cu Laser: p - Nd:YAG(240W) cw IPG-FL (4kW) Parameter: 4 kw Pulsleistung 4kW 35 J Pulsenergie Tiefe: 1 mm 3mm Speed: 0.1m/min 3m/min SwissLaserNet/DU/ _#016
17 Drilling of Filters SwissLaserNet/DU/ _#017
18 Hole Diameter(µm) 1000 Limit: Intensity, pulse energy Single Shot on the fly* Drilling (200W) Processing time <2s Aspect 10 StSt (0.5mm) Limit: Beam Quality Limit at necessary energy: Pulse frequency Average Power Movement plpssl cwfl(modulated) Holes per Second SwissLaserNet/DU/ _#018
19 Disruptive Technologies in Laser Mikroprocessing? Industrial short pulse lasers FL Diode Industrial market rquirements: Cost of ownership improvement Process quality, reliability, productivity SwissLaserNet/DU/ _#019
20 Laser Microprocessing: The System Laser technology beamforming (temporal/spacial) Process support Process-Optics Beam distribution Protection Control (process/system) Workpiece (interaction, thermal effects) Positioning Contour movement (CNC) SwissLaserNet/DU/ _#020
21 CNC disruptive Technology for high speed laser processing Precision cost of ownership Speed +Precision Superspeed+Precision Umsetzung Laser-Vorgaben Marktbedürfnisse SwissLaserNet/DU/ _#021
22 Rod-versus Fiberlaser in Thermal Laser Microprocessing Each application has its own Optimized laser Decision for customer more difficult: needs more neutral counseling Potential of new lasers is limited by Accessories / CNC properties SwissLaserNet/DU/ _#022
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