AME. Shunt Bandgap Voltage Reference. General Description. Functional Block Diagram. Features. Typical Application. Applications

Transcription

1 General Description The is a micropower 2-terminal band-gap voltage regulator diode. It operates over a 30µA to 20mA current range. Each circuit is trimmed at wafer sort to provide a ± 0.5% initial tolerance. The design of the allows for a large range of load capacitances and operating currents. The low start-up current makes these parts ideal for battery applications. Functional Block Diagram VR offers this part in a TO-92 and SOP-8 packages as well as the space saving SOT-23. Bandgap Cell Feedback Current Shunt Features Small Packages: SOT-23, TO-92, SOP-8 Tolerates Capacitive Loads Fixed Reverse Breakdown Voltage of 1.235V Tight Voltage Tolerance ±0.5% Wide Operating Current µA to 20mA Wide Temperature Range o C to +85 o C Low Temperature Coefficient --100ppm/ o C (max) Excellent Transient Response Green Products Meet RoHS Standards GND Typical Application VS RS Applications Portable Electronics Power Supplies Computer Peripherals Data Acquisition Systems Battery chargers Consumer Electronics 0.1m F Value optional VR VR = 1.235V RS = VS - VR I 1

2 Pin Configuration SOP-8 SOT NC 2. NC 3. NC NC 6. NC 7. NC NC* * Die Attach: Conductive Epoxy * Die Attach: Non-Conductive Epoxy TO NC* * Die Attach: Non-Conductive Epoxy * The NC pin must float or be connected to - (negative) 2

3 Ordering Information 385 x x x x x - x Special Feature2 Special Feature1 Number of Pins Package Type Operating Ambient Temperature Range Accuracy Accuracy (SOT-23) (SOP-8) (TO-92-3) Operating Ambient Temperature Range Package Type Number of Pins Special Feature1 Special Feature2 (For TO-92 Package Only) Package Lead Pitch A: 0.5% E: -40 O C to +85 O C A: TO-92 A: 8 Z: Lead Free N/A: Taping 5.08mm E: SOT-2X T: 3 1: Bulk 2.54mm H: SOP 3

4 Ordering Information (contd.) Part Number Marking Accuracy Package Operating Ambient Temperature Range 385AEET ABXww 0.5% SOT o C to +85 o C 385AEETZ ABXww 0.5% SOT o C to +85 o C 385AEAT 385AEAT-1 385AEATZ 385AEATZ AEAT yyww 385 AEAT yyww 385 AEAT yyww 385 AEAT yyww 0.5% TO o C to +85 o C 0.5% TO o C to +85 o C 0.5% TO o C to +85 o C 0.5% TO o C to +85 o C 385AEHA 385 AEHA yyww 0.5% SOP-8-40 o C to +85 o C 385AEHAZ 385 AEHA yyww 0.5% SOP-8-40 o C to +85 o C Note: 1. ww & yyww represents the date code pls see the Date Code Rule on Package Dimension. 2. A bar on top of the first letter represents lead free plating such as ABXww. 3. Please consult sales office or authorized Rep./Distributor for the availability of voltage accuracy and package type. 4

5 Absolute Maximum Ratings Parameter Maximum Unit Supply Current 50 ma Caution: Stress above the listed absolute maximum rating may cause permanent damage to the device Recommended Operating Conditions Parameter Symbol Rating Unit Ambient Temperature Range T A - 40 to +85 o C Junction Temperature Range T J - 40 to +125 o C Storage Temperature Range T STG - 65 to +150 o C Supply Current 100µA ~ 20mA Electrical Specifications Unless otherwise specified, T A = 0~70 O C, I R = 100µA Parameter Symbol Test Condition Min Typ Max Units Reference Voltage, ±0.5% V REF I REF = 100µA V Reference Voltage Change With Current dv REF/I I MIN < I < 1mA 1mA < I < 20mA Reverse Dynamic Impedence RDI I R = 100µA, f=20hz 1.5 Ohm Wideband Noise (rms) Vn I R = 100µA, 10 Hz<f<10KHz 60 µv I R = 100µA, T A =25 o C, Long term Stability 20 ppm T=1000 Hours Reference Voltage Temp. Coeff. V REFTC 0 o C < T 100 ppm/ o A < 70 o C C Operation Current I OP ma mv 5

6 Thermal Information Parameter Package Die Attach Symbol Maximum Unit Thermal Resistance* (Junction to Case) Thermal Resistance (Junction to Ambient) Internal Power Dissipation SOT-23 Non-Conductive 140 Epoxy TO SOP-8 Conductive Epoxy SOT-23 Non-Conductive 280 TO-92-3 Epoxy 150 SOP-8 Conductive Epoxy θ JC SOT-23 Non-Conductive 400 TO-92-3 Epoxy 625 θ JA P D o C / W o C / W mw SOP-8 Conductive Epoxy 810 Maximum Junction Temperature Solder Iron (10 Sec)** o C o C * Measure θ JC on center of molding compound if IC has no tab. ** MIL-STD-202G 210F 6

7 Characterization Curve(For reference only) Normalized Percentage Change vs. Temp Reference Voltage Change vs. Current 2 Change of V REF (%) I=100µA Change of V REF (mv) Temperature ( o C) Operation Current (ma) 100 Reverse Characteristic 1 Forward Characteristic I R (ua) O C 25 O C I F (ma) O C 85 O C V R (V) V F (V) Line Transient Response 25 o C 5V/DIV V IN 0.5V/DIV VR 200mS/DIV 7

8 Date Code Rule Marking Date Code Year A A A W W xxx0 A A A W W xxx1 A A A W W xxx2 A A A W W xxx3 A A A W W xxx4 A A A W W xxx5 A A A W W xxx6 A A A W W xxx7 A A A W W xxx8 A A A W W xxx9 Tape and Reel Dimension SOT-23 P W Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size SOT ±0.1 mm 4.0±0.1 mm 3000pcs 180±1 mm 8

9 Tape and Reel Dimension TO-92-3 W P Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size TO mm 12.7±0.2 mm 2000pcs N/A SOP-8 P W Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size SOP ±0.1 mm 4.0±0.1 mm 2500pcs 330±1 mm 9

10 Package Dimension SOT-23 D Side View MILLIMETERS INCHES SYMBOLS MIN MAX MIN MAX A A E H b D e L E e 1.90 BSC BSC H Front View L 0.35BSC BSC q1 0 o 10 o 0 o 10 o A b A1 SOP-8 Side View C SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A H E A A REF REF B D L C D E Front View 7 o (4X) e 1.27 BSC BSC L H A2 A y e A1 q 0 o 8 o 0 o 8 o B 10

11 Package Dimension TO-92-3 (bulk pack) L SYMBOLS MIN MAX MIN MAX A b MILLIMETERS 0.40REF INCHES REF e e1 w D E e e1 3.94REF 2.54REF 1.27REF REF REF REF b Side View A E-PIN C 1/16 R E L R W D Notes: 1. Package outline exclusive of any mold flashes dimension. 2. Package outline exclusive of burr dimension. 3. Lead pitch=2.54mm is bulk pack. 4. Lead pitch=5.08mm is tape pack. TO-92-3 (tape pack) SYMBOLS MILLIMETERS INCHES MIN MAX MIN MAX A L b 0.40REF REF e e1 w E e 5.08REF 0.2REF D e1 2.54REF 0.1REF L Side View A E-PIN C 1/16 R R W D b E Notes: 1. Package outline exclusive of any mold flashes. 2. Package outline exclusive of burr dimension. 3. Lead pitch=2.54mm is bulk pack. 4. Lead pitch=5.08mm is tape pack. 11

12 Life Support Policy: These products of, Inc. are not authorized for use as critical components in life-support devices or systems, without the express written approval of the president of, Inc., Inc. reserves the right to make changes in the circuitry and specifications of its devices and advises its customers to obtain the latest version of relevant information., Inc., February 2012 Document: 2003/2037-DS H.01 Corporate Headquarter, Inc. 8F, 12, WenHu St., Nei Hu Taipei, Taiwan. 114 Tel: Fax: