Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED

Transcription

1 Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED

2 Report Title: Report Type: Date: Qualification Test Report See Attached See Attached

3 HMC121 HMC132 HMC132 HMC147 HMC168 HMC173

4 Introduction The testing performed for this report is designed to accelerate the predominant failure mode, electro-migration (EM), for the devices under test. The devices are stressed at high temperature and DC biased to simulate a lifetime of use at typical operating temperatures. Using the Arrhenius equation, the acceleration factor (AF) is calculated for the stress testing based on the stress temperature and the typical use operating temperature. This report is intended to summarize all of the High Temperature Operating Life Test (HTOL) data for the MESFET-D process. The FIT/MTTF data contained in this report includes all the stress testing performed on this process to date and will be updated periodically as additional data becomes available. Data sheets for the tested devices can be found at Glossary of Terms & Definitions: 1. HTOL: High Temperature Operating Life. This test is used to determine the effects of bias conditions and temperature on semiconductor devices over time. It simulates the devices operating condition in an accelerated way, through high temperature and/or bias voltage, and is primarily for device qualification and reliability monitoring. This test was performed in accordance with JEDEC JESD22-A Operating Junction Temp (T oj ): Temperature of the die active circuitry during typical operation. 3. Stress Junction Temp (T sj ): Temperature of the die active circuitry during stress testing.

5 Qualification Sample Selection: All qualification devices used were manufactured and tested on standard production processes and met pre-stress acceptance test requirements. Summary of Qualification Tests: HMC128 (QTR02003) Initial Electrical Complete HTOL, 620 hours Complete Post HTOL Electrical Test Pass Bond Pull 5 5 Pass Die Shear 4 4 Pass SEM Inspection 5 5 Pass Metal and Dielectric Thickness 5 5 Pass

6 HMC129 (QTR02003) Initial Electrical Complete HTOL, 1240 hours Complete Post HTOL Electrical Test Pass Bond Pull 5 5 Pass Die Shear 4 4 Pass SEM Inspection 5 5 Pass Metal and Dielectric Thickness 5 5 Pass HMC121 (QTR02006) Initial Electrical Complete HTOL, 620 hours Complete Post HTOL Electrical Test Pass Bond Pull Pass Die Shear Pass SEM Inspection 5 5 Pass Metal and Dielectric Thickness 5 5 Pass

7 HMC182 (QTR02009) Initial Electrical Complete HTOL, 1000 hours Complete Post HTOL Electrical Test Pass HMC182 (QTR02009) Initial Electrical Complete HTOL, 720 hours Complete Post HTOL Electrical Test Pass

8 MESFET-D Failure Rate Estimate Based on the HTOL test results, a failure rate estimation was determined using the following parameters: With Device Operating Temp = 85 C HMC128 (QTR02003) HMC129 (QTR02003) HMC121 (QTR02006) HMC182 (QTR02009) HMC182 (QTR02009) Device hours: HMC128 (QTR02003) = (33 X 620hrs) = 20,460 hours HMC129 (QTR02003) = (12 X 1240hrs) = 14,880 hours HMC121 (QTR02006) = (35 X 620hrs) = 21,700 hours HMC182 (QTR02009) = (20 X 1000hrs) = 20,000 hours HMC182 (QTR02009) = (239 X 720hrs) = 172,080 hours For MESFET-D MMIC, Activation Energy = 1.6 ev

9 Acceleration Factor (AF): HMC128 (QTR02003) Acceleration Factor = exp[1.6/8.6 e-5(1/358-1/423)] = HMC129 (QTR02003) Acceleration Factor = exp[1.6/8.6 e-5(1/358-1/423)] = HMC121 (QTR02006) Acceleration Factor = exp[1.6/8.6 e-5(1/358-1/423)] = HMC182 (QTR02009) Acceleration Factor = exp[1.6/8.6 e-5(1/358-1/423)] = HMC182 (QTR02009) Acceleration Factor = exp[1.6/8.6 e-5(1/358-1/423)] = Equivalent hours = Device hours x Acceleration Factor Equivalent hours = (20,460x2938.6)+(14,880x2938.6)+(21,700x2938.6)+ (20,000x2938.6)+(172,080x2938.6) = 1.68x10 8 hours Since there were no failures and we used a time terminated test, F=0, and R = 2F+2 = 2 The failure rate was calculated using Chi Square Statistic: at 60% and 90% Confidence Level (CL), with 0 units out of spec and a 85 C package backside temp; Failure Rate λ 60 = [(χ 2 ) 60, 2 ]/(2X 1.68x10 8 )] = 1.8/ 3.36x10 8 = 5.46x10-9 failures/hour or 5.5 FIT or MTTF = 1.83x10 8 Hours λ 90 = [(χ 2 ) 90, 2 ]/(2X 1.68x10 8 )] = 4.6/ 3.36x10 8 = 1.38x10-8 failures/hour or 13.8 FIT or MTTF = 7.27x10 7 Hours