2.0 Part Number. The complete part number(s) of this specification follow: Part Number
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1 8-Bit High-Speed Multiplying D/A Converter DAC SCPE This specification documents the detailed requirements for Analog Devices space qualified die including die qualification as described for Class K in MIL-PRF-38534, Appendix C, Table C-II except as modified herein. The manufacturing flow described in the STANDARD DIE PRDUCTS PRGRAM brochure at is to be considered a part of this specification. This data sheet specifically details the space grade version of this product. A more detailed operational description and a complete data sheet for commercial product grades can be found at Part Number. The complete part number(s) of this specification follow: Part Number Description DAC08-000C 8-Bit High-Speed Multiplying D/A Converter DAC08R000C Radiation guaranteed 8-Bit High-Speed Multiplying D/A Converter 3.0 Die Information 3.1 Die Dimensions Die Size Die Thickness Bond Pad Metalization 63 mil x 87 mil 19 mil ± 2 mil Al/Cu 3.2 Die Picture 1. LC 2. I UT I UT 5. B1 (MSB) 6. B2 7. B3 8. B4 9. B5 10. B6 11. B7 12. B8 (LSB) REF+ 15. REF- 16. CMP ASD Rev. F Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies. ne Technology Way, P.. Box 9106, Norwood, MA , U.S.A. Tel: Fax: Analog Devices, Inc. All rights reserved.
2 DAC Absolute Maximum Ratings 1/ Supply oltage (+ to -) dc Logic Inputs... - to (- plus 36 dc) Logic Control oltage ( LC )... - to + Analog Current utputs (at - = 15) Reference Input ( REF+ to REF- )... - to + Reference Input Differential oltage ( REF+ to REF- )... ±18 dc Reference Input current (I REF+ )... 5 Storage Temperature Range C to +125 C Ambient perating Temperature Range (T A ) C to +125 C Junction Temperature (T J ) C Absolute Maximum Ratings Notes: 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 4.0 Die Qualification In accordance with class-k version of MIL-PRF-38534, Appendix C, Table C-II, except as modified herein. (a) Qual Sample Size and Qual Acceptance Criteria 25/2 (b) Qual Sample Package DIP (c) Pre-screen electrical test over temperature performed post-assembly prior to die qualification. ASD Rev. F Page 2 of 6
3 Table I - Dice Electrical Characteristics Parameter Symbol Conditions 1/ Min Max Power Supply I+ 3.8 S = ±15; I REF 2 I Full Range Current I FR REF = 10, utput oltage Compliance C Full Range Current Change < 1/2 LSB Zero Scale Current I ZS 2 μα Full Range Symmetry I FRS I FR - I FR ±8 μα utput Current Range I R1 REF = 15, - = -10, 2.1 I R2 REF = 25, - = -12, = 4.5 to 18, % ΔI PSSI FS+ ± = -18; I REF = 1 % Δ + Power Supply Sensitivity PSSI FS- - = -4.5 to -18, % ΔI ± = +18; I REF = 1 % Δ - Reference Bias Current I REF- 0-3 μα Logic Input Levels IL Logic 0, LC = IH Logic 1, LC = 0 2 Logic Input Current I IL IN = -10, LC = 0-10 (Each Bit) I IH IN = 18, LC = μα Logic Input Swing IS I FR = 1.94 (min) I FR = 2.04 (max) Resolution 8 Bits Monotonicity 8 Bits Nonlinearity NL ±0.1 %FS DAC08 Table I Notes: 1. S = ±15, I REF = 2, and T A = +25 C, unless otherwise specified. ASD Rev. F Page 3 of 6
4 DAC08 Parameter Power Supply 2/ Full Range Current utput oltage Compliance 4/ Table II - Electrical Characteristics for Qualification Symbol I+ I- I FR C Conditions 1/ Subgroups Min Max S = ±15 or +5, -15 S = ±5, I REF = 1 1, 2, M, D, L, R 4.0 S = ±15 or +5, -15 1, 2, S = ±5; I REF = 1 1, 2, M, D, L, R 3/ REF = 10, 1, 2, M, D, L, R 3/ Full-Scale Current Change < 1/2 LSB 1, 2, Zero Scale Current I ZS 1, 2, 3 2 M, D, L, R 3/ 1 2 μα Full Range Symmetry 4/ I FRS I FR - I FR 1, 2, 3 ±8 μα utput Current Range 4/ I REF = 15, - = -10; R , 2, 3 I REF = 25, - = -12; R = 4.5 to 18, %ΔI PSSI FS+ - = -18, I REF = 1 ±0.01 Power Supply Sensitivity %Δ+ 1, 2, 3 4/ - = -4.5 to -18, %ΔI PSSI FS- + = 18, I REF = 1 ±0.01 %Δ- Reference Bias Current 4/ I REF- 1, 2, μα Logic Input Levels IL Logic 0, LC = 0 1, 2, M, D, L, R 3/ IH Logic 1, LC = 0 1, 2, M, D, L, R 3/ IN = -10, LC = 0 1, 2, 3-10 I IL Logic Input Current M, D, L, R 3/ 1-30 μα (Each Bit) 4/ IN = 18, LC = 0 1, 2, 3 10 I IH M, D, L, R 3/ 1 10 Logic Input Swing 4/ IS I FR = 1.94 (min) I FR = 2.04 (max) 1, 2, Monotonicity 4/ 1, 2, 3 8 Bits ASD Rev. F Page 4 of 6
5 Table II - Electrical Characteristics for Qualification DAC08 Parameter Symbol Conditions 1/ Subgroups Min Max 1, 2, 3 ±0.19 Nonlinearity NL %FS M, D, L, R 3/ 1 ±0.45 Full Scale Tempco 4/ TCI FS 8 ±80 ppm/ C Table II Notes: 1. S = ±15, I REF = 2, unless otherwise specified. 2. When the device is used in an un-biased state at high temperature only, and subsequently biased, the device supply currents may rise 30% above specification for as long as 30 seconds. 3. Devices tested at 100K. 4. This parameter not tested post irradiation. Table III - Life Test Endpoint and Delta Parameter (Product is tested in accordance with Table II with the following exceptions) Parameter Subgroups Min Max Min Post Burn In Post Life Test Symbol Max Life Test Delta Full Range Current Zero Scale Current I FR I FR I ZS I ZS μa 5.0 Life Test/Burn-In Information 5.1 HTRB is not applicable for this drawing. 5.2 Burn-in is per MIL-STD-883 Method 1015 test condition B or C. 5.3 Steady state life test is per MIL-STD-883 Method ASD Rev. F Page 5 of 6
6 DAC08 Rev Description of Change Date A Initiate 20-DEC-01 B Update web address Aug. 5, 2003 C Add radiation limits same as SMD Aug. 25, 2003 D Update header/footer & add to 1.0 Scope description. March 3, 2008 E Add Junction Temperature (T J ) C to Absolute Max. Ratings April 2, 2008 F Updated Section 4.0c note to indicated pre-screen temp testing being performed. June Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective companies. Printed in the U.S.A. 06/09 ASD Rev. F Page 6 of 6
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