City University of Hong Kong Course Syllabus. offered by Department of Mechanical and Biomedical Engineering with effect from Semester B in 2015 / 16

Transcription

1 City University of Hong Kong Course Syllabus offered by Department of Mechanical and Biomedical Engineering with effect from Semester B in 2015 / 16 Remarks: This course has two modules and they are offered in two different semesters, namely Summer Term for Module A (MBE4048A) and Semester B for Module B (MBE4048B), respectively. Either Module A or Module B will fulfil the course requirements. Part I Course Overview Course Title: Course Code: Course Duration: Credit Units: Level: Medium of Instruction: Medium of Assessment: Prerequisites : (Course Code and Title) Precursors: (Course Code and Title) Equivalent Courses: (Course Code and Title) Exclusive Courses: (Course Code and Title) Advanced Manufacturing Technologies MBE semester 3 credits B4 English English MEEM2003 (offered until Semester A 2011/12)/MBE2003 Mechanics or MBE2040 Basic Mechanical Engineering Principles or MBE2109 Engineering Mechanics (offered from Semester A 2017/18) and (1) MEEM2034 (offered until Semester A 2011/12)/MBE2034 Engineering Materials and Processing or (2) MBE2110 Engineering Materials (offered from Semester A 2017/18) and MBE3119 Manufacturing Technology (offered from Semester A 2017/18) Nil MEEM4036 Rapid Prototyping Technologies (for module A)/ MEEM4048 Advanced Manufacturing Technologies Nil Note: Students may repeat a course, or an equivalent course, to improve course grade only if the previous course grade obtained is D or below. 1

2 Part II Course Details 1. Abstract (A 150-word description about the course) General Course Aims & Objectives: This course aims to introduce advanced manufacturing technologies that are affecting contemporary design for manufacture (DFM) practices. The syllabus in this course consists of the following two modules. A. 3D Printing and Rapid Prototyping Technologies B. Fundamentals and Applications of Nanotechnology Each module is devoted to a particular class of advanced manufacturing technologies. However, only one module is needed to meet the course requirements. Part II (Other Sections) and Part III Further information for other sections of Part II and all sections of Part III of this syllabus are organized according to the respective module and can be found in the attachments. 2

3 MBE4048 Advanced Manufacturing Technologies (Attachment) Module A 3D Printing and Rapid Prototyping Technologies Part II (A) 1. Course Aims (for Module A): The aims of Module A of this course are to develop an understanding of a class of 3D printing and rapid prototyping (RP) technologies for rapid product development, including reverse engineering, 3D printing and additive manufacturing, and rapid tooling; and an holistic view of various applications of these technologies in relevant fields. Key components to be covered in Module A include CAD issues for 3D printing and rapid prototyping, reverse engineering for model reconstruction from existing physical parts through digitizing and surface fitting, a class of additive manufacturing technologies for 3D printing and physical model prototyping, and rapid tooling for quick batch production. 2. Course Intended Learning Outcomes (CILOs) (CILOs state what the student is expected to be able to do at the end of the course according to a given standard of performance.) No. CILOs 1. Describe various CAD issues for 3D printing and rapid prototyping and related operations for STL model manipulation. 2. Formulate and solve typical problems on reverse engineering for surface reconstruction from physical prototype models through digitizing and spline-based surface fitting. 3. Formulate and solve typical problems on reverse engineering for surface reconstruction from digitized mesh models through topological modelling and subdivision surface fitting. 4. Explain and summarize the principles and key characteristics of additive manufacturing technologies and commonly used 3D printing and additive manufacturing systems. 5. Explain and summarize typical rapid tooling processes for quick batch production of plastic and metal parts. Weighting* (if applicable) Discovery-enriched curriculum related learning outcomes (please tick where appropriate) A1 A2 A3 10% 25% 20% 25% 20% 100% * If weighting is assigned to CILOs, they should add up to 100%. A1: Attitude Develop an attitude of discovery/innovation/creativity, as demonstrated by students possessing a strong sense of curiosity, asking questions actively, challenging assumptions or engaging in inquiry together with teachers. A2: Ability Develop the ability/skill needed to discover/innovate/create, as demonstrated by students possessing 3

4 critical thinking skills to assess ideas, acquiring research skills, synthesizing knowledge across disciplines or applying academic knowledge to self-life problems. A3: Accomplishments Demonstrate accomplishment of discovery/innovation/creativity through producing /constructing creative works/new artefacts, effective solutions to real-life problems or new processes. 3. Teaching and Learning Activities (TLAs) (TLAs designed to facilitate students achievement of the CILOs.) TLA Brief Description CILO No. Hours/week (if applicable) Lecture Lectures covering three major areas on reverse engineering, 3D printing and 2 hrs/week additive manufacturing technologies, Laboratory Work and rapid tooling. Hands-on activities on reverse engineering, 3D printing and additive manufacturing processes, and rapid tooling. 3 hrs/week for 5 weeks 4. Assessment Tasks/Activities (ATs) (ATs are designed to assess how well the students achieve the CILOs.) Assessment CILO No. Weighting* Remarks Tasks/Activities Continuous Assessment: 40% Test/Assignment 20% Laboratory Exercise 20% Examination: 60% (duration: 2 hours) * The weightings should add up to 100%. 100% For a student to pass the course, at least 30% of the maximum mark for the examination should be obtained. 4

5 5. Assessment Rubrics (Grading of student achievements is based on student performance in assessment tasks/activities with the following rubrics.) Assessment Task Criterion Excellent (A+, A, A-) 1. Examination Ability to formulate and solve typical problems on reverse engineering, and to explain key concepts, principles and methods on 3D printing, additive manufacturing technologies and rapid tooling. 2. Test/Assignment Ability to formulate and solve typical problems on reverse engineering, and to explain key concepts and methods on 3D printing and additive manufacturing processes. 3. Laboratory Exercise Familiarization with processes for 3D printing, additive manufacturing and rapid tooling and ability to solve typical problems in reverse engineering using selected digitizing and modelling solutions. Good (B+, B, B-) Adequate (C+, C, C-) Marginal (D) Failure (F) High Significant Moderate Basic Not even reaching High Significant Moderate Basic Not even reaching High Significant Moderate Basic Not even reaching 5

6 Part III Other Information (more details can be provided separately in the teaching plan) 1. Keyword Syllabus (An indication of the key topics of the course.) Fundamentals of 3D printing and rapid prototyping (RP) technologies: various CAD issues for 3D printing and rapid prototyping, CAD and RP interfacing, triangular surface modelling and manipulation for 3D printing and additive manufacturing processes. Reverse engineering: digitizing, laser scanning, CT-scanning, point cloud manipulation, data segmentation, surface reconstruction, model further processing. Spline-based approaches for reverse engineering: various approaches for sample data parametrization, various approaches for knots allocation, spline surface fitting. Subdivision-based approaches for reverse engineering: topological modeling through mesh simplification, direct subdivision surface fitting, parametrization-based subdivision surface fitting. Liquid based processes for 3D printing and additive manufacturing: principles of stereolithography and typical processes, such as the SLA process, solid ground curing and others. Powder based processes for 3D printing and additive manufacturing: principles and typical processes, such as selective laser sintering and some other 3D printing processes. Solid based processes for 3D printing and additive manufacturing: principles and typical processes, such as fused deposition modelling, laminated object modelling and others. Rapid tooling: principles and typical processes for quick batch production of plastic and metal parts through quick tooling. 2. Reading List 2.1 Compulsory Readings (Compulsory readings can include books, book chapters, or journal/magazine articles. There are also collections of e-books, e-journals available from the CityU Library.) 2.2 Additional Readings (Additional references for students to learn to expand their knowledge about the subject.) 1. Joseph J. Beaman, et. al., Solid Freeform Fabrication, Kluwer Academic Publishers, Marshall Burns, Automated Fabrication, Prentice Hall, Englewood Cliffs, NJ, Paul F. Jacobs, Rapid Prototyping & Manufacturing: Fundamentals of Stereolithography, Society of Manufacturing Engineers, Dearborn, Paul F. Jacobs, Stereolithography and other RP&M Technologies: from Rapid Prototyping to Rapid Tooling, Society of Manufacturing Engineers and the Rapid Prototyping Association, New York, Chua Chee Kai and Leong Kah Fai, 3D Printing and Additive Manufacturing - Principles and Applications (with Companion Media Pack), Fourth Edition of Rapid Prototyping, World Scientific Publishing Co., October D.T. Pham and S.S. Dimov, Rapid manufacturing: the Technologies and Applications of Rapid Prototyping and Rapid Tooling, Springer, London, P.K. Venuvinod and Weiyin Ma, Rapid Prototyping Laser-based and Other Technologies, Kluwer Academic Publishings, Boston, T. Wohlers, 3D Printing and Additive Manufacturing State of the Industry, Annual Report, Wohlers Assoicates, Rapid Prototyping Report (monthly publication), CAD/CAM Pub., San Diego, California,

7 MBE4048 Advanced Manufacturing Technologies (Attachment) Module B Fundamentals and Applications of Nanotechnology Part II (B) 1. Course Aims (for Module B): The aim of Module B of this course is to introduce the importance and significance of nanoscience and nanotechnology, advanced electron spectroscopies, laser engineering, and PVD/CVD technology, and to learn the basic knowledge and process of micro-/nanoelectronic systems. This module covers basic concept, general background, principle, and practical knowledge of a modern multidisciplinary subject. The prime intention of this course is to equip undergraduate students in advanced knowledge and skills with focused and in-depth understanding of the nanotechnology and advanced manufacturing systems required for industrial applications. 2. Course Intended Learning Outcomes (CILOs) (CILOs state what the student is expected to be able to do at the end of the course according to a given standard of performance.) No. CILOs 1. Explain the concept, principles and fundamentals in the field of nanoscience and nanotechnology. 2. Explain structural, mechanical and tribological properties of advanced solid materials in nano-scales. 3. Elaborate the basic theory and knowledge for scanning electron microscopy (SEM), transmission electron microscopy (TEM), atomic force microscopy (AFM), nanoindentation, and X-ray diffraction (XRD). 4. Describe nanomaterials technology (CVD/PVD) and explain its working principles: synthesis and development of typical nanomaterials including nanowires, nanotubes, nanorods, nanoparticles, and various solid thin films. 5. Analyze basic principle of laser engineering, describe its technology and applications, and perform processing and applications of advanced electronic microsystems. * If weighting is assigned to CILOs, they should add up to 100%. Weighting* (if applicable) Discovery-enriched curriculum related learning outcomes (please tick where appropriate) A1 A2 A3 30% 20% 20% 15% 15% 100% A1: Attitude Develop an attitude of discovery/innovation/creativity, as demonstrated by students possessing a strong sense of curiosity, asking questions actively, challenging assumptions or engaging in 7

8 inquiry together with teachers. A2: Ability Develop the ability/skill needed to discover/innovate/create, as demonstrated by students possessing critical thinking skills to assess ideas, acquiring research skills, synthesizing knowledge across disciplines or applying academic knowledge to self-life problems. A3: Accomplishments Demonstrate accomplishment of discovery/innovation/creativity through producing /constructing creative works/new artefacts, effective solutions to real-life problems or new processes. 3. Teaching and Learning Activities (TLAs) (TLAs designed to facilitate students achievement of the CILOs.) TLA Brief Description CILO No. Hours/week (if applicable) Lecture Lecturing mainly focused on basic 3 hrs/week background, fundamentals and analytical methods in the field of nanoscience and nanotechnology with various applications to nanostructured materials. Laboratory Work TWO labs (SEM/EDX and AFM/nanoindentation) will be carried out by the students. 3 hrs/week for two weeks 4. Assessment Tasks/Activities (ATs) (ATs are designed to assess how well the students achieve the CILOs.) Assessment CILO No. Weighting* Remarks Tasks/Activities Continuous Assessment: 40% Mid-term Test 20% Laboratory Exercise 20% Examination: 60% (duration: 2 hours) * The weightings should add up to 100%. 100% For a student to pass the course, at least 30% of the maximum mark for the examination should be obtained. 8

9 5. Assessment Rubrics (Grading of student achievements is based on student performance in assessment tasks/activities with the following rubrics.) Assessment Task Criterion Excellent (A+, A, A-) 1. Examination Ability to explain and elaborate the basic concepts, principles and fundamentals in the fields of nanoscience and nanotechnology, nanostructured materials, CVD/PVD technology, and laser engineering. 2. Mid-term Test Ability to describe and elaborate the basic concepts, principles, fundamentals and analytical skills of basic nanoscience and nanotechnology. 3. Laboratory Exercise Familiarization of relevant facilities through two advanced hands-on experiments and an ability to analyse the results. These facilities include scanning electron microscopy, nano-indentation, and atomic force microscopy. Two individual lab reports will be completed and submitted for assessment. Good (B+, B, B-) Adequate (C+, C, C-) Marginal (D) Failure (F) High Significant Moderate Basic Not even reaching High Significant Moderate Basic Not even reaching High Significant Moderate Basic Not even reaching 9

10 Part III Other Information (more details can be provided separately in the teaching plan) 1. Keyword Syllabus (An indication of the key topics of the course.) Nanotechnology Basis: Structure of Manufacturing Materials Atomic Force Microscopy (AFM) and Nano-Indentation Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) Manufacturing Tribology: Adhesion, Wear and Friction Thin Film Deposition (I): Physical Vapor Deposition (PVD) and Sputtering Thin Film Deposition (II): Chemical Vapor Deposition (CVD) Basic Laser Technology (I): Background and Principle Basic Laser Technology (II): Manufacturing Applications Introduction to Advanced Electronic Packaging Processing and Application of Advanced Electronic Packaging 2. Reading List 2.1 Compulsory Readings (Compulsory readings can include books, book chapters, or journal/magazine articles. There are also collections of e-books, e-journals available from the CityU Library.) 2.2 Additional Readings (Additional references for students to learn to expand their knowledge about the subject.) 1. William D. Callister, Materials Science and Engineering: An Introduction, 7 th Edition, John Wiley & Sons, New York, Yip-Wah Chung, Practical Guide to Surface Science and Spectroscopy, Academic Press, San Diego, CA, Donald L. Smith, Thin-Film Deposition: Principles and Practice, McGraw-Hill, Boston, Hornyak G. Louis, Tibbals, H.F., Dutta Joydeep, Fundamentals of Nanotechnology, CRC Press, Boca Raton, Rao R. Tummala, Fundamentals of Microsystems Packaging, McGraw-Hill, New York, 2001, TK F William M. Steen, Laser Material Processing, Springer, New York, 2003, TS183.S73. 10