Silicon Photonics Opportunity, applications & Recent Results
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1 Silicon Photonics Opportunity, applications & Recent Results Dr. Mario Paniccia Intel Fellow Director, Photonics Technology Lab Intel Corporation Purdue University Oct
2 Agenda Motivation & applications History & progress Intel s s Research Program Future work Summary 2
3 Photonics Applications Wireless RF Distribution Chemical Analysis Enterprise Communication PC, Server Interconnects Health Environmental Monitoring Photonics could impact all of these. But today costs are prohibitive. 3
4 Processor History Number of transistors per chip is increasing Intel co-founder G. Moore predicted doubling of transistors approximately every 2 years (Electronic Magazine, 1965) 4
5 Electronics: Economics of Moore s s Law SCALING + WAFER SIZE + HIGH VOLUME = LOWER COST Integration & increased functionality 5
6 Tera-leap to Parallelism: ENERGY-EFFICIENT PERFORMANCE Hyper-Threading Instruction level parallelism Dual Core 10 s to 100 s of cores Quad-Core The days of single-core chips Era of Tera-Scale Computing More performance Using less energy TIME All this compute capability may require high speed optical links 6
7 Future Physical I/O for a Tera-scale Servers Core-Core: Core: On Die Interconnect fabric Memory: Package 3D Stacking Chip-Chip: Chip: Fast Copper FR4 or Flex cables Memory Memory Tb/s of I/O Tera-scale CPU Memory CPU 2 Memory Integrated Tb/s Optical Chip? 7
8 Moving to Interconnects Optical Copper Metro & Long Haul km Chip to Chip 1 50 cm Billions Rack to Rack 1 to 100 m Board to Board cm Millions Volumes Thousands Decreasing Distances Drive optical to high volumes and low costs 8
9 Photonics Evolution? What could Integrated Photonics Deliver? 9
10 Silicon Photonics Motivation & applications History & progress Intel s s Research Program Future work Summary 10
11 The Opportunity of Silicon Photonics Enormous ($ billions) CMOS infrastructure, process learning, and capacity Draft continued investment in Moore s s law Potential to integrate multiple optical devices Micromachining could provide smart packaging Potential to converge computing & communications To benefit from this optical wafers must run alongside existing product. 11
12 Silicon as an Optical Material Intel Litho Photon Energy (ev) Wavelength (µm) eV 1.12µm Comms Window Transparent > ~1.1 μm High index CMOS Compatible Low cost material Low light emission efficiency No electro-optical effect No detection in μm Silicon traditionally NOT optical material of choice 12
13 Si Photonics Recent Progress *This is not exhaustive Pioneering work by Dr. Richard Soref early 1980 s) Integrated APD+TIA UT Inverted Taper NTT, Cornel Raman λ Conv. UCLA Modeled GHz PIN Modulator Surrey, Naples DGADC Surrey PBG WG <25dB/cm IBM Polarization Indep.. Rings Surrey Raman Laser UCLA >GHz MOS Modulator Intel 30GHz Si-Ge Photodetector IBM PBG WG <7dB/cm IBM, FESTA, NTT QCSE in Si Stanford Stim-Emission Brown CW Raman Laser Intel 10Gb/s Modulator Intel, Luxtera 1.5Gb/s Ring Mod. Cornell NTT Hybrid Silicon Laser Intel - UCSB Broadband Amplification Cornell E-O O Effect Strained-Si Si DTU 39GHz Si-Ge Photodetector 10Gb/s SiGe PIN Commercial Univ. Stuttgart Quality PBG WG <3db/cm Intel 40Gb/s Raman Amp & λ Conv. Ring Laser Intel 40Gb/s Modulator Intel 40Gb/s SiGe Wave Guide PIN Intel Device performance making significant advances 13
14 Silicon Photonics Motivation & applications History & progress Intel s s Research Program Future Work Summary 14
15 Intel s s Silicon Photonics Research First: Innovate to prove silicon is a viable optical material 15
16 Intel s s Silicon Photonics Research Continuous Wave Silicon Raman Laser (Feb 05) Electrically Pumped Hybrid Silicon laser (September 2006) 40 Gb/s TODAY 1GHz ( Feb 04) 1GHz 10 Gb/s (Apr (Apr 05) 40 Gb/s (Jul 07) Achieved 40 Gb/s for most devices Next: Focus on integration 16
17 Integration Vision Time Filter ECL Modulator Drivers Multiple Channels First: Prove Silicon good optical material Receiver Chip Integrated in Silicon Photodetectors DEMUX Taper Photodetector CMOS Circuitry TIA TIA Passive Alignment Driver Chip Passive Align FUTURE Monolithic? Lasers MUX Next Integration: silicon devices into hybrid modules Increasing silicon integration over time 17
18 Building Block Research 18
19 Guiding Light with Si Waveguides Ex: Rib waveguide SEM IMAGES Silicon Silicon oxide oxide Proven area for silicon High index = small structures Strip and Photonic crystals for further scaling Splitters, couplers, gratings, AWGs, MMIs have all been demonstrated Continue to reduce size while maintaining performance 19
20 Options for Integrating Light Sources Bonded Hybrid Laser Silicon grating Attached Laser Gold bumps Alignment groove Mirror Hybrid Silicon Laser Bond InP based material to Silicon No alignment Many lasers with one bonding step Amenable to high integration Potentially lowest cost Off-chip laser Off-chip Laser High power laser required Requires fiber attach Non-integrated solution Direct Attached Laser Expensive Tight alignment tolerances Requires gold metal bonding Passive alignment challenges Less Expensive 20
21 Hybrid Silicon Laser Collaboration with UCSB The Indium Phosphide emits the light into the silicon waveguide The silicon acts as laser cavity: Silicon waveguide routes the light End Facets or gratings are reflectors/mirrors Light bounces back and forth and gets amplified by InP based material Laser performance determined by Silicon waveguide No alignment needed 10 s if not 100 s of lasers with ONE bond 21
22 Hybrid Laser Process 1) A waveguide is etched in silicon 2) The Indium phosphide is processed to make it a good light emitter 3) Both materials are exposed to the oxygen plasma to form the glass-glue 4) The two materials are bonded together under low heat 22
23 Hybrid Laser Process 5) The Indium phosphide is etched and electrical contacts are added 6) Photons are emitted from the Indium Phosphide when a voltage is applied 7) The light is coupled into the silicon waveguide which forms the laser cavity. Laser light emanates from the device. 23
24 Hybrid Laser Structure SEM (Scanning Electron Microscope) Photograph 24
25 Silicon Hybrid Laser 1 inch 7 lasers outputting simultaneously 25
26 Direct or External modulation Modulation External used for 10G at ~12km+ Direct Modulation chirp Fiber dispersion Data rate limited External Modulation Fiber Very $$$ No electro-optic effect use free carriers 26
27 Intel s s Second Generation: Silicon Modulator input 1x2 MMI pn phase shifters 2x1 MMI output Metal contact Phase shifter waveguide SEM picture of p-n phase shifter -Based on traveling wave design -Optimized optical & electrical RF 27
28 Recent Results: 40Gb/s Data Transmission 1 Optical Roll-off Normalized Modulator Output (db) ~30 GHz roll-off Frequency (GHz) 40Gb/s Data Transmission Optical 3 db roll off ~30 GHz 28
29 Photodetection Silicon does not absorb IR well Using SiGe to extend to 1.3µm+ Must overcome lattice mismatch Ge Bulk Films of Si and Ge Strained Si 1-x Ge x on Si Relaxed Si 1-x Ge x on Si Si a Ge ~.565 nm a Si ~.543 nm misfit dislocation Misfit dislocations typically create threading dislocations which h degrade device performance - dark current (I( dk ) goes up. Must simultaneously achieve required speed, responsivity, & dark current. 29
30 Waveguide Photodetector Design Top View N-Ge i-ge P-contact P-contact Si Si SiO SiO 2 2 (BOX) Si Si (Substrate) Passivation N-contact Ge Ge Rib Rib waveguide P-contact P-contact SEM Cross-Section SEM Cross-Section 30
31 Experimental Results: 40Gb/s Presented Sept 20 th : Group IV conference Tokyo Japan 3 Normalized response (db) ~ 31 GHz roll-off 1G 1 10G Frequency (GHz) 31 GHz Optical Bandwidth 40 Gb/s Data transmission 95% efficient (up to λ ~1.56um) < 200nA of dark current 31
32 Low Cost Assembly Use passive alignment and lithographically defined silicon micromachining 32
33 Challenge: Packaging Example: Optical Interface Package topside Connection? Monolithic Integration? Unlikely PROCESSOR FIBERS ORGANIC PACKAGE SOCKET FR4 MOTHERBOARD Board connection? Issues: Connector cost, assembly cost, testing, reliability and compatibility with existing electrical packages Multiple approaches. Must balance performance, flexibility and feasibility 33
34 CMOS Intelligence Intel 10 km XENPAK Serializer De-serializer Electronics are needed to control photonics no optical logic Transimpedance & Limiting Amplifiers fo photodetection Drivers for lasers/modulators Also Clock Data Recovery, Serializers/Deserializers,, etc. Laser Driver Control and Monitor Microprocessor Use hybrid attached CMOS electronics. Explore monolithic integration over time 34
35 Integration: Hybrid? Photonics and electronics processed separately 10 Gbps electronics could use < 0.13µm while optics may use older gen. process. Attachment via bumps or wirebonds. Receiver Chip Integration of passive and active silicon devices reduces assembly & cost. Driver Chip External III-Vs: require coupling and alignment (vertical & horizontal) or direct wafer bonding to waveguides. Example hybrid chip Integrated in Silicon Photodetectors DEMUX Taper Passive Align Both monolithic and hybrid chips will need to couple light to the outside world. Lasers MUX Hybrid will offer the best price-performance near term 35
36 Integration: Monolithic? Photonics and electronics processed together on a single wafer Motivations: Performance, e.g. a Photodetector with a Trans-impedance amp Reduced form factor Cost? Filter Photodetector CMOS Circuitry Example monolithic chip ECL TIA TIA Drivers Modulator Passive Alignment Multiple Channels But many challenges for achieving high yield: Tighter thermal budgets, topology, metrology, complexity, etc. Yield issues make monolithic a longer term proposition 36
37 Silicon Photonics Motivation & applications History & progress Intel s s Research Program Future Work Summary 37
38 Where are we going? Optical Fiber Multiplexor 25 modulators at 40Gb/s 25 hybrid lasers An future integrated 1 Tb/s optical link on a single chip 38
39 Integrating into a Tera-scale System This transmitter would be combined with a receiver Rx Tx Which could then be built into an integrated, silicon photonic chip!! 39
40 Integrating into a Tera-scale System This integrated silicon photonic chip could then be integrated into computer boards And this board could be integrated into a Tera- scale system 40
41 Summary Long term, convergence opportunities will be in silicon Silicon photonic device performance advancing at an accelerated pace. Need to continue to push performance (i.e. 40G, 100G ) Next phase of challenges will be with integration. For interconnects, need to optimize electronics & photonics Packaging, power, signaling, and cost will be key If successful volume economics could allow silicon photonics to impact many areas from communications to bio to medicine 41
42 Silicon Photonics Future ECL Modulator Multiple Channels Filter Drivers CMOS Circuitry TIA Passive Alignment TIA Photodetector 42
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