STPS10150CG. High voltage power Schottky rectifier. Main product characteristics. Features and benefits. Description. Order Codes
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1 STPS15C High voltage power Schottky rectifier Main product characteristics I F(AV) V RRM T j V F (max) Features and benefits HIgh junction temperature capability Good trade off between leakage current and forward voltage drop Low leakage current Avalanche capability specified Insulated package TO-22FPAB Insulating voltage = 2 V Typical package capacitance 12 pf Description 2 x 5 A 15 V 175 C.75 V Dual center tap schottky rectifier designed for high frequency Switched Mode Power Supplies. K D 2 PAK STPS15CG Order Codes Part Number STPS15CT STPS15CG STPS15CG-TR STPS15CFP K Marking K TO-22FPAB STPS15CFP K TO-22AB STPS15CT STPS15CT STPS15CG STPS15CG STPS15CFP Table 1. Absolute ratings (limiting values) Symbol Parameter Value Unit V RRM Repetitive peak reverse voltage 15 V I F(RMS) RMS forward voltage A I F(AV) TO-22AB Average forward current D 2 T PAK C = 155 C Per diode 5 δ =.5 TO-22FPAB T C = 145 C Per device A I FSM Surge non repetitive forward current t p = ms sinusoidal 12 A P ARM Repetitive peak avalanche power t p = 1 µs T j = 25 C 3 W T stg Storage temperature range -65 to C T j Maximum operating junction temperature (1) 175 C dv/dt Critical rate of rise of reverse voltage V/µs 1. dptot condition to avoid thermal runaway for a diode on its own heatsink dtj Rth ( j a) June 26 Rev 6 1/9 9
2 Characteristics STPS15C 1 Characteristics Table 2. Thermal resistance Symbol Parameter Value Unit R th(j-c) Junction to case TO-22AB, D 2 PAK 4 Per diode TO-22FPAB 7 TO-22AB, D 2 PAK 2.4 Total TO-22FPAB 5.3 C/W R th(c) Coupling TO-22AB, D 2 PAK.7 TO-22FPAB 3.7 Table 3. When the diodes 1 and 2 are used simultaneously: T j (diode 1) = P(diode 1) x R th(j-l) (Per diode) + P(diode 2) x R th(c) Static electrical characteristics (per diode) Symbol Parameter Tests conditions Min. Typ Max. Unit I R (1) V F (2) Reverse leakage current Forward voltage drop T j = 25 C 2. µa V R = V RRM T j = 125 C.4 2. ma T j = 25 C.92 I F = 5 A T j = 125 C T j = 25 C 1 I F = A T j = 125 C V 1. t p = 5 ms, δ < 2% 2. t p = 38 µs, δ < 2% To evaluate the conduction losses use the following equation: P =.65 x I F(AV) +.2 I F 2 (RMS) Figure 1. Average forward power dissipation versus average forward current (per diode) Figure 2. Average forward current versus ambient temperature (δ =.5, per diode) P F(av) (W) δ =.1 δ =.2 δ =.5 4. δ = δ = T 1..5 I F(av) (A) δ=tp/t tp I F(av) (A) T R th(j-a) =R th(j-c) TO-22FPAB R th(j-a) =15 C/W TO-22AB/D²PAK 1. d=tp/t tp T amb( C) /9
3 STPS15C Characteristics Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature P ARM(t p) P ARM(1µs) 1.1 P ARM(t p) P ARM(25 C) t p(µs) T j( C) Figure 5. Non repetitive surge peak forward current versus overload duration - maximum values, per diode (TO-22AB, D 2 PAK) Figure 6. Non repetitive surge peak forward current versus overload duration - maximum values, per diode (TO-22FPAB) I M(A) Tc=5 C Tc=75 C Tc=125 C IM t δ=.5 t(s) 1E-3 1E-2 1E-1 1E I (A) M T C =5 C T C =75 C T C =125 C IM t(s) t d=.5 1.E-3 1.E-2 1.E-1 1.E+ Figure 7. Relative variation of thermal impedance junction to case versus pulse duration (TO-22AB, D 2 PAK) Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-22FPAB) Zth(j-c)/Rth(j-c) 1. Single pulse TO-22AB D²PAK Zth(j-c)/Rth(j-c) 1. Single pulse TO-22FPAB.1 tp(s).1 1.E-3 1.E-2 1.E-1 1.E+ tp(s). 1.E-3 1.E-2 1.E-1 1.E+ 1.E+1 3/9
4 Characteristics STPS15C Figure 9. Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure. Junction capacitance versus reverse voltage applied (typical values, per diode) 1E+5 1E+4 1E+3 1E+2 1E+1 1E+ I R(µA) Tj=175 C Tj=15 C Tj=125 C Tj=75 C Tj=25 C 1E-1 V R(V) 1E C(pF) F=1 MHz V OSC =3 mv RMS T j =25 C V R(V) 1 Figure 11. Forward voltage drop versus forward current (per diode) Figure 12. Thermal resistance, junction to ambient, versus copper surface under tab - Epoxy printed circuit board, e cu 35 µm (D 2 PAK only) I 1 FM (A) Tj=125 C (Maximum values) Tj=125 C (Typical values) Tj=25 C (Maximum values) V FM(V) R 8 th(j-a) ( C/W) D²PAK S CU(cm²) Figure 13. Thermal resistance, junction to ambient, versus copper surface under tab - Epoxy printed circuit board, e cu 35 µm (TO22FPAB only) R th(j-a) ( C/W) S CU (cm²) TO22FPAB /9
5 STPS15C Package information 2 Package information Epoxy meets UL94, V. Table 4. D 2 PAK Dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A A L2 E C L D B B L3 C C B2 B C R D E G G MIN. FLAT ZONE L L V2 L M R.4 typ..16 typ. V2 8 8 Figure 14. D 2 PAK footprint dimensions (in mm) /9
6 Package information STPS15C Table 5. TO-22AB Dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A C H2 Dia L5 A C L7 D E F L2 F2 F1 L9 L6 D F F G G F G1 G L4 M E H L typ..645 typ. L L L L L M 2.6 typ..2 typ. Diam /9
7 STPS15C Package information Table 6. TO-22FPAB Dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A A H B B D L3 L2 L4 L6 L5 F1 F2 Dia D L7 E F F F G G H L2 16 Typ..63 Typ. L G1 F E L G L L L Dia In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: 7/9
8 Ordering information STPS15C 3 Ordering information Ordering type Marking Package Weight Base qty Delivery mode STPS15CT STPS15CT TO-22AB 2.2 g 5 Tube STPS15CG STPS15CG D 2 PAK 1.48 g 5 Tube STPS15CG-TR STPS15CG D 2 PAK 1.48 g Tape and reel STPS15CFP STPS15CFP TO-22FPAB 2. g 5 Tube 4 Revision history Date Revision Description of Changes Jul-23 5B Last update. 19-Jun-26 6 Reformatted to current standard. Added ECOPACK statement. Added TO22FPAB. 8/9
9 STPS15C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 26 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 9/9
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