uclamp0571p - uclamp3671p
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1 - MicroClamp Description μclamp TS diodes are designed to protect sensitive electronics from damage or latch-up due to EOS, lightning, CDE, and ESD. They feature large cross-sectional area junctions for conducting high transient currents. These devices offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The μclamp xx71p series are in 2-pin SGP16N2 package measuring 1.6 x 1. mm with a nominal height of.7mm. The leads are finished with leadfree NiPdu. They may be used to protect, 8,, 12, 1, 18, 22, 26, and 6 systems. They feature high surge current capability and low clamping voltage making them ideal for use in harsh transient environments. uclamp71p - uclamp671p High-Power μclamp 1-Line Surge Protection Features Transient protection for high-speed data lines to IEC (ESD) k (air), k (contact) IEC (EFT) 4 (/ns) IEC 6-4- (Lightning) 2-8 (8/2μs) Protects one data or power line Low leakage current High peak pulse current capability Operating voltage options:, 8,, 12, 1, 18, 22, 26, 6 Qualified to EC-Q Solid-state silicon-avalanche technology Mechanical Characteristics SGP16N2 package Pb-Free, Halogen Free, ohs/weee Compliant Nominal Dimensions: 1.6 x 1. x.7 mm Lead Finish: NiPdu Marking: Marking code Packaging: Tape and eel pplications Cellular Handsets & ccessories US oltage us attery Protection Digital Lines Proximity Sensors utomotive pplications Nominal Dimensions Schematic SC.7 2 ll Dimensions in mm SGP16N2 (ottom iew) evision 9/2/214 1
2 uclamp71p - uclamp671p bsolute ating ating alue 1 Pulse Power (tp = 8/2μs) P k p Watts ESD per IEC (ir) SD per IEC (Contact) E 2 ESD +/- +/- k Operating Temperature T J -4 to +12 C Storage Temperature T STG to +1 - C Electrical Characteristics (T=2 o C unless otherwise specified) uclamp71p Stand-Off oltage WM P reakdown oltage = 1m I WM =, T=2 C < n tp = 8/2μs 8 oltage C = 4, tp = 8/2μs oltage C = 8, tp = 8/2μs 1 esistance DYN =.2 / n s. =, f = 1MHz Semtech Corporation 2
3 uclamp71p - uclamp671p uclamp871p Stand-Off oltage WM P 8 reakdown oltage = 1m I WM = 8, T=2 C < n tp = 8/2μs 6 oltage C =, tp = 8/2μs oltage C = 6, tp = 8/2μs 1 2 esistance DYN =.2 / n s. =, f = 1MHz 47 uclamp71p Stand-Off oltage WM P reakdown oltage = 1m I WM =, T=2 C < n tp = 8/2μs 6 oltage C =, tp = 8/2μs oltage C = 6, tp = 8/2μs 17 2 esistance DYN =.2 / n s. =, f = 1MHz 214 Semtech Corporation
4 uclamp71p - uclamp671p Electrical Characteristics (T=2 o C unless otherwise specified) uclamp1271p Stand-Off oltage WM P 12 reakdown oltage = 1m I WM = 12, T=2 C < n tp = 8/2μs 4 oltage C =, tp = 8/2μs oltage C = 4, tp = 8/2μs 22 esistance DYN =.2 / n s. =, f = 1MHz 27 uclamp171p Stand-Off oltage WM P 1 reakdown oltage = 1m I WM = 1, T=2 C < n tp = 8/2μs 4 oltage C =, tp = 8/2μs oltage C = 4, tp = 8/2μs 2 4 esistance DYN =.2 / n s. =, f = 1MHz Semtech Corporation 4
5 uclamp71p - uclamp671p uclamp1871p Stand-Off oltage WM P 18 reakdown oltage = 1m I WM = 18, T=2 C < n tp = 8/2μs oltage C =, tp = 8/2μs oltage C =, tp = 8/2μs 28 4 esistance DYN =.2 / n s. =, f = 1MHz 22 uclamp2271p Stand-Off oltage WM P 22 reakdown oltage = 1m I WM = 22, T=2 C < n tp = 8/2μs 2 oltage C =, tp = 8/2μs oltage C = 2, tp = 8/2μs 4 esistance DYN =.2 / n s. =, f = 1MHz Semtech Corporation
6 uclamp71p - uclamp671p Electrical Characteristics (T=2 o C unless otherwise specified) uclamp2671p Stand-Off oltage WM P 26 reakdown oltage = 1m 29 2 I WM = 26, T=2 C < n tp = 8/2μs 2 oltage C =, tp = 8/2μs oltage C = 2, tp = 8/2μs 6 esistance DYN =.2 / n s.1 =, f = 1MHz 1 uclamp671p Stand-Off oltage WM P 6 reakdown oltage = 1m 7 44 I WM = 6, T=2 C < n tp = 8/2μs 18 oltage C = 2, tp = 1.2/μ s oltage C = 18, tp = 8/2μs 48 8 esistance DYN =.2 / n s.29 =, f = 1MHz 1 Notes 1) Pulse Power = c x I (tp = 8/2us) (max) PP (Max) 2)ESD gun return path connected to ESD ground reference plane. )Transmission Line Pulse Test (TLP) Settings: t p = ns, t r =.2ns, I TLP and TLP averaging window: t 1 = 7ns to t 2 = 9ns. 4) resistance calculated from I TLP = 4 to I TLP = Semtech Corporation 6
7 uclamp71p - uclamp671p Characteristics Non-epetitive Pulse Power vs. Pulse Time oltage vs. (tp=8/2us) Pulse Power - P PP (kw) T = 2 O C 2uS 2uS 1 2uS Pulse Duration - tp (µs) Forward oltage vs. (tp=8/2us) oltage - C () uclamp671p uclamp2271p uclamp171p uclamp1271p () TLP Characteristic T = 2 O C Waveform: tp=8x2us uclamp71p uclamp871p uclamp71p oltage - C () T = 2 O C Waveform: tp= 8x2us () TLP Current () Transmission Line Pulse Test (TLP) Settings: tp = ns, tr =.2ns, uclamp71p uclamp871p I TLP and TLP averaging window: uclamp1271p t 1 = 7ns to t 2 = 9ns uclamp71p uclamp171p uclamp2271p oltage () uclamp671p oltage - C () ESD - uclamp71p (+8k Contact per IEC 6-4-2) UC71P_P8_ESD Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun ESD - uclamp71p (-8k Contact per IEC 6-4-2) Semtech Corporation 7 oltage - C () Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun UC71P N8_ESD
8 uclamp71p - uclamp671p Characteristics ESD - uclamp871p (+8k Contact per IEC 6-4-2) 4 ESD - uclamp871p (-8k Contact per IEC 6-4-2) oltage - C () Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun oltage - C () Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun ESD - uclamp71p (+8k Contact per IEC 6-4-2) ESD - uclamp71p (-8k Contact per IEC 6-4-2) 4 oltage - C () 2 Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun oltage - C () Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun ESD - uclamp1271p (+8k Contact per IEC 6-4-2) ESD - uclamp1271p (-8k Contact per IEC 6-4-2) 4 oltage - C () 2 Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun Semtech Corporation 8 oltage - C () Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun
9 uclamp71p - uclamp671p Characteristics ESD - uclamp171p (+8k Contact per IEC 6-4-2) 6 ESD - uclamp171p (-8k Contact per IEC 6-4-2) oltage - C () 4 2 Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun oltage - C () Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun ESD - uclamp1871p (+8k Contact per IEC 6-4-2) ESD - uclamp1871p (-8k Contact per IEC 6-4-2) 6 oltage - C () 4 2 Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun oltage - C () Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun ESD - uclamp2271p (+8k Contact per IEC 6-4-2) ESD - uclamp2271p (-8k Contact per IEC 6-4-2) oltage - C () Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun Semtech Corporation 9 oltage - C () Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun
10 uclamp71p - uclamp671p Characteristics ESD - uclamp2671p (+8k Contact per IEC 6-4-2) 8 ESD - uclamp2671p (-8k Contact per IEC 6-4-2) 7 6 oltage - C () 4 2 Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun oltage - C () Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun ESD - uclamp671p (+8k Contact per IEC 6-4-2) ESD - uclamp671p (-8k Contact per IEC 6-4-2) oltage - C () Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun oltage - C () Measured with Ohm scope input for Ohm, 2d attenuator. ESD gun Semtech Corporation
11 uclamp71p - uclamp671p pplications Information ssembly Guidelines The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech s recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. Stencil Opening Land Pad ( Follow drawing ) 1.6 ssembly ecommendation.7 Solder Stencil Design perture shape Laser cut, Electro-polished ectangular with rounded corners S older Stencil Thickness.12 mm (.") Solder Paste Type Type size sphere or smaller Solder eflow Profile Per JEDEC J-STD-2 PC Solder Pad Design Non-Solder mask defined ll Dimensions are in mm. Land Pad. Stencil opening Component ecommended Mounting Pattern PC Pad Finish OSP O Niu 214 Semtech Corporation 11
12 uclamp71p - uclamp671p Outline Drawing - SGP16N2 D TOP IEW E DIMENSIONS DIM MILLIMETES MIN NOM MX b..4.4 D E e L.8 1. SC.9.9 N 2 aaa.8 bbb. aaa C C SETING PLNE 1 D/ E/2 LxN. Pin 1 ID e/2 bxn bbb C e OTTOM IEW NOTES: 1. CONTOLLING DIMENSIONS E IN MILLIMETES (NGLES IN DEGEES ). Land Pattern - SGP16N2 DIMENSIONS (C) G Y Z DIM MILLIMETES C (1.22) G.6 X 1. Y.62 Z 1.8 X NOTES: CONTOLLING DIMENSIONS E IN MILLIMETES (NGLES IN DEGEES). THIS LND PTTEN IS FO EFEENCE PUPOSES ONLY. CONSULT YOU MNUFCTUING GOUP TO ENSUE YOU COMPNY'S MNUFCTUING GUIDELINES E MET. 214 Semtech Corporation 12
13 uclamp71p - uclamp671p Example Device Marking Ordering Information Part Number Marking Code Working oltage Qty per eel uclamp71p.tnt 6, 6 uclamp871p.tnt 11 8, uclamp71p.tnt 12, uclamp1271p.tnt 16 12, uclamp171p.tnt 18 1, Notes: 1) Marking includes marking code, pin 1 bar, and 2x matrix date code uclamp1871p.tnt 24 18, uclamp2271p.tnt 26 22, uclamp2671p.tnt 26, uclamp671p.tnt 7 6, Notes: MicroClamp, uclamp and μclamp are trademarks of Semtech Corporation 214 Semtech Corporation 1
14 uclamp71p - uclamp671p Carrier Tape Specification Note: ll dimensions in mm unless otherwise specified PIN 1 Location (Towards Sprocket Holes) Device Orientation in Tape Contact Information Semtech Corporation Protection Products Division 2 Flynn d., Camarillo, C 912 Phone: (8) FX (8) Semtech Corporation 14
15 Mouser Electronics uthorized Distributor Click to iew Pricing, Inventory, Delivery & Lifecycle Information: Semtech: UCLMP71P.TNT UCLMP71P.TNT UCLMP1871P.TNT UCLMP871P.TNT UCLMP1271P.TNT UCLMP671P.TNT UCLMP2671P.TNT UCLMP2271P.TNT UCLMP171P.TNT
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