DELAWARE DIAMOND KNIVES

Transcription

1 DELAWARE DIAMOND KNIVES PHASE 4 REPORT December 10, 2010 By Jeff LeBlanc, Nnamdi Ibeka, David Kim, and Matthew Lindemer

2 Table of Contents Updated Project Scope... 3 New Project Information... 3 Prototype Fabrication... 6 Subsystem A: Shaft Collar... 6 Subsystem B: Lead Screws... 6 Subsystem C: Guide Rails... 7 Subsystem D: Digital Indicator and Laser Mount... 7 Subsystem E: Leg Supports... 8 Testing Results & Analysis... 8 Broad Measurement Range (Area)... 8 Broad Measurement Range (Thickness) Measurement Accuracy Assembly Time Mobility Finite Element Analysis Future Process Design Changes Chemical Mechanical Grinding Path Forward Appendix A: Cost Analysis Appendix B: Design Specification Appendix C: Gantt Chart Appendix D: Design Package... 24

3 Updated Project Scope The purpose of this project is to design and manufacture a measuring device that is sensitive enough to precisely measure the thickness of diamond slabs manufactured by Delaware Diamond Knives within an accuracy of 1 micron. The current measurement tools used by Delaware Diamond Knives require the diamond specimens to be removed from their apparatuses which consequently results in measurement inaccuracy due to bow, glue-line thickness, and taper. To combat this issue the new measuring device will be designed to measure the diamond wafers while they remain in their respective positions on the grinding apparatus. New Project Information Since the end of Phase 3, there have been design changes to the grinding arm. The assembled grinding head has been changed from a stationary head to a head that swivels in place. This design has added some difficulty and variables into our Final Concept Design. Since the head of the grinding arm now has the ability to swivel, our Final Concept Design had to attach to the shaft of the head, because the surrounding parts have become moving parts. Also there were new clearance heights around the shaft and the overall dimensions have changed slightly. Updated Design Changes 90 Joining Plate Figure 1: New Rail System Design After our Phase 3 presentation with our sponsor, we found a design flaw in our rail system. The Phase 3 Design Package had assembled our rails using pin connections (connection locations circled in Figure 1). These pin connections would cause our rail system to become a parallelogram over time, because the pin would allow for two degrees of freedom. Our new design uses 90 Joining Plates, which we modeled from any common bridge or truss connection that sustains loading over time. This new connection will provide a more rigid structure and perform better over time than pins would have.

4 Knurled Knob Figure 2: Additional Design to Acme Screw Another design change that was made since Phase 3 is the addition of knobs [Figure 2] to the end of our Acme Screws. It is difficult to turn the Acme Screws by hand in the prototype, because of the small diameter rod, the grease added to provide extra lubrication to the flange, and the fine thread. The knobs have a knurled radius that provide extra grip when working with the prototype. Another reason why the knobs were knurled is because the employee s at DDK are constantly working with machinery and mechanical devices, so they often have grease on their hands. The knob s will improve our ease of use metric and provide better ability to make fine adjustments. Figure 3: Battery Pack Assembly One of our original metrics from Phase 2 was to use a battery operated laser. However, the manufacturer did not specify if the Voltage to our Laser Level was DC or AC, so we waited till we received the laser before we made our battery pack. The battery back includes 3AA battery in series, which are wired to an operating switch, which allows the operator to turn the laser on and off [Figure 3]. This battery pack improves the mobility metric and the ease of use metric. It improves the mobility metric, because the prototype is no longer limited to operational use near an electrical power source. Also, the ease of use metric is improved, because a switch operated laser will be easier to operate than plugging and unplugging the laser for operational use.

5 Reference Plane Figure 4: New Reference Plane Figure 5: Notched Copper Face Plate During our sponsor discussion after Phase 3, we re-examined any ways to simplify the fabrication process of the reference plane. In inspection of the copper face plates [Figure 4] we found that they were purposely notched to prevent the face plate from rotating in place. The design change we decided to make was to use this notched piece of the copper faceplate and extended our reference plane from this point [Figure 5]. In Phase 3, our design package included a drawing to lathe down the head of the Grinding Arm then insert a plane that would extended in the radial direction beyond the copper faceplate. The new reference plane required less machining, taking advantage of an existing feature, and a smaller amount of material added to the Grinding Head. The smaller amount of material will reduce the risk of changing the performance of the Grinding Head and also improve the metric of ease of use. The shaft collar will be assembled easier with the new reference plane, because it does not restrict some on the clearance problems that occurred with the Phase 3 design. Pinion Rack Set Screw Figure 6: Rack and Pinion Provides Track Movement Figure 7: New Digital Indicator Mount In Phase 3, our design to mount the Digital Indicator to the L-Bracket was done by using the provided hole pattern that was on the back of the Indicator. This design did not allow for any fine adjustments

6 because in order to bring the Indicator closer or further away from the diamond film, all the lead screws would have to be adjusted. The new design uses a Rack and Pinion Gear System [Figure 6], where the black knob turns the pinion and translates the motion of the rack, the Indicator, along the distance of the rack. This mounting plate also has set screws, seen in [Figure 7] which provides a locking mechanism to ensure that the Indicator does not freely move. Prototype Fabrication The main components, including guide rails, acme screws, ball joints, flanges, leveling feet, digital indicator, and laser, were purchased. Our design team fabricated the remaining parts. The design was modified in order to simplify machining. All of fabrication and assembly was performed in the Delaware Diamond Knives machine shop. Aluminum sheets were the main fabrication material. The total cost of aluminum stock was $ Subsystem A: Shaft Collar Figure 8: Shaft Collar The Shaft Collar components were milled by a CNC Router, including the hole pattern seen in [Figure 8]. The center arcs in the collar were milled to a radius of 1.35 inches. The three larger holes were milled by the router to a diameter of 0.5 inches, which is the clearance hole size for the flange nuts of the acme screws. The hole pattern around the three holes match the flange hole pattern for the acme screws. These holes were tapped using ¼-20 taper tap then the bottom piece was tapped using 5-40 taps and then deburred. Subsystem B: Lead Screws Most of parts of this subsystem were purchased, but some modification was required. The acme screw was cut using a hack saw to acquire the needed length. Also, since the ball joint thread angle is different from the thread angle of the acme screw, the ball joint threads were bored out with a lathe machine and the acme screws were connected to them using an epoxy. [Figure 9]. Figure9: Lead Screw

7 Subsystem C: Guide Rails Three kinds of brackets used in this assembly, two of the bracket connecting carts and the crossing guide rail, four joining plates, and three brackets connecting the guide rails and ball joints. Two alignment rods were machined on the milling machine for the supporting frame of the rail system. The lip was also fabricated to attach to one of alignment rod. The main caution on this subsystem was keeping the side guide rails parallel to each other. In order to keep the side guide rail parallel, a slip hole feature was machined on the Figure 10: Guide Rail System alignment rods so that the rails could be adjusted on the assembly to make them parallel. After attaching the 90⁰ joining plates with the alignment rods, guide rails were placed on to the opposite side of the joining plates as seen in [Figure 10] using the holes on the guide rails as a clearance hole, punched on the joining plates and tapped using #5-40 taper tap. The cart bracket was tapped with M3 size tap to attach on the carts following the dimensions provided by THK, the guide rail manufacturer. Finally, to mount the crossing guide rail on top of it, the holes were tapped using #5-40 taps. Subsystem D: Digital Indicator and Laser Mount Figure 11: L-bracket with Micrometer and Laser Figure 12: Battery Pack The L-bracket was fabricated to mount digital indicator and laser on opposite sides of each other as seen in [Figure 11]. This bracket was also machined on the milling machine with.125 inch thick aluminum sheet. The battery casing was also modified on the milling machine to allow for the appropriate cavities for both the wires and switch, which increased the overall mobility of the prototype instead of using a power cord. [Figure 12]

8 Subsystem E: Leg Supports Bases of the legs and blocks, which sit on at the end of the rods, were fabricated on the milling machine with aluminum stock, which came from the sponsor s general inventory. The angle at one of corner was cut at 45⁰ to meet the shaft alignment rod lip at its flat surface. The length of all four threaded rods were modified using a hack saw, as shown in [Figure 13]. Figure 13: Leg Supports Testing Results & Analysis Broad Measurement Range (Area) Purpose of This Test: The purpose of this test is to prove our measurement area metric. The metric states that the prototype must have the ability to measure a circular area with the diameter of 50mm or 2 inches. Method: Center the Digital Indicator in the center of the Linear Guide Rail System. Then move the Digital Indicator to the furthest position in the X and Y direction. The Laser Leveling System was not attached beneath the Indicator for this test, but the height and size of the laser was taken into account when taking measurement. All measurements were taken using high accuracy calipers. The measurement was completed by measuring from the outer most radius of the shaft collar to the tip on the Digital Indicator. Since we know that the radius of the Shaft Collar was fabricated with a radius of 1.35inches. So the radius of the Shaft Collar was subtracted from each measurement, which would ensure that we would be taking our measurement from the center of the collar. Figure 14.1: Centering the Digital Indicator within the Rail System

9 Figure 14.2: Indicator to the bottom Y position Figure 4.3: Indicator to the right X position Figure 14.4: Indicator to the left X position Figure14.5: Indicator to the top Y position

10 Test Results: 2.45 (Top Y Position) Y 1.35 Radius (Shaft Collar) 2.55 (Left X Position) X 2.35 (Right X Position) 1.05 (Bottom Y Position) Data Analysis: Every data point measured must be beyond the radius of 25mm or 1 inch, which shows that the Indicator can measure on a diameter of 50 mm or 2 inches. The top Y position, right X position, left X position show that the Indicator satisfies the 50mm requirement and has enough freedom of movement to go farther than the diamond and reach the reference plane. However, the bottom Y position can only reach a radius of 1.05 inches or 27mm, this satisfies the 25mm radius requirement, but does not allow the Indicator to reach the reference plane in the lower Y region of the measuring area. In conclusion, the prototype satisfies the measurement area requirement. In addition to the measurement area requirement, the data taken shows that the reference plane can only be found in the upper Y region of the measuring area because the laser mount below the Indicator allows for less clearance at the bottom position than the top position. Broad Measurement Range (Thickness) Purpose of Test: The purpose of this test is to prove the metric for thickness measurement range of the prototype. The metric states that the prototype must measure a range of 5µm to 2mm. Method: The way this tested was using known thickness values of materials then testing them by first leveling the Indicator. Then providing a measuring surface, aluminum plate, and zeroing the Indicator in this position. Then measuring two materials with known thickness and analyze the results.

11 Figure 15.1: Zeroing Indicator on Aluminum Figure 5.2: Measuring Thin Piece of Paper Figure 16: Gold Colored Diamond Film Figure 17: Measuring Diamond Film Test Results: The first item used for testing was a sheet of paper with a known thickness of 50µm or 0.050mm, this paper was then replaced with a paper of known thickness of 49µm or 0.049mm. This shows that the prototype is able to measure a thickness change of 1µm. Our next item that we measured was a gold diamond film backed by a silicon wafer with the thickness of 3.944mm or 3944µm. This item matches our metric requirement because the film thickness of this silicon wafer is 1.944mm thick and the silicon wafer backing it has a thickness of 2mm. So this wafer represents the maximum testing range for the prototype.

12 Data Analysis: This test shows that the prototype satisfies the thickness range requirement of 5µm to 2mm diamond film. This accuracy can be due to the high tolerance Digital Indicator and also the fine tip that was special ordered from Mahr. This special tip has a diameter of.040 inches or 40 thousands of an inch. However, this small tip also showed how sensitive the Indicator was to small amounts of movement. The combination of the high accuracy Indicator and needle point tip show that operational use of the Indicator will have to be very precise because of the sensitivity. Measurement Accuracy Purpose of Test: The purpose of this test is to prove the metric accuracy of the prototype. The metric states that the prototype must have an accuracy of 1µm. Method: The measurement accuracy and repeatability were tested by taking a displacement measurement from the set reference plane to the top surface of the diamond film wafer each time the prototype was attached to the grinding arm, a total of 12 times. Before taking the measurements specific steps were taken to ensure the measurement readings would be as accurate as possible. Using the three lead screws and the alignment laser, the plane of the prototype was finely adjusted until a parallel was achieved between the plane of prototype and the face of the diamond film. Observing when the center point of the cross-hair laser beam shined directly back into its orifice served as an indicator for when parallel planes were achieved. The results from the measurements are shown in [Table 1] Figure 18: Measuring Data Point Figure 6: Reference Plane with Diamond Film

13 Test Results: Table 1: Displacement Data Trial # Wafer Displacement (mm) MEAN MODE ST. DEV Data Analysis: Based on the data obtained from the measurement trials the measurement prototype was accurate within +/- 5 microns. According to the metric set in the project scope of +/- 1 micron for measurement accuracy, the accuracy of the measurement prototype missed the set metric by 4 microns. Due to this shortcoming an analysis of sources of error were done. After some timely observation the project team identified a few sources of error that could generate such a small discrepancy. Imperfections in part fabrication could be a viable source of error and also vigorous vibrations generated from surrounding machinery also would cause a variance in the accuracy of the prototype. It is also possible that the parallel positioning set during the measurement processes are not always 100% perfect and in that case the accuracy of the device would be offset. Vibrations were considered to be the most underlining cause of in accuracy. Based on these observations the accuracy achieved was deemed acceptable given that it still improves upon the current accuracy of DDK s measuring process. Assembly Time Purpose of Test: The purpose of this test is to test the prototypes assembly time metric. This metric has been adjusted since Phase 2, because of new information gathered about the current process. Currently it takes 15 minutes to remove the wafer, dissolve the adhesive backing, then measure and reapply the

14 wafer to the grinding arm. The target metric is to have the prototype assemble for 12 minutes to outperform the current solution Method: The processing time was tested by measuring time durations during two stages of the diamond film measuring process. The stages observed during the test were the time it takes to attach the measurement device to the grinding arm and the time it takes to disassemble and remove the device from the grinding arm. The test was done in a total 12 trials, each member of the project team completed three trials each. Several people completed multiple time trials in order to generate realistic variances in assembly times, being that many employees at DDK will use the prototype and the assembly and disassembly time will vary from person to person. The data in [Table 2] depicts the recorded times for each of the 12 trials. Figure 20: Assembly the Prototype Figure 7: Prototype Fully Assembled Test Results: Table2: Assembly Data Trial # Mount Time (sec) Dismount Time (sec) Average Time Approx. 4 minutes 7 seconds Approx. 3 minutes 48 seconds

15 Data Analysis: Based upon the information obtained from DDK machinist, Bill Tabeling, the original preparation time needed to get the diamond wafer to be measured was approximately 15 minutes. This process included removing the wafer from the grinding apparatus, soaking it in a solution to soften and dissolve the adhesive, and cleaning the adhesive from the surface completely. Based on the time it originally took to prepare the wafer for measurement, an acceptable goal for set up and breakdown time for assembly time was set at simply achieving a time shorter than the original time it took to prepare the wafer for measurement. As shown in the data table the average set-up and breakdown time for the measurement prototype was approximately 8 minutes, which nearly cuts the time in half from the original preparation time. Based on the given data the assembly time for the prototype is considered acceptable. Mobility Purpose of Test: The purpose of this test is to analyze the mobility metric of the prototype. The metric states that the prototype must weigh less than 5lbs. Method: This test was conducted by weighing the subsystems of the prototype on a packaging scale provided by the sponsor. After all the subsystems have been weighed, the combined weight will be added together. Figure 22: Weighing Indicator Figure 8: Weighting Guide Rails with Acme Screws Test Results: The weight of the prototype in full assembly was measured to be 4.5 pounds. Data Analysis: The components that comprise what is considered to be the full assembly are as follows: shaft collar, acme screws (with nuts and flanges), guide rail assembly with carts, digital indictor with an adjustable mount, alignment laser, a series of brackets used throughout out the assembly, as well as a variety of screws used to assemble the prototype. The leg supports were not include in the weighing process during the mobility testing due to the fact they are handled separately when installing the main measurement device to the grinding arm. As shown by the previously stated results, the weight of the prototype is within the set weight constraints and therefore meets the mobility requirements.

16 Finite Element Analysis Purpose of Test: The purpose of this test is to analyze the durability and the amount of deflection that occurs when the acme screws are loaded differently in potential situations Method: Using SolidWorks and SimulationXpress, a model of the Acme Screw, with the material property of Stainless Steel, was loaded in compression and in a bending moment. Bending Moment on Acme Screw Figure 24: SolidWorks Model of Acme Screw, ¼ inch Diameter, 5 inches Long Figure 25: Fixing Bottom of Screw to Create Screw in Shaft Collar

17 Deflection (mm) Figure 26: Compression Force on top of Screw Simulating Loading from Rails Figure 27: Compression Loading Results from SimulationXpress Table3 Load vs. Max Deflection Load (lbf) Maximum Deflection (mm) E E E E E E E E E E E E E E E E E E E E E E E E E E E E E-04 Chart 1: Acme Screw in Compression Acme Screws in Compression Loading 0.00E Load (lbf) Data Analysis: This testing shows that the screw can be loaded in compression up to 10 lbf, which would be over the realistic loading limit, and still show no significant deflection. The maximum deflections occur in the top of the screw, 8.88x10^-4 mm, where the acme screw would be loaded in compression by the ball joint on the rail system.

18 Deflection (mm) Figure 28: Force Location to Create Bending Moment Figure 29: Resulting Bending Moment of 1 lbf Table 4: Load vs. Deflection Chart 2: Bending Moment on Acme Screw Load (lbf) Maximum Deflection (mm) E E E E E E E E E E E E E E E E E E E E E E E E-01 Bending Moment on Acme Screw 0.00E Bending Moment (lbf) Data Analysis: The deflection in the screw is the largest at the location of the bending moment. The maximum deflection that was seen is 2.12 mm. This is more than expected, but the prototype should never experience a bending moment of 10 lbf. This also shows that the rod is still in the elastic region and has some flexibility. This flexibility will help keep the screw from translating more force into the shaft collar. It is a concern if the acme screw is too flexible because it possibly become permanently deformed.

19 Maximum Deflection (mm) Bending Moment on Shaft Collar Figure 30: Resultant Deformation Diagram Figure 31: Fixed Shaft Collar Center with Bending Moment Table 5: Load vs. Deflection Load (lbf) Maximum Deflection (mm) E E E E E E E E E E E E E E E E E E E-03 Chart 3: Bending Moment on Shaft Collar Bending Moment on Shaft Collar 3.00E E E E E E E Load (lbf)

20 Data Analysis: This data shows the possible deformation of the Shaft Collar design. The reason why we would want to reduce the deformation in the Shaft Collar is because it could possible move the hole locations. The largest amount of deflection is 2.78E-03 mm, which is not a significant amount of deflection. Therefore, we are convinced under the loading conditions of the prototype there will be no significant deformation causing the prototype to lose any performance metrics. Further Design Development After analyzing the overall design of the measurement prototype there are a few changes that could be made in the future to improve the quality, versatility, and ease of use of the device. In the future DDK will look to upgrade the mounting collar s latching mechanism from screws to toggle clamps. This change will make it easier to fasten the collar to the grinding shaft and will therefore cut down the time it takes to mount and dismount the device to and from the grinding arm substantially. Further feasible design developments also include implementing set screws in the shaft collar which would be used to adjust the diameter of the collar. Such development would make it possible for the measurement device to be adaptable to new grinding mechanisms that DDK will design and fabricate in the future as well as other grinding stations that were not included in the scope of this project. Using set screws would undoubtedly increase the overall adaptability of the prototype. Future Process Design Changes Though fabricating a device that allows one to measure the thickness of diamond wafers while they remain on the grinding arm improves the accuracy and efficiency of the grinding process, it is imperative to recognize that the accuracy in measurement also depends greatly on the efficiency of the grinding process itself. With the implication of that notion, it has been determined that there are more efficient ways to grind CVD diamond films in opposition to the process chosen by Delaware Diamond Knives, such as, Chemical-Mechanical Planarization. Chemical Mechanical Grinding Chemical Mechanical Planarization (CMP) defined as a process of smoothing surfaces by means of both chemical and mechanical forces. This method of surface grinding/finishing can be used to remove topography from silicon oxide, metals, and polysilicon surfaces. The mechanical process currently used by DDK has a much higher surface damage rate when compared to CMP. The process of grinding by method of CMP uses abrasive and corrosive chemical slurry, most likely a colloid, combined with a polishing pad and a retaining ring as shown in [Figure 32]. Also notable, CMP is capable of grinding surface down to Angstrom levels. Figure 32: CMP Diagram:

21 By implementing this grinding process in place of their current fully mechanical grinding process DDK would greatly improve the quality of the diamond films they polish. The faces of the diamond films would definitely be more even and the rate at which films are cracked and damaged during the actual grinding process would decrease greatly. Being that reducing the risk of damage to the diamond film was an essential aspect of the project scope, it would be feasible to propose that DDK look into optimizing their grinding process in the future. Path Forward In order to move our design into a fully working item for all grinding devices a few steps to need be taken. The final design is completed, but to fully implement our design to all of DDK s grinding machines new shaft collars and alignment rods would need to be fabricated to fit grinding machines of different configurations. The manufacturing process is similar to the one used previous. The only differences are the center arc radius of the shaft collar and the distance between the holes that the acme screws come out of. The additional design development as noted previously also includes, toggle clamps and implementing set screws into shaft collar. Finally, the measurement process requires training workers to calculate exact thicknesses from the measured displacement as well as the mounting and dismounting process.

22 Appendix A: Cost Analysis After looking at the materials and parts costs it is determined that a budget of $2000 would be sufficient to complete the prototype. The table below is the complete list of all of parts that were purchased. The two most cost intensive of part were Micrometer and Laser Level. Other purchased products were comparatively small. Some aluminum materials, acme screw handle, and battery pack were provided by Sponsor DDK. The final design cost was about $1,600 which is significantly less than the initial target value of $9,000. Delaware Diamond Knives costs $3,000-$10,000 to grow diamond film on the wafer and have 5% chance of breaking the diamond film while taking on and off from the grinding arm. The use of our design will save at least $1,400 on first month and save same amount money as loss by breaking the diamond film from next month. Over a year, the benefit will be $31,400 at least and $184,000 at most. Purchased Parts: Table6: Purchase Sheet QTY Part Brand Price Quote Order/ Item # (each) 1 Micrometer Mahr XLI $ Mounting Bracket Mahr AT Tip Mahr PT Linear Guide Rail (Cross Section) THK RSR12ZM $ Material Stock McMaster-Carr 9246K13 $ Material Stock McMaster-Carr 8973K43 $ Threaded Rod (Acme) Roton Industries $ Lead Screw Nut Roton Industries $ Lead Screw Flange Roton Industries $ Ball Joint Mid-West Control FMIL250C $ Laser Level Cole-Parmer EW $289 1 Laser Battery Sears UPG 5.00v Lithi $ Leveling Foot 80/20 Inc Rod Ends McMaster-Carr 95475A576 $ Material Stock McMaster-Carr 9135K261 $ Inch Standard Screws McMaster-Carr 91251A080 $ Inch Standard Screws McMaster-Carr 91251A126 $ Inch Standard Screws McMaster-Carr 90128A245 $ Metric Standard Screws McMaster-Carr 91290A113 $ Inch Standard Screws McMaster-Carr 91251A125 $8.44 TOTAL: $1,601.31

23 Future Cost The prototype which was built is only for one type of the grinding machine. The shaft collar and guide rail system including the alignment rod and the corner bracket will be machined for another grinding machine. Also, changes of the laser will increase accuracy of the leveling the system. Table6: Estimated Future Cost Part Price Material Stock $200 Laser $300 Total $500 Appendix B: Design Specification Final Design Details How the Design Works The mathematical theory behind the design is very simple. Our idea for the design was to use a Digital Indicator to measure the change in thickness of the diamond films. Our sponsor gave us a list of assumptions to base our design around. These assumptions include: 1. While the Diamond Film is grown onto the Silicon Wafer during the Chemical Vapor Deposition process in the High Pressure Microwave Plasma Reactor, the Silicon Wafer will not have any thickness etched away and will remain at 1/8 thickness. 2. The current Micrometer at DDK s facility has the ability to map the thickness profile of the Diamond Film after the Diamond is grown onto the Silicon and before the Silicon and Diamond Wafer is placed onto the Grinding Arm. Thus the sponsors current solution with give us an initial thickness profile for the Diamond. 3. The Diamond Film backed with the Silicon Wafer is placed onto the Grinding Arm using a light adhesive. This adhesive is a paste material that is applied by hand, and does not have a uniform thickness profile. Also the lightweight strength of this adhesive cause the diamond to spin in place while it is being grinded because the wheel with physically spin the Diamond and the adhesive does not stop the diamond from rotating. The first things to be done to begin is put the shaft collar over the shaft, and secure the bottom of the collar using ¼-20 screws to pull the collar tight to the shaft. Then level a diamond film measurement is to ensure that the frame of our design and the Digital Indicator is square with the Diamond Film. To do this we will use our laser leveling system, which is backed by the Digital Indicator to ensure we are parallel with the Indicator. Then we will use the three lead screws to make fine adjustments in the angle of the frame. The theory behind this leveling system is that you need three points to create a plane; therefore we need three adjustments to ensure that the digital indicator is on a square plane with the diamond. The purpose of the Digital Indicator is to use the New Surface (which will be added using the lathe), as a reference point that will be permanent. If we directly attach a surface to the shaft of the Grinding Head, we know that it will be an unchanging reference point and square to the diamond.

24 The Digital Indicator will measure the distance to the New Surface, and Zero that position. This will be done every time before a measurement is taken. The Digital Indicator will map the height of the diamond film, using the same mapping technique the sponsor uses, and this will be a measurement of the initial height. So after the initial height around the diamond is mapped. The structure will be reattached, leveled, and zeroed. Then the Diamond Film with be mapped again, and the change in height around the Diamond Film will be the resulting thickness change in the Film. Since the initial thickness of the Film is known, we can calculate what the current thickness of the diamond. Appendix C: Gantt Chart The project schedule will be uploaded onto Sakai File Name: Updated Gantt Chart Phase 4_Appendix C Appendix D: Design Package Bill of Materials Table 7: Bill of Materials DWG NO. PART NAME PART NUMBER DESCRIPTION QTY. 1 Lead Screw ¼ -20 Diameter 3 2 Lead Nut Bronze Nut 3 3 Ball Joint FMIL250C ¼ Flange Cart 1 RSR12ZM 3 6 Rail 220mm RSR12ZM 1 7 Alignment Rod 1 8 Alignment Rod with Lip 1 9 Rail 160mm RSR12ZM 2 10 Cart Bracket 2 11 Bracket for Block 2 12 Shaft Collar Shaft Collar Leveling feet 2515T Leg to Collar Shaft 2 16 Leg to Guide Rail 2 17 Base of the Leg 2 18 L-Bracket 1 19 Laser LTM2HKD 1

25 20 Standard Screw 90128A242 ¼ -20 1/2" length 1 21 Standard Screw 91251A173 # /4" length 22 Bracket to Cart 92196A459 # A459, 1/4" Length 23 Standard Screw, 91251A096 # A096 1/2" Length 24 Set Screw 91375A A124 #5-401/4" Length 1 25 Micrometer XLI Digital-1 Stroke 1 Part List Figure 1: Fully Assembled Prototype with Numbers Referencing Bill of Materials in previous page

26 Full Assembly Drawing Figure 2: Assembly Drawing with instructions

27 Sub Assembly Drawings Sub Assembly Drawing #1: Lead Screw Figure 3: Sub Assembly Drawing #1: Lead Screw

28 Sub Assembly Drawing #2: Guide Rail System Figure 4: Sub Assembly Drawing #2 for Guide Rail System

29 Sub Assembly Drawing #3: Collar Shaft

30 Sub Assembly Drawings #4: Support Legs

31 Part Drawings Parts in Sub Assembly #1

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35 Parts in Sub Assembly #2

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42 Parts in Sub Assembly #3

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44 Parts in Sub Assembly #4

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48 Remaining Parts

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