Technical Data TD. X-Ray FLAT PANEL IMAGER FDX3543RP FEATURING: Active Area: 35(H) 43(V)cm (14 17 ) Excellent Sensitivity & Resolution

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1 Technical Data TD X-Ray FLAT PANEL IMAGER FDX3543RP FEATURING: Active Area: 35(H) 43(V)cm (14 17 ) Excellent Sensitivity & Resolution Excellent Image Quality Excellent Reliability Excellent Sensitivity & Resolution Toshiba s advanced and proven fine structured CsI:Tl and direct vapor deposition technology deliver higher sensitivity and better resolution. Reflection coating on CsI:Tl screen enables excellent Detective Quantum Efficiency (DQE) and low noise. A high Modulation Transfer Function (MTF) FPD is the result of these outstanding technologies diagnostic images, while delivering the benefits of lower radiation dose to the patient. The FDX3543RP achieves a new level of functionality and reliability in developing functional FPD s for system manufacturers. Excellent Image Quality Achieves a raw image with a low-noise through the use of Toshiba s own circuit technology. Images have a shorter lag time with an improved refresh function, suitable for radiographic double exposure. Driver software (attached to the product) provides excellent, clear raw images, adopting ghost image correction, offset correction, gain correction and defect corrections. Excellent Reliability Excellent durability by using CsI:Tl screen direct vapor deposition method. The structure is highly reliable and protected from degradation due to the use of a unique moisture-proof sealing method for the CsI:Tl screen The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA ELECTRON TUBES & DEVICES CO., LTD. (TETD) for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TETD or others. The information contained herein may be changed without prior notice. It is therefore advisable to contact TETD before proceeding with the design of equipment incorporating this product. No.TE-FDX3543RP

2 Flat Panel Sensor Unit: COMPONENTS AND CHARACTERISTICS Sensor Protection Plate... Carbon Fiber Plate Cooling... Natural Air Cooling Input... DC15V (from Interface Box) Power Consumption... Maximum 10W Overall Dimensions mm (W(H) D(V) (H)) Weight... 3 kg (approx.) Interface Box: Input... AC100 to 240V, 50/60Hz Output... DC15V 2.6A 30VA Overall Dimensions mm (W(H) D(V) (H)) Weight... 1 kg (approx.) Dimensional Outline: Refer to pages 24 to 25. Environmental: Under delivery and stock Temperature ~ 55 Humidity ~ 90 %(Non-Condensing) Pressure ~ 106 kpa Under operating Temperature ~ 35 Humidity ~ 85 % (Non-Condensing) Pressure ~ 106 kpa Cables: ACCESSORIES AC Cable m 1 GND Cable... 3 m 1 CD: CD(Defect map, SDK)... 1 pcs OPTION ACCESSORIES Sensor Unite Cable (Sensor Unit - Interface Unit) ECB-F035A-09/G... 9 m ECB-F035A-14/G m -2-

3 Image Format: MAIN CHARACTERISTICS X-ray Conversion Layer... Cesium Iodide (Csl) with Amorphous Silicon (a-si) Photodiode Active Area... 35(H) 43(V)cm (14 17 inch) Pixel Matrix (H) 2984(V) Pixel Pitch μ m Cycle Time... Shot to Shot 6sec Performance: Limiting Resolution Lp/mm typ. MTF (2.0 Lp/mm, 70 kvp, 1 1) % typ. DQE (DQE (0), Quantum - Limited)... > 70 % A/D Conversion bit Ratings: Energy Range... 40~150 kvp Maximum Entrance Dose (low Gain)(Linear Output Range)... 4 mr / frame Interface (Interface Box): Sensor Unit UNIT Interface... Connect to Interface Box Interface Box Unit Interface... Connect to Sensor Unit Data Output bit Digital Output Ethernet (1000BASE-T) Command Control... Ethernet (1000BASE-T) X-ray Synchronization Control... External Power Input... AC100 to 240V, 50/60 Hz Image Acquisition Exposure period: X-ray period (ms)...standard: 500 (Variable between 500 to 2000) -3-

4 Product Components and Interface: Detector Control Board X-ray Control Unit (User) X-ray Sync DC15V Interface Box Image Data &Control Gate Driver ROIC Unit Ethernet TFT Panel PC (User) NOTE: Do not disconnect Ethernet connection while DC15V is operating and supplying to Sensor Unit. LED Display Mode: Name POWER ETHERNET Status Turn on when power on Turn on when Connect Ethernet -4-

5 Image Acquisition Communication Block Diagram: Sensor unit Generator Digital Unit Image Data Panel Unit X-ray Sync DC Power Image Data PC Image Data Interface Box DC Power Power Unit DC Power Communication Availability: Signal Name Type Ethernet Command Control D-Sub Signal Control (PC) (X-ray Controller) EXP_REQ INPUT OK OK EXP_OK OUTPUT N.A OK *EXP_REQ Command Response -5-

6 Image Acquisition Control Interface: D-Sub Signal Control Interface Operation Sequence Description of the sequence 1. By receiving EXP_REQ during Refresh status proceeds to Exposure after completion of Refresh. 2. Continues EXP_OK signal ON during Exposure. ON period is defined by Image Acquisition mode table. 3. Proceeds to Data Read after completion of Exposure. (1) Single Exposure B C D FPI Drive Ready Ref Exposure Read Ready Ref 1st 1st 2 1 A EXP_RE <IN> C EXP_OK <OUT> EXPOSURE DATA_STRAGE Data FPI ENABLED A: EXP_REQ width Minimum 1ms B: Refresh period For line drive (2984 Line scan), 80 ms C: EXP period Set value: see the Image acquisition mode table (500 to 2000 ms (by 500 ms step), standard 500 ms). D: Read period For line drive (2984 Line Scan) 240 ms 1:EXP_REQ-EXP_OK period... Maximum 150 ms 2:EXP_REQ-DATA STORAGE period... Maximum 1700 ms (case EXPOSURE 500 ms) -6-

7 (2) Double Exposure B C D C D FPI Drive Ready Ref Exposure Read Ref Exposure Read 1st 2 1st 2nd 2nd 1 A EXP_RE <IN> C C EXP_OK <OUT> EXPOSURE DATA_STRAGE 1st image data 2nd image data FPI ENABLED A: EXP_REQ width Minimum 1ms B: Refresh period For line drive (2984 Line scan) 80 ms C: EXP period Set value: see the Image Acquisition mode table (500 to 2000 ms (by 500 ms step), standard 500 ms). D: Read period For line drive (2984 Line Scan) 240 ms 1:EXP_REQ-EXP_OK period... Maximum 150 ms 2:Double EXPOSURE cycle period... Maximum 1700 ms (case EXPOSURE 500 ms) -7-

8 Image Acquisition Control Interface: Ethernet Interface Command Control Operation Sequence Description of the sequence 1. By receiving EXP_REQ request command during Refresh status proceeds to Exposure after completion of Refresh. 2. Continues EXP_OK signal ON during Exposure. ON period is defined by Image Acquisition mode table. 3. Proceeds to Data Read after completion of Exposure. (1) Single Exposure FPI Drive Ready Ref Exposure Read Ready Ref 1st 1st 2 1 EXP_RE <IN> EXP_OK <OUT> EXPOSURE DATA_STRAGE Data FPI ENABLED 1:EXP_REQ-EXP_OK period... Maximum 150 ms 2:EXP_REQ-DATA STORAGE period... Maximum 1700 ms (case EXPOSURE 500 ms) -8-

9 (2) Double Exposure FPI Drive Ready Ref Exposure Read Ref Exposure Read 1st 1st 2nd 2nd 2 1 EXP_RE <IN> EXP_OK <OUT> EXPOSURE DATA_STRAGE FPI ENABLED 1:EXP_REQ-EXP_OK period... Maximum 150 ms 2:Double EXPOSURE cycle period... Maximum 1700 ms (case EXPOSURE 500 ms) -9-

10 Image Acquisition Control Interface of Interface Box: 1. Pins assign Pin No Signal name I/O Contents 1 NC - Not connected 2 EXP_REQ+ Input Image acquisition (X-ray exposure) 3 0_TEXP_OK+ Output Request signal + Image acquisition (X-ray exposure) Period signal + 4 0_EXP_OK+ (OC) Output Open Collector + 5 NC - Not connected 6 NC - Not connected 7 EXP_REQ- Input 8 0_TEXP_OK- Output Image acquisition (X-ray exposure) Request signal - Image acquisition (X-ray exposure) Period signal - 9 0_EXP_OK- (OC) Output Open Collector- *1 Please put the protective resistance more than 1.4 kω in the series. *2 Maximum sink current is 20 ma. 2. External Interface (EXT-INF) D-Sub 9pin female (Front View) M UNC 3. Input Circuit User System Side FPI Side Pin 2 Pin 7 D-Sub 9 Pin Connector Input Voltage Symbol Min. Typ. Max. Unit Vih 5-28 V Vil 0-1 V -10-

11 4. Output Circuit 4.1 5V CMOS Level Type FPI Side User System Side 5V Pin 3 Pin 8 D-Sub 9 Pin Connector 4.2 Open Collector Type FPI Side User System Side 22Ω Pin 4 Protective resistance Pin 9 D-Sub 9 Pin Connector Max Voltage 28V Protective resistance more than 1.4kΩ must be inserted in series. IP Address Select Switch Select IP address IP IP or User defined IP address *Please use HUB when you connect two sensor units (Dual use). -11-

12 The information about EMC conformity (IEC :2007) Guidance and manufacturer s declaration - electromagnetic emissions The X-Ray FLAT PANEL IMAGER (hereafter called FPI) is intended for use in the electromagnetic specified below. The customer or the user of the FPI should assure that it is used in such an environment. Emissions test Compliance Electromagnetic environment - guidance RF emissions CISPR 11 Group1 The FPI uses RF energy only for its internal function. Therefore, its RF emissions are very low and are not likely to cause any interference in nearby electronic equipment. RF emissions CISPR 11 Harmonic emissions Class A Not applicable The FPI is suitable for use in all establishments other than domestic and those directly connected to the public low-voltage power supply network that supplies building used for domestic purposes. IEC Voltage fluctuations/ flicker emissions IEC Note Not applicable The FPI is not allowed to use the cables or components differ from the originally attached. If the different cables or components are used, they may deteriorate the performance of electromagnetic emissions. The limited length of cables for conforming EMC (IEC :2007) Cables Cable length (Max.) Sensor Unit Cable 14 m GND Cable 3 m Refer to Product Components and Interface about wiring and connection of these cables. -12-

13 Guidance and manufacturer s declaration electromagnetic immunity The FPI is intended for use in the electromagnetic specified below. The customer or the user of the FPI should assure that it is used in such an environment. Immunity test IEC60601 test level Compliance level Electromagnetic environment - guidance Electrostatic discharge (ESD) IEC Electrical fast transient/burst IEC Surge IEC Voltage dips, short interruptions and voltage variations on power supply input lines IEC Power frequency (50/60Hz) magnetic field ±6kV contact ±8kV air ±2 kv for power supply lines ±1kV for input/ output lines ±1kV differential mode ±2kV common mode <5 % U T (>95 % dip in, U T ) for 5 sec ±6kV contact ±8kV air ±2kV for power supply lines ±1kV for input/ output lines ±1kV differential mode ±2kV common mode <5 % U T (>95 % dip in, U T ) for 5 sec Floors should be wood, concrete or ceramic tile. If floors are covered with synthetic material. The relative humidity should be at least 30 %. Mains power quality should be that of a typical commercial or hospital environment. Mains power quality should be that of a typical hospital environment. Mains power quality should be that of a typical hospital environment. If the user of the FPI requires continued operation during power mains interruptions, it is recommended that the FPI be powered from an uninterruptible power supply or a battery. 3A/m 3A/m Power frequency magnetic fields should be at levels characteristic of a typical location in atypical commercial or hospital environment. IEC Note: (1) U T is the a.c.mains voltage prior to application of the test level. (2) This FPI can only allow to use the designated cables and components. If the different cables or components are used, they may deteriorate the performance of recommended separation distance between portable and mobile RF communications equipment and this system. -13-

14 Guidance and manufacturer s declaration electromagnetic immunity The FPI is intended for use in the electromagnetic environment specified below. The customer or the user of the FPI should assure that it is used such an environment. Immunity test IEC test level Compliance level Electromagnetic environment guidance Portable and mobile RF communications equipment should be used no closer to any part of the FPI, including cables, than the recommended separation distance calculated from the equation applicable to the frequency of the transmitter. Recommended separation distance Conducted RF IEC Vrms 150kHz to 80MHz 3Vrms d = 1. 2 P 150kHz to 80MHz d = 1. 2 P 80 MHz to 800 MHz Radiated RF IEC V/m 80MHz to 2.5GHz 3V/m d = 2. 3 P 800 MHz to 2.5 GHz Where P is the maximum output power rating of the transmitter in watts (W) according to the transmitter manufacturer and d is the recommended separation distance in meters (m). Field strengths from fixed RF transmitters, as determined by an electromagnetic site survey a, should be less than the compliance level in each frequency range b. Interference may occur in the vicinity of equipment marked with the following symbol: Note: (1) At 80 MHz and 800 MHz, the higher frequency range applies. (2) These guidelines may not apply in all situations. Electromagnetic propagation is affected by absorption and reflection from structures, object and people. (3) This FPI can only allow to use the designated cables and components. If the different cables or components are used, they may deteriorate the performance of electromagnetic immunity. a Field strengths from fixed transmitters, such as base stations for radio (cellular/cordless) telephones and land mobile radios. Amateur radio, AM and FM radio broadcast and TV broadcast cannot be predicted theoretically with accuracy. To assess the electromagnetic environment due to fixed RF transmitters, an electromagnetic site survey should be considered. If the measured field strength in the location in which the FPI is used exceeds the applicable RF compliance level above, the FPI should be observed to verify normal operation. If abnormal performance is observed, additional measures may be necessary, such as reorienting or relocating the FPI. b Over the frequency range 150 khz to 80 MHz, field strengths should be less than 3V/m. -14-

15 Recommended separation distances between portable and mobile RF communications equipment and the FPI. The FPI is intended for use in an electromagnetic environment in which radiated RF disturbances are controlled. The customer or the user of the FPI can help prevent electromagnetic interference by maintaining a minimum distance between portable and mobile RF communication equipment (transmitters) and the FPI as recommended below, according to the maximum output power of the communications equipment. Rated maximum output power of transmitter W Separation distance according to frequency of transmitter m 150kHz to 80MHz 80MHz to 800MHz 800MHz to 2.5GHz d = 1. 2 P d = 1. 2 P d = For transmitters rated at a maximum output power listed above, the recommended separation distance d in meters (m) can be estimated using the equation applicable to the frequency of the transmitter. Where P is the maximum output power rating of the transmitter in watts (W) according to the transmitter manufacturer. Note: (1) At 80MHz and 800MHz, the separation distance for the higher frequency range applies. (2) These guidelines may not apply in all situations. Electromagnetic propagation is affected by absorption by absorption and reflection from structures objects and people. (3) The FPI can only allow to use the designated cables and components. If the different cables or components are used, they may deteriorate the performance of recommended separation distance between portable and mobile RF communications equipment and this system. P CAUTION CAUTION DO NOT USE THE ELECTROMAGNETIC DEVICE, SUCH AS (CELLULAR/CORDLESS) TELEPHONES AND RADIO CONTROLLED TOYS, CLOSE TO THIS SYSTEM. OTHERWISE, IT MAY CAUSE MALFUNCTION OF THE SYSTEM. -15-

16 INSTALLATION For installing the FPI in the apparatus, refer to the dimensional outlines. INSTALLING HOUSING IN APPARATUS: 1. Surface of the base plate that locates FPI on the apparatus should be flat and smooth. 2. It is necessary to clean both surface of FPI and the base plate of the apparatus before FPI is installed. -16-

17 DAILY CHECK ITEMS MAINTENANCE AND CHECK Before using the sensor unit, check the following items: (1) Environment - The environmental conditions for operation must be adequate. (2) Appearance - Wiring and appearance must be free from any abnormality. (3) Operation - The sensor unit must operate normally after power on. (4) Others - Any abnormalities such as unusual sound and strange odor are not permissible. PERIODIC CHECK ITEMS Check the following at a certain interval within one year: (1) Appearance - The sensor unit must be free from errors in appearance. - The outer mounting screws must be free from looseness and slip-off. - The mounting screws to the equipment must be free from abnormalities such as looseness. - Each cable must be free from cracks and damages. - Each cable must be securely connected. Any looseness is not permissible. (2) Electrical safety - The protective grounding wire must be accurately connected. (3) Cleaning - Cleaning of the outer surface (4) Functionality - The sensor unit must operate normally under control. -17-

18 SAFETY PRECAUTIONS AND WARNING Find this document before using X-Ray FLAT PANEL IMAGER (FPI) This document describes the attention of equipment manufactures and users to use safety X-Ray FLAT PANEL IMAGER (hereafter called FPI). Please find the technical data sheet of each product and this document SAFETY PRECAUTIONS AND WARNING and understand these contents before using FPI. The FPI is used under X-ray exposures. Therefore engineers or service people who have sufficient technical knowledge and experience shall handle the FPI with enough care. Moreover these documents are always stored and can be seen in operating place. If you have any questions, please contact our local sales representatives for further information. The FPI present a certain number of potential risks by the very nature of the physical principles included in their manufacture or operation and because of the materials used to make FPI. Therefore equipment manufacturers and users shall take the responsibility by themselves to protect against these risk and respect local safety laws and regulations. 1. Electric Shock In operating, do not touch the lead wires and connectors of the X-Ray FLAT PANEL IMAGER (FPI). If necessary to touch lead wires and connectors, please turn off the power supply and confirm no residual voltage exist before connecting, disconnecting and handling them. The housing of the FPI should always be connected to ground. All ground terminals and ground wires shall be also done to ground. 2. Ground Connection Connect all protective earth and cables of the FPI to ground. The housing with protective earth should be connected to ground. The resistance between protective earth and ground cables shall be less than 0.1 ohms. The sectional area of the conductor is required for 0.75mm 2 or more. 3. Stop Operation During Abnormal Status Shut down power supply and contact to sales representatives immediately when the FPI stops operation during abnormal status. 4. Remodeling Electronics Parts Do not reconstruct FPI electronics parts because it leads to deterioration of images and the cause of malfunctions. 5. Processing of Housing Do not process FPI housing because it leads to weakness of housing strength and the cause of malfunctions. 6. Screws of Housing As the screws of FPI housing are tightened by proper torque, do not loosen or remove them. -18-

19 7. Handling Do not hold the FPI connector and sensor unite cable when lifting and/or moving the FPI. Please be careful not to drop the FPI. If dropped, check appearance and do not use FPI if it has abnormality. 8. Ingress of Spill Liquid Do not spill a liquid (Blood, Body fluid, Cleaning liquid, etc) on the FPI. When spilled a liquid, please wipe it off with soft cloth promptly, and clean the surface. When a large quantity of blood or body fluid might attach, please use sanitary cover from a sanitary point of view. 9. Ingress of Liquid Do not splash the FPI with any liquid. Occasionally that is a cause of damage. Wipe of once when it get wet. 10. Cleaning When cleaning the surface of FPI, please wipe the surface by the soft cloth soaked with water, oxygenated water or dilution ethanol. Do not use other medicines. 11. Load Please do not apply excessive load on the FPI. Maximum load: 150 the whole 100 mm of the center 12. Unnecessary X-ray, Qualified Personnel The FPI is used combined with X-ray tube assembly. Only Qualified personnel for X-ray handling procedures can use the FPI. For set-ups and services, only knowleged enigineers or special service personnels are able to handle the FPI. 13. X-ray Shield When using this device, unnecessary X-ray irradiation must be avoided. (1) Please follow the "minimum distance between the X-ray tube focal point and X-ray incidence plane" and "maximum tube voltage" specified in the technical data. (2) This devise does not absorb 100% X-ray. It requires X-ray protection measures for X-ray system to comply with the IEC X-ray Specifications Please follow the ratings below. (1) Maximum tube voltage kv (2) Minimum tube voltage 40 kv (3) Maximum X-ray incident dose rate x 10-3 Gy/min [1R/min] (4) Minimum distance between the X-ray tube focal point and X-ray incidence plane.. 73 cm -19-

20 15. Stop Operation A limited operating life and the possibility of random failures are inherent to FPI and shall be taken into account for the protection of personnel and equipment. The operation of FPI under inappropriate conditions, either due to the lack of care or knowledge, can lead to grave risk to the life and limb of personnel, independent of the risk of FPI and/or equipment damage. 16. Mechanical Shock and Vibration Do not give a mechanical shock or vibration to the FPI housing. It may cause the malfunction of FPI due to break down of TFT panel. 17. Protection of Input Plate The FPI input plate consists of a thin carbon plate (CFRP). Therefore it shall never receive shock or pressure. 18. Environmental Temperature, Humidity and Atmosphere (Electromagnetic Waves) The specified temperature and humidity in operating and storage are described at the technical data sheet and the specification. Moreover, FPI shall not experience large and fast temperature and humidity change. Do not use and set the FPI in an atmosphere of inflammable and/or corrosion gasses. Do not install FPI at around any electromagnetic wave noise sources. 19. Condensation Do not let FPI in condensation situation at any time. It may cause malfunctions of electronics circuit and deterioration of images. 20. Dust and Particles Do not use FPI in the environment where dust and particles exist. 21. Power Supply (1) Use the Interface Box attached to FPI. (2) Do not remodel the power supply. Use the power supply as delivered. 22. Adjustment The FPI requires adjustment (ex. Gain and image processing calibrations) according to input X-ray conditions. Be sure to start using the FPI with equipment after adjustment. In the case of exchanging X-ray tube assembly or change of X-ray intensity distribution, adjustment of the FPI is necessary. 23. Memory A memory chip is mounted on this device. The memory contents may be cleared due to electrical shock as ESD, Donot apply major stress such as ESD. 24. Environment Temperature Use the FPI under specified temperature conditions. This is in order to prevent deterioration of FPI characteristics and the cause of malfunctions due to lowering cooling availability. -20-

21 25. Temperature Sensor The FPI is equipped with temperature sensor. Alarm appears through a network by your system(e.g. personal computer), when it detects abnormal internal temperature. Stop operating FPI when it appears then check surrounding temperature. 26. Cables Users must use cables attached with the FPI. Be sure to connect correctly and do not loosen cables. The cable connector has a locking mechanism. Do not pull the cable, when pulling out the connector. 27. Ethernet Cross type Ethernet cable must be used. Also, do not connect Ethernet cable to common networks, must be directly connected to PC. Do not disconnect Ethernet connection while DC24V is operating and supplying to FPI. Do not disconnect cable during operation. In the case of detecting network cable disconnection, the system should have a protective function which manages not allowing exposures. 28. Fuses Fuses (250V T4AL) are installed inside of Interface box. Stop immediately using the FPI when fuse breaks. 29. Defects It is natural due to characteristics of TFT that the FPI has defects. Please calibrates/corrects defects upon usage of FPI. Defects can be corrected by using defect maps. 30. Vibration Noise Donot apply vibration noise during operation. It may becomes the cause of image deterioration or noise. 31. Maintenance Maintenance should be carried out periodically according to the technical data sheet. 32. Shipment FPI should be removed from equipment then put into polyethylene-type bag and pack in TETD packing box to be protected. Keep FPI input plate faced upwards during shipment. 33. Scrap Dispose the scrapped products according to the requirement of local regulation. If you have any questions, please contact to our local sales representatives for further information. -21-

22 CAUTION LABEL This label is a caution label to notify the user of the following point. "These contents are quite important for safety" Attachment position: Housing -22-

23 DEFINITION SYMBOL MARKS (1) CE MARKING OF CONFORMITY (2) SERIAL NUMBER (3) MANUFACTURER (4) DATE OF MANUFACTURE (5) AUTHORISED REPRESENTATIVE IN THE EUROPEAN COMMUNITY (6) PROTECTIVE EARTH (7) WARNING,CAUTION (8) HANDLE WITH CARE (9) LOAD WEIGHT RESTRICTION (10) TYPE B APPLIED PART -23-

24 DIMENSIONAL OUTLINE (1) (Flat Panel Sensor Unit) Unit: mm -24-

25 DIMENSIONAL OUTLINE (2) (Interface Box) Unit: mm -25-

26 OVERSEAS SUBSIDIARIES AND AFFILIATES EU REPRESENTATIVE TOSHIBA ELECTRONICS EUROPE GMBH HANSAALLEE DÜSSELDORF, GERMANY PHONE +49 (211) FAX +49 (211) For Sales & Technical Services, please contact the following representative: TOSHIBA ELECTRONICS EUROPE GMBH HANSAALLEE DÜSSELDORF, GERMANY PHONE +49 (211) FAX +49 (211) TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC EAST LAKE COOK ROAD, SUITE 310 BUFFALO GROVE, ILLINOIS U.S.A PHONE +1 (847) FAX +1 (847) TOSHIBA ELECTRON DEVICES & MATERIALS (SHANGHAI) CO., LTD. (TEMS) RM1606, SH-PLAZA, No.336, XIZANG ROAD (MIDDLE), SHANGHAI, , CHINA PHONE +86 (21) FAX +86 (21) (Sales & Marketing Department) 1385 SHIMOISHIGAMI, OTAWARA-SHI, TOCHIGI-KEN, , JAPAN PHONE: FAX: Toshiba Electron Tubes & Devices Co., Ltd. meets the Environmental Management System Standard, ISO14001 Toshiba Electron Tubes & Devices Co., Ltd. meets internationally recognized Standards for Quality Management System ISO9001, ISO13485.