100W Peak Power Broadband SPDT

Transcription

1 Preliminary Specification TS7329K 00W Peak Power Broadband SPDT FEATURES Low insertion loss (TX Path) o 800 MHz High isolation (RX Path) o 800 MHz High Peak Power Handling No external DC blocking capacitors on RF line Versatile V power supply All RF Ports OFF state APPLICATIONS 4G, 5G systems Receiver Protection Small cells LTE relays and microcells DESCRIPTION The TS7329K is an asymmetrical reflective Single Pole Dual Throw (SPDT) switch designed for broadband, high peak power switching applications. Its broadband behavior from 700MHz to 5GHz frequencies makes the TS7329K an excellent switch for all the applications requiring low insertion loss, high isolation and high linearity within a small package size. The TS7329K is packaged into a compact Quad Flat No lead (QFN) 3x3mm 6 leads plastic package. () TX () () VCP 2 () VDD 2 RFC V 3 0 () V2 4 9 () RX () () Figure : Functional Block Diagram (top view) ORDERING INFORMATION Base Part Number Package Type Form Standard Pack Quantity Orderable Part Number TS7329K QFN 3 mm x 3 mm Tape and Reel 3000 TS7329KMTRPBF Tagore Technology Rev.7

2 PIN DESCRIPTION PIN NUMBER PIN NAME DESCRIPTION VCP Input Pin. Connecting a SMD Capacitor (or capacitor in parallel with high value resistor) between this pin and ground enable faster switching time 2 VDD DC power supply 3 V Switch control input 4 V2 Switch control input 2 5 Ground 6 RX RX Path RFC RF Common port TX TX Path 6 The backside ground slug of the package must be grounded directly to the ground plane to ensure proper operation ABSOLUTE MAXIMUM RATINGS Exceeding one or a combination of the Absolute Maximum Ratings conditions may cause permanent damage to the device. SWITCH TRUTH TABLE PARAMETER SYMBOL RATINGS UNITS Power supply voltage VDD 2.6 to 5.5 V Storage temperature Range T st -55 to +25 C Operating Temperature Range T op -40 to +05 C RF Input Power CW Base plate temp 85degC TX,RFC 42 m RF Input Power CW Base plate temp 05degC TX,RFC 4 m V2 V RF PATH 0 All OFF state 0 0 RFC-TX 0 RFC-RX Note: VDD should be applied first before V and V2. There is an internal pull-down to ground on the V2 control pin: this pin can be left floating when the all OFF state is not used. There is an internal pull-down to ground on the V control pin: default switch state at start-up without any control voltage applied will be RFC- TX on Tagore Technology Rev.7

3 ELECTRICAL SPECIFICATIONS Temperature=25 degc, VDD=3.3V, 50Ω source and load conditions PARAMETER CONDITIONS MIN TYP MAX UNITS Operating frequency MHz 800MHz GHz Insertion loss_tx Insertion loss_rx Isolation RFC-TX Isolation RFC-RX Return Loss RFC, TX,RX 2.6GHz GHz (With match See Fig 4) GHz (With match See Fig 4) MHz GHz GHz GHz (With match See Fig 4) GHz (With match See Fig 4) MHz GHz GHz GHz (With match See Fig 4) GHz (With match See Fig 4) MHz GHz GHz GHz (With match See Fig 4) GHz (With match See Fig 4) MHz 22.9GHz GHz 8 3.8GHz (With match See Fig 4) 7 5.0GHz (With match See Fig 4) 7 Peak Power Peak Power = 49.2m, Isolation 3.8GHz 35 H2 800MHz, Pin=35m -40 m H3 800MHz, Pin=35m -45 m IIP3 800MHz 70 m P0. TX MHz. CW signal 42 m Peak P0. TX MHz %DC, 0us pulse width m P0. RX MHz. CW signal 39 m Enhanced Switching Time 50% ctrl to 0. of max RF power. C=nF(refer to figure 4 schematic).0 s Control voltage Power Supply VDD V V,V2 ctrl pin V ih V Tagore Technology Rev.7

4 All control pins Vil V Control current Iil, V or V2 0 A Iih, V or V2 7.5 A Current consumption Active mode (VDD On) A PACKAGE INFORMATION Figure 2: Package drawings Tagore Technology Rev.7

5 VDD V V VCP VDD V V2 RFC TS7329K EVALUATION KIT The board consists of a 4 layer stack with 2 outer layers made of Rogers 4350B (Er = 3.48) and 2 inner layers of FR4 (Er = 4.80). The total thickness of the board is 62 mils (.57mm). The inner layers provide a ground plane for the 50 transmission lines. The thickness between signal and ground plane is 6.6mils. Each transmission line is designed using coplanar waveguide with ground plane (CPWG) model using a trace width of 32 mils (0.83mm), gap of 5 mils (0.38mm), and a metal thickness of.4mils (0.05mm). Figure3: Evaluation board Picture (Top layer) RFC/ANT 3 8 TX 4 5 TX 3x3_SP2T_asym RX 7 6 RX pF TBD nf VCP NOTE: Below 3GHz, no match required on RX port. Above 3GHz, 0.2pF (Passive Plus 0603N0R2AW25) required to improve RX IL. Figure 4: Evaluation board schematic Tagore Technology Rev.7

6 QUALIFICATION INFORMATION Qualification Level Consumer Moisture Sensitivity Level 3x3 QFN MSL Human Body Model Charged Device Model Class A NA RoHS Compliant Yes The information provided in this document is believed to be accurate and reliable. However, Tagore Technology assumes no responsibility for the consequences of the use of this information. Tagore Technology assumes no responsibility for any infringement of patents or of other rights of third parties which may result from the use of this information. No license is granted by implication or otherwise under any patent or patent rights of Tagore Technology. The specifications mentioned in this document are subject to change without notice. This document supersedes and replaces all information previously supplied. For technical support, please contact Tagore Technology support@tagoretech.com WORLD HEADQUARTERS: 5 East College Dr. Suite 200, Arlington Heights, IL Tagore Technology Rev.7