Surface Mount Silicon Zener Diodes

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1 FEATURES - Low profile package - Ideal for automated placement - Glass passivated junction - Built-in strain relief - Low inductance CREAT BY ART - Moisture sensitivity level: level, per J-STD-2 - Compliant to RoHS Directive 2/65/EU and in accordance to WEEE 22/96/EC - Halogen-free according to IEC definition Surface Mount Silicon Zener Diodes SMB5926 thru SMB5956 MECHANICAL DATA Case: DO-24AA (SMB) Molding compound, UL flammability classification rating 94V- Base P/N with suffix "G" on packing code - green compound (halogen-free) Base P/N with prefix "H" on packing code - AEC-Q qualified Terminal: Matte tin plated leads, solderable per JESD22-B2 Meet JESD 2 class A whisker test, with prefix "H" on packing code meet JESD 2 class 2 whisker test Polarity: Indicated by cathode band Weight:. g (approximately) DO-24AA (SMB) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T A =25 unless otherwise noted) PARAMETER DC power dissipation at T L =75, measure at zero lead length (Note ) derate above 75 DC power dissipation at T A =25 Derate above 25 SYMBOL R θjl R θja T J T STG Value 3 P D 4 P D Thermal Resistance from Junction to Lead 25 Thermal Resistance from Junction to Ambient 226 Operating junction temperature range - 55 to +5 Storage temperature range - 55 to +5 Note : Mounted on Cu-Pad size 5mm x 5mm x.6mm on PCB UNIT Watts mw/ mw mw/ /W /W O C O C ORDERING INFORMATION PART NO. AEC-Q QUALIFIED SMBxxxx (Note ) Prefix "H" PACKING CODE GREEN COMPOUND CODE Note : "xxxx" defines voltage from V (SMB5926) to 2V (SMB5956) PACKAGE PACKING R5 SMB 85 / 7" Plastic reel R4 Suffix "G" SMB 3, / 3" Paper reel M4 SMB 3, / 3" Plastic reel EXAMPLE PREFERRED P/N SMB5926 R5 PART NO. SMB5926 AEC-Q GREEN COMPOUND PACKING CODE QUALIFIED CODE R5 DESCRIPTION SMB5926 R5G SMB5926 R5 G Green compound SMB5926HR5 SMB5926 H R5 AEC-Q qualified Document Number: DS_D4567 Version: H4

2 RATINGS AND CHARACTERISTICS CURVES (TA=25 unless otherwise noted) Device (Note ) Device Marking Code Nominal Zener Voltage Min Vz@Iz V Nom (Notes 2) Max Test Current Zener Impedance (Note 3) SMB5926 thru SMB5956 Leakage Current Maximum DC Zener Current I ZT Z ZT Z ZK I R I ZM ma Ω Ω ma μa V ma(dc) SMB B SMB B SMB B SMB B SMB593 93B SMB593 93B SMB B SMB B SMB B SMB B SMB B SMB B SMB B SMB B SMB594 94B SMB594 94B SMB B SMB B SMB B SMB B SMB B SMB B SMB B SMB B SMB595 95B SMB595 95B SMB B SMB B SMB B SMB B SMB B Notes:. Tolerance and type number designation the type numbers listed indicate a tolerance of 5% 2. Zener voltage (Vz) measurement Nominal Zener voltage is measured with the device junction in thermal equilibrium with ambient temperature Zener impedance (Zz) derivation : Z ZT and Z ZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for Iz(AC) =. Iz(DC) with the AC frequency = 6 Hz Document Number: DS_D4567 Version: H4

3 SMB5926 thru SMB5956 FIG. STEADY STATE POWER DERATING FIG.2 MAXIMUM SURGE POWER 4 P D, MAXIMUM POWER DISSIPATION(WATTS) 3 2 TL TA P PK, PEAK SURGE POWER(W) T, TEMPERATURE( ) PW, PULSE WIDTH(ms) FIG. 3 ZENER VOLTAGE - TO 2 VOLTAGES FIG.4 ZENER VOLTAGE 4 TO 2 VOLTAGES O VZ, TEMPERATURE COEFFICIENT (mv/ ) Vz@IZT O VZ, TEMPERATURE COEFFICIENT (mv/ ) Vz@IZT V Z, ZENER VOLTAGE(V) V z, ZENER VOLTAGE (V) FIG. 5 Vz = 3.3 THRU VOLTS FIG. 6 Vz = 2 THRU 82 VOLTS I Z, ZENER CURRENT (ma) I Z, ZENER CURRENT (ma) Vz, ZENER VOLTAGE (V) Vz, ZENER VOLTAGE (V) Document Number: DS_D4567 Version: H4

4 SMB5926 thru SMB5956 FIG. 7 EFFECT OF ZENER VOLTAGE FIG. 8 EFFECT OF ZENER CURRENT Vz=5V TA=25 Iz(rms)=. Iz(dc) Zz, DYNAMIC IMPEDANCE (Ω) Iz(dc) = ma ma Iz(ms) = Iz(dc) 2mA Iz, ZENER CURRENT (ma) Zz, DYNAMIC IMPEDANCE (Ω) 9V 62V 22V 2V 6.8V. Iz. ZENER TEST CURRENT(mA) FIG.9 CAPACITANCE CURVE FIG. TYPICAL PULSE RATING CURVE C, CAPACITANCE(pF) Vz/2 MEASURED@ ZERO BIAS P PK, PEAK POWER (KW). NONREPETITIVE, EXPONENTIAL PULSE WAVEFORM, TA=25 BREAKDOWN VOLTAGE (V)... Tp. PULSE WIDTH (ms) FIG. PULSE WAVEFORM FIG. 2 PULSE WAVEFORM I PPM, PEAK PULSE CURRENT (%) td μs PEAK VALUE Ippm PW(ID) IS DEFINED AS THE POINT WHERE THE PEAK CURRENT DECAYS TO 5% OF Ipp HALF VALUE - Ipp/2 / μs WAVEFORM AS DEFINED BY R.E.A I PPM, PEAK PULSE CURRENT (%) T = 8μs. IPEAK.9 IPEAK.5 IPEAK 8/2 μs WAVEFORM AS DEFINED BY ANSI C62. AND IEC T, TIME(ms) T, TIME(ms) Document Number: DS_D4567 Version: H4

5 SMB5926 thru SMB5956 PACKAGE OUTLINE DIMENSIONS DO-24AA (SMB) DIM. Unit (mm) Unit (inch) Min Max Min Max A B C D E F G H SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A B C D.8.7 E MARKING DIAGRAM P/N = G = YW = F = Device Marking Code Green Compound Date Code Factory Code Document Number: DS_D4567 Version: H4

6 SMB5926 thru SMB5956 Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D4567 Version: H4

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