Ultrafast Avalanche SMD Rectifier

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Stuart Rodgers
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1 Ultrafast Avalanche SMD Rectifier BYG2D thru BYG2J FEATURES Low profile package Ideal for automated placement Glass passivated junction Low reverse current Soft recovery characteristics DO-24AC (SMA) Ultrafast reverse recovery time Meets MSL level, per J-STD-2C, LF max peak of 26 C Solder Dip 26 C, 4 seconds MAJOR RATINGS AND CHARACTERISTICS I F(AV).5 A V RRM 2 V to 6 V I FSM 3 A I R. µa V F.4 V t rr 75 ns E R 2 mj T j max. 5 C Component in accordance to RoHS 22/95/EC and WEEE 22/96/EC TYPICAL APPLICATIONS For use in high frequency rectification of power supply, inverters, converters and free-wheeling diodes for consumer, automotive and telecommunication. MECHANICAL DATA Case: DO-24AC (SMA) Epoxy meets UL 94V- flammability rating Terminals: Matte tin plated leads, solderable per J-STD-2B and JESD22-B2D E3 suffix for commercial grade, HE3 suffix for high reliability grade (AEC Q qualified) Polarity: Color band denotes the cathode end MAXIMUM RATINGS (T A = 25 C unless otherwise noted) PARAMETER SYMBOL BYG2D BYG2G BYG2J UNIT Device marking code BYG2D BYG2G BYG2J Maximum repetitive peak reverse voltage V RRM V Average forward current I F(AV).5 A Peak forward surge current ms single half sine-wave superimposed on rated load I FSM 3 A Pulse energy in avalanche mode, non repetitive (inductive load switch off) I (BR)R = A, T j = 25 C E R 2 mj Operating junction and storage temperature range T J, T STG - 55 to + 5 C 2-Dec-6

2 Average BYG2D thru BYG2J ELECTRICAL CHARACTERISTICS (T A = 25 C unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL BYG2D BYG2G BYG2J UNIT Maximum instantaneous forward voltage () at I F = A I F =.5 A T j = 25 C V F.3.4 V Maximum DC reverse current Maximum reverse recovery time at V R = V RRM T j = 25 C T j = C I F =.5 A, I R =. A, I rr =.25 A Note: () Pulse test: 3 µs pulse width, % duty cycle I R t rr 75 ns µa THERMAL CHARACTERISTICS (T A = 25 C unless otherwise noted) PARAMETER SYMBOL BYG2D BYG2G BYG2J UNIT Typical thermal resistance - Junction lead T L = const. R θjl 25 C/W Typical thermal resistance - Junction Ambient Note: () Mounted on epoxy-glass hard tissue (2) Mounted on epoxy-glass hard tissue, 5 mm 2 35 µm Cu (3) Mounted on Al-oxide-ceramic (Al 2 O 3 ), 5 mm 2 35 µm Cu R θja 5 () 25 (2) (3) C/W ORDERING INFORMATION PREFERRED P/N UNIT WEIGHT (g) PACKAGE CODE BASE QUANTITY DELIVERY MODE BYG2D-E3/TR.64 TR 8 7" Diameter Plastic Tape & Reel BYG2D-E3/TR3.64 TR3 75 3" Diameter Plastic Tape & Reel RATINGS AND CHARACTERISTICS CURVES (T A = 25 C unless otherwise noted). Tj = 5 C. Tj = 25 C Forward Voltage (V) RthJA 25 K/W RthJA 5 K/W RthJA 25 K/W Ambient Temperature ( C) half sine-wave Figure. Forward Current vs. Forward Voltage Figure 2. Max. Average Forward Current vs. Ambient Temperature 2 2-Dec-6

3 Diode Capacitance (pf) BYG2D thru BYG2J 6 IR =.5 A, ir =.25 A Reverse Current (µa) Reverse Recovery Time (ns) Tamb = 25 C Tamb = C Tamb = 75 C Tamb = 5 C Tamb = 25 C Junction Temperature ( C) Figure 3. Reverse Current vs. Junction Temperature Figure 6. Reverse Recovery Time vs. Forward Current Reverse Power Dissipation (mw) PR - Limit at 8 % VR Junction Temperature ( C) PR - Limit at % VR Reverse Recovery Charge (nc) 2 IR =.5 A, ir =.25 A 5 Tamb = 25 C Tamb = C Tamb = 75 C 5 Tamb = 5 C Tamb = 25 C Figure 4. Max. Reverse Power Dissipation vs. Junction Temperature Figure 7. Reverse Recovery Charge vs. Forward Current 3 f = MHz Reverse Voltage (V) Thermal Resistance for Pulse Cond. (K/W) 25 K/W DC tp/t =.5 tp/t =.2 tp/t =. tp/t =.5 tp/t =.2 Single Pulse tp/t = Pulse Length (s) Figure 5. Diode Capacitance vs. Reverse Voltage Figure 8. Thermal Response 2-Dec-6 3

4 BYG2D thru BYG2J PACKAGE OUTLINE DIMENSIONS in inches (millimeters) DO-24AC (SMA) Cathode Band Mounting Pad Layout.65 (.65).49 (.25). (2.79). (2.54).66 MIN. (.68 MIN.).74 MAX. (.88 MAX.).77 (4.5).57 (3.99).2 (.35).6 (.52).6 MIN. (.52 MIN.).9 (2.29).78 (.98).28 (5.28) REF.6 (.52).3 (.76).8 (.23) ().28 (5.28).94 (4.93) 4 2-Dec-6

5 Notice Legal Disclaimer Notice Vishay Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale. Document Number: 9 Revision: 8-Apr-5

Ultrafast Avalanche SMD Rectifier

Ultrafast Avalanche SMD Rectifier FEATURES Low profile package Ideal for automated placement Glass passivated junction Low reverse current Low forward voltage DO-24AC (SMA) MAJOR RATINGS AND CHARACTERISTICS