. POWER AMPLIFIER . FLYBACK GENERATOR . THERMAL PROTECTION TDA9302H VERTICAL DEFLECTION OUTPUT CIRCUIT
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1 TDA930H VERTICAL DEFLECTION OUTPUT CIRCUIT. POWER AMPLIFIER. FLYBACK GENERATOR. THERMAL PROTECTION DESCRIPTION The TDA930H is a monolithic integrated circuit in HEPTAWATT TM package. It is a high efficiency power booster for direct driving of vertical windings of TV yokes. It is intended for use in Color and B & W television as well as in monitors and displays. HEPTAWATT (Plastic Package) ORDER CODE : TDA930H PIN CONNECTIONS (top view) Tab connected to Pin 3 NON-INVERTING INPUT OUTPUT STAGE SUPPLY OUTPUT GROUND FLYBACK GENERATOR SUPPLY VOLTAGE INVERTING INPUT 930H-0.EPS BLOCK DIAGRAM + 3 Flyback Generator Power Amplifier Thermal Protection YOKE TDA930H 930H-0.EPS August 99 /
2 TDA930H ABSOLUTE MAXIMUM RATINGS AT TA = o C Symbol Parameter Value Unit Supply Voltage (pin ) 3 V V, V Flyback Peak Voltage 0 V V3 Voltage at Pin 3 + Vs V, V Amplifier Input Voltage + Vs 0. V Io Deflection Output Current ±.8 A I 3 Pin 3 DC Current at V <V 00 ma Ptot Total Power Dissipation at Tcase = 90 C W T stg, T j Storage and Junction Temperature 0, +0 C 930H-0.TBL THERMAL DATA Symbol Parameter Value Unit R th (j c) Thermal Resistance Junction-case Max. C/W 930H-0.TBL RECOMMENDED OPERATING CHARACTERISTICS AT T A = o C Symbol Parameter Test Conditions Min. Typ. Max. Unit V M Recommended Supply Voltage V V R Operating Supply Voltage Range 30 V IPP Deflection Output Current App 930H-03.TBL ELECTRICAL CHARACTERISTICS (refer to the test circuits, = 3V, T amb = o C unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig. I Pin Quiescent Current I 3 =0,I = 0 ma a I Pin Quiescent Current I 3 =0,I = 0 3 ma a I Amplifier Input Bias Current V = V, V = V 0. µa a V = V, V = V 0. µa a V3L Pin 3 Saturation Voltage to GND I3 = 0 ma. V c V Quiescent Output Voltage Vs = 3V, Ra = 39kΩ 8 V d V L Output Saturation Voltage to GND I = A V c I = 0. A 0. V c VH Output Saturation Voltage to Supply I = A. V b I = 0. A.3.8 V b T j Junction Temperature for Thermal Shut Down 0 C 930H-0.TBL /
3 TDA930H Figure : DC Test Circuits. Figure a : Measurement of I ;I;I Figure b : Measurement of VH I I V H 0kΩ V S a b I V 930H-03.EPS V V I 930H-0.EPS S : (a) I and I ; (b) I Figure c : Measurement of V 3L ;V L Figure d : Measurement of V I 3 or I 3 b S a kω V 3V V V R a V V 3L V L 930H-0.EPS.kΩ 930H-0.EPS S : (a) V 3L ; (b) V L 3/
4 TDA930H Figure : AC Test Circuit BY V C 80mF C 0µF D C3 0µF t fly 3 GND to V i IN R kω V RE F R3 R C 0.µF R.Ω Iy R 330Ω Ly 0mH Ry.9Ω to V R 0k Ω kω C.µF kω C 000µF R Iy =V * Recommended for VREF filtering R Ω to 0ms 930H-0.EPS MOUNTING INSTRUCTIONS The power dissipated in the circuit must be removed by adding an external heatsink. Thanks to the HEPTAWATT TM package attaching the heatsink is very simple, a screw or a compression spring (clip) being sufficient. Figure 3 : Mounting Examples Between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two surfaces, since the tab is connected to Pin which is ground. 930H-08.EPS/930H-09.EPS /
5 TDA930H PACKAGE MECHANICAL DATA : 9 PINS - PLASTIC HEPTAWATT L E L A C D L D L L3 H3 G G G M M Dia. L L F H F PM-HEPTV.EPS Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A C D D E F F G G G H H L L L L L L L M M Dia HEPTV.TBL Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 99 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I C Patent. Rights to use these components in a I C system, is granted provided that the system conforms to the I C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. /
6 This datasheet has been downloaded from: Datasheets for electronic components.
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