50V - 1.5A QUAD DARLINGTON SWITCHES

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Eugene Sutton
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1 ULN206B - ULN2066B ULN2068B - ULN2070B ULN207B - ULN2076B 0-1.A QUAD DARLINGTON SWITCHES OUTPUT CURRENT TO 1. A EACH DAR- LINGTON. MINIMUM BREAKDOWN 0 SUSTAINING OLTAGE AT LEAST 3 INTEGRAL SUPPRESSION DIODES (ULN206B, ULN2066B, ULN2068B and ULN2070B). ISOLATED DARLINGTON PINOUT (ULN207B, ULN2076B) ERSIONS COMPATIBLE WITH ALL POPU- LAR LOGIC FAMILIES DESCRIPTION Designed to interface logic to a wide variety of high current, high voltageloads, thesedeviceseach contain four NPN darlington switches delivering up to 1. A with a specified minimum breakdown of 0 and a sustaining voltage of 3 measured at 100. The ULN206B, ULN2066B, ULN2068B and ULN2070B contain integral suppression diodes for inductive loads have common emitters. The ULN207B and ULN2076B feature isolated darlington pinouts and are intended for applications such as emitter followerconfigurations.inputsof the ULN206B, ULN2068B and ULN207B are compatible with popular logic families and the ULN2066B and ULN2076B are compatible with 6-1 CMOS and PMOS. Types ULN2068B and ULN2070Binclude a predriverstageto reduceloading on the control logic. POWERDIP PIN CONNECTIONS AND ORDER CODES ULN206B ULN2066B ULN2068B ULN2070B ULN207B ULN2076B April /8

2 ULN206B-ULN2066B-ULN2068B-ULN2070B-ULN207B-ULN2076B SCHEMATIC DIAGRAM ULN206B : R IN = 30Ω ULN2066B : R IN =3kΩ ULN2068B : R IN = 2.kΩ, R s = 900Ω ULN2070B : R IN = 11.6kΩ, R s = 3.kΩ ULN207B : R IN = 30Ω ULN2076B : R IN =3kΩ ABSOLUTE MAXIMUM RATINGS Symbol Parameter alue Unit CEX Output oltage 0 CE(sus) Output Sustaining oltage 3 I O Output Current 1.7 A i Input oltage for ULN2066B 2070B - 207B B for ULN206B 2068B I I Input Current 2 s Supply oltage for ULN2068B for ULN2070B P tot Power Dissipation at Tpins =90 C at Tamb =70 C T amb Operating Ambient Temperature Range 20 to 8 C T stg Storage Temperature to 10 C W W ELECTRICAL CHARACTERISTICS (T amb =2 o C unless otherwise specified ) Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig. I CEX Output Leakage Current CE = 0 T amb =2 C T amb =70 C CE(sus) Collector-emitter Sustaining oltage I C = 100, i = CE(sat) Collector-emitter Saturation oltage I C = 00 I B = 62µA I C = 70 I B = 93µA I C =1A I B = I C = 1.2A I B = I i(on) Input Current for ULN206B and ULN207B i = 2. i = 3.7 for ULN2066B and ULN2076B i = i = 12 for ULN2068B i = 2.7 i = 3.7 for ULN2070B i = i = µa µa 1 2/8

3 ULN206B-ULN2066B-ULN2068B-ULN2070B-ULN207B-ULN2076B ELECTRICAL CHARACTERISTICS (Tamb =2 o C unless otherwise specified ) (continued) Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig. i(on) Input oltage CE = 2, I C =1A ULN206B, ULN207B ULN2066B, ULN2076B CE = 2, I C = 1.A ULN206B, ULN207B ULN2066B, ULN2076B ULN2068B ULN2070B I s Supply Current for ULN2068B I C = 00, i = 2.7 for ULN2070B I C = 00, i =. tplh Turn-on Delay Time 0. i to 0. o 1 µs t PHL Turn-off Delay Time 0. i to 0. o 1. µs IR Clamp Diode Leakage Current for ULN206B-ULN2066B and ULN2068B-ULN2070B R =0 T amb =2 C T amb =70 C F Clamp Diode Forward oltage for ULN206B-ULN2066B and ULN2068B-ULN2070B I F =1A I F = 1. A Notes : 1. Input voltage is with reference to the substrate (no connection to any other pins) for the ULN207B and ULN2076B reference is ground for all other types. 2. Input current may be limited by maximum allowable input voltage µa µa TEST CIRCUITS Figure 1. Figure 2. Figure 3. Figure. 3/8

4 ULN206B-ULN2066B-ULN2068B-ULN2070B-ULN207B-ULN2076B Figure. Figure 6. Figure 7. Figure 8. Figure 9 : Input Current as a Function of Input oltage. Figure 10 : Input Current as a Function of Input oltage. Figure 11 : CollectorCurrent as a Function of Input Current. /8

5 ULN206B-ULN2066B-ULN2068B-ULN2070B-ULN207B-ULN2076B MOUNTING INSTRUCTIONS The Rth j-amb can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Fig. 12) or to an external heatsink (Fig. 13). The diagram of Figure 1 shows the maximum dissipable power P tot and the R th j-amb as a function of the side α of two equal square copper areas having a thickness of 3 µ (1. mils). Figure 12 : Example of P.C. Board Area which is Used as Heatsink. During soldering the pins temperature must not exceed 260 C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 13 : ExternalHeatsink Mounting Example. Figure 1 : Maximum Dissipable Power and Junction to Ambient Thermal Resistance vs. Side α. Figure 1 : Maximum Allowable Power Dissipation vs. Ambient Temperature. /8

6 ULN206B-ULN2066B-ULN2068B-ULN2070B-ULN207B-ULN2076B TYPICAL APPLICATIONS Figure 16 : Common-anode LED Drivers. Figure 17 : Common-cathode LED Drivers. 6/8

7 ULN206B-ULN2066B-ULN2068B-ULN2070B-ULN207B-ULN2076B POWERDIP 16 PACKAGE MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. a B b b D E e e F I L Z /8

8 ULN206B-ULN2066B-ULN2068B-ULN2070B-ULN207B-ULN2076B Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics SGS-THOMSON Microelectronics Printed in Italy All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 8/8

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