HCC/HCF4015B DUAL 4-STAGE STATIC SHIFT REGISTER WITH SERIAL INPUT/PARALLEL OUTPUT

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1 DUAL 4-STAGE STATIC SHIFT REGISTER WITH SERIAL INPUT/PARALLEL OUTPUT MEDIUM SPEED OPERATION : 12MHz (typ.) CLOCK RATE AT DD -SS = 10 FULLY STATIC OPERATION 8 MASTER-SLAE FLIP-FLOPS PLUS INPUT AND OUTPUT BUFFERING HIGH NOISE IMMUNITY QUIESCENT CURRENT SPECIFIED TO 20 FOR HCC DEICE INPUT CURRENT OF 100nA AT 18 AND 25 C FOR HCC DEICE. 100% TESTED FOR QUIESCENT CURRENT 5, 10, AND 15 PARAMETRIC RATINGS MEETS ALL REQUIREMENTS OF JEDEC TEN- TATIE STANDARD N O. 13A, STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEICES EY (Plastic Package) M1 (Micro Package) F (Ceramic Frit Seal Package) C1 (Plastic Chip Carrier) ORDER CODES : HCC4015BF HCF4015BM1 HCF4015BEY HCF4015BC1 PIN CONNECTIONS DESCRIPTION The HCC4015B (extended temperature range) and HCF4015B (intermediate temperature range) are monolithic integrated circuits, available in 16-lead dual in-line plastic or ceramic package and plastic micropackage. The HCC/HCF4015B consists of two identical, independent, 4-stage serial-input/parallel-output registers. Each register has independent CLOCK and RESET inputs as well as a single serial DATA input. Q outputsare available from each of thefour stages on both registers. All register stages are D-type, master-slave flip-flops. The logic level present at the DATA input is transferred into the first register stage and shifted over one stage at each positive-going clock transition. Resetting of all stages is accomplished by a high level on the reset line. Register expansion to 8 stages using one HCC/HCF4015B package, or to more than 8 stages using additional HCC/HCF4015B s is possible. June /12

2 FUNCTIONAL DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter alue Unit DD * Supply oltage : HCC HCF 0.5 to to + 18 i Input oltage 0.5 to DD I I DC Input Current (any one input) ± 10 ma P tot Total Power Dissipation (per package) Dissipation per Output Transistor for T op = Full Package-temperature Range mw mw T op Operating Temperature : HCC HCF 55to to+85 T stg Storasge Temperature 65 to C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to SS pin voltage. C C RECOMMENDED OPERATING CONDITIONS Symbol Parameter alue Unit DD Supply oltage : HCC HCF 3to18 3to15 I Input oltage 0 to DD T op Operating Temperature : HCC HCF 55 to to+85 C C 2/12

3 LOGIC DIAGRAMS AND TRUTH TABLE CL D R Q 1 Q n / Q n 1 / Q n 1 \ X 0 Q Q n 1 (no. change) X X /12

4 STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Symbol I L OH OL IH IL I OH I OL I IH,I IL Parameter Quiescent Current Output High oltage Output Low oltage Input High oltage Input Low oltage Output Drive Current Output Sink Current Input Leakage Current HCC HCF HCC HCF HCC HCF HCC HCF Test Conditions alue I O I O DD T Low * 25 C T High * () () (µa) () Min. Max. Min. Typ. Max. Min. Max. 0/ / / / / / / / 5 < /10 < /15 < /0 < /0 < /0 < /4.5 < /9 < /13.5 < /0.5 < /1 < /1.5 < / / / / / / / / / / / / / / /18 18 ± 0.1 ±10 5 ± 0.1 ± 1 Any Input 0/15 15 ± 0.3 ±10 5 ± 0.3 ± 1 C I Input Capacitance Any Input pf *TLow= 55 C for HCC device : 40 C for HCF device. * THigh= C for HCC device : + 85 C for HCF device. The Noise Margin for both 1 and 0 level is : 1 min. with DD = 5, 2 min. with DD = 10, 2.5 min. with DD = 15. Unit µa ma ma µa 4/12

5 DYNAMIC ELECTRICAL CHARACTERISTICS (T amb =25 C, C L = 50 pf, R L = 200 kω, typical temperature coefficient for all DD values is 0.3 %/ C, all input rise and fall times = 20 ns) alue Symbol Parameter Test Conditions DD () Min. Typ. Max. CLOCKED OPERATION t PLH,t PHL Propagation Delay Time (carry out or decoded out lines) t THL,t TLH Transition Time (carry out or decoded out lines) f CL Maximum Clock Input Frequency t W Clock Pulse Width t r,t f * Clock Input Rise or Fall Time t setup Data Setup Time RESET OPERATION t PLH,t PHL Propagation Delay Time t W Reset Pulse Width * If more than unit is cascaded in the parallel clocked application, t rcl should be made less than or equal to the sum of the fixed propagation delay at 15pF and the transition time of the carry output driving stage for the estimated capacitive load. Unit ns ns MHz ns µs ns ns ns 5/12

6 Typical Output Low (sink) Current Characteristics. Minimum Output Low (sink) Current Characteristics. Charac- Typical Output High (source) Current teristics. Minimum Output High (source) Current Characteristics. Typical transition Time vs. Load Capacitance. Typical propagation Delay Time vs. Load Capacitance.. 6/12

7 Typical Dynamic Power Dissipation vs. Frequency. TEST CIRCUITS Quiescent Device Current. Input current. Input oltage. Power Dissipation. 7/12

8 Plastic DIP16 (0.25) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. a B b b D E e e F I L Z P001C 8/12

9 Ceramic DIP16/1 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A B D E e F G H L M N P Q P053D 9/12

10 SO16 (Narrow) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A a a b b C c1 45 (typ.) D E e e F G L M S 8 (max.) P013H 10/12

11 PLCC20 MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A B D d d E e e F G M M P027A 11/12

12 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronicsproducts are not authorized foruse ascritical componentsin life support devices or systems without express written approval of SGS-THOMSON Microelectonics SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 12/12

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