Advanced Power Electronics Corp. APE8902 APPLICATION ORDERING INFORMATION 2A LOW DROPOUT REGULATOR WITH ENABLE. ESOP-8 (MP) (Top View) TEMP.
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1 2A LOW DROPOUT REGULATOR WITH ENABLE FEATURES Adjustable Output Low to 0.8V Input Voltage as Low as 1.4V and VPP Voltage 5V 350mV 2A, VO 1.2V Over Current and Over Temperature Protection Enable Pin Low Reverse Leakage (Output to Input ) ±2% Output Voltage VO Power OK Signal 1.2V, 1.5V, 1.8V and 2.5V and Adjustable Output Voltage VO Pull Low Resistance when Disable SOP-8 with Exposed Pad APPLICATION Motherboards Peripheral Cards Network Cards Set Top Boxes Notebook Computers DESCRIPTION is a high performance positive voltage regulator designed for use in applications requiring very low Input voltage and very low dropout voltage at up to 2 amps. It operates with a VIN as low as 1.4V and VPP voltage 5V with output voltage programmable as low as 0.8V. features ultra low dropout, ideal for applications where VOUT is very close to VIN. Additionally, the has an enable pin to further reduce power dissipation while shutdown. provides excellent regulation over variations in line, load and temperature. provides a power OK signal to indicate if the voltage level of VO reaches 92% of its rating value. is available in the exposed SOP-8(MP) package. It is available with 1.2V, 1.5V, 1.8V and 2.5V internally preset outputs that are also adjustable using external resistors. ORDERING INFORMATION ORDER NUMBER MP MP-12 MP-15 MP-18 MP-25 MARKING 8902MP 8902MP MP MP MP-25 TEMP. RANGE - 40 C ~ + 85 C - 40 C ~ + 85 C - 40 C ~ + 85 C - 40 C ~ + 85 C - 40 C ~ + 85 C PACKAGE ESOP-8 (with exposed pad) PACKAGE INFORMATION TYPICAL APPLICATION CIRCUIT POK VEN VIN VPP ESOP-8 (MP) (Top View) GND ADJ/NC VO NC VPP (5V) VIN VO C PP 1uF C 1 10uF C 2 10uF R1 R2 VPP VEN VIN VO ADJ POK GND 10KΩ VOUT VO = [ 0.8 x (R1+R2) ] / R2 Volts R2 < 120 K Ω is recommended Data and specifications subject to change without notice
2 ABSOLUTE MAXIMUM RATINGS (Note1) V PP, V IN, Input Voltage V Power Dissipation Internally Limited (Note2) Maximum Junction Temperature C Storage Temperature Range C To 150 C Rth ja, Thermal Resistance Junction to Ambient C/W Rth jc, Thermal Resistance Junction to Case C/W ESD Rating (Human Body Model) KV RECOMMENDED OPERATING CONDITIONS V IN Voltage V to 5.5V V PP Voltage V to 5.5V V OUT, Output Voltage V to 2.7V T A, Temperature Range C To 85 C ELECTRICAL SPECIFICATIONS V PP =5V, V IN =V OUT +500mV, V EN =V PP, I O =10mA, C IN =10uF, T A =T J =25 C, unless otherwise specefied. (Note3) Parameter SYM TEST CONDITION MIN TYP MAX UNITS VIN Input Voltage Range V IN V Quiescent Current I Q I O =0mA ua VPP VPP Voltage Range V PP V VPP Current I PPH I O =0mA ma I O =2A ma I PPL V EN =0V ua VO Output Voltage (Internal Fixed Voltage) V O V IN =V O +0.5V, V O =1.8V V Line Regulation V IN =(V O +0.5V) to 5V % Load Regulation 10mA I O 2A % Dropout Voltage V D I O =2A mv Short Circuit Current A VO Pull Low Resistance V EN =0V Ω ADJ Reference Voltage V REF V ADJ =V O V Adjust Pin Current I ADJ na VEN VEN Pin Voltage High V ENH V VEN Pin Voltage Low V ENL V VEN Pin Bias Current I ENH ua POK VO Power OK Voltage V THPOK % Hysteresis V HYPOK % 2
3 ELECTRICAL SPECIFICATIONS(Cont.) Parameter SYM TEST CONDITION MIN TYP MAX UNITS OVER TEMPERATURE PROTECTION Over Temperature T OT C Over Temperature Hysteresis T OTHY C Note1. Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2. The maximum power dissipation is a function of the maximum junction temperature, Tjmax; total resistance, Rthja, and ambient temperature T A. The maximum allowable power dissipation at any ambient temperature is (Tjmax -TA) / Rthja. If this dissipation is exceeded, the die temperature will rise above 150 C and IC will go into thermal shutdown. Note3. Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4. Rth ja is measured by mounted on a high effective thermal conductivity test board in free air. The bottom exposed pad of ESOP-8 is soldered directly on the PCB. PIN DESCRIPTIONS PIN SYMBOL POK VEN VIN VPP NC VO ADJ/NC GND PIN DESCRIPTION Assert high once VO reaches 92% of its rating voltage. Open-drain output. Enable Input. Pulling this pin below 0.4V turns the regulator off, reducing the quiescent current to a fraction of its operating value. The device will be enabled if this pin is left open. Input voltage. Large bulk capacitance should be placed closely to this pin. A 10uF ceramic capacitor is recommended at this pin. Input voltage for controlling circuit. Not connected The power output of the device. A pull low resistance exists when deactivate device by VEN. This pin, when sets the output voltage bye the internal feedback resistors, is NC pin. If external feedback resistors are used, the output voltage will be VO = 0.8( R1+R2 ) / R2 Volts. Reference ground. 3
4 BLOCK DIAGRAM DEFINITIONS Dropout Voltage Line Regulation The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. 4
5 POWER SEQUENCE DIAGRAM POWER ON SEQUENCE Vpp Vin EN OUT POWER OFF SEQUENCE EN OUT Vin Vpp 5
6 TYPICAL PERFORMANCES CHARACTERISTICS (V CC = 3.3V, T A =25 C, unless otherwise noted.) Quiescent Current vs. Input Voltage Quiescent Current vs. Temperature Quiescent Current, IQ(mA) Input Voltage, VIN Input Voltage, V IN (V) Temperature, ( ) IPPH Current vs. Temperature IPPH Current vs. Input Voltage IPPH Current (ma) IPPH Current (ma) Temperature ( C) Input Voltage (V) Output Voltage vs. Input Voltage Output Voltage vs. Load Current Output Voltage Output Volrtage (V) Input Voltage (V) Load Current (A) 6
7 TYPICAL PERFORMANCES CHARACTERISTICS (continued) Output Voltage vs. Temperature Reference Voltage vs. Input Voltage Output Voltage (V) Reference Voltage (V) Temperature ( C) Input Voltage (V) Reference Voltage vs. Temperature Reference Voltage (V) Temperature ( C) 7
8 TYPICAL PERFORMANCES CHARACTERISTICS (continued) Load Transient Short Circuit Current Vin Start up Waveform VEN Start up Waveform 8
9 DEMO BOARD FOOTPRINT 9
10 Package Outline : ESOP-8 ADVANCED POWER ELECTRONICS CORP. P Millimeters SYMBOLS MIN NOM MAX A B C B Q A2 L D E F M H L J K G P REF TYP Q I J 1.All Dimension Are In Millimeters. 2.Dimension Does Not Include Mold Protrusions. Part Marking Information & Packing : ESOP MP-&& YWWSSS Part Number Package Code Output Voltage Date Code (YWWSSS) Y:Last Digit Of The Year WW:Week SSS:Sequence 10
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