TLE8386EL. Datasheet. Automotive Power. Smart Boost Controller. Rev. 1.0,

Transcription

1 Smart Boost Controller Datasheet Rev..0, Automotive Power

2 Table of Contents Table of Contents Overview Block Diagram Pin Configuration Pin Assignment Pin Definitions and Functions General Product Characteristics Absolute Maximum Ratings Functional Range Thermal Resistance Boost Regulator Description Electrical Characteristics Oscillator and Synchronization Description Electrical Characteristics Enable Function Description Electrical Characteristics Linear Regulator Description Electrical Characteristics Protection and Diagnostic Functions Description Electrical Characteristics Package Outlines Application Information Further Application Information Revision History Datasheet 2 Rev..0,

3 Smart Boost Controller TLE8386EL Overview Features Wide Input Voltage Range from 4.75 V to 45 V Constant Current or Constant Voltage Regulation Very Low Shutdown Current: IQ< 0 µa Flexible Switching Frequency Range, 00 khz to 500 khz Synchronization with external clock source Output Open Circuit Diagnostic Output Available in a small thermally enhanced PG-SSOP-4 package Internal 5 V Low Drop Out Voltage Regulator Output Overvoltage Protection Internal Soft Start Over Temperature Shutdown Automotive AEC Qualified Green Product (RoHS) Compliant PG-SSOP-4 Description The TLE8386EL is a boost controller with built in protection and diagnostic features. The main function of this device is step-up (boost) an input voltage to a larger output voltage. The diagnostics are communicated on a status output (pin ST) to indicate a fault conditions such as over temperature, open feedback and open load. The switching frequency is adjustable in the range of 00 khz to 500 khz and can be synchronized to an external clock source. The TLE8386EL features an enable function reducing the shut-down current consumption to <0 µa. The current mode regulation scheme of this device provides a stable regulation loop maintained by small external compensation components. The integrated soft-start feature limits the current peak as well as voltage overshoot at start-up. This IC is suited for use in the harsh automotive environments and provides protection functions such as output overvoltage protection and overtemperature shutdown. Type Package Marking TLE8386EL PG-SSOP-4 TLE8386 Datasheet 3 Rev..0,

4 Block Diagram 2 Block Diagram IN 4 LDO IVCC Internal Supply Power On Reset EN 3 On/Off Logic EN_INT FREQ/ SYNC Oscillator Soft Start Slope Comp. PWM Generator Power Switch Gate Driver Switch Current Error Amplifier SWO SWCS SGND Thermal Protection Leading Edge Blanking ST 0 Diagnostics Logic Open Load Detection Over Volage Protection 9 OVFB COMP 8 Feedback Voltage Error Amplifier 6 7 FBH FBL 2 BlockDiagram.vsd GND Figure Block Diagram Datasheet 4 Rev..0,

5 Pin Configuration 3 Pin Configuration 3. Pin Assignment Figure 2 Pin Configuration 3.2 Pin Definitions and Functions Pin Symbol Function IVCC Internal LDO Output; Used for internal biasing and gate drive. Bypass with external capacitor. Do not leave pin IVCC open. 2 SWO Switch Output; Connect to gate of external boost converter switching MOSFET 3 SGND Current Sense Ground; Ground return for current sense switch 4 SWCS Current Sense Input; Detects the peak current through switch 5 NC No Connect; 6 FBH Voltage Feedback Positive; Non inverting Input (+) 7 FBL Voltage Feedback Negative; Inverting Input (-) 8 COMP Compensation Input; Connect R and C network to pin for stability Datasheet 5 Rev..0,

6 Pin Configuration Pin Symbol Function 9 OVFB Output Overvoltage Protection Feedback; Connect to resistive voltage divider to set overvoltage threshold. 0 ST Status Output; Open drain diagnostic output to indicate fault condition. Connect pull up resistor to pin. FREQ / SYNC Frequency Select or Synchronization Input; Connect external resistor to GND to set frequency. Or apply external clock signal for synchronization within frequency capture range. 2 GND Ground; Connect to system ground. 3 EN Enable; Apply logic high signal to enable device. 4 IN Supply Input; Supply for internal biasing. Exposed Pad Connect to GND. Datasheet 6 Rev..0,

7 General Product Characteristics 4 General Product Characteristics 4. Absolute Maximum Ratings Absolute Maximum Ratings ) T j = -40 C to +50 C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Max. Voltages 4.. IN V IN V Supply Input 4..2 EN V EN V Enable Input 4..3 FBH-FBL; V FBH -V FBL V Feedback Error Amplifier Differential 4..4 FBH; V FBH V Feedback Error Amplifier Positive Input 4..5 FBL V FBL V Feedback Error Amplifier Negative Input 4..6 OVFB V OVP V 4..7 Over Voltage Feedback Input V t < 0s 4..8 SWCS V SWCS V 4..9 Switch Current Sense Input V t < 0s 4..0 SWO V SWO V 4.. Switch Gate Drive Output V t < 0s 4..2 SGND V SGND V Current Sense Switch GND 4..3 COMP V COMP V 4..4 Compensation Input V t < 0s 4..5 FREQ / SYNC; Frequency and V FREQ / SYNC V 4..6 Synchronization Input V t < 0s 4..7 ST V ST V 4..8 Diagnostic Status Output I ST -5 5 ma 4..9 IVCC V IVCC V Internal Linear Voltage Regulator Output V t < 0s Temperatures 4..2 Junction Temperature T j C Storage Temperature T stg C Datasheet 7 Rev..0,

8 General Product Characteristics Absolute Maximum Ratings ) T j = -40 C to +50 C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Max. ESD Susceptibility ESD Resistivity to GND V ESD,HBM -2 2 kv HBM 2) ESD Resistivity to GND V ESD,CDM V CDM 3) ESD Resistivity Pin, 7, 8, 4 (corner pins) to GND V ESD,CDM,C V CDM 3) ) Not subject to production test, specified by design. 2) ESD susceptibility, Human Body Model HBM according to EIA/JESD 22-A4B 3) ESD susceptibility, Charged Device Model CDM EIA/JESD22-C0 or ESDA STM5.3. Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as outside normal operating range. Protection functions are not designed for continuous repetitive operation. 4.2 Functional Range Pos. Parameter Symbol Limit Values Unit Conditions Min. Max Supply Voltage Input V IN V V IVCC > V IVCC,RTH,d Feedback Voltage Input V FBH; V V FBL Junction Temperature T j C Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table. 4.3 Thermal Resistance Note: This thermal data was generated in accordance with JEDEC JESD5 standards. For more information, go to Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max Junction to Case ) R thjc 0 K/W ) 2) Junction to Ambient R thja 47 K/W 2s2p R thja 54 K/W s0p mm R thja 64 K/W s0p mm 2 ) Not subject to production test, specified by design. 2) Specified R thja value is according to JEDEC 2s2p (JESD 5-7) + (JESD 5-5) and JEDEC s0p (JESD 5-3) + heatsink area at natural convection on FR4 board; Datasheet 8 Rev..0,

9 Boost Regulator 5 Boost Regulator 5. Description The TLE8386EL boost (step-up) regulator provides a higher output voltage than input voltage. The boost regulator function is implemented by a pulse width modulated (PWM) current mode controller. The PWM current mode controller uses the peak current through the external power switch and error in the output current to determine the appropriate pulse width duty cycle (on time) for constant output current. The current mode controller it provides a PWM signal to an internal gate driver which then outputs the same PWM signal to external n-channel enhancement mode metal oxide field effect transistor (MOSFET) power switch. The current mode controller also has built-in slope compensation to prevent sub-harmonic oscillations which is a characteristic of current mode controllers operating at high duty cycles (>50% duty). An additional built-in feature is an integrated soft start that limits the current through the inductor and external power switch during initialization. The soft start function gradually increases the inductor and switch current over ms (typical) to minimize potential overvoltage at the output. OVFB OV FB H when OVFB >.25V COMP V Ref.25 V = H when IVCC <4.0V UV IVCC FBH FBL x EA gmea I EA Current Comp H when l EA -I SLOPE -I CS >0 OFF when H NOR _ > Output Stage OFF when L R & Q = V Ref 4.0 V INV Gate Driver Supply IVCC SWO FREQ/ SYNC V Ref 0.3 V = Oscillator Soft start I Slope Comp t ISLOP E L when T j > 75 C Clock R & & Q S Q Error-FF NAND 2 & S & PWM-FF Q I CS Gate Driver Current Sense SWCS SGND Figure 3 Boost Regulator Block Diagram Datasheet 9 Rev..0,

10 Boost Regulator 5.2 Electrical Characteristics ) V IN = 6V to 40V; 4.5V V FBH 40V, 4.5V V FBL 40V, T j = -40 C to +50 C, all voltages with respect to ground, positive current flowing into pin; (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. Boost Regulator: 5.2. Feedback Reference Voltage V REF V V IN = 9 V; V REF = V FBH -V FBL Voltage Line Regulation V REF / V IN 0.5 %/V V IN = 6 to 9 V; V BO = 30 V; I BO = 00 ma Figure Voltage Load Regulation V REF / I BO 5 %/A V IN = 9 V; V BO = 30V; I BO = 00 to 500 ma Figure Switch Peak Over Current Threshold V SWCS mv V IN = 6 V V FBH = V FBL = 5 V V COMP = 3.5V Maximum Duty Cycle D MAX,fixed % Fixed frequency mode Maximum Duty Cycle D MAX,sync 88 % Synchronization mode Soft Start Ramp t SS µs V FB rising from 5% to 95% of V FB, typ Feedback Input Current I FBx µa V FBH - V FBL = 0.3 V Switch Current Sense Input I SWCS µa V SWCS = 50 mv Current Input Undervoltage Shutdown V IN,off 3.75 V V IN decreasing 5.2. Input Voltage Startup V IN,on 4.75 V V IN increasing I 380 ma V = 3.5V I 550 ma V =.5V Gate Driver for Boost Switch Gate Driver Peak Sourcing Current ) SWO,SRC SWO Gate Driver Peak Sinking Current ) SWO,SNK SWO Gate Driver Output Rise Time t R,SWO ns C L,SWO = 3.3nF; V SWO = V to 4V Gate Driver Output Fall Time t F,SWO ns C L,SWO = 3.3nF; V SWO = V to 4V Gate Driver Output Voltage ) V SWO V C L,SWO = 3.3nF; ) Not subject to production test, specified by design Datasheet 0 Rev..0,

11 Oscillator and Synchronization 6 Oscillator and Synchronization 6. Description R_OSC vs. switching frequency The internal oscillator is used to determine the switching frequency of the boost regulator. The switching frequency can be selected from 00 khz to 500 khz with an external resistor to GND. To set the switching frequency with an external resistor the following formula can be applied. R FREQ = 0 2 s ( 4 0 [ ]) ( f []) Ω FREQ s 3 ( 3.5 [ Ω ]) [ Ω ] In addition, the oscillator is capable of changing from the frequency set by the external resistor to a synchronized frequency from an external clock source. If an external clock source is provided on the pin FREQ/SYNC, then the internal oscillator synchronizes to this external clock frequency and the boost regulator switches at the synchronized frequency. The synchronization frequency capture range is 250 khz to 500 khz. TLE8386 FREQ / SYNC Oscillator Clock Frequency Detector Multiplexer PWM Logic Gate Driver SWO V CLK R FREQ Oscillator_BlkDiag.vsd Figure 4 Oscillator and Synchronization Block Diagram and Simplified Application Circuit Figure 5 Synchronization Timing Diagram Datasheet Rev..0,

12 Oscillator and Synchronization 6.2 Electrical Characteristics V IN = 6V to 40V; 4.5V V FBH 40V, 4.5V V FBL 40V, T j = -40 C to +50 C, all voltages with respect to ground, positive current flowing into pin; (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. Oscillator: 6.2. Oscillator Frequency f FREQ khz R FREQ = 20kΩ Oscillator Frequency Adjustment Range FREQ / SYNC Supply Current f FREQ khz 7% internal tolerance + external resistor tolerance I FREQ -700 µa V FREQ = 0 V Frequency Voltage V FREQ V f FREQ = 00 khz Synchronization Synchronization Frequency f SYNC khz Capture Range Synchronization Signal High Logic Level Valid V SYNC,H 3.0 V ) Synchronization Signal V SYNC,L 0.8 V ) Low Logic Level Valid Synchronization Signal Logic High Pulse Width t SYNC,PWH 200 ns ) ) Synchronization of external PWM ON signal to falling edge Datasheet 2 Rev..0,

13 Oscillator and Synchronization Typical Performance Characteristics of Oscillator Switching Frequency f SW versus Frequency Select Resistor to GND R FREQ/SYNC ffreq [khz] T j = 25 C R FREQ/SYNC [kohm] Datasheet 3 Rev..0,

14 Enable Function 7 Enable Function 7. Description The enable function powers on or off the device. A valid logic low signal on enable pin EN powers off the device and current consumption is less than 0 µa. A valid logic high enable signal on enable pin EN powers on the device. The voltage at pin IVCC (internal biasing) stays present for the Power Off Delay Time after the the device is switched off by the Enable signal. Figure 6 Timing Diagram Enable Datasheet 4 Rev..0,

15 Enable Function 7.2 Electrical Characteristics V IN = 6V to 40V; 4.5V V FBH 40V, 4.5V V FBL 40V, T j = -40 C to +50 C, all voltages with respect to ground, positive current flowing into pin; (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. Enable Input: 7.2. Enable Turn On Threshold Enable Turn Off Threshold V EN,ON 3.0 V V EN,OFF 0.8 V Enable Hysteresis V EN,HYS mv Enable High Input Current Enable Low Input Current Enable Turn Off Delay Time I EN,H 30 µa V EN/PWMI = 6.0 V I EN,L 0. µa V EN/PWMI = 0.5 V t EN,OFF,DEL ms Enable Startup Time t EN,START 00 µs Current Consumption Current Consumption, Shutdown Mode Current Consumption, Active Mode ) I q_off 0 µa V EN/PWMI = 0.8 V; T j 05C; V IN = 6V I q_on 7 ma V EN/PWMI 4.75 V; I BO = 0 ma; V IN = 6V V SWO = 0% Duty ) Dependency on switching frequency and gate charge of boost and dimming switch. Datasheet 5 Rev..0,

16 Linear Regulator 8 Linear Regulator 8. Description The internal linear voltage regulator supplies the internal gate drivers with a typical voltage of 5 V and current up to 50 ma. An external output capacitor with low ESR is required on pin IVCC for stability and buffering transient load currents. During normal operation the external boost MOSFET switche will draw transient currents from the linear regulator and its output capacitor. Proper sizing of the output capacitor must be considered to supply sufficient peak current to the gate of the external MOSFET switch. Please refer to application section for recommendations on sizing the output capacitor. An integrated power-on reset circuit monitors the linear regulator output voltage and resets the device in case the output voltage falls below the power-on reset threshold. The power-on reset helps protect the external switches from excessive power dissipation by ensuring the gate drive voltage is sufficient to enhance the gate of an external logic level n-channel MOSFET. Figure 7 Voltage Regulator Block Diagram and Simplified Application Circuit 8.2 Electrical Characteristics V IN = 6V to 40V; 4.5V V FBH 40V, 4.5V V FBL 40V, T j = -40 C to +50 C, all voltages with respect to ground, positive current flowing into pin; (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max Output Voltage V IVCC V 6 V V IN 45 V 0. ma I IVCC 50 ma Output Current Limitation I LIM 5 90 ma V IN = 3.5 V V IVCC = 4.5V Drop out Voltage V DR 400 mv I IVCC = 50mA ) Output Capacitor C IVCC 0.47 µf 2) Output Capacitor ESR R IVCC,ESR 0.5 Ω f = 0kHz Undervoltage Reset Headroom V IVCC,HDRM 00 mv V IVCC decreasing V IVCC - V IVCC,RTH,d Undervoltage Reset Threshold V IVCC,RTH,d 4.0 V V IVCC decreasing Undervoltage Reset Threshold V IVCC,RTH,i 4.5 V V IVCC increasing ) Measured when the output voltage V CC has dropped 00 mv from its nominal value. 2) Minimum value given is needed for regulator stability; application might need higher capacitance than the minimum. Datasheet 6 Rev..0,

17 Protection and Diagnostic Functions 9 Protection and Diagnostic Functions 9. Description The TLE8386EL has integrated circuits to diagnose and protect against output overvoltage, open load, open feedback and overtemperature faults. In case any of the four fault conditions occur the Status output ST will output an active logic low signal to communicate that a fault has occurred. During an overvoltage or open load condition the gate driver outputs SWO will turn off. Figure illustrates the various open load and open feedback conditions. In the event of an overtemperature condition the integrated thermal shutdown function turns off the gate drivers and internal linear voltage regulator. The typical junction shutdown temperature is 75 C. After cooling down the IC will automatically restart operation. Thermal shutdown is an integrated protection function designed to prevent immediate IC destruction and is not intended for continuous use in normal operation. Input Output Overvoltage Protection and Diagnostic Circuit Output Open Load Open Feedback OR SWO Gate Driver Off Overtemperature Input Undervoltage OR Pro_Diag_BlckDiag.vsd Linear Regulator Off Figure 8 Protection and Diagnostic Function Block Diagram Figure 9 Input Condition Overvoltage Open Load Open Feedback Overtemperature *Note: Sw = Switching False = Condition does not exist True = Condition does exist Status Output Truth Table Level* False True False True False True False True Output ST SWO IVCC H Sw* Active L L Active H Sw* Active L L Active H Sw* Active L L Active H Sw* Active L L Shutdown Pro_Diag_TT.vsd Datasheet 7 Rev..0,

18 Protection and Diagnostic Functions Figure 0 Open Load and Open Feedback Conditions Datasheet 8 Rev..0,

19 Protection and Diagnostic Functions Figure Status Output Timing Diagram Datasheet 9 Rev..0,

20 Protection and Diagnostic Functions 9.2 Electrical Characteristics V IN = 6V to 40V; 4.5V V FBH 40V, 4.5V V FBL 40V, T j = -40 C to +50 C, all voltages with respect to ground, positive current flowing into pin; (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. Status Output: 9.2. Status Output Voltage Low V ST,LOW 0.4 V I ST = ma Status Sink Current Limit I ST,MAX 2 ma V ST = V Status Output Current I ST,HIGH µa V ST = 5V Status Delay Time t SD ms Temperature Protection: Over Temperature Shutdown T j,sd C Over Temperature Shutdown Hystereses T j,sd,hyst 5 C Overvoltage Protection: Output Over Voltage Feedback Threshold Increasing Output Over Voltage Feedback Hysteresis V OVFB,TH V V OVFB,HYS mv Output Voltage decreasing Over Voltage Reaction Time t OVPRR 2 0 µs Output Voltage decreasing Over Voltage Feedback Input Current I OVFB - 0. µa V OVFB =.25 V Open Load and Open Feedback Diagnostics 9.2. Open Load/Feedback Threshold V REF,, mv V REF = V FBH - V FBL Open Circuit or Open Feedback Threshold V REF,2 0.5 V V REF = V FBH - V FBL Open Circuit 2 Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as outside normal operating range. Protection functions are not designed for continuous repetitive operation. Datasheet 20 Rev..0,

21 Package Outlines 0 Package Outlines Stand Off (.45).7 MAX. C 0.08 C 0.35 x ±0. ) 0. D 2x ± MAX ±0.05 2) 0.5 M C A-B D 4x D 6 ± M D 8x Bottom View A B 0. A-B 2x 4.9 ±0. ) Exposed Diepad 3 ± ±0. Index Marking ) Does not include plastic or metal protrusion of 0.5 max. per side 2) Does not include dambar protrusion PG-SSOP-4--PO V0 Figure 2 PG-SSOP-4 Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). For further package information, please visit our website: Dimensions in mm Datasheet 2 Rev..0,

22 Application Information Application Information Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device. Figure 3 Boost Voltage Application Circuit (Voltage Source) Reference Designator Value Manufacturer Part Number Type Quantity D BO Schottky, 3 A, 00 V R Vishay SS3H0 Diode C BO C IN 00 uf, 80V Panasonic EEVFKK0Q Capacitor 00 uf, 50V Panasonic EEEFKH0GP Capacitor C COMP 0 nf Capacitor C IVCC uf, 6.3V EPCOS MLCC CCNPZC05KBW X76 Capacitor IC -- Infineon TLE8386EL IC IC 2 -- Infineon XC886 IC L BO 00 uh Coilcraft MSS278T-04ML_ Inductor R COMP 0 kω Resistor R FB,R FB3 5 kω, % Panasonic ERJ3EKF502V Resistor R FB2 kω, % Panasonic ERJ3EKF00V Resistor R FREQ,R ST 20 kω, % Panasonic ERJ3EKF2002V Resistor 2 R OVH 5 kω, % Panasonic ERJP06F502V Resistor R OVL kω, % Panasonic ERJ3EKF00V Resistor R CS 50 mω, % Panasonic ERJBCFR05U Resistor T SW N-ch, 75 V, 65 mω Infineon IPD22N08S2L-50 Transistor AppDiagBoostBOM.vsd Figure 4 Bill of Materials for Boost Voltage Application Circuit Note: This is a simplified example of an application circuit. The function must be verified in the real application. Datasheet 22 Rev..0,

23 Application Information I BO DRV L VIN LBO DBO VBO VBATT CIN ISW CBO C C2 4 IN SWO 2 TSW RL SWCS 3 TLE 8386 RCS SGND 4 ROVH Microcontroller (e.g. XC 2000) V CC OVFB 9 RST ROVL Input 0 ST Output Output 3 8 EN FREQ / SYNC COMP FBH FBL 6 7 R FB C COMP IVCC RFB_L R FREQ R COMP CIVCC GND 2 VisioDocument Provisional Parts Figure 5 Boost Voltage Application Circuit (Current Source) Datasheet 23 Rev..0,

24 Application Information. Further Application Information In fixed frequency mode where an external resistor configures the switching frequency the minimum boost inductor is given by the formula infigure 6. L MIN = Minimum Inductacne Required During Fixed Frequency Operation V BO = Boost Output Voltage R CS = Current Sense Resistor f FREQ = Switching Frequency L MIN V BO [ V] R CS [ Ω] [ V] f FREQ [ Hz] Figure 6 Minimum Inductance Required During Fixed Frequency Operation In synchronization mode where an external clock source configures the switching frequency the minimum boost inductor is given by the formula in Figure 7. L SYNC = Minimum Inductacne Required During Synchronization Operation V BO = Boost Output Voltage R CS = Current Sense Resistor L SYNC V BO [ V] R CS [ Ω] [ V] 250kHz Figure 7 Minimum Inductance Required During Synchronization Operation Datasheet 24 Rev..0,

25 Revision History 2 Revision History Revision Date Changes Initial datasheet Datasheet 25 Rev..0,

26 Edition Published by Infineon Technologies AG 8726 Munich, Germany 200 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.