Specification For UV Series
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1 Specification For UV Series Features High Efficacy 3W UV LED Dimension : 4.4mm(L) 4.4mm(W) All Metal Design Cu Substrate/Al reflector with Quartz Glass Lens View Angle 60 Low thermal resistance The InGaN Chip inside Superior ESD protection Applications UV Printing/UV Curing Medical Electronics Assembly Opto Electronics Special Lighting Defect Detection 5F, No 173-8, Yung-Fon Road, Tu-Cheng District, New Taipei City, Taiwan, R.O.C. TEL: FAX : /26 --
2 Table of Contents General Information...3 Part Number Matrix...4 Absolute Maximum Ratings...4 Initial Electrical/Optical Characteristics...5 Forward Voltage...5 Radiant Flux...5 Peak Wavelength...5 Spectra half-width...5 Typical Radiation Pattern...6 Bin Code List for Reference...7 Wavelength Bins...7 Part Number Formation...8 Characteristic Diagram...9 Outline Dimension...13 Pad Configuration...13 Recommended Solder Pattern...15 Shipping Package Style...16 Lens Type...16 Tapping Dimension Packaging Specification...16 Assembly Type...21 Tapping Dimension Packaging Specification...21 Qualification Reliability Testing...24 Recommended Solder Profile /26 --
3 General Information HPL - H44 X1 X21C0 X1:Lens & Assembly Type- R:60 Lens Emitter only T:60 Lens Emitter on Standard Star X2:Color- U: UV390~420nm Power- C: 3W - 3/26 --
4 Part Number Matrix Wavelength Type 60 Lens 60 Lens & Star U HPL-H44TU1C0 Absolute Maximum Ratings (Tj=25 ) Parameter Symbol Rating Unit Power Dissipation UV nm P 3 W Forward Current I F 700 ma Forward Pulse Current (1/10 Duty Cycle, 400msec Pulse Width) I FP 1000 ma Thermal Resistance, Junction-Case R th, J-C1 5 C/W LED Junction Temperature T J 125 C Operating Temperature Range T opr - 40 C to + 80 C Storage Temperature Range T stg - 40 C to C Soldering Condition T sol 260 C For 5 Seconds Note: 1. The thermal resistance value is measured with MCPCB (Star). - 4/26 --
5 I nitial Electrical/Optical Characteristics Forward Voltage (Tj=25 ) Wavelength Forward Voltage Symbol MIN. TYP. MAX. Test Condition Unit 390~420nm VF IF= 700mA V Caution: The real output is decided by chip capability Radiant Flux(Tj=25 ) Wavelength Radiant Flux Symbol MIN. TYP. MAX. Test Condition Unit 410~420nm ~410nm Φe IF = 700mA mw 390~400nm Caution: The real output is decided by chip capability Peak wavelength (Tj=25 ) Wavelength Wavelength Symbol MIN. TYP. MAX. Test Condition Unit 390~420nm λp IF = 700mA nm Spectra half-width (Tj=25 ) Wavelength Wavelength Symbol MIN. TYP. MAX. Test Condition Unit 390~420nm λ IF = 700mA nm - 5/26 --
6 Typical Radiation Pattern Typical spatial Radiation Pattern 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% Angular Displacement Deg Fig. (60 Lens) Typical Representative Spatial Radiation Pattern - 6/26 --
7 Bin Code List for Reference (Tj=25 ) Item Bin Code Symbol Condition Min. Max. Unit H J Forward Voltage 1 Radiant Flux 2 K V F I F = 700 [ma] L M N D E F Φe I F = 700 [ma] G H J V mw Wavelength Bins Wavelength 3 Bin Code Symbol Condition Min. Max. Unit U 390~420nm UF UE UD λp IF = 700 [ma] UC UB UA nm Note 1. Forward voltage measurement allowance is ± 0.1V. 2. Radiant flux measurement allowance is ± 10%. 3. Wavelength measurement allowance is ± 2nm. - 7/26 --
8 Part Number Formation H 4 4 R U 1 C 0 - L F U A Bin Code C Dissipation power Chip Quantity 1 Quantity Wavelength U nm Lens & Assembly Type R Lens 60 Type H High Power L F U A Forward Voltage Bin Code Radiant Flux Bin Code Wavelength Bin Code - 8/26 --
9 Characteristic Diagram Forward Current (ma) Forward Voltage (V) Fig. Forward Current vs. Forward Voltage Relative Intensity Forward Current (ma) Fig. Relative Intensity vs. Forward Current. - 9/26 --
10 1.2 1 Relative Intensity Wavelength (nm) Fig. Typical Relative Intensity vs. wavelength Forward Current (ma) Rth_j-a=30 C/W Rth_j-a=25 C/W Rth_j-a=20 C/W Ambient Temperature ( C ) Note: Fig. Forward Current Degrading Curve Rth_j-a : junction to Ambient Thermal Resistance - 10/26 --
11 1.2 1 Relative Intensity Case Temperature ( C) Fig. Relative Intensity vs. Case Temperature Forward Voltage (V) Case Temperature ( C) Fig. Forward Voltage vs. Case Temperature - 11/26 --
12 Peak Wavelength Shift (nm) Case Temperature ( C) Fig. Peak Wavelength shift vs. Case Temperature - 12/26 --
13 Outline Dimension Unit : mm Fig. Package Outline Drawing. Pad Configuration PAD Function 3 TOP 3 BOTTOM Fig. Pad configuration. 1 Cathode 2 Anode 3 Thermal - 13/26 --
14 HPL-H44TU1C0 Fig. Assembly r Outline Drawing. PROTECTION CIRCUIT LED PROTECTION ZENER - 14/26 --
15 Recommended Solder Pattern SOLDER MASK COPPER LAYER Fig. Solder Pad Layout. - 15/26 --
16 Shipping Package Style Lens Type Tapping Dimension Packaging Specification 60 Degree Lens Type : Moisture proof bag. 1 Reel/bag. Q ty: 650 (MAX)/Reel. Unit : mm - 16/26 --
17 Label Formation 75mm*8mm Package Box Type Dimension (mm) Reel/Box 60 Lens Type (Pcs) Small Box(S) 230x85x265 5 Reel/Box 3250 Middle Box(M) 470x265x Reel/Box Large Box(L) 470x435x Reel/Box Reel Packaging : Reel Part : Unit : mm - 17/26 --
18 Anti Statistic Bag : Unit : mm - 18/26 --
19 Small Box Unit : mm Middle Box Unit : mm - 19/26 --
20 Large Box Unit : mm Label Formation 70mm Unit : mm 40mm - 20/26 --
21 Assembly Type Tapping Dimension Packaging Specification 60 Degree Assembly Type : Moisture proof bag. 21 Tray (MAX) /bag. Q ty: 48pcs(MAX)/Tray Unit : mm - 21/26 --
22 60 Degree Assembly Type : 1 Tube Q ty:20pcs(max)/tube Q ty: 300 Tube (MAX)/Box Unit : mm Label Formation 75mm*8mm - 22/26 --
23 Package Large Box Unit : mm Label Formation 70mm Unit : mm 40mm - 23/26 --
24 Qualification Reliability Testing - 24/26 --
25 Recommended Solder Profile Soldering Recommended soldering conditions: 300 Pre-heat Soaking Reflow T 3 T 1 T 2 T Temperature ( ) Cooling Time (sec) T 1 T 2 T 3 Ramp up rate 1.0 ~ 3.0 /sec Pre-heat time 50 ~ 80 sec Soaking temperature 155 ~ 185 Dwell time during soaking 60 ~ 120 sec Reflow temperature 240 ~ 250 Reflow time Max 10 sec Ramp up rate during reflow 1.2 ~ 2.3 /sec T 4 Cooling 1.0 ~ 6.0 /sec Note: Suggest using Sn96Ag3Cu0.5 lead free solder. Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary. - 25/26 --
26 This page is intended left blank. For the latest product information, call us or visit: 2015, High Power Lighting Corporation(HPL), all rights reserved. This document contains information that is proprietary to HPL and may be duplicated in whole or in part by the original recipient for the internal business purposes only, provided that this entire notice appears in all copies. In accepting this document, the recipient agrees to make every reasonable effort to prevent unauthorized use of this information. 5F, No 173-8, Yung-Fon Road, Tu-Cheng District, New Taipei City, Taiwan, R.O.C. TEL: FAX : /26 --
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365nm UV LED Gen 2 Emitter LZ1 00UV00 Key Features 365nm UV LED with up to 1250mW flux output at 2.7W power dissipation Ultra small foot print 4.4mm x 4.4mm Highest Radiant Flux density Surface mount ceramic
Technical Data Sheet 5mm Infrared LED, T-1 3/4
Technical Data Sheet 5mm Infrared LED, T-1 3/4 Features High reliability High radiant intensity Peak wavelength λp=85nm 2.54mm Lead spacing Low forward voltage Pb free The product itself will remain within
Technical Data Sheet 5mm Infrared LED, T-1 3/4
Technical Data Sheet 5mm Infrared LED, T-1 3/4 Features High reliability 2.54mm lead spacing Low forward voltage Good spectral matching to Si photodetector High radiant intensity Pb free The product itself
Cree TR5050M LEDs CxxxTR5050M-Sxx000
Cree TR55M LEDs CxxxTR55M-Sxx Data Sheet Cree s TR55M LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with Cree s proprietary device technology and
COPYRIGHT 2013 LED ENGIN. ALL RIGHTS RESERVED. LZ4-00G100 (5.4 11/18/13)
High Luminous Efficacy Green LED Emitter LZ4-00G100 Key Features High Luminous Efficacy 10W Green LED Ultra-small foot print 7.0mm x 7.0mm Surface mount ceramic package with integrated glass lens Very
Technical Data Sheet. Top View LEDs with Lens 67-21B/BHC-XS1T2M/BT
Features PLCC-2 package. High flux output. High current capability. White package. Optical indicator. Colorless clear window. Ideal for backlight and light pipe application. Inter reflector. Suitable for
UVLED SMD. Description. Maximum Ratings (T CASE = 25 C) Electro-Optical Characteristics (T CASE = 25 C, I F = 500mA)
UVLED-365-500-SMD v 3.0 02.02.2016 Description UVLED-365-500-SMD is a surface mount infrared High Power LED with a typical peak wavelength of 365 nm and radiant intensity of typ. 500 mw. It comes in ceramic
LED HIGH POWER. Data Sheet Created Date: // // LED HIGH POWER C03 UV Product Series
LED HIGH POWER C03 C08 UV Product Product Series Series Data Sheet Created Date: 09 03 // 03 08 // 2014 2013 Revision: 3.2, 1.3, 05 03 // 29 15 // 2015 2013 1 Created Date : 05/26/2007 Revison : 1.01,
Lamp 339-9SUGSURSUBC/S1174 Features
Lamp Features Popular T-1 3/4 package. High efficiency. Available on tape and reel. Built in red, green, and blue chips. UV resistance epoxy. The product itself will remain within RoHS compliant version
PLCC Series W Plant Lighting
PLCC Series PLCC Series 2835 0.5W Plant Lighting Datasheet Introduction : Ultra high luminous efficacy, combined with the flexibility in design due to its slim and miniature size, PLCC LED Series are optimized
UV RADIATION Avoid exposure to the beam Wear protective eyewear COPYRIGHT 2017 LED ENGIN. ALL RIGHTS RESERVED. LZC-00UB00 (1.
385-410nm VIOLET LED Emitter LZC-00UB00 Key Features Ultra-high flux output 385-410nm surface mount ceramic VIOLET LED package with integrated glass lens 5nm wavelength bins Small high density foot print
UV RADIATION Avoid exposure to the beam Wear protective eyewear. COPYRIGHT 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ1-00UAP5 (Pre 08/23/18)
PRELIMINARY LuxiGen TM Violet LED Emitter Series LZ1 395nm Power LZ1-00UAP5 Key Features Highest Radiant Flux density 395nm LED emitter: 4.1W flux output from 1mm 2 chip Up to 3A max drive current Compact
COPYRIGHT 2017 LED ENGIN. ALL RIGHTS RESERVED. LZ1-00R202 (1.3 4/10/17)
High Efficiency Deep Red 660nm LED Emitter LZ1-00R202 Key Features Deep Red 660nm LED emitter 5.7 µmol/s at 2.6W power dissipation 51% Wall Plug Efficiency Ultra-small foot print 4.4mm x 4.4mm Up to 1.2A
Technical Data Sheet 3mm Infrared LED, T-1
Technical Data Sheet 3mm Infrared LED, T-1 Features High reliability High radiant intensity Peak wavelength λp=94nm 2.54mm Lead spacing Low forward voltage Pb free This product itself will remain within
LZ1-00WW05. LedEngin, Inc. High Luminous Efficacy Warm White LED Emitter. Key Features. Typical Applications. Description
High Luminous Efficacy Warm White LED Emitter LZ1-00WW05 Key Features High Luminous Efficacy 5W Warm White LED Ultra-small foot print 4.4mm x 4.4mm x 3.2mm Surface mount ceramic package with integrated
Technical Data Sheet 0805 Package Chip LED Preliminary
Lead (Pb) Free Product - RoHS Compliant Feature RoHS compliant. Chip LED package. Colorless clear resin Wide viewing angle 140 o. Brightness:11.2 to 28.0 mcd at 5 ma. Qualification according to AEC-Q101.
1206 Reverse Package Super Blue LED TSP3-BF3216-N1P2. Features. Descriptions. Applications. Device Selection Guide
1206 Reverse Package Super Blue LED 1206 Reverse Package Super Blue LED Features Package in 8mm tape on 7 diameter reel Compatible with automatic placement equipment Compatible with infrared and vapor
COPYRIGHT 2018 LED ENGIN. ALL RIGHTS RESERVED. LZ1-00G102 (1.2 01/05/18)
High Luminous Efficacy Green LED Emitter LZ1-00G102 Key Features High Luminous Efficacy Green LED emitter Ultra-small foot print 4.4mm x 4.4mm Up to 1.5A drive current Surface mount ceramic package with
Technical Data Sheet 5mm Infrared LED, T-1 3/4
Technical Data Sheet 5mm Infrared LED, T-1 3/4 Features High reliability High radiant intensity Peak wavelength λp=94nm 2.54mm Lead spacing Low forward voltage Pb free The product itself will remain within
Technical Data Sheet 1.6mm round Subminiature Side Looking Infrared LED
Technical Data Sheet 1.6mm round Subminiature Side Looking Infrared LED Features Small double-end package Low forward voltage Good spectral matching to Si photo detector Package in 8mm tape on 7 diameter
Technical Data Sheet 0.20" Single Digit SMD Display
Features Packaged in tape and reel for SMT manufacturing. Design flexibility (common cathode or anode). Categorized for luminous intensity. The thickness is thinness than tradition display. Pb free. The
COPYRIGHT 2015 LED ENGIN. ALL RIGHTS RESERVED. LZ1-00R102 (1.0 03/27/15)
High Luminous Efficacy Red 623nm LED Emitter LZ1-00R102 Key Features High Luminous Efficacy Red 623nm LED emitter Ultra-small foot print 4.4mm x 4.4mm Up to 1.5A drive current Surface mount ceramic package
SMD REFLECTOR 67-03A/R6GHBHW-A01/2T/MS
Features Package in 8 mm tape on 7 diameter reel Compatible with automatic placement equipment Various Compatible with infrared and vapor phase reflow solder process 4 Pins for separate control of each
DATA SHEET: Multi DomiLED. Bi-Color DKxx-NJS
DATA SHEET: Multi DomiLED Multi DomiLED Synonymous with function and performance, the Multi DomiLED series is perfectly suited for a variety of cross-industrial applications due to its small package outline,