Senior Project Manager / Keysight Joe Lin 林昭彥

Transcription

1 Senior Project Manager / Keysight Joe Lin 林昭彥

2 How do you build a 400G optical link? Multimode fiber or single-mode fiber? IEEE 802.3bs 400G will use both multimode fiber for 100 meter spans and singlemode fiber for 500m to 10 km links NRZ or PAM4? NRZ is used for multimode systems, while PAM4 is used for single-mode systems 2

3 Source, Rob Stone, Source, Samuel Liu, And_v1.pdf. 3

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5 Passive Component Measurements Insertion Loss (IL) Return Loss (RL) Polarization Dependent Loss (PDL) Swept / Multi-Channel IL and PDL Chromatic Dispersion (CD) Polarization Mode Dispersion (PMD) Active Component Measurements Power vs. Wavelength Polarization Spectral Characteristics Gain/Noise Figure O/E E/O Amplitude/Phase Response Receiver Sensitivity/Stress Test Complex Modulation Analysis N7782B PER Analyzer and N7783B Thermal Cycling Unit N7700 series multiport power meter for sweep wavelength and polarization test 5

6 Photonics: - Photonics is the technology of signal processing, transmission and detection where the signal is carried by Photons (light). Silicon Photonics: - Silicon Photonics can be defined as the utilization of silicon-based materials for the generation (electrical-to-optical conversion), guidance, control, and detection (optical-to-electrical conversion) of light to communicate information over distance. Picture: Courtesy of Intel 6

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8 Graphics from GF, IBM, IME All function except light source integrated into Si foundry flow Require optical/electrical test on wafer level 8

9 Silicon Photonics is evolving technology in which data is transferred among computer chips by optical rays can carry far more data in less time than electrical conductors Its overarching goal is to develop hig-volume, low-cost optical components using standard CMOS process. The same manufacturing process used for microprocessors and semiconductor devices. Chip Level Integrated electrical- optical transceiver Closing packing of components ex): Driver/Amplifier/Lasers/Detectors Adding the transceiver to the silicon function library 9

10 picture: courtesy of Molex/Luxtera 10

11 picture: courtesy of NEC picture: courtesy of STm 11

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13 Passive devices: Waveguide Attenuator (VOA) Polarization Beam Splitter Source devices: Light emitting diode (LED) Laser diode (LD) Transmitter optical sub-assembly (TOSA) Transmitter modules (Tx) Optical modulator Receiving devices: Photodiode (PD) Receiver optical sub-assembly (ROSA) Receiver modules (Rx) Wavelength domain: Spectral emission properties: IL/PDL Time domain Eye analysis: tr/f, DC, XP, OMA, ER,... Jitter analysis: TJ, DJ, PJ, RJ,... Frequency domain Bandwidth, flatness Conversion gain or efficiency, Phase, group delay Return loss Phase domain EVM Constrallation diagram I/Q-Eye 13

14 - Wafer manufacture who requires optical/electrical test on wafer level (some vendor ship wafer w/o opt/elec. test) - Component / System manufactures who requires test for incoming inspection 14

15 A R R AY A L I G N M E N T F I B E R A L I G N M E N T B L O C K D I A G R A M W O / O P T I C A L S W I T C H Once optical alignment is successful,penetration power is biggest or reflective power becomes smallest. The location which becomes biggest or smallest is searched by alignment stage controller and stage. Target Port Port1 Top View Port16 Optical Input Signal from TLS 81602/6A Optical Output Signal from Port1/16 Electrical Signal from N7747A analog out - Output level is proportional to Input level from DUT Stage Control signal Tunable Laser Source 81602A Stage Controller w/fiber Alignment Opt. PM Coupler DC Switch Opt. Circulator Port1 Z X Y θ Power Meter w/analog Output N7747A Opt. Circulator Auto Alignment Stage Port16 15

16 T E S T R E G I S T R AT I O N P R O B I N G M E A S U R E R E P O R T I N G D AT A Start Test registration Perform measurement Opt. Char: DC Char.: Freq.Char: Eye Pattern Wafer Load (1-N) Temperature stability waiting Move chip to probing position(1-m) Probe contact 0.5sec under Normal Condition 10sec if distance re-adjustment from contact pad to probe is needed under high temperature condition. Alignment fiber Probe separate Move chip to probing position(1-m) Unload Wafer Wafer Load (1-N) Finish 16

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18 A R A N G E O F P R I C E - P E R F O R M A N C E O P T I O N S 15 db more dynamic range than before 81602A 81606A 81607A 81608A 81609A C-, L-band (options 116, 216) NEW >+11 dbm >+7 dbm >+11 dbm >+11 dbm NEW LR4 range (options 013, 113) >+16 dbm >+11 dbm >+11 dbm >+11 dbm Peak power (options 216, 116) NEW (options 013, 113) >+18 dbm >+12 dbm >+13 dbm = not available >+8 dbm >+12 dbm >+13 dbm >+12 dbm >+13 dbm Signal to SSE ratio 50 db/nm 80 db/nm 75 db/nm 75 db/nm 75 db/nm 4x more throughput than before 81602A 81606A 81607A 81608A 81609A two-way sweep up to 200 nm/s stepped 0.06 sec to accelerate to max speed tune & settle in 300 ms (1 nm step) 4x more accurate than before 81602A 81606A 81607A 81608A 81609A absolute accuracy (static) absolute accuracy (static, typical) ±2 pm ±1.5 pm ±2 pm ±1.5 pm ±5 pm ±3 pm ±20 pm ±5 pm ±30 pm ±10 pm absolute accuracy at max speed (typ.) ±1.5 pm ±1.5 pm ±3 pm ±10 pm wave cell incl. for long-term stability real-time l control, high-res. tracking 18

19 H I G H P E R F O R M A N C E S W E P T - W AV E L E N G T H M E A S U R E M E N T S Application: Use for duplicating multiport IL&PDL setups using PFL software at better price highest dynamic range and best PDL accuracy. (For PDL add the 8169A and N4150A software) N7747A (2 port) 100 db N7748A (4 port) Setup uses 81600B tunable laser with low SSE for highest wavelength purity and N7700A IL software (free) 19

20 Single Dual Graph Roll C O S T - E F F E C T I V E S O L U T I O N F O R H I G H S P E E D L - I - V T E S T I N G L-I-V characteristics Model Ch Range Source Measure Min. Resolution Min. Resolution I V I V Typical system configuration for LD test Min. digitizing interval (Sample rate) Min. programmable interval View Mode B2901A V 20 μs 1 pa 1 μv 100 fa 100 nv 20 μs (50k pts/s) B2902A 2 3 A DC B2911A A pulse 10 fa 100 nv 10 fa 100 nv 10 μs 10 μs (100k pts/s) B2912A 2 20

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22 PAM-4 or NRZ Remote head 2 Input (RX) under test Key features pattern generator: 1 or 2 channels per module with synthesizer (M8045A, 3U) Up to 32/64 Gbaud data rate for each channel PAM-4/NRZ format selection by user interface Built-in de-emphasis 4 taps Built-in calibrated jitter injection: RJ, SJ (multi-tone), clk/2, BUJ, SSC Level non-linearity for PAM-4 Remote head to get close to the DUT (M8057A) Output amplitude 1.8/1.2 Vpp <32/<56GBd Fast transition times 9/11 ps > 32/< 32GBd (20/80% Low intrinsic RJ <200 fs rms (@ Gb/s NRZ) 58 GBd PAM-4 22

23 Key features: Single / Dual / Quad 20-28G optical channel Sample rate 100K or 250 K (option FS1) Jitter below 400 fs without a precision timebase Optical channel noise at < 5 uw incorporates an amplifier which effectively reduces the channel noise from ~11 uw to less than 5 uw A laptop running the same Flex-DCA interface that runs on the 86100D (N1010A, $0) controls the N109X instrument compliant reference receivers for 20, 25.78, 27.95, and 100Gbase-SR4/400Gbase-SR16 TDEC test 23

24 Key features: Balanced measurements up to 67 GHz (new!) Accurate NIST traceable responsivity Fastest time to market with turn key solution Fast and easy calibration, no optical calibration More than 10 times faster then 86030A One UI, one Remote interface for all LCA Electrical External optical sources input for more wavelength N522xA 43.5/50/67GHz PNA based Optical 24

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