Development Board EPC9063 Quick Start Guide

Transcription

1 Development Board EPC906 Quick Start Guide EPC07 00 V Half Bridge with Sync FET Bootstrap Gate Drive Revision.0

2 QUICK START GUIDE DESCRIPTION The EPC906 development board is a 00 V maximum device voltage,.5 A maximum output current, half bridge with onboard gate drives, featuring the EPC07 enhancement mode (egan ) half bridge. The gate driver has been configured with a synchronous FET bootstrap circuit included in the EPC07 device that eliminates high side device losses induced by the reverse recovery losses of the internal bootstrap diode of the gate driver. The purpose of this development board is to simplify the evaluation process of the EPC07 egan half bridge by including all the critical components on a single board that can be easily connected into any existing converter. The inclusion of the synchronous FET bootstrap circuit enables significant increase in operating frequency capability of the half bridge circuit. The EPC906 development board is x.5 and has one EPC07 egan device in a half bridge configuration using Texas Instruments LM5 gate driver with supply and bypass capacitors. The board contains all critical components and layout for optimal switching performance. There are also various probe points to facilitate simple waveform measurement and efficiency calculation. The board includes pads for the inclusion of customer components to facilitate testing in a Buck converter or ZVS Class D amplifier configurations. A complete block diagram of the circuit is given in figure. For more information on the EPC07 egan half bridge please refer to the datasheet available from EPC at The datasheet should be read in conjunction with this quick start guide. QUICK START PROCEDURE Development board EPC906 is easy to set up to evaluate the performance of the EPC07 egan half bridge. Refer to figure for proper connect and measurement setup and follow the procedure below:. Configure the board for either ZVS class D (L ZVS and J) operation OR Buck converter (L buck ) operation.. With power off, connect the input power supply bus to +V IN (J) and ground / return to V IN (J).. For ZVS class D operation, with power off, connect a HF load to the HF output (RF-J OR Vsw-J and GND-J). For Buck converter operation, with power off, connect a DC load to the DC output (+V OUT -J5 and GND-J). Table : Performance Summary (T A = 5 C) EPC906 Symbol Parameter Conditions Min Max Units V DD Gate Drive Input Supply Range 7.5 V V IN Bus Input Voltage Range 80* V V OUT Switch Node Output Voltage 00 V I OUT Switch Node Output Current.5* A V PWM PWM Logic Input Voltage Threshold Minimum High State Input Pulse Width Minimum Low State Input Pulse Width Input High Input Low V PWM rise and fall time < 0ns V PWM rise and fall time < 0ns V V 0 ns 60# ns *Assumes inductive load, maximum current depends on die temperature actual maximum current with be subject to switching frequency, bus voltage and thermals. # Limited by time needed to refresh high side bootstrap supply voltage.. With power off, connect the gate drive input to +V DD (J90, Pin-) and ground return to V DD (J90, Pin-). 5. With power off, connect the input PWM control signal to PWM (J70, Pin-) and ground return to either Pin- or Pin- of J Turn on the gate drive supply make sure the supply is within the 7.5 V and V range. 7. Turn on the controller / PWM input source. 8. Turn on the bus voltage to the required value (do not exceed the absolute maximum voltage of 80 V on V OUT ) and probe switching node to observe switching operation. 9. Once operational, adjust the bus voltage and load PWM control within the operating range and observe the output switching behavior, efficiency and other parameters. 0. For shutdown, please follow steps in reverse. NOTE. When measuring the high frequency content switch node, care must be taken to avoid long ground leads. Measure the switch node by placing the oscilloscope probe tip through the large via on the switch node (designed for this purpose) and grounding the probe directly across the GND terminal provided. See figure for proper scope probe technique. V DD Gate Drive Regulator 5 V Q C R Damp V IN HF Output PWM C DECP Logic and Dead-time Adjust D ENH* D V7 Level Shift Q A C Bypass L ZVS L Buck COUT C ZVS DC Output GND Q B PGND R Bleed R ON EPC906 development board photo C ENH D OFF Turn-on delay Turn-off immediate Figure : Block diagram of EPC906 development board EPC EFFICIENT POWER CONVERSION CORPORATION COPYRIGHT 06

3 QUICK START GUIDE VDC > Main voltage measurement + Switch-node oscilloscope probe VIN supply (note polarity) Ground post High frequency connection Dead-time setting (if installed) + 80 VDCmax VMain supply (note polarity) SMA (optional) DC output Control signal inputs V DC output measurement Figure : Proper connection and measurement setup Do not use probe ground lead Ground probe against post Place probe tip in large via Minimize loop Figure : Proper measurement of the switch nodes EPC EFFICIENT POWER CONVERSION CORPORATION COPYRIGHT 06

4 QUICK START GUIDE MEASUREMENT CONSIDERATIONS The EPC906 development board has been provided with specially designed high frequency (up to GHz minimum) capable measurement connections using MMCX connectors located at J & J with direct access to the gate signals of both the upper and lower FETs. These nodes can be measured directly using the Tektronix IsoVu probe shown in figure. Figure 5 shows typical gate waveforms measured using the IsoVu probe. Please contact EPC for special instructions on using these connections. To prevent an unterminated transmission line hanging on the gate it is recommended to remove resistors R & R when not using this feature. The maximum impedance loading of these nodes is.5 kω. Tektronix is a leading manufacturer of power test solutions for design validation, characterization, and performance testing. EPC partnered with Tektronix to define the requirements for accurate measurements on GaN devices which led to the development of the Tektronix IsoVu measurement system. IsoVu is a galvanically isolated differential measurement system with GHz bandwidth, Million to (0 db) common mode rejection ratio, 50 V differential, and 000 V common mode voltage range. Previously impossible differential measurements such as the high-side VGS are now possible because of IsoVu s high common mode rejection across bandwidth. IsoVu allows you to: Characterize the time alignment of high side and low side events Optimize and tune switching characteristics such as edge rates, overshoot, ringing and dead time See the interactions due to parasitic coupling between the high and low side transistors Figure : Tektronix IsoVu measurement setup. Make isolated high frequency current measurements using low impedance sense resistors This native connection between the high and low side gate-source nodes to an IsoVu probe tip cable has less than pf common mode loading and completely eliminates ground loops due to its galvanic isolation. These MMCX connectors offer a shielded coaxial environment to the test point which minimizes noise pickup. Improve reliability through accurate characterization across all operating conditions EPC would like to acknowledge Tektronix ( isolated-measurement-systems) for their support of this project. VSW VSW GHS GLS GLS GHS Figure 5: Upper gate and lower gate measurements using the Tektronix IsoVu and switch-node voltage measurement using the TPP000 probe. EPC EFFICIENT POWER CONVERSION CORPORATION COPYRIGHT 06

5 QUICK START GUIDE THERMAL CONSIDERATIONS The EPC906 development board showcases the EPC07 egan half bridge with integrated synchronous bootstrap. Although the electrical performance surpasses that for traditional silicon devices, their relatively smaller size does magnify the thermal management requirements. The EPC906 is intended for bench evaluation with low ambient temperature and convection cooling. The addition of heat-sinking and forced air cooling can significantly increase the current rating of these devices, but care must be taken to not exceed the absolute maximum die temperature of 50 C. A heatsink kit can be used with this board and the assembly is shown in figure 6. Contact EPC for more information on the heatsink kit. NOTE. The EPC906 development board does not have any current or thermal protection on board. Heat sink shim Cross-section plane Mounting holes center line 56 x / inch nylon screw Heat-sink Shim (Copper shown) Heat sink (5 mm x 5 mm x.5 mm) Thermal interface material for device 5 mm x 5 mm. adhesive on both sides of thermal pad OPTIONAL interface frame heat sink rests on frame (thickness = die thickness) EPC die 56 nylon hex nut Figure 6: Assembly of the heatsink kit Table : EPC906 Board Item Qty Reference Part Description Manufacturer Part Number C, C, C 0 nf, 00 V TDK C005X7SA0K050BB C, C5, C6 µf 00 V TDK C0X7SA05K5AB C7 µf 00 V TDK C0X7SA05K5AB C0.7 µf, 0 V Samsung CL05A75MP5NRNC 5 C, C, C6 00 nf, 5 V TDK C005X7RE0K050BB 6 C, C pf, 50 V Kemet C00C0J5GACTU 7 C5 nf, 5 V TDK C005X7REK050BB 8 C7, C7 00 nf, 5 V TDK C608X7RE0K 9 C95, C96, C97 µf, 5 V TDK C608X7RE05K 0 D0 0 V 00 ma ST BAT5KFILM D 5 V, 50 mw Bournes CD060-Z D, D5 0 V 0 ma Diodes Inc. SDM0U0-7 D7, D75 0 V 0 ma Diodes Inc. SDM0U0 GP." Male Vert. pos Würth J, J, J, J5 x." Male Vert. TE Connectivity J70." Male Vert. pos Tyco J90." Male Vert. pos Würth Q 00 V 0 mω with SB EPC EPC07 9 R, R 0 Ω Stackpole RMCF00ZT0R00 0 R Ω7 Panasonic ERJ-GEJR7X EPC EFFICIENT POWER CONVERSION CORPORATION COPYRIGHT 06 5

6 QUICK START GUIDE Table : EPC906 Board cont. Item Qty Reference Part Description Manufacturer Part Number R5 0 Ω Stackpole RMCF00JT0R0 R6 7 k Panasonic ERJ-GEJ7X R70 0 k Yageo RC060JR-070KL R7 0 Ω Panasonic ERJ-RKF00X 5 R75 80 Ω Panasonic ERJ-RKF800X 6 TP, TP, TP, TP SMD probe loop Keystone U0 00 V egan driver Texas Instruments LM5TM 8 U7 In AND Fairchild NC7SZ08L6X 9 U7 In NAND Fairchild NC7SZ00L6X 0 U V 50 ma DFN Microchip MCP70T-500E/MC Optional Components Item Qty Reference Part Description Manufacturer Part Number J SMA Board Edge Linx CONREVSMA0.06 J, J MMCX SMD Molex Lbuck example 0 μh,.5 A Wϋrth 70 Lzvs example 500 nh CoilCraft 99SQ-50JEB 5 P7, P75 k Murata PV7W0C0B00 6 R7, R7 0 Ω Panasonic ERJ-GEY0R00V 7 R7 0 k Yageo RC060JR-070KL Heatsink Kit Item Qty Part Description Manufacturer Part Number Screw Mach Phil -56 x / Nylon B&F Fastener Supply NY PMS PH Heatsink mounting shim Custom - Request from EPC PCBshim Heat-sink 5mm x 5mm x.5mm Advanced Thermal Sol ATS-550K-C-R0 Thermal interface pad with adhesive Wakefield 7-7-A 5 Nylon washer Keystone Electronics 7 6 Washer Flat # Stainless Steel B&F Fastener Supply FWSS 00 7 Washer internal tooth # Stainless Steel B&F Fastener Supply INT LWSS 00 8 Hex Nut /6" -56 Stainless Steel B&F Fastener Supply HNSS56 8 Hex Nut /6" Nylon -56 B&F Fastner NY HN 56 6 EPC EFFICIENT POWER CONVERSION CORPORATION COPYRIGHT 06

7 QUICK START GUIDE Logic Supply 7.DC - VDC J90 V7in." Male Vert. R70 0k A B C7 00nF, A B C7 00nF, U95 MCP 70T-500E/MC 5.0V 50mA DFN C95 µf, OUT Logic Supply Regulator U7 NC7SZ08L 6X 0E Deadtime Right P7 Y D7 SDM0U0 U7 NC7SZ00L 6X 80E Deadtime Left P75 D75 SDM0U0 C96 µf, HS U0 L M5TM Gate Driver HS GRH GRH GL H GL H C µf 00V GND PWM IN H_Sig L _Sig C97 µf, C pf, 50V H_Sig L _Sig C pf, 50V GRret TP SMD probe loop C 0nF, 00V GRret PH ProbeHole L zvs DNP 500nH ZVS Tank Circuit GP." Male Vert. J x." Male Vert. Main Supply Input J SMA Board Edge J70." Male Vert. PWM PWM PWM R7 DNP PWM PWM PWM PWM R7 DNP 0E R7 DNP 0E C 00nF, Gbtst R E7 C 00nF, D CD060- Z D SDM0U0-7 Synchronous Boostrap Power Supply.7V C6 00nF, C5 nf, R6 7k C 0nF, 00V.7V HS DNP R5 0E D0 BAT5K FIL M C0.7µF, 0V GL H TP SMD probe loop L buck DNP Output C6 µf 00V HF Ground Post C 0nF, 00V C7 µf 00V C5 µf 00V Buck Output HF Output V7in R7 DNP k R75 DNP k QB EP C07 00V 0mE with SB D5 SDM0U0-7 R 0E EMP TY J MMCX SMD EMP TY GRH GRret GL H QA EP C07 00V 0mE with SB TP TP SMD probe loop Output SMD probe loop J5 x." Male Vert. J x." Male Vert. SW Output J x." Male Vert. GND R 0E EMP TY J MMCX SMD EMP TY GRret Figure 7: EPC906 Schematic EPC EFFICIENT POWER CONVERSION CORPORATION COPYRIGHT 06 7

8 For More Information: Please contact or your local sales representative Visit our website: Sign-up to receive EPC updates at bit.ly/epcupdates or text EPC to 88 EPC Products are distributed through Digi-Key. Demonstration Board Warning and Disclaimer The EPC906 board is intended for product evaluation purposes only and is not intended for commercial use. Replace components on the Evaluation Board only with those parts shown on the parts list (or Bill of Materials) in the Quick Start Guide. Contact an authorized EPC representative with any questions. This board is intended to be used by certified professionals, in a lab environment, following proper safety procedures. Use at your own risk. As an evaluation tool, this board is not designed for compliance with the European Union directive on electromagnetic compatibility or any other such directives or regulations. As board builds are at times subject to product availability, it is possible that boards may contain components or assembly materials that are not RoHS compliant. Efficient Power Conversion Corporation (EPC) makes no guarantee that the purchased board is 00% RoHS compliant. The Evaluation board (or kit) is for demonstration purposes only and neither the Board nor this Quick Start Guide constitute a sales contract or create any kind of warranty, whether express or implied, as to the applications or products involved. Disclaimer: EPC reserves the right at any time, without notice, to make changes to any products described herein to improve reliability, function, or design. EPC does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, or other intellectual property whatsoever, nor the rights of others.