LX3055 4Gbs Singlet InGaAs PIN PHOTODIODE

Transcription

1 4Gbs Singlet InGaAs PIN PHOTODIODE Manufactured by: Microsemi Integrated Products Garden Grove, CA Telephone: More than solutions enabling possibilities

2 INTRODUCTION CONFIDENTIAL INFORMATION This new product introduction guide is intended for use only by Microsemi s sales people and authorized representatives and distributors. This material can be adapted for customer presentations, but the sales strategy and summary [pricing, availability, etc.] is confidential and should not be shown to customers. DESCRIPTION Microsemi s InGaAs/InP PIN Photo Diode chips are ideal for high bandwidth 1310nm and 1550nm optical networking applications. The device series offers high responsivity, low dark current and high bandwidth for high performance and low sensitivity receiver design. The LX Gbps coplanar waveguide photodiode is currently offered in die form allowing manufacturers the versatility of custom assembly configurations including traditional wirebond or flip chip assembly. This device is ideal for manufacturers of optical receivers, transponders, optical transmission modules and combination PIN photo diode transimpedance amplifier Copyright 2001 Page 2

3 KEY PRODUCT INFORMATION BLOCK DIAGRAM KEY FEATURES LX3055 single die, 3 Gbs, 80µm active area Coplanar Waveguide, 50 ohm characteristic impedance High Responsivity Low Dark Current High Bandwidth Anode/Cathode on illuminated Side 125µm Pad pitch Die good for bond wire or flip chip applications Die good for non-hermetic packaging (passed bare-die 85/85 test) Copyright 2001 Page 3

4 TYPICAL APPLICATION LX Gigabit Fiber Channel for 1310 nm wavelength APPLICATIONS Up to 4 Gigabit telecom, datacom, fibre channel, storage application. SONET/SDH OC48/STM16 Connections Internal Telecom and Datacom Switch/Router Connection Any optical link over single-mode fiber at a maximum distance of 40km Good for any data rate 1.25/2.5/3.125/ 4/Gbps Copyright 2001 Page 4

5 COMPETITIVE ANALYSIS LX3055 Competitor Device Aperture Diameter (µm) (GHz) Bandwidth Capacitance (pf) Responsivities (A/W) Dark Current Microsemi LX Albisopto PDCS65T Optical BW Emcore (na) Notes compete with LX3050, not LX3055 Luxnet DI2C BW not enough Alternative Microsemi Solutions Device Description Notes LX Gbps If a bigger aperture is desired LX Gbps If a high bandwidth is desired Copyright 2001 Page 5

6 SALES STRATEGY Customers Our customers make these products: photo-receiver, transceiver, and transponder. Most customers have their custom packages and want to buy bare PIN photodiode die. Customers are very technically oriented and need to work with Microsemi technical support. Potential Customers Vitesse Picolight Finisar JDSU MindSpeed MAXIM Luxtera Lightron Copyright 2001 Page 6

7 Pricing SUMMARY Device Package Industrial (-25 to 85 C) DC LX3055 Bare Die $3.33 $4.09 Note: Availability Options Samples: Production: Packages: Temperature: Technical Support Datasheet: Now Now Application Note: Evaluation Board: Factory Contacts Bare Die Technical Questions: Marketing Manager: -25 C to +85 C Microsemi Website N/A N/A Jay Lai jlai@microsemi.com Michael Kim mkim@microsemi.com Copyright 2001 Page 7