TECHNICAL NOTE 10 IC LIN( LIN LIN LIN. Light Control Unit (LCU) Figure 1 ( ) Direct Drive. ( Direct Drive ) DirectDrive (EMC.

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1 TECHNIC NOTE 10 IC HID( ) IN( ) IN IN IN Figure 1 ( ) ight Control (CU) Headlamp us or Hard Wired ight Control us or Direct Drive evelling ctuator with Direct Drive ending ctuator with Mechatronics Drive FS ctuator with Direct or Mechatronics Drive Figure 1. asic Wiring Elements ( Direct Drive ) ( ) ( ) Direct Drive (PWM ) DirectDrive (EMC ) ( ) (CU ) Semiconductor Components Industries, C, 2013 January, 2013 Rev. 2 1 Publication Order Number: TND337JP/D

2 IN IN IN 1 1 ( ) IN IN IN 1 1 Master Control Master Task Slave Control Slave Control Slave Task Slave Task Slave Task us HEDER MESSGE FRME RESPONSE Inter-frame Space or REK SYNCH REK SYNCH FIED IDENT FIED DT FIED DT FIED DT FIED DT FIED CHECKSUM FIED In-frame Response Space Inter-byte Space Figure 2. IN asic Network and Message Frame IN 19,200 IN 8 10 ms 5 ms 1 FS ( ) INlin-subbus.org CU 6100 Table HID CU 2

3 Table 1. HEDMP WIRING CSSIFICTION Variable Value Subtype Name Comments & Constraints Headlamp Type Halogen eveling H1 ctual Standard is S1, C1, 2 eveling + ending H2 C3 too Expensive 1 not Standard if C1 or C2 > only 1 out of (1, 1) HID eveling H3 ctual Standard is S1, C1, 1 eveling + ending H4 If C1 or C2 > only 1 out of (1, 1) eveling + ending + FS Sensor Signals Wired S1 No with C3 and (C2 Combined with H4 or H5) us S2 Control e C1 S Variable Not Relevant Sing Car Front C2 Dual 1 per Headlamp C3 eaving ctuator Direct Drive 1 Multiplex 2 ending ctuator Direct Drive 1 Variable Not Relevant for H1, H3 Multiplex 2 FS ctuator Direct Drive 1 Variable Not Relevant for H1, H2, H3, H4 Multiplex 2 H5 CU Figure 3 1 H1 DC ( H1a) HID (Table 1 ) H1bH1 IN CU 1 CU 1 CU 1 Figure FME H2a HID H2b ( ) H2a H2b CU PWM( ) H1 H1b PWM H2a H2b HID () 3

4 rchitecture H1 Power & ulbs djust nalog nalog rchitecture H1a djust ight Control nalog nalog Drive/F Drive/F Power & ulbs rchitecture H1b Power & ulbs djust ight Control IN IN Figure 3. Halogen, Cabin ocation of CU rchitecture H2a rchitecture H2b Power & ulbs Power & ulbs eft eft djust on us/pwm nalog Drive/F us/pwm Power & ulbs Front ight Control djust on us/pwm us/pwm IN Power & ulbs Front ight Control Figure 4. Halogen, Front ocation of CU 4

5 HID HID CU HID CU (PWM ) Figure 5 IN FS X1a X1b IN IN X1b H1b HID rchitecture X1a Power, ulbs & ifunction ISO 9141 ISO 9141 allast ight Control Drive/F Drive/F IN IN rchitecture X1b Power, ulbs & ifunction allast ight Control IN IN Figure 5. HID, Cabin ocation of CU HID CU 1 Figure 6 CU X2a X2b H1a H1b FS (CN IN ) HID ( FS ) CU HID CU IN HID CU 2 Figure 7 1CU 1 X3a CU FS X3b IN X3a X3b IN 5

6 rchitecture X2a eft Power, ulbs & ifunction Power, ulbs & ifunction on us us -- allast Front ight Control Drive/F IN -- allast rchitecture X2b eft Power, ulbs & ifunction Power, ulbs & ifunction on us us allast Front ight Control IN IN allast Figure 6. HID, Front ocation of Single CU rchitecture X3a eft Power, ulbs & ifunction Power, ulbs & ifunction on us us allast Front eft ight Control Direct/F IN IN Direct/F allast Front ight Control rchitecture X3b eft Power, ulbs & ifunction Power, ulbs & ifunction on us us allast Front eft ight Control IN IN allast Front ight Control Figure 7. HID, Front ocation of Dual CU 6

7 H1b X1b 2 ( PWM) HID H2 X2 CU( ) X3 OEM 1 HID ( FS) IN IN IN IN IN CU IN MIS IN ( ) ( ) CU IN ININ Figure 8 IN Optional Switch Inputs 14 V/24 V VDD1 V REG IN Protocol Positioning IP Microstepping PWM oop Current Meas. Chargepump H H 2 Stepper Motor VDD1 Figure 8. pplication Diagram IN Stepper Motor 7

8 IN EMC IN [1] [2] Gerd ahnmueller, Headlamp Development-Reduced Time to Market, P 2001 Symposium, Darmstadt University of Technology. [3] lexis Dubrovin, Optimised ighting Systems rchitecture, P 2001 Symposium, Darmstadt University of Technology. [4] Michael Hamm, System Strategies for daptive ighting Systems, P 2001 Symposium, Darmstadt University of Technology. [5] Geert Vandensande, System-on-Chip Slave Nodes, paper presented at 1st International IN Conference, September 2002, udwigsburg. [6] John V. DeNuto et al., IN us and its Potential for use in Distributed Multiplex pplications, SE Technical Paper ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. listing of SCIC s product/patent coverage may be accessed at Marking.pdf. SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should uyer purchase or use SCIC products for any such unintended or unauthorized application, uyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUICTION ORDERING INFORMTION ITERTURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. ox 5163, Denver, Colorado US Phone: or Toll Free US/Canada Fax: or Toll Free US/Canada orderlit@onsemi.com N. merican Technical Support: Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative TND337JP/D