LIGHT EMITTING DIODE SPECIFICATION DESCRIPTION: XT1-5630BXRY-DN

Transcription

1 LIGHT EMITTING DIODE SPECIFICATION DESCRIPTION: XT1-5630BXRY-DN REVISION: V1.0 ISSUE DATE: 2014/03/26 1 / 17

2 Revision Note Date Revision Page Vision 2014/03/26 Initiate Document 1~17 V1.0 2 / 17

3 Lighting LED Specification XT1-5630BXRY-DN White LED Specification Features Feature of the device: Small package with high efficiency Typical view angle: 120 Soldering methods: SMT Grouping parameter: Brightness, Forward Voltage and Chromaticity. The product itself will remain within RoHS compliant version. Applications LED Bulb application Plate lighting source Panel Light luminaire Indicator & in-direct lighting Retrofit applications Materials Items Description Housing Encapsulating Resin Electrodes Die attach Chip Heat resistant polymer Silicone resin Ag plating copper alloy Thermal conductive paste InGaN 3 / 17

4 Dimensions 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are ± 0.2mm. 4 / 17

5 Product Nomenclature XT BXRY-DN Where: Group 1(XT1): Group 2(5630): LumenMax PLCC 1 Chip Type Package size 5.7mm x 3.0mm Group 3(B XR Y): CR-Cool white /CRI 80 UP NR-Natural white /CRI 80 UP WR-Warm white /CRI 80 UP Group 4(DN): Operating current 150mA, no zener chip 5 / 17

6 Absolute Maximum Ratings (T A =25 ) Parameter Symbol Rating Unit DC Forward Current (1) I FD 180 ma Pulse Forward Current (tp 10ms,Duty cycle=1/10) I FP 450 ma Reverse Voltage V R 5 V Reverse Current I R 10 ua ESD Sensitivity (HBM) VB 2,000 V LED Junction Temperature T j 125 Operation Temperature T opr -40~80 Storage Temperature T stg -40~80 Thermal resistance R th 20 /W 1. The solder pad temperature must be lower 80 C. (Ts<80 C) 6 / 17

7 Electrical-Optical Characteristics For Individual LED (T A =25 ) Parameter Symbol Color Bin Min Max Unit Condition Cool White Brightness (1) Ф v Natural white lm I F =150mA Warm white Color rendering Index (2) CRI ALL R % 1. Luminous intensity is measured with the accuracy of ± 10%. 2. CRI measurement tolerance is ± 3,for porduct nomenclature group 3. Parameter Symbol Bin Min Max Unit Condition VA VB Forward Voltage (1) V F VC VA V I F =150mA VB VC Forward Voltage measurement tolerance is ± 0.1V. 7 / 17

8 Relative Luminous Intensity Typical Electro-Optical Characteristics Curves Relative Spectrum Distribution IF=150mA, T Ambient =25 Forward Voltage vs Forward Current T Ambient =25 Luminous Relatie Intensity vs Forward Current, T Ambient =25 Typical Representative Spatial Radiation Pattern θ 1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2. View angle tolerance is ± Degree (2 ) 8 / 17

9 Chromaticity Coordinate Groups Cool White Item Central CIE(X,Y) (0.3123,0.3282) (0.3287,0.3417) (0.3447,0.3553) g g g Macadam ellipse 3step,tolerance: ± 0.5 step /STUV 57/STUV 50/STUV Macadam ellipse 5step,tolerance: ± 0.5 step. 9 / 17

10 Cool White 7050K Y C 70D 70Z K X B 65A 65W Y C 65D 65Z K X B 57A 57W Y C 57D 57Z / 17

11 5000K 50X 50Y B 50A 50W C 50D 50Z CIE-X Y measure tolerance: ± / 17

12 Neutral White Item 403 Central CIE(X,Y) (0.3818,0.3797) g g g Macadam ellipse 3step,tolerance: ± 0.5 step 2. 40/STUV Macadam ellipse 5step,tolerance: ± 0.5 step 12 / 17

13 Neutral White 4500K X B 45A 45W Y C 45D 45Z K X B 40A 40W Y C 40D 40Z CIE-X Y measure tolerance: ± / 17

14 Warm White Item Central CIE(X,Y) (0.4073,0.3917) (0.4338,0.4030) (0.4578,0.4101) g g g Macadam ellipse 3step,tolerance: ± 0.5 step 2. 35/STUV 30/STUV 27/STUV Macadam ellipse 5step,tolerance: ± 0.5 step 14 / 17

15 Warm White 3500K A B 35C 35D K A B 30C 30D K A B 27C 27D CIE-X Y measure tolerance: ± / 17

16 Carrier Tape Dimensions: Standard loaded quantity 3000pcs per reel Reel Specification 16 / 17

17 Reflow Soldering Recommend tin glue specifications: Melting temperature: 150~260 Contains: Sn96.5%,Ag3.0%,Cu 0.5% JIS Z 3282 TEST Never take next process until the component is cooled down to room temperature after reflow The recommended reflow soldering profile (measuring on the surface of the LED resin) is following Cleaning The conditions of cleaning after soldering: An alcohol-based solvent such as Isopropyl Alcohol (IPA) is recommended. Temperature Time :< 50 30sec, or <30 3min Ultra sonic cleaning :< 15W/bath volume: 1 liter max Curing: 100 max,<3min Cautions of Pick and Place It should be avoided to load stress on the resin during high temperature. Avoid rubbing or scraping the resin by any object. Electric-static may cause damage to the component. Please confirm that the equipment is grounding well. Using an ionizer fan is recommended. Cautions of Design and Applications It should be done to connect with a current-limiting serial resistor. Avoid to drive reverse voltage over the specifications on LED when ON/OFF Any application should refer to the specifications of absolute maximum ratings. The dimensions of the recommended soldering pattern may not meet every user. Please confirm and study first before designing the soldering pattern in order to obtain the best performance of soldering. Do not contact with any component on the assembly board. 17 / 17