Pressure Sensors for Printed Blast Dosimeters

Size: px
Start display at page:

Download "Pressure Sensors for Printed Blast Dosimeters"

Transcription

1 Pressure Sensors for Printed Blast Dosimeters Jurgen Daniel +, Tse Nga Ng, Sean Garner and Ana Claudia Arias Palo Alto Research Center (PARC) Palo Alto, CA 94304, USA + Daniel@parc.com John Coleman, Jianzhong Liu and Ronald Jackson * Naval Medical Center San Diego San Diego, CA, USA * Ronald.Jackson@med.navy.mil Abstract Disposable printed sensor tapes are being developed to record the magnitude of explosive blasts in the battlefield. The goal is to detect and mitigate the possible occurrence of traumatic brain injury in soldiers. This paper presents results on the pressure sensors to measure the blast pressure and the blast noise. The sensors are based on piezoelectric polymers and their fabrication is compatible with roll-to-roll fabrication methods to enable low cost. I. INTRODUCTION Printing technologies are promising for the fabrication of large-area and low-cost electronics devices, particularly when combined with roll-to-roll (R2R) processes. We have previously used inkjet printing to fabricate active-matrix transistor backplanes for reflective displays such as electronic paper [1,2]. Here, we apply a related technology towards printed sensor systems. Our goal was to use technologies that are compatible with flexible substrates to fabricate disposable blast dosimeter tapes that can be attached to a soldier s helmet. Blast events due to improvised explosive devices (IEDs) are a major cause of traumatic brain injury (TBI) in the battlefield [3]. The tape-like dosimeter is designed to measure and record the force and the number of blast events during one week in order to enable early administration of medical care. The disposable tape would be replaced with a new one after reading out the stored data. The goal was to implement measurements of blast pressure, blast noise, acceleration and light on the sensor tape together with printed circuitry to process and store the sensor data. An integrated flexible battery would function as the power source. This paper focuses on the pressure sensors to record the extent of the blast pressure wave and the acoustic pressure (or sound pressure) of an explosion. Printed amplifier [4], data acquisition and memory circuitry [5] was developed in parallel to this work. II. SENSOR DESIGN The blast dosimeter was designed so that pressure and acoustic sensors would cover the ranges of psi and db (equivalent to psi). Both types of sensors Figure 1. Printed blast pressure and acoustic sensors connected to conventional charge amplifiers and mounted on rigid aluminum holders for test experiments. have a similar design, with the acoustic sensors being slightly larger due to the lower pressure range. Sets of ten blast pressure and ten acoustic sensors were fabricated, calibrated and tested. Figure 1 shows the sensors attached to rigid aluminum holders for test experiments. A sensing concept based on piezoelectric polymers was chosen for the pressure and acoustic sensors because of attributes such as low power consumption, flexibility, reduced sensor drift and compatibility with solution or web processing. Particularly the need for low power operation favored piezoelectric sensing. Also the reduced sensitivity to static strain, which may occur in a flexible device, was an important factor [6]. While piezoelectric sensors cannot measure absolute pressure changes, they are well suited for short-term transients such as blast overpressure. The design of the pressure sensors is based on a suspended sensor membrane over a cavity. Deflection of the membrane due to a pressure change causes strain in the piezo-polymer film and therefore induces a charge which can be measured as

2 a voltage across the film. This voltage V is dependent on the film capacitance and the input impedance of the readout electronics. In the ideal case of infinitely high input impedance, the voltage is given by V= g31 in-plane stress film thickness, (1) where g31 is the piezoelectric coefficient [7]. Piezoelectric materials are also sensitive to temperature changes because of the pyroelectric effect. Therefore, the sensors were designed with an added thermal mass over the piezoelectric film to delay and weaken the temperature signal. This is particularly important for measuring blast events where the blast wind can cause temperature changes. For both types of sensors, a rugged design was essential to survive the maximum targeted pressure of 100 psi. Moreover, the blast pressure sensors had to be fast enough to capture the peak pressure of a blast wave. The developed blast pressure sensors had a calculated resonance frequency around 21 khz which enables them to capture pressure peaks with rise-times well below 1 ms. III. FABRICATION Fabrication methods that would allow R2R processing, including printing, lamination, die cutting and laser machining were chosen to enable inexpensive manufacturing. Due to the different sensitivity ranges for blast pressure and acoustic sensors, two different fabrication approaches were chosen (Fig. 2). One is based on the lamination of a piezoelectric foil, the other one on a solution process to deposit the piezo material. Although eventually only one method may be selected, this path also enabled us to evaluate the advantages and disadvantages of either process. A. Solution Process The pressure sensors were fabricated by depositing a polyvinylidene fluoride - trifluoroethylene (PVDF-TrFE) copolymer film from solution onto a sensor foil. The polymer was spin-coated to a thickness between 1 and 5 µm and slotcoating or inkjet printing may be used in a R2R process. The polymer was then heated to form polar beta-phase crystallites and subsequently oriented by corona charge poling. A top electrode was patterned via inkjet printing of conductive silver ink or PEDOT:PSS conductive polymer [8,9]. For prototyping purposes, some of the top contacts were also deposited by sputtering of Pd/ Au through a shadow mask. The sensor foil was then aligned and laminated to a spacer foil in which a 6 mm diameter hole was formed. This bilayer foil is laminated to a substrate. The top electrode and the stainless steel bottom electrode are connected to the input of an amplifier circuit with silver ink. An elastomer layer is formed on the sensor membrane as thermal mass to reduce the sensor temperature sensitivity. By choosing an elastomeric material, the increase of the mechanical stiffness of the sensor membrane is minimized. Figure 2. Fabrication of printed blast pressure and acoustic sensors using a combination of lamination and printing methods. All of these techniques are compatible with roll-to-roll processing. B. Lamination Process The acoustic sensors were fabricated by using a commercial PVDF piezoelectric foil. A foil with a thin metal layer on both sides was laminated onto a spacer foil in which a 12 mm diameter hole was formed. This double-layer structure was then laminated onto a substrate. The top electrode for the PVDF film was patterned via laser ablation or by spark erosion. After connecting the electrodes to an amplifier circuit with silver ink, an elastomer layer was formed on the top surface of the sensor foil as thermal mass. C. Process Comparison Both fabrication processes have advantages and disadvantages. Solution processing would be easier to integrate into a R2R process because the alignment of subsequent layers is simpler than in a lamination process. However, the annealing time to form the beta-phase in the piezoelectric copolymer can be long, making it problematic for a R2R process. Promising in this respect are some newer varieties of piezoelectric copolymers which require shorter annealing times. The polarization of the material can be optimized in a separate process when the lamination process is used. D. Sensor Readout Electronics To test the sensors, a high impedance operational amplifier was attached to a flexible printed circuit patterned from Pyralux (Dupont) material. The copper traces were formed by jet-printing wax as an etch mask and then etching the unprotected areas [10]. The sensors and amplifier circuits were bonded to aluminum holders to provide rigid support during sensor testing. The connection between the sensors and the amplifier circuit was established with conductive silver ink. Sets of ten sensors were fabricated and tested to show the

3 repeatability of the fabrication process. In addition, one blast pressure sensor was combined with a printed inverter circuit. IV. MEASUREMENTS AND RESULTS The sensors were tested and calibrated with custom-built equipment to provide the required acoustic and blast pressure ranges. In all the measurements, commercial reference sensors were placed as close as possible to the printed sensors. In verification experiments, the sensors were examined for deviations from the calibration. A. Thermal Sensitivity As described earlier, it was necessary to add a thermal mass in form of an elastomer to the front surface of the piezoelectric sensor membrane in order to reduce the response to thermal transients (pyroelectric response). The beneficial effect is illustrated in Fig. 3. An illuminated optical fiber was used as a heat source and passed twice across the printed sensor and a piezoresistive reference sensor next to it. Without elastomer layer, the printed sensor showed a pronounced pyroelectric signal. It was much reduced after adding the elastomer layer to the sensor. The piezoresistive reference sensor also shows some temperature sensitivity which serves as a measure for the magnitude of the heat pulse. B. Blast Pressure Sensor Testing and Calibration The pressure sensors were calibrated using a pressure chamber with a fast acting valve. Printed sensor and piezoresistive reference sensor were mounted in a small chamber near the exit port of the valve. With this setup, pressure pulses with a rise time around 5 ms and a length of ~10 ms were achieved over a pressure range of ~1-100 psi. The pressure pulses were very reproducible. A calibration curve for each of the ten sensors was established by applying ten pressure pulses near each of the values of 5, 10, 15, 25, 50 and 100 psi. The pulse profiles were displayed on an oscilloscope and the peak values were recorded. A second order curve fit was used to establish the parameters for the calibration curves. A subset of four sensors was then selected by an independent observer and tested against the calibration using similar pressure pulses over a range of pressure values. Fig. 4a shows a plot of the calibration curve and the data points from the verification. In Fig. 4b, the error of the sensor reading is plotted. Within the specified pressure range of 5-100psi, the verification values were well within the allowed +/-10% error interval. At around 1psi, which was outside the specified pressure range, the error was larger. By modifying the sensor geometry, this error could be reduced. The performance of the pressure sensors in a simulated blast pressure wave was tested with a blast tube. With a blast tube, fast pressure pulses in the range of a millisecond can be generated by pressurizing a chamber with a membrane window. Upon bursting of the membrane, a pressure wave is directed towards the sensor. Compared to a mechanical valve, significantly faster pressure pulses can be generated with a a) Figure 3. Reduced temperature sensitivity of a printed piezoelectric blast pressure sensor by adding an elastomer layer as thermal mass. A piezoresistive reference sensor is mounted in close proximity. In a) and, the sensor output voltage is shown for the printed and the reference sensor when passing a heat source over the sensors. The temperature sensitivity of the printed sensor is significantly reduced with the elastomer layer attached. In, the heat pulses were larger as noticed by the larger signal of the reference sensor. larger volume of displaced air. However, the shape of the pressure pulse is more complex. Printed sensors were mounted in front of the blast tube with a piezoelectric reference sensor positioned as close as possible. Rigid mounting of the sensors was essential to avoid false signals due to vibration caused by the blast wave. In Fig. 5, the blast pressure curves of the printed and the reference sensor are shown for a blast pressure pulse in the psi range. The pressure value was extracted from the highest peak using the calibration of the sensors. Although not exactly the same, the shape of both curves is very similar. C. Acoustic Sensor Testing and Calibration Calibration and verification of the acoustic sensors occurred in an acoustic chamber with a 500 Hz sinusoidal signal from a speaker facing the printed sensor and reference sensor. Multiple measurement series were taken at various sound pressure levels using a commercial piezoelectric acoustic sensor as the reference to determine the sound pressure level. A calibration curve was established for each printed sensor from the first measurement series by using a linear curve fit for the data of sound pressure level (db) versus output voltage of the printed sensor. The data points for the second and third measurement series were then plotted next to the calibration curve as shown in Fig. 6. Two sensors were exposed to blast over pressure (BOP) pulses from a blast tube

4 a) voltage low, a thin polymer gate dielectric was employed. Before connecting the circuit to the sensor, the operation of the inverter was verified by applying an ac signal to its input and monitoring the output with a high impedance oscilloscope probe. Fig. 7(a) shows a 100Hz input signal and the inverted output with ~0.8 times amplification. The input of the inverter circuit was then electrically connected to the pressure sensor with silver ink. Several pressure pulses of varying magnitude were applied to the sensor membrane. The sensor signal was recorded via the inverter output and is plotted in Fig. 7( against the pressure in the pressure chamber which provides the pressure pulses. Some of the data point scatter was due to the difference between the pressure reading of the pressure chamber and the actual pressure pulse value on the sensor membrane. In this experiment a more accurate pressure reading from a reference sensor next to the printed sensor was not available. Figure 4. Calibration and verification of a printed blast pressure sensor. The measurement error was determined by comparing the pressure values of the printed sensor obtained via the calibration curve with the pressure values of a commercial reference sensor. Pressure pulses with a ~5ms rise time were applied to the sensors. The measurement error for this sensor was well within ~+/-5% for the range of ~5psi to ~90psi. in order to test their ruggedness. The applied pressure pulses were ~90 psi and ~170 psi. Afterwards, theses sensors were measured again to check for a potential permanent drift of the sensor signal and the data points were plotted against the calibration curve. The measurement error was calculated as the deviation of the measured values from the calibration curve. For all measurements from ~ db, the error was well below +/-2%. The BOP pulses did not change the sensor response indicating that the sensors have a robust design. a) D. Pressure Sensor with Printed Amplifier One ultimate goal in the development of the blast dosimeter tape is to fabricate the electronic readout circuit using printing techniques. As a first step towards this, a printed blast pressure sensor was coupled to a printed inverter circuit. A unipolar inverter design was used with two p-type thin-film transistors. The circuit was fabricated by inkjet printing using silver nanoparticle ink for the conductors and organic semiconductor ink for the transistor channel. A similar fabrication process has been reported for complementary inverters [4]. In order to keep the operating Figure 5. Blast pressure curves of a printed blast pressure sensor (a) and a commercial reference sensor (. Both sensors were placed next to each other in front of a blast tube to expose them as close as possible to the same blast pressure. The peak pressure values, extracted from the sensor calibration, were for both sensors in the psi range and the shape of the curves for this blast event is rather similar.

5 a) Figure 6. Calibration and verification of a printed acoustic sensor. In order to test its robustness, the sensor was exposed to a blast over pressure (BOP) of ~90psi and ~170psi and then re-measured. The deviation from the calibration curve was well below +/-2%. V. CONCLUSION Pressure sensors were fabricated, calibrated and tested in ranges capable of measuring blast overpressure and sound pressure. The fabrication approaches used are compatible with roll-to-roll processing. The tested sensors showed that the desired pressure ranges can be reliably measured within the specifications. ACKNOWLEDGMENT The authors would like to thank Robert Reuss and George Duchak for advice and helpful discussions. We also like to acknowledge help and advice by the following people at PARC: Chris Paulson, Brent Krusor, Greg Anderson and Jeng Ping Lu. We thank Measurement Specialties, Inc. for providing a sample of PVDF copolymer and Dupont for samples of Pyralux flexible circuit material. This research was partially funded by DARPA, under contract number W81XWH-09-C Approved for public release, distribution unlimited. REFERENCES [1] J.H. Daniel, et al., Flexible Electrophoretic Displays with Jet-Printed Backplanes, SID 09 Digest, 44.3, 2009, pp [2] A.C. Arias, et al., All-additive inkjet-printed display backplanes: Materials development and integration, J. SID, 15/7, 2007, pp Figure 7. Printed blast pressure sensor with a printed inverter circuit. In a) the input and output signal of the inverter circuit alone is shown at a frequency of 100Hz. At the chosen voltage settings, the amplification factor of this circuit was ~0.8. In, the inverter and the sensor are connected. The graph shows the sensor voltage measured at the inverter output as a function of the applied pressure. The pressure is applied in form of a pulse originating from a pressurized chamber. [3] E. Singer, Brain Trauma in Iraq, Technology Review, May/June 2008, pp [4] T. Ng, et al., Electrical stability of inkjet-patterned organic complementary inverters measured in ambient conditions, App. Phys. Lett., 94, (2009) [5] T.N. Ng, et al., Degradation mechanisms of organic ferroelectric fieldeffect transistors used as nonvolatile memory, J. Appl. Phys. 106, (2009) [6] R.H. Brown, The Piezo Solution for Vital Signs Monitoring, Medical Design Technology, 2008, [7] P. Ueberschlag, PVDF piezoelectric polymer, Sensor Review, Vol 21, No.2, 2001, pp [8] D. Kim, et al., Direct writing of silver conductive patterns: Improvement of film morphology and conductance by controlling solvent compositions, Appl. Phys. Lett., 89, (2006) [9] H. Sirringhaus, et al., High-resolution inkjet printing of all-polymer transistor circuits, Science, Vol 290 (2000) [10] W.S. Wong, et al., Amorphous silicon thin-film transistors and arrays fabricated by jet-printing, Appl. Phys. Lett, 80 (2002)

Chapter 30: Principles of Active Vibration Control: Piezoelectric Accelerometers

Chapter 30: Principles of Active Vibration Control: Piezoelectric Accelerometers Chapter 30: Principles of Active Vibration Control: Piezoelectric Accelerometers Introduction: Active vibration control is defined as a technique in which the vibration of a structure is reduced or controlled

More information

Diverse Lasers Support Key Microelectronic Packaging Tasks

Diverse Lasers Support Key Microelectronic Packaging Tasks Diverse Lasers Support Key Microelectronic Packaging Tasks Written by D Muller, R Patzel, G Oulundsen, H Halou, E Rea 23 July 2018 To support more sophisticated and compact tablets, phones, watches and

More information

2007-Novel structures of a MEMS-based pressure sensor

2007-Novel structures of a MEMS-based pressure sensor C-(No.16 font) put by office 2007-Novel structures of a MEMS-based pressure sensor Chang-Sin Park(*1), Young-Soo Choi(*1), Dong-Weon Lee (*2) and Bo-Seon Kang(*2) (1*) Department of Mechanical Engineering,

More information

Flexible glass substrates for roll-to-roll manufacturing

Flexible glass substrates for roll-to-roll manufacturing Science & Technology Flexible glass substrates for roll-to-roll manufacturing Corning - S. Garner, G. Merz, J. Tosch, C. Chang, D. Marshall, X. Li, J. Matusick, J. Lin, C. Kuo, S. Lewis, C. Kang ITRI -

More information

Design & Simulation of Multi Gate Piezoelectric FET Devices for Sensing Applications

Design & Simulation of Multi Gate Piezoelectric FET Devices for Sensing Applications Design & Simulation of Multi Gate Piezoelectric FET Devices for Sensing Applications Sunita Malik 1, Manoj Kumar Duhan 2 Electronics & Communication Engineering Department, Deenbandhu Chhotu Ram University

More information

Pressure Transducer Handbook

Pressure Transducer Handbook 123 Pressure Transducer Handbook Date: February 2004 TABLE OF CONTENTS SECTION 1 - Introduction 1.1 Introduction 1.2 Product Overview SECTION 2 - Kulite Sensing Technology 2.1 Pressure Transducers 2.2

More information

Piezoelectric Sensors and Actuators

Piezoelectric Sensors and Actuators Piezoelectric Sensors and Actuators Outline Piezoelectricity Origin Polarization and depolarization Mathematical expression of piezoelectricity Piezoelectric coefficient matrix Cantilever piezoelectric

More information

Miniature silicon-on-insulator pressure transducer for absolute pressure measurement at 260 C TP 301

Miniature silicon-on-insulator pressure transducer for absolute pressure measurement at 260 C TP 301 Miniature silicon-on-insulator pressure transducer for absolute pressure measurement at 260 C TP 301 Model 8540 miniature pressure transducer for absolute pressure measurement at 260 C Abstract A miniature,

More information

Application of Ultrasonic Guided Waves for Characterization of Defects in Pipeline of Nuclear Power Plants. Younho Cho

Application of Ultrasonic Guided Waves for Characterization of Defects in Pipeline of Nuclear Power Plants. Younho Cho Application of Ultrasonic Guided Waves for Characterization of Defects in Pipeline of Nuclear Power Plants Younho Cho School of Mechanical Engineering, Pusan National University, Korea ABSTRACT State-of-art

More information

Miniature silicon-on-insulator pressure transducer for absolute pressure measurement at 260 C

Miniature silicon-on-insulator pressure transducer for absolute pressure measurement at 260 C Miniature silicon-on-insulator pressure transducer for absolute pressure measurement at 260 C PMiniature silicon-on-insulator pressure transducer for absolute pressure measurement at 260 C Abstract A miniature,

More information

Section 7 - Measurement of Transient Pressure Pulses

Section 7 - Measurement of Transient Pressure Pulses Section 7 - Measurement of Transient Pressure Pulses Special problems are encountered in transient pressure pulse measurement, which place stringent requirements on the measuring system. Some of these

More information

21 st Transducer Workshop Vehicular Instrumentation/Transducer Committee

21 st Transducer Workshop Vehicular Instrumentation/Transducer Committee 1 21 st Transducer Workshop Vehicular Instrumentation/Transducer Committee Blast Measurements: Selecting the Appropriate Pressure Transducer and Properly Interfacing It Patrick L. Walter Measurement Specialist,

More information

Characterization of Silicon-based Ultrasonic Nozzles

Characterization of Silicon-based Ultrasonic Nozzles Tamkang Journal of Science and Engineering, Vol. 7, No. 2, pp. 123 127 (24) 123 Characterization of licon-based Ultrasonic Nozzles Y. L. Song 1,2 *, S. C. Tsai 1,3, Y. F. Chou 4, W. J. Chen 1, T. K. Tseng

More information

BMC s heritage deformable mirror technology that uses hysteresis free electrostatic

BMC s heritage deformable mirror technology that uses hysteresis free electrostatic Optical Modulator Technical Whitepaper MEMS Optical Modulator Technology Overview The BMC MEMS Optical Modulator, shown in Figure 1, was designed for use in free space optical communication systems. The

More information

Silicon Light Machines Patents

Silicon Light Machines Patents 820 Kifer Road, Sunnyvale, CA 94086 Tel. 408-240-4700 Fax 408-456-0708 www.siliconlight.com Silicon Light Machines Patents USPTO No. US 5,808,797 US 5,841,579 US 5,798,743 US 5,661,592 US 5,629,801 US

More information

A large-area wireless power transmission sheet using printed organic. transistors and plastic MEMS switches

A large-area wireless power transmission sheet using printed organic. transistors and plastic MEMS switches Supplementary Information A large-area wireless power transmission sheet using printed organic transistors and plastic MEMS switches Tsuyoshi Sekitani 1, Makoto Takamiya 2, Yoshiaki Noguchi 1, Shintaro

More information

Micro-sensors - what happens when you make "classical" devices "small": MEMS devices and integrated bolometric IR detectors

Micro-sensors - what happens when you make classical devices small: MEMS devices and integrated bolometric IR detectors Micro-sensors - what happens when you make "classical" devices "small": MEMS devices and integrated bolometric IR detectors Dean P. Neikirk 1 MURI bio-ir sensors kick-off 6/16/98 Where are the targets

More information

Novel Approach to Make Low Cost, High Density PZT Phased Array and Its Application in Structural Health Monitoring

Novel Approach to Make Low Cost, High Density PZT Phased Array and Its Application in Structural Health Monitoring Novel Approach to Make Low Cost, High Density PZT Phased Array and Its Application in Structural Health Monitoring B. XU, S. BUHLER, K. L1TIAU, S. ELROD, S. UCKUN, V. HAFIYCHUK and V. SMELYANSKIY ABSTRACT

More information

The file. signal, and. the. from

The file. signal, and. the. from Supplementary Figures Supplementary Figure 1. Spectrogram of (a) the commercial hydrophone and (b) our hydrogel sensor. First note the high similarity between the two spectrograms, which supportss our

More information

Gigahertz Ambipolar Frequency Multiplier Based on Cvd Graphene

Gigahertz Ambipolar Frequency Multiplier Based on Cvd Graphene Gigahertz Ambipolar Frequency Multiplier Based on Cvd Graphene The MIT Faculty has made this article openly available. Please share how this access benefits you. Your story matters. Citation As Published

More information

Technical Information

Technical Information Technical Information Introduction to force sensors Driving long cable lengths Conversions, article reprints, glossary INTRODUCTION TO QUARTZ FORCE SENSORS Quartz Force Sensors are well suited for dynamic

More information

Zero-Bias Resonant Sensor with an Oxide-Nitride Layer as Charge Trap

Zero-Bias Resonant Sensor with an Oxide-Nitride Layer as Charge Trap Zero-Bias Resonant Sensor with an Oxide-Nitride Layer as Charge Trap Kwan Kyu Park, Mario Kupnik, Hyunjoo J. Lee, Ömer Oralkan, and Butrus T. Khuri-Yakub Edward L. Ginzton Laboratory, Stanford University

More information

Supplementary Figure S1. Characterization using X-ray diffraction (XRD). (a) Starting titanium (Ti) foil used for the synthesis (JCPDS No ).

Supplementary Figure S1. Characterization using X-ray diffraction (XRD). (a) Starting titanium (Ti) foil used for the synthesis (JCPDS No ). Supplementary Figure S1. Characterization using X-ray diffraction (XRD). (a) Starting titanium (Ti) foil used for the synthesis (JCPDS No. 65-3362). (b) Oxidized Rutile titanium dioxide (TiO 2 ) obtained

More information

National Centre for Flexible Electronics

National Centre for Flexible Electronics National Centre for Flexible Electronics Tripartite Partnership Government FlexE Centre - A platform for a meaningful interaction between industry and academia. An interdisciplinary team that advances

More information

Capacitive Versus Thermal MEMS for High-Vibration Applications James Fennelly

Capacitive Versus Thermal MEMS for High-Vibration Applications James Fennelly Capacitive Versus Thermal MEMS for High-Vibration Applications James Fennelly Design engineers involved in the development of heavy equipment that operate in high shock and vibration environments need

More information

Large Signal Displacement Measurement with an MTI Photonic Sensor Rev B

Large Signal Displacement Measurement with an MTI Photonic Sensor Rev B Radiant Technologies, Inc. 2835D Pan American Freeway NE Albuquerque, NM 8717 Tel: 55-842-87 Fax: 55-842-366 e-mail: radiant@ferrodevices.com www.ferrodevices.com Large Signal Displacement Measurement

More information

Charge-integrating organic heterojunction

Charge-integrating organic heterojunction In the format provided by the authors and unedited. DOI: 10.1038/NPHOTON.2017.15 Charge-integrating organic heterojunction Wide phototransistors dynamic range for organic wide-dynamic-range heterojunction

More information

Application Note: Precision Displacement Test Stand Rev A

Application Note: Precision Displacement Test Stand Rev A Radiant Technologies, Inc. 2835D Pan American Freeway NE Albuquerque, NM 87107 Tel: 505-842-8007 Fax: 505-842-0366 e-mail: radiant@ferrodevices.com www.ferrodevices.com Application Note: Precision Displacement

More information

Herzlich willkommen. Druckbare Sensoren für Food Packaging ICT-Agri-Food Symposium. Sören Fricke Section Head Large Area & Flexible Systems

Herzlich willkommen. Druckbare Sensoren für Food Packaging ICT-Agri-Food Symposium. Sören Fricke Section Head Large Area & Flexible Systems Herzlich willkommen Druckbare Sensoren für Food Packaging ICT-Agri-Food Symposium Sören Fricke Section Head Large Area & Flexible Systems Agroscope Tänikon, 05.09.2017 Motivation Printed Sensors can be

More information

Influence of dielectric substrate on the responsivity of microstrip dipole-antenna-coupled infrared microbolometers

Influence of dielectric substrate on the responsivity of microstrip dipole-antenna-coupled infrared microbolometers Influence of dielectric substrate on the responsivity of microstrip dipole-antenna-coupled infrared microbolometers Iulian Codreanu and Glenn D. Boreman We report on the influence of the dielectric substrate

More information

Introduction to LIVM Accelerometers

Introduction to LIVM Accelerometers Introduction to LIVM Accelerometers Construction Low Impedance Voltage Mode (LIVM) accelerometers are designed to measure shock and vibration phenomena over a wide frequency range. They contain integral

More information

DESIGNING A PATCH ANTENNA FOR DOPPLER SYSTEMS

DESIGNING A PATCH ANTENNA FOR DOPPLER SYSTEMS DESIGNING A PATCH ANTENNA FOR DOPPLER SYSTEMS Doppler Requirements for Antennas Range Determines power consumption Defines frequency band R max = 4 P t GσA e 4π 2 S min Narrow Bandwidth Tolerance range

More information

SUPPLEMENTARY INFORMATION

SUPPLEMENTARY INFORMATION A flexible and highly sensitive strain-gauge sensor using reversible interlocking of nanofibres Changhyun Pang 1, Gil-Yong Lee 2, Tae-il Kim 3, Sang Moon Kim 1, Hong Nam Kim 2, Sung-Hoon Ahn 2, and Kahp-Yang

More information

5. Transducers Definition and General Concept of Transducer Classification of Transducers

5. Transducers Definition and General Concept of Transducer Classification of Transducers 5.1. Definition and General Concept of Definition The transducer is a device which converts one form of energy into another form. Examples: Mechanical transducer and Electrical transducer Electrical A

More information

Supplementary materials for Tactile Feedback Display with Spatial and Temporal Resolutions

Supplementary materials for Tactile Feedback Display with Spatial and Temporal Resolutions Supplementary materials for Tactile Feedback Display with Spatial and Temporal Resolutions Siarhei Vishniakou,, Brian W. Lewis,, Xiaofan Niu, Alireza Kargar, Ke Sun, Michael Kalajian,, Namseok Park, Muchuan

More information

SILICON BASED CAPACITIVE SENSORS FOR VIBRATION CONTROL

SILICON BASED CAPACITIVE SENSORS FOR VIBRATION CONTROL SILICON BASED CAPACITIVE SENSORS FOR VIBRATION CONTROL Shailesh Kumar, A.K Meena, Monika Chaudhary & Amita Gupta* Solid State Physics Laboratory, Timarpur, Delhi-110054, India *Email: amita_gupta/sspl@ssplnet.org

More information

OPSENS WHITE-LIGHT POLARIZATION INTERFEROMETRY TECHNOLOGY

OPSENS WHITE-LIGHT POLARIZATION INTERFEROMETRY TECHNOLOGY OPSENS WHITE-LIGHT POLARIZATION INTERFEROMETRY TECHNOLOGY 1. Introduction Fiber optic sensors are made up of two main parts: the fiber optic transducer (also called the fiber optic gauge or the fiber optic

More information

Acceleration Sensor AS - 022

Acceleration Sensor AS - 022 1 Application Acceleration Sensor AS - 022 The acceleration sensor AS-022 is used for measurement of vibration acceleration. Fig. 1 Acceleration Sensor AS - 022 2 Measuring Principle 3 Technical Data Acceleration

More information

Low Temperature Integration of Thin Films and Devices for Flexible and Stretchable Electronics

Low Temperature Integration of Thin Films and Devices for Flexible and Stretchable Electronics Low Temperature Integration of Thin Films and Devices for Flexible and Stretchable Electronics Pooran Joshi, Stephen Killough, and Teja Kuruganti Oak Ridge National Laboratory FIIW 2015 Displays and PV

More information

High Sensitivity Interferometric Detection of Partial Discharges for High Power Transformer Applications

High Sensitivity Interferometric Detection of Partial Discharges for High Power Transformer Applications High Sensitivity Interferometric Detection of Partial Discharges for High Power Transformer Applications Carlos Macià-Sanahuja and Horacio Lamela-Rivera Optoelectronics and Laser Technology group, Universidad

More information

MICROMACHINED INTERFEROMETER FOR MEMS METROLOGY

MICROMACHINED INTERFEROMETER FOR MEMS METROLOGY MICROMACHINED INTERFEROMETER FOR MEMS METROLOGY Byungki Kim, H. Ali Razavi, F. Levent Degertekin, Thomas R. Kurfess G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta,

More information

CHARACTERIZATION AND FIRST APPLICATION OF A THIN-FILM ELECTRET UNSTEADY PRESSURE MEASUREMENT TECHNIQUE

CHARACTERIZATION AND FIRST APPLICATION OF A THIN-FILM ELECTRET UNSTEADY PRESSURE MEASUREMENT TECHNIQUE XIX Biannual Symposium on Measuring Techniques in Turbomachinery Transonic and Supersonic Flow in CHARACTERIZATION AND FIRST APPLICATION OF A THIN-FILM ELECTRET UNSTEADY PRESSURE MEASUREMENT TECHNIQUE

More information

NON-TRADITIONAL MACHINING PROCESSES ULTRASONIC, ELECTRO-DISCHARGE MACHINING (EDM), ELECTRO-CHEMICAL MACHINING (ECM)

NON-TRADITIONAL MACHINING PROCESSES ULTRASONIC, ELECTRO-DISCHARGE MACHINING (EDM), ELECTRO-CHEMICAL MACHINING (ECM) NON-TRADITIONAL MACHINING PROCESSES ULTRASONIC, ELECTRO-DISCHARGE MACHINING (EDM), ELECTRO-CHEMICAL MACHINING (ECM) A machining process is called non-traditional if its material removal mechanism is basically

More information

Impact of etch factor on characteristic impedance, crosstalk and board density

Impact of etch factor on characteristic impedance, crosstalk and board density IMAPS 2012 - San Diego, California, USA, 45th International Symposium on Microelectronics Impact of etch factor on characteristic impedance, crosstalk and board density Abdelghani Renbi, Arash Risseh,

More information

OPSENS WHITE-LIGHT POLARIZATION INTERFEROMETRY TECHNOLOGY

OPSENS WHITE-LIGHT POLARIZATION INTERFEROMETRY TECHNOLOGY OPSENS WHITE-LIGHT POLARIZATION INTERFEROMETRY TECHNOLOGY 1. Introduction Fiber optic sensors are made up of two main parts: the fiber optic transducer (also called the fiber optic gauge or the fiber optic

More information

Application Bulletin 240

Application Bulletin 240 Application Bulletin 240 Design Consideration CUSTOM CAPABILITIES Standard PC board fabrication flexibility allows for various component orientations, mounting features, and interconnect schemes. The starting

More information

Installation of vibration sensors

Installation of vibration sensors Installation of vibration sensors This technical note describes basic installation techniques for accelerometers and other vibration sensors. It will allow qualified field technicians to install vibration

More information

Industrialization of Micro-Electro-Mechanical Systems. Werner Weber Infineon Technologies

Industrialization of Micro-Electro-Mechanical Systems. Werner Weber Infineon Technologies Industrialization of Micro-Electro-Mechanical Systems Werner Weber Infineon Technologies Semiconductor-based MEMS market MEMS Market 2004 (total 22.7 BUS$) Others mostly Digital Light Projection IR Sensors

More information

ADVANCES IN USING A POLYMERIC TAPE FOR LASER-INDUCED DEPOSITION AND ABLATION

ADVANCES IN USING A POLYMERIC TAPE FOR LASER-INDUCED DEPOSITION AND ABLATION ADVANCES IN USING A POLYMERIC TAPE FOR LASER-INDUCED DEPOSITION AND ABLATION Arne Koops, tesa AG, Hamburg, Germany Sven Reiter, tesa AG, Hamburg, Germany 1. Abstract Laser systems for industrial materials

More information

SUPPLEMENTARY INFORMATION

SUPPLEMENTARY INFORMATION Transfer printing stacked nanomembrane lasers on silicon Hongjun Yang 1,3, Deyin Zhao 1, Santhad Chuwongin 1, Jung-Hun Seo 2, Weiquan Yang 1, Yichen Shuai 1, Jesper Berggren 4, Mattias Hammar 4, Zhenqiang

More information

Supplementary Figure 1 Schematic illustration of fabrication procedure of MoS2/h- BN/graphene heterostructures. a, c d Supplementary Figure 2

Supplementary Figure 1 Schematic illustration of fabrication procedure of MoS2/h- BN/graphene heterostructures. a, c d Supplementary Figure 2 Supplementary Figure 1 Schematic illustration of fabrication procedure of MoS 2 /hon a 300- BN/graphene heterostructures. a, CVD-grown b, Graphene was patterned into graphene strips by oxygen monolayer

More information

Instruction manual and data sheet ipca h

Instruction manual and data sheet ipca h 1/15 instruction manual ipca-21-05-1000-800-h Instruction manual and data sheet ipca-21-05-1000-800-h Broad area interdigital photoconductive THz antenna with microlens array and hyperhemispherical silicon

More information

PvdF Piezoelectric Film Based Force Measuring System

PvdF Piezoelectric Film Based Force Measuring System Research Journal of Applied Sciences, Engineering and Technology 4(16): 2857-2861, 2012 ISSN: 2040-7467 Maxwell Scientific Organization, 2012 Submitted: March 31, 2012 Accepted: April 17, 2012 Published:

More information

Ultrasonic. Advantages

Ultrasonic. Advantages Ultrasonic Advantages Non-Contact: Nothing touches the target object Measures Distance: The distance to the target is measured, not just its presence Long and Short Range: Objects can be sensed from 2

More information

STUDY OF VIBRATION MODAL ESTIMATION FOR COMPOSITE BEAM WITH PZT THIN FILM SENSOR SYSTEM

STUDY OF VIBRATION MODAL ESTIMATION FOR COMPOSITE BEAM WITH PZT THIN FILM SENSOR SYSTEM STUDY OF VIBRATION MODAL ESTIMATION FOR COMPOSITE BEAM WITH PZT THIN FILM SENSOR SYSTEM Nobuo Oshima, Takehito Fukuda and Shinya Motogi Faculty of Engineering, Osaka City University 3-3-38, Sugimoto, Sumiyoshi-ku,

More information

Available online at ScienceDirect. Procedia Computer Science 79 (2016 )

Available online at   ScienceDirect. Procedia Computer Science 79 (2016 ) Available online at www.sciencedirect.com ScienceDirect Procedia Computer Science 79 (2016 ) 785 792 7th International Conference on Communication, Computing and Virtualization 2016 Electromagnetic Energy

More information

Theory and Applications of Frequency Domain Laser Ultrasonics

Theory and Applications of Frequency Domain Laser Ultrasonics 1st International Symposium on Laser Ultrasonics: Science, Technology and Applications July 16-18 2008, Montreal, Canada Theory and Applications of Frequency Domain Laser Ultrasonics Todd W. MURRAY 1,

More information

Application Note 1047

Application Note 1047 Low On-Resistance Solid-State Relays for High-Reliability Applications Application Note 10 Introduction In military, aerospace, and commercial applications, the high performance, long lifetime, and immunity

More information

A Laser-Based Thin-Film Growth Monitor

A Laser-Based Thin-Film Growth Monitor TECHNOLOGY by Charles Taylor, Darryl Barlett, Eric Chason, and Jerry Floro A Laser-Based Thin-Film Growth Monitor The Multi-beam Optical Sensor (MOS) was developed jointly by k-space Associates (Ann Arbor,

More information

MEAS Silicon MEMS Piezoresistive Accelerometer and its Benefits

MEAS Silicon MEMS Piezoresistive Accelerometer and its Benefits MEAS Silicon MEMS Piezoresistive Accelerometer and its Benefits Piezoresistive Accelerometers 1. Bonded Strain Gage type (Gages bonded to metal seismic mass using epoxy) Undamped circa 1950 s Fluid (oil)

More information

Body-Biased Complementary Logic Implemented Using AlN Piezoelectric MEMS Switches

Body-Biased Complementary Logic Implemented Using AlN Piezoelectric MEMS Switches University of Pennsylvania From the SelectedWorks of Nipun Sinha 29 Body-Biased Complementary Logic Implemented Using AlN Piezoelectric MEMS Switches Nipun Sinha, University of Pennsylvania Timothy S.

More information

The below identified patent application is available for licensing. Requests for information should be addressed to:

The below identified patent application is available for licensing. Requests for information should be addressed to: DEPARTMENT OF THE NAVY OFFICE OF COUNSEL NAVAL UNDERSEA WARFARE CENTER DIVISION 1176 HOWELL STREET NEWPORT Rl 02841-1708 IN REPLY REFER TO Attorney Docket No. 300119 25 May 2017 The below identified patent

More information

MEMS in ECE at CMU. Gary K. Fedder

MEMS in ECE at CMU. Gary K. Fedder MEMS in ECE at CMU Gary K. Fedder Department of Electrical and Computer Engineering and The Robotics Institute Carnegie Mellon University Pittsburgh, PA 15213-3890 fedder@ece.cmu.edu http://www.ece.cmu.edu/~mems

More information

Figure 4.1 Vector representation of magnetic field.

Figure 4.1 Vector representation of magnetic field. Chapter 4 Design of Vector Magnetic Field Sensor System 4.1 3-Dimensional Vector Field Representation The vector magnetic field is represented as a combination of three components along the Cartesian coordinate

More information

Non-contact Thickness Meters/Displacement Meters

Non-contact Thickness Meters/Displacement Meters Non-contact Thickness Meters/Displacement Meters (Electrostatic capacitance type) Non-contact displacement meters VT-5200/5700 Series Gap detectors VE Series New advances have been made in displacement

More information

Turnkey Dielectric Spectroscopy

Turnkey Dielectric Spectroscopy Turnkey Dielectric Spectroscopy Measure dielectric constant & tan as a function of Temperature & Frequency Capability This low-cost turnkey test system can be used to measure capacitance (dielectric constant)

More information

Amorphous Selenium Direct Radiography for Industrial Imaging

Amorphous Selenium Direct Radiography for Industrial Imaging DGZfP Proceedings BB 67-CD Paper 22 Computerized Tomography for Industrial Applications and Image Processing in Radiology March 15-17, 1999, Berlin, Germany Amorphous Selenium Direct Radiography for Industrial

More information

Application Note Silicon Flow Sensor SFS01

Application Note Silicon Flow Sensor SFS01 Application Note Silicon Flow Sensor SFS01 AFSFS01_E2.2.0 App Note Silicon Flow Sensor 1/11 Application Note Silicon Flow Sensor SFS01 1. SFS01 - Classification in the Product Portfolio 3 2. Applications

More information

MEASUREMENT AND INSTRUMENTATION QUESTION BANK UNIT I INTRODUCTION. Part A

MEASUREMENT AND INSTRUMENTATION QUESTION BANK UNIT I INTRODUCTION. Part A MEASUREMENT AND INSTRUMENTATION QUESTION BANK UNIT I INTRODUCTION Part A 1. Define Standard deviation. 2. Why calibration of instrument is important? 3. What are the different calibration methodologies?

More information

UNIT-VI FIELD EFFECT TRANSISTOR. 1. Explain about the Field Effect Transistor and also mention types of FET s.

UNIT-VI FIELD EFFECT TRANSISTOR. 1. Explain about the Field Effect Transistor and also mention types of FET s. UNIT-I FIELD EFFECT TRANSISTOR 1. Explain about the Field Effect Transistor and also mention types of FET s. The Field Effect Transistor, or simply FET however, uses the voltage that is applied to their

More information

PIEZOELECTRIC TRANSFORMER FOR INTEGRATED MOSFET AND IGBT GATE DRIVER

PIEZOELECTRIC TRANSFORMER FOR INTEGRATED MOSFET AND IGBT GATE DRIVER 1 PIEZOELECTRIC TRANSFORMER FOR INTEGRATED MOSFET AND IGBT GATE DRIVER Prasanna kumar N. & Dileep sagar N. prasukumar@gmail.com & dileepsagar.n@gmail.com RGMCET, NANDYAL CONTENTS I. ABSTRACT -03- II. INTRODUCTION

More information

Verification Structures for Transmission Line Pulse Measurements

Verification Structures for Transmission Line Pulse Measurements Verification Structures for Transmission Line Pulse Measurements R.A. Ashton Agere Systems, 9333 South John Young Parkway, Orlando, Florida, 32819 USA Phone: 44-371-731; Fax: 47-371-777; e-mail: rashton@agere.com

More information

A Review of MEMS Based Piezoelectric Energy Harvester for Low Frequency Applications

A Review of MEMS Based Piezoelectric Energy Harvester for Low Frequency Applications Available Online at www.ijcsmc.com International Journal of Computer Science and Mobile Computing A Monthly Journal of Computer Science and Information Technology IJCSMC, Vol. 3, Issue. 9, September 2014,

More information

MAGNETO-DIELECTRIC COMPOSITES WITH FREQUENCY SELECTIVE SURFACE LAYERS

MAGNETO-DIELECTRIC COMPOSITES WITH FREQUENCY SELECTIVE SURFACE LAYERS MAGNETO-DIELECTRIC COMPOSITES WITH FREQUENCY SELECTIVE SURFACE LAYERS M. Hawley 1, S. Farhat 1, B. Shanker 2, L. Kempel 2 1 Dept. of Chemical Engineering and Materials Science, Michigan State University;

More information

3/24/11. Introduction! Electrogenic cell

3/24/11. Introduction! Electrogenic cell March 2011 Introduction! Electrogenic cell Electrode/electrolyte interface! Electrical double layer! Half-cell potential! Polarization! Electrode equivalent circuits Biopotential electrodes! Body surface

More information

High Power RF MEMS Switch Technology

High Power RF MEMS Switch Technology High Power RF MEMS Switch Technology Invited Talk at 2005 SBMO/IEEE MTT-S International Conference on Microwave and Optoelectronics Conference Dr Jia-Sheng Hong Heriot-Watt University Edinburgh U.K. 1

More information

Switch-less Dual-frequency Reconfigurable CMOS Oscillator using One Single Piezoelectric AlN MEMS Resonator with Co-existing S0 and S1 Lamb-wave Modes

Switch-less Dual-frequency Reconfigurable CMOS Oscillator using One Single Piezoelectric AlN MEMS Resonator with Co-existing S0 and S1 Lamb-wave Modes From the SelectedWorks of Chengjie Zuo January, 11 Switch-less Dual-frequency Reconfigurable CMOS Oscillator using One Single Piezoelectric AlN MEMS Resonator with Co-existing S and S1 Lamb-wave Modes

More information

attosnom I: Topography and Force Images NANOSCOPY APPLICATION NOTE M06 RELATED PRODUCTS G

attosnom I: Topography and Force Images NANOSCOPY APPLICATION NOTE M06 RELATED PRODUCTS G APPLICATION NOTE M06 attosnom I: Topography and Force Images Scanning near-field optical microscopy is the outstanding technique to simultaneously measure the topography and the optical contrast of a sample.

More information

Fig 1 Microphone transducer types

Fig 1 Microphone transducer types Microphones Microphones are the most critical element in the recording chain. Every sound not created purely electronically must be transduced through a microphone in order to be recorded. There is a bewildering

More information

Processes for Flexible Electronic Systems

Processes for Flexible Electronic Systems Processes for Flexible Electronic Systems Michael Feil Fraunhofer Institut feil@izm-m.fraunhofer.de Outline Introduction Single sheet versus reel-to-reel (R2R) Substrate materials R2R printing processes

More information

Micro-nanosystems for electrical metrology and precision instrumentation

Micro-nanosystems for electrical metrology and precision instrumentation Micro-nanosystems for electrical metrology and precision instrumentation A. Bounouh 1, F. Blard 1,2, H. Camon 2, D. Bélières 1, F. Ziadé 1 1 LNE 29 avenue Roger Hennequin, 78197 Trappes, France, alexandre.bounouh@lne.fr

More information

Development of Miniature Dynamic Electret Pressure Sensor

Development of Miniature Dynamic Electret Pressure Sensor Author: Simo Ahtiainen (UKU) email: sahtiain@hytti.uku.fi 21.9.2006 Development of Miniature Dynamic Electret Pressure Sensor SUSPOWER PROJECT Supervisors: Jens Fridh (KTH) Prof. Hannu Ollkonen (UKU) Ass.

More information

NEW LASER ULTRASONIC INTERFEROMETER FOR INDUSTRIAL APPLICATIONS B.Pouet and S.Breugnot Bossa Nova Technologies; Venice, CA, USA

NEW LASER ULTRASONIC INTERFEROMETER FOR INDUSTRIAL APPLICATIONS B.Pouet and S.Breugnot Bossa Nova Technologies; Venice, CA, USA NEW LASER ULTRASONIC INTERFEROMETER FOR INDUSTRIAL APPLICATIONS B.Pouet and S.Breugnot Bossa Nova Technologies; Venice, CA, USA Abstract: A novel interferometric scheme for detection of ultrasound is presented.

More information

Electronic Systems - B1 23/04/ /04/ SisElnB DDC. Chapter 2

Electronic Systems - B1 23/04/ /04/ SisElnB DDC. Chapter 2 Politecnico di Torino - ICT school Goup B - goals ELECTRONIC SYSTEMS B INFORMATION PROCESSING B.1 Systems, sensors, and actuators» System block diagram» Analog and digital signals» Examples of sensors»

More information

ELECTRONIC SYSTEMS. Introduction. B1 - Sensors and actuators. Introduction

ELECTRONIC SYSTEMS. Introduction. B1 - Sensors and actuators. Introduction Politecnico di Torino - ICT school Goup B - goals ELECTRONIC SYSTEMS B INFORMATION PROCESSING B.1 Systems, sensors, and actuators» System block diagram» Analog and digital signals» Examples of sensors»

More information

Accelerometer Sensors

Accelerometer Sensors Accelerometer Sensors Presented by: Mohammad Zand Seyed Mohammad Javad Moghimi K.N.T. University of Technology Outline: Accelerometer Introduction Background Device market Types Theory Capacitive sensor

More information

Tunable Color Filters Based on Metal-Insulator-Metal Resonators

Tunable Color Filters Based on Metal-Insulator-Metal Resonators Chapter 6 Tunable Color Filters Based on Metal-Insulator-Metal Resonators 6.1 Introduction In this chapter, we discuss the culmination of Chapters 3, 4, and 5. We report a method for filtering white light

More information

FATIGUE CRACK CHARACTERIZATION IN CONDUCTING SHEETS BY NON

FATIGUE CRACK CHARACTERIZATION IN CONDUCTING SHEETS BY NON FATIGUE CRACK CHARACTERIZATION IN CONDUCTING SHEETS BY NON CONTACT STIMULATION OF RESONANT MODES Buzz Wincheski, J.P. Fulton, and R. Todhunter Analytical Services and Materials 107 Research Drive Hampton,

More information

M70LL Laser Distance Sensor

M70LL Laser Distance Sensor M7LL Laser Distance Sensor for automated manufacturing with Ethernet interface to connect with PLC The analog sensors of series M7LL use a PSD for their receiver optics. This assures a position measurement

More information

High-speed wavefront control using MEMS micromirrors T. G. Bifano and J. B. Stewart, Boston University [ ] Introduction

High-speed wavefront control using MEMS micromirrors T. G. Bifano and J. B. Stewart, Boston University [ ] Introduction High-speed wavefront control using MEMS micromirrors T. G. Bifano and J. B. Stewart, Boston University [5895-27] Introduction Various deformable mirrors for high-speed wavefront control have been demonstrated

More information

Outline: Introduction: What is SPM, history STM AFM Image treatment Advanced SPM techniques Applications in semiconductor research and industry

Outline: Introduction: What is SPM, history STM AFM Image treatment Advanced SPM techniques Applications in semiconductor research and industry 1 Outline: Introduction: What is SPM, history STM AFM Image treatment Advanced SPM techniques Applications in semiconductor research and industry 2 Back to our solutions: The main problem: How to get nm

More information

Embedded Surface Mount Triaxial Accelerometer

Embedded Surface Mount Triaxial Accelerometer Embedded Surface Mount Triaxial Accelerometer Robert D. Sill Senior Scientist PCB Piezotronics Inc. 951 Calle Negocio, Suite A San Clemente CA, 92673 (877) 679 0002 x2954 rsill@pcb.com Abstract 18566 59

More information

MAGNETORESISTIVE random access memory

MAGNETORESISTIVE random access memory 132 IEEE TRANSACTIONS ON MAGNETICS, VOL. 41, NO. 1, JANUARY 2005 A 4-Mb Toggle MRAM Based on a Novel Bit and Switching Method B. N. Engel, J. Åkerman, B. Butcher, R. W. Dave, M. DeHerrera, M. Durlam, G.

More information

Driving Strain-Gauge Bridge Sensors with Signal- Conditioning ICs

Driving Strain-Gauge Bridge Sensors with Signal- Conditioning ICs SENSOR SIGNAL CONDITIONERS Nov 11, 2004 Driving Strain-Gauge Bridge Sensors with Signal- Conditioning ICs Strain-gauge sensors - reliable, repeatable, and precise - are used extensively in manufacturing,

More information

Pressure Sensors, Accelerometers, and Custom Microstructures

Pressure Sensors, Accelerometers, and Custom Microstructures Sensors, Accelerometers, and Custom Microstructures IC SENSORS Products Databook Consistent with Measurement Specialties, Inc. policy of continually updating and improving its products, the type designation

More information

First Observation of Stimulated Coherent Transition Radiation

First Observation of Stimulated Coherent Transition Radiation SLAC 95 6913 June 1995 First Observation of Stimulated Coherent Transition Radiation Hung-chi Lihn, Pamela Kung, Chitrlada Settakorn, and Helmut Wiedemann Applied Physics Department and Stanford Linear

More information

Circular Piezoelectric Accelerometer for High Band Width Application

Circular Piezoelectric Accelerometer for High Band Width Application Downloaded from orbit.dtu.dk on: Apr 27, 2018 Circular Piezoelectric Accelerometer for High Band Width Application Hindrichsen, Christian Carstensen; Larsen, Jack; Lou-Møller, Rasmus; Hansen, K.; Thomsen,

More information

MAE334 - Introduction to Instrumentation and Computers. Final Exam. December 11, 2006

MAE334 - Introduction to Instrumentation and Computers. Final Exam. December 11, 2006 MAE334 - Introduction to Instrumentation and Computers Final Exam December 11, 2006 o Closed Book and Notes o No Calculators 1. Fill in your name on side 2 of the scoring sheet (Last name first!) 2. Fill

More information

Technology for the MEMS processing and testing environment. SUSS MicroTec AG Dr. Hans-Georg Kapitza

Technology for the MEMS processing and testing environment. SUSS MicroTec AG Dr. Hans-Georg Kapitza Technology for the MEMS processing and testing environment SUSS MicroTec AG Dr. Hans-Georg Kapitza 1 SUSS MicroTec Industrial Group Founded 1949 as Karl Süss KG GmbH&Co. in Garching/ Munich San Jose Waterbury

More information

INSPECTION OF THERMAL BARRIERS OF PRIMARY PUMPS WITH PHASED ARRAY PROBE AND PIEZOCOMPOSITE TECHNOLOGY

INSPECTION OF THERMAL BARRIERS OF PRIMARY PUMPS WITH PHASED ARRAY PROBE AND PIEZOCOMPOSITE TECHNOLOGY INSPECTION OF THERMAL BARRIERS OF PRIMARY PUMPS WITH PHASED ARRAY PROBE AND PIEZOCOMPOSITE TECHNOLOGY J. Poguet Imasonic S.A. France E. Abittan EDF-GDL France Abstract In order to meet the requirements

More information