MICROMACHINED INTERFEROMETER FOR MEMS METROLOGY

Size: px
Start display at page:

Download "MICROMACHINED INTERFEROMETER FOR MEMS METROLOGY"

Transcription

1 MICROMACHINED INTERFEROMETER FOR MEMS METROLOGY Byungki Kim, H. Ali Razavi, F. Levent Degertekin, Thomas R. Kurfess G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA ABSTRACT A microfabricated grating interferometer is described and evaluated by measuring the dynamic performance of a microfabricated microphone membrane. The device uses a phase sensitive diffraction grating for interferometric axial resolution and a microfabricated lens for improved lateral response. Experimental results show that both the transient and steady state vibration of MEMS devices can be measured and mapped using the micro interferometer. Since the interferometer is fabricated on a planar substrate and its dimensions are small, it is possible to implement interferometer arrays for parallel, fast measurement of MEMS devices and integrate optoelectronics. The integration strategy and the photodetector arrays fabricated for this purpose using CMOS technology are also discussed. INTRODUCTION Significant part of MEMS research has so far concentrated on developing process technology and optimizing individual device performance. However, as the technology and market potential are being realized, a sophisticated MEMS quality control scheme needs to be developed. This requires metrology throughout the design, fabrication, wafer level test, post-package test and reliability testing processes 1. In this paper, a microfabricated position sensing grating interferometer (µpsgi) is presented for dynamic MEMS metrology. The proposed micro interferometer measures distance using a reflective diffraction grating on a transparent substrate and a microlens fabricated using a photoresist reflow technique on the same substrate. This structure forms a phase sensitive diffraction grating to have interferometric sensitivity, while adding the capability of better lateral resolution by focusing. Figure 1 shows the schematic of a µpsgi with a photodetector. Depending on the distance between diffraction grating and target surface, diffraction pattern at the detector plane is changed. By monitoring the intensity of the certain diffraction order by the detector, the profile change of the target surface can be mapped. Detailed diffraction models of the microinterferometer have been developed to predict the device response and the location of photodetectors for integrated optoelectronics 2. Target surface Micromachined lens Quartz wafer Diffraction gratings Detector Figure 1. Schematic of a µpsgi American Society for Precision Engineering 73

2 A particular device is fabricated on a fused silica substrate using aluminum to form the diffraction grating fingers and AZ4620 photoresist for the microlens. The details of the fabrication process can be found in reference 2. The structure also enables optoelectronics integration so that the interferometer with photo detectors can fit in a surface area of 1mmx1mm. The feasibility of µpsgi was demonstrated for measurement of moving microstructures 2 and a similar structure was also integrated to acoustic transducers for displacement detection 3. An experimental set-up was implemented to test the microinterferometer on MEMS devices as shown in Figure 2. Experimental results were obtained on vibrating MEMS devices, such as a 1µm thick aluminum MEMS microphone membrane with 150µm diameter and 2.5µm air gap 3. For testing purposes, the membrane was actuated electrostatically using a 40V DC bias and 10V sinusoidal burst at its resonance frequency of 726kHz. The displacement map of the membrane is obtained by digitizing the photodetector output at 10MHz while scanning the MEMS device. The results showed the expected 15nm maximum vibration amplitude as well as the vibration shape of the membrane 4. Figure 3 shows the detector output that is equivalent to the vibrating shape of the membrane. The discontinuities of the profile in Fig. 3 are mainly due to misalignment and vibration noise in set-up. HeNe Laser Lens µpsgi Photo Detector Micro membrane Figure 2. Experimental set-up Figure 3. Vibrating membrane 2003 Winter Topical Meeting - Volume 28 74

3 EXPERIMENTAL SET-UP AND RESULTS To reduce the vibration noise in the signal, the experimental set-up has been improved to include a phase sensitive detector (lock-in amplifier). Similar MEMS microphone membranes have been used as the device under test. The membrane that was used in this paper has a diameter of 150 µm of diameter, a thickness of 1 µm and a 2.5 µm gap between its electrodes. In this particular case, the microlens has 200µm diameter and 0.3mm focal length. The light source was HeNe laser. The schematic of the µpsgi scanning system set-up is depicted in Fig. 4. For the scanning purposes, X-Y plane actuator was implemented to scan the MEMS microphone and the Z direction actuator was used to adjust the distance from µpsgi to the target surface to the focal length of the lens on the µpsgi. The membrane was actuated with the same signals as the vibrating membrane of Fig. 3. For the phase sensitive detection the lock-in amplifier was locked to the AC actuation signal while the photo detector output was used as the input signal. The low pass filter removed high frequency components of the mixed signal and then only DC out which is proportional to the cosine of the phase difference between the input and the reference was remained. With this configuration, the amplitude and phase of the input signal can be determined 5. During the experiments, the amplitude and the phase of the output from lock-in amplifier were recorded by data acquisition system at a sampling rate of 10 MHz followed by 10 averaging while the membrane was scanned in the x-y plane using a 5 µm by 5 µm grid size. Figure 5 shows mapping of R(x,y)*cos(θ), where R(x,y) is the amplitude, and θ, is the phase of the vibration at point (x,y). The resulting image shows a significant reduction in the noise outside of the vibrating membrane as well as an improved intensity pattern on the microphone membrane as compared to the previous data shown in Fig. 3. Nevertheless there are still some artifacts such as the slanted fringes superimposed on the measured vibration profile. These problems can be solved by using an active control scheme to keep the sample/diffraction grating distance at the maximum sensitivity level, i.e. the maximum slope of the fringe pattern 6. Data acquisition R θ Ref Lock-in amp. Signal Photo Photo detector detector Microphone 726 khz Lens HeNe X Moving Stage µpsgi Y Z Figure 4. µpsgi scanning system American Society for Precision Engineering 75

4 Figure 5. Scanning results using phase sensitive detector ARRAY IMPLEMENTATION Due to its small volume and planar fabrication, these interferometers can be easily made into arrays. When implemented in the form of arrays, this device can perform fast, non-contact and precision static and dynamic measurements of MEMS structures in a parallel fashion to enable in-line inspection. This array structure integrated with detectors is shown schematically in Fig. 6. In order to obtain high signal to noise from each interferometer in the array, the distance between the grating and the target surface should be independently adjusted. As shown in Fig. 6, this can be achieved by using electrostatically actuated deformable diffraction gratings 7. The optoelectronics can also be integrated using an array of photodetectors on a separate silicon chip. Such a photodetector array has already been fabricated using CMOS compatible processes. Figure 7 shows a 3x3 array of Silicon PN-junction diodes fabricated for this purpose. The location of the diodes are designed such that the 1 st order of the diffraction order illuminates the detector when the gap between the µpsgi array and detector array is 1mm and the grating period is 3µm. To avoid cross talk by high order diffraction in maintaining compact size, the detectors are properly inclined. Over all size of the array is 3mmx3mm. More details of the photo detector array fabrication can be found in reference 8. Target surface µpsgi array Photo detector Deformable grating Detector array Light source Light source guide hole Si substrate Figure 6. Schematic of an array of µpsgi integrated with detector array 2003 Winter Topical Meeting - Volume 28 76

5 Diameter 200 µm, light source guide hole 300 µm x 300 µm, Photo diodes 3mm 3mm Figure 7. A fabricated array of 3x3 detectors CONCLUSION AND FUTURE WORK The microscale phase sensitive diffraction grating interferometer has been used to measure the displacement of MEMS microphone structures with nm resolution in a wide frequency range. The phase sensitive detection using lock-in amplifier shows improved scanning results for the vibrating microphone during steady state operation. The performance of the interferometer can be further improved by active control of the distance to the MEMS device for maximum sensitivity. In order to operate an array of µpsgi on a typical MEMS fabrication wafer, each integrated array element needs to be optimized for displacement detection at each sensor. This is achieved by electrostatic actuation of a movable diffraction grating. This capability along with the integration of optoelectronics will eventually reduce alignment and noise problems. REFERENCES 1. K. Panetta, N. Aluru, S. Bart, S. Blanton, K. Böhringer, and R. Brown, ITC 2000 Panel Discussion: Testing Challenges For MEMS, Proceedings of ITC International Test Conference, pp October 3-5, B. Kim, H. A. Razavi, F. L. Degertekin, and T. R. Kurfess, Microinterferometer for Noncontact Inspection of MEMS, The 3 rd International Workshop on Microfactories, pp Minneapolis, Minnesota, September 16-18, N.A. Hall and F.L. Degertekin, Integrated optical interferometric detection method for micromachined capacitive acoustic transducers, Applied Physics Letters, Vol. 80, pp B. Kim, H. A. Razavi, F. L. Degertekin, and T. R. Kurfess, Micromachined Interferometer for measuring dynamic response of microstructures, Proceedings of ASME International Mechanical Engineering Congress and Exposition, MEMS Symposium, New Orleans, Louisiana, November 17-22, User s Manual Model SR844 RF Lock-In Amplifier, SRS, 1997 American Society for Precision Engineering 77

6 6. J. E. Graebner, Optical Scanning Interferometer for Dynamic Imaging of High-Frequency Surface Motion, IEEE Ultrasonics Symposium, pp , D.M. Bloom, The grating light valve: revolutionizing display technology, Proc. SPIE, Projection Displays III, vol. 3013, pp , February, W. Lee, N. A. Hall, and F. L. Degertekin, Micromachined acoustic sensor array with diffraction-based optical interferometric detection, Proceedings of SPIE Micromachining and Microfabrication, San Jose, California, January 27-31, 2003 (to be published) 2003 Winter Topical Meeting - Volume 28 78

MINIATURIZED DIFFRACTION BASED INTERFEROMETRIC DISTANCE MEASUREMENT SENSOR

MINIATURIZED DIFFRACTION BASED INTERFEROMETRIC DISTANCE MEASUREMENT SENSOR MINIATURIZED DIFFRACTION BASED INTERFEROMETRIC DISTANCE MEASUREMENT SENSOR A Thesis Presented to The Academic Faculty By Byungki Kim In Partial Fulfillment of the Requirements for the Degree Doctor of

More information

MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications

MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications Part I: RF Applications Introductions and Motivations What are RF MEMS? Example Devices RFIC RFIC consists of Active components

More information

Theory and Applications of Frequency Domain Laser Ultrasonics

Theory and Applications of Frequency Domain Laser Ultrasonics 1st International Symposium on Laser Ultrasonics: Science, Technology and Applications July 16-18 2008, Montreal, Canada Theory and Applications of Frequency Domain Laser Ultrasonics Todd W. MURRAY 1,

More information

Sensitivity Enhancement of Bimaterial MOEMS Thermal Imaging Sensor Array using 2-λ readout

Sensitivity Enhancement of Bimaterial MOEMS Thermal Imaging Sensor Array using 2-λ readout Sensitivity Enhancement of Bimaterial MOEMS Thermal Imaging Sensor Array using -λ readout O. Ferhanoğlu, H. Urey Koç University, Electrical Engineering, Istanbul-TURKEY ABSTRACT Diffraction gratings integrated

More information

Lecture 22 Optical MEMS (4)

Lecture 22 Optical MEMS (4) EEL6935 Advanced MEMS (Spring 2005) Instructor: Dr. Huikai Xie Lecture 22 Optical MEMS (4) Agenda: Refractive Optical Elements Microlenses GRIN Lenses Microprisms Reference: S. Sinzinger and J. Jahns,

More information

SCANNING MICRO INTERFEROMETER WITH TUNABLE DIFFRACTION GRATING FOR LOW NOISE PARALLEL OPERATION

SCANNING MICRO INTERFEROMETER WITH TUNABLE DIFFRACTION GRATING FOR LOW NOISE PARALLEL OPERATION SCANNING MICRO INTERFEROMETER WITH TUNABLE DIFFRACTION GRATING FOR LOW NOISE PARALLEL OPERATION A Dissertation Presented to The Academic Faculty by Omkar Karhade In Partial Fulfillment of the Requirements

More information

BMC s heritage deformable mirror technology that uses hysteresis free electrostatic

BMC s heritage deformable mirror technology that uses hysteresis free electrostatic Optical Modulator Technical Whitepaper MEMS Optical Modulator Technology Overview The BMC MEMS Optical Modulator, shown in Figure 1, was designed for use in free space optical communication systems. The

More information

OPTICAL FIBER-BASED SENSING OF STRAIN AND TEMPERATURE

OPTICAL FIBER-BASED SENSING OF STRAIN AND TEMPERATURE OPTICAL FIBER-BASED SENSING OF STRAIN AND TEMPERATURE AT HIGH TEMPERATURE K. A. Murphy, C. Koob, M. Miller, S. Feth, and R. O. Claus Fiber & Electro-Optics Research Center Electrical Engineering Department

More information

Silicon Light Machines Patents

Silicon Light Machines Patents 820 Kifer Road, Sunnyvale, CA 94086 Tel. 408-240-4700 Fax 408-456-0708 www.siliconlight.com Silicon Light Machines Patents USPTO No. US 5,808,797 US 5,841,579 US 5,798,743 US 5,661,592 US 5,629,801 US

More information

MEMS-based Micro Coriolis mass flow sensor

MEMS-based Micro Coriolis mass flow sensor MEMS-based Micro Coriolis mass flow sensor J. Haneveld 1, D.M. Brouwer 2,3, A. Mehendale 2,3, R. Zwikker 3, T.S.J. Lammerink 1, M.J. de Boer 1, and R.J. Wiegerink 1. 1 MESA+ Institute for Nanotechnology,

More information

Surface Micromachining

Surface Micromachining Surface Micromachining An IC-Compatible Sensor Technology Bernhard E. Boser Berkeley Sensor & Actuator Center Dept. of Electrical Engineering and Computer Sciences University of California, Berkeley Sensor

More information

PROBLEM SET #7. EEC247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2015 C. Nguyen. Issued: Monday, April 27, 2015

PROBLEM SET #7. EEC247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2015 C. Nguyen. Issued: Monday, April 27, 2015 Issued: Monday, April 27, 2015 PROBLEM SET #7 Due (at 9 a.m.): Friday, May 8, 2015, in the EE C247B HW box near 125 Cory. Gyroscopes are inertial sensors that measure rotation rate, which is an extremely

More information

Figure 1: Layout of the AVC scanning micromirror including layer structure and comb-offset view

Figure 1: Layout of the AVC scanning micromirror including layer structure and comb-offset view Bauer, Ralf R. and Brown, Gordon G. and Lì, Lì L. and Uttamchandani, Deepak G. (2013) A novel continuously variable angular vertical combdrive with application in scanning micromirror. In: 2013 IEEE 26th

More information

Micro-nanosystems for electrical metrology and precision instrumentation

Micro-nanosystems for electrical metrology and precision instrumentation Micro-nanosystems for electrical metrology and precision instrumentation A. Bounouh 1, F. Blard 1,2, H. Camon 2, D. Bélières 1, F. Ziadé 1 1 LNE 29 avenue Roger Hennequin, 78197 Trappes, France, alexandre.bounouh@lne.fr

More information

NEW LASER ULTRASONIC INTERFEROMETER FOR INDUSTRIAL APPLICATIONS B.Pouet and S.Breugnot Bossa Nova Technologies; Venice, CA, USA

NEW LASER ULTRASONIC INTERFEROMETER FOR INDUSTRIAL APPLICATIONS B.Pouet and S.Breugnot Bossa Nova Technologies; Venice, CA, USA NEW LASER ULTRASONIC INTERFEROMETER FOR INDUSTRIAL APPLICATIONS B.Pouet and S.Breugnot Bossa Nova Technologies; Venice, CA, USA Abstract: A novel interferometric scheme for detection of ultrasound is presented.

More information

Adaptive Optics for LIGO

Adaptive Optics for LIGO Adaptive Optics for LIGO Justin Mansell Ginzton Laboratory LIGO-G990022-39-M Motivation Wavefront Sensor Outline Characterization Enhancements Modeling Projections Adaptive Optics Results Effects of Thermal

More information

3D Optical Motion Analysis of Micro Systems. Heinrich Steger, Polytec GmbH, Waldbronn

3D Optical Motion Analysis of Micro Systems. Heinrich Steger, Polytec GmbH, Waldbronn 3D Optical Motion Analysis of Micro Systems Heinrich Steger, Polytec GmbH, Waldbronn SEMICON Europe 2012 Outline Needs and Challenges of measuring Micro Structure and MEMS Tools and Applications for optical

More information

Figure 7 Dynamic range expansion of Shack- Hartmann sensor using a spatial-light modulator

Figure 7 Dynamic range expansion of Shack- Hartmann sensor using a spatial-light modulator Figure 4 Advantage of having smaller focal spot on CCD with super-fine pixels: Larger focal point compromises the sensitivity, spatial resolution, and accuracy. Figure 1 Typical microlens array for Shack-Hartmann

More information

Capabilities of Flip Chip Defects Inspection Method by Using Laser Techniques

Capabilities of Flip Chip Defects Inspection Method by Using Laser Techniques Capabilities of Flip Chip Defects Inspection Method by Using Laser Techniques Sheng Liu and I. Charles Ume* School of Mechanical Engineering Georgia Institute of Technology Atlanta, Georgia 3332 (44) 894-7411(P)

More information

AgilOptics mirrors increase coupling efficiency into a 4 µm diameter fiber by 750%.

AgilOptics mirrors increase coupling efficiency into a 4 µm diameter fiber by 750%. Application Note AN004: Fiber Coupling Improvement Introduction AgilOptics mirrors increase coupling efficiency into a 4 µm diameter fiber by 750%. Industrial lasers used for cutting, welding, drilling,

More information

- Near Field Scanning Optical Microscopy - Electrostatic Force Microscopy - Magnetic Force Microscopy

- Near Field Scanning Optical Microscopy - Electrostatic Force Microscopy - Magnetic Force Microscopy - Near Field Scanning Optical Microscopy - Electrostatic Force Microscopy - Magnetic Force Microscopy Yongho Seo Near-field Photonics Group Leader Wonho Jhe Director School of Physics and Center for Near-field

More information

Holographic Augmented Reality: Towards Near-to-Eye Electroholography

Holographic Augmented Reality: Towards Near-to-Eye Electroholography +1 (617) 452-5644 +1 (770) 316-2569 sjolly@media.mit.edu http://www.sundeepjolly.com Ph.D. student and researcher at the MIT Media Lab with primary research interests in computational optical methods and

More information

Laser Telemetric System (Metrology)

Laser Telemetric System (Metrology) Laser Telemetric System (Metrology) Laser telemetric system is a non-contact gauge that measures with a collimated laser beam (Refer Fig. 10.26). It measure at the rate of 150 scans per second. It basically

More information

ISSCC 2006 / SESSION 16 / MEMS AND SENSORS / 16.1

ISSCC 2006 / SESSION 16 / MEMS AND SENSORS / 16.1 16.1 A 4.5mW Closed-Loop Σ Micro-Gravity CMOS-SOI Accelerometer Babak Vakili Amini, Reza Abdolvand, Farrokh Ayazi Georgia Institute of Technology, Atlanta, GA Recently, there has been an increasing demand

More information

BROADBAND CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS RANGING

BROADBAND CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS RANGING BROADBAND CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS RANGING FROM 1 KHZ TO 6 MHZ FOR IMAGING ARRAYS AND MORE Arif S. Ergun, Yongli Huang, Ching-H. Cheng, Ömer Oralkan, Jeremy Johnson, Hemanth Jagannathan,

More information

Optical Characterization and Defect Inspection for 3D Stacked IC Technology

Optical Characterization and Defect Inspection for 3D Stacked IC Technology Minapad 2014, May 21 22th, Grenoble; France Optical Characterization and Defect Inspection for 3D Stacked IC Technology J.Ph.Piel, G.Fresquet, S.Perrot, Y.Randle, D.Lebellego, S.Petitgrand, G.Ribette FOGALE

More information

Characterization of Silicon-based Ultrasonic Nozzles

Characterization of Silicon-based Ultrasonic Nozzles Tamkang Journal of Science and Engineering, Vol. 7, No. 2, pp. 123 127 (24) 123 Characterization of licon-based Ultrasonic Nozzles Y. L. Song 1,2 *, S. C. Tsai 1,3, Y. F. Chou 4, W. J. Chen 1, T. K. Tseng

More information

A MEMS Based Visible-NIR Fourier Transform Microspectrometer

A MEMS Based Visible-NIR Fourier Transform Microspectrometer A MEMS Based Visible-NIR Fourier Transform Microspectrometer C. Ataman 1, H. Urey 1, S.O. Isikman 1, and A. Wolter 2 1 Optical Microsystems Laboratory, Department of Electrical Engineering, Koc University

More information

Deformable Membrane Mirror for Wavefront Correction

Deformable Membrane Mirror for Wavefront Correction Defence Science Journal, Vol. 59, No. 6, November 2009, pp. 590-594 Ó 2009, DESIDOC SHORT COMMUNICATION Deformable Membrane Mirror for Wavefront Correction Amita Gupta, Shailesh Kumar, Ranvir Singh, Monika

More information

MICROMACHINED BROADBAND ACOUSTIC TRANSDUCERS WITH INTEGRATED OPTICAL DISPLACEMENT DETECTION. A Dissertation Presented to. The Academic Faculty

MICROMACHINED BROADBAND ACOUSTIC TRANSDUCERS WITH INTEGRATED OPTICAL DISPLACEMENT DETECTION. A Dissertation Presented to. The Academic Faculty MICROMACHINED BROADBAND ACOUSTIC TRANSDUCERS WITH INTEGRATED OPTICAL DISPLACEMENT DETECTION A Dissertation Presented to The Academic Faculty By Neal A. Hall In Partial Fulfillment of the Requirements for

More information

TALKACTIVE CONTROL OF A DIFFRACTION GRATING INTERFEROMETER FOR MICROSCALE DEVICES. A Thesis Presented to. The Academic Faculty. Michael C.

TALKACTIVE CONTROL OF A DIFFRACTION GRATING INTERFEROMETER FOR MICROSCALE DEVICES. A Thesis Presented to. The Academic Faculty. Michael C. TALKACTIVE CONTROL OF A DIFFRACTION GRATING INTERFEROMETER FOR MICROSCALE DEVICES A Thesis Presented to The Academic Faculty By Michael C. Schmittdiel In Partial Fulfillment of the Requirements for the

More information

High-speed wavefront control using MEMS micromirrors T. G. Bifano and J. B. Stewart, Boston University [ ] Introduction

High-speed wavefront control using MEMS micromirrors T. G. Bifano and J. B. Stewart, Boston University [ ] Introduction High-speed wavefront control using MEMS micromirrors T. G. Bifano and J. B. Stewart, Boston University [5895-27] Introduction Various deformable mirrors for high-speed wavefront control have been demonstrated

More information

Piezoelectric Sensors and Actuators

Piezoelectric Sensors and Actuators Piezoelectric Sensors and Actuators Outline Piezoelectricity Origin Polarization and depolarization Mathematical expression of piezoelectricity Piezoelectric coefficient matrix Cantilever piezoelectric

More information

MICROACTUATED MICRO-XYZ STAGES FOR FREE-SPACE MICRO-OPTICAL BENCH

MICROACTUATED MICRO-XYZ STAGES FOR FREE-SPACE MICRO-OPTICAL BENCH MCROACTUATED MCRO-XYZ STAGES FOR FREE-SPACE MCRO-OPTCAL BENCH L. Y. Lin*, J. L. Shen, S. S. Lee, G. D. Su, and M. C. Wu University of California at Los Angeles, Electrical Engineering Department 405 Hilgard

More information

Winter College on Optics: Fundamentals of Photonics - Theory, Devices and Applications February 2014

Winter College on Optics: Fundamentals of Photonics - Theory, Devices and Applications February 2014 2572-10 Winter College on Optics: Fundamentals of Photonics - Theory, Devices and Applications 10-21 February 2014 Photonic packaging and integration technologies II Sonia M. García Blanco University of

More information

Lithography. 3 rd. lecture: introduction. Prof. Yosi Shacham-Diamand. Fall 2004

Lithography. 3 rd. lecture: introduction. Prof. Yosi Shacham-Diamand. Fall 2004 Lithography 3 rd lecture: introduction Prof. Yosi Shacham-Diamand Fall 2004 1 List of content Fundamental principles Characteristics parameters Exposure systems 2 Fundamental principles Aerial Image Exposure

More information

EE C245 ME C218 Introduction to MEMS Design

EE C245 ME C218 Introduction to MEMS Design EE C245 ME C218 Introduction to MEMS Design Fall 2008 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 1: Definition

More information

Transmitting Performance Evaluation of ASICs for CMUT-Based Portable Ultrasound Scanners

Transmitting Performance Evaluation of ASICs for CMUT-Based Portable Ultrasound Scanners Downloaded from orbit.dtu.dk on: Jul 23, 2018 Transmitting Performance Evaluation of ASICs for CMUT-Based Portable Ultrasound Scanners Llimos Muntal, Pere; Diederichsen, Søren Elmin; Jørgensen, Ivan Harald

More information

Photolithography II ( Part 2 )

Photolithography II ( Part 2 ) 1 Photolithography II ( Part 2 ) Chapter 14 : Semiconductor Manufacturing Technology by M. Quirk & J. Serda Saroj Kumar Patra, Department of Electronics and Telecommunication, Norwegian University of Science

More information

Parallel Mode Confocal System for Wafer Bump Inspection

Parallel Mode Confocal System for Wafer Bump Inspection Parallel Mode Confocal System for Wafer Bump Inspection ECEN5616 Class Project 1 Gao Wenliang wen-liang_gao@agilent.com 1. Introduction In this paper, A parallel-mode High-speed Line-scanning confocal

More information

MEMS in ECE at CMU. Gary K. Fedder

MEMS in ECE at CMU. Gary K. Fedder MEMS in ECE at CMU Gary K. Fedder Department of Electrical and Computer Engineering and The Robotics Institute Carnegie Mellon University Pittsburgh, PA 15213-3890 fedder@ece.cmu.edu http://www.ece.cmu.edu/~mems

More information

Mechanical Spectrum Analyzer in Silicon using Micromachined Accelerometers with Time-Varying Electrostatic Feedback

Mechanical Spectrum Analyzer in Silicon using Micromachined Accelerometers with Time-Varying Electrostatic Feedback IMTC 2003 Instrumentation and Measurement Technology Conference Vail, CO, USA, 20-22 May 2003 Mechanical Spectrum Analyzer in Silicon using Micromachined Accelerometers with Time-Varying Electrostatic

More information

SILICON BASED CAPACITIVE SENSORS FOR VIBRATION CONTROL

SILICON BASED CAPACITIVE SENSORS FOR VIBRATION CONTROL SILICON BASED CAPACITIVE SENSORS FOR VIBRATION CONTROL Shailesh Kumar, A.K Meena, Monika Chaudhary & Amita Gupta* Solid State Physics Laboratory, Timarpur, Delhi-110054, India *Email: amita_gupta/sspl@ssplnet.org

More information

Low-Cost Far-Infrared FPA based on High-Volume Pressure Sensor Process

Low-Cost Far-Infrared FPA based on High-Volume Pressure Sensor Process Low-Cost Far-Infrared FPA based on High-Volume Pressure Sensor Process Michael Krueger 1, Ingo Herrmann 1 Robert Bosch GmbH - Automotive Electronics, Tuebinger Str. 13, D-776 Reutlingen, Germany, michael.krueger@de.bosch.com

More information

PSD Characteristics. Position Sensing Detectors

PSD Characteristics. Position Sensing Detectors PSD Characteristics Position Sensing Detectors Silicon photodetectors are commonly used for light power measurements in a wide range of applications such as bar-code readers, laser printers, medical imaging,

More information

MICROMACHINED DIFFRACTION BASED OPTICAL MICROPHONES AND INTENSITY PROBES WITH ELECTROSTATIC FORCE FEEDBACK

MICROMACHINED DIFFRACTION BASED OPTICAL MICROPHONES AND INTENSITY PROBES WITH ELECTROSTATIC FORCE FEEDBACK MICROMACHINED DIFFRACTION BASED OPTICAL MICROPHONES AND INTENSITY PROBES WITH ELECTROSTATIC FORCE FEEDBACK A Dissertation Presented to The Academic Faculty by Baris Bicen In Partial Fulfillment of the

More information

Instruction manual and data sheet ipca h

Instruction manual and data sheet ipca h 1/15 instruction manual ipca-21-05-1000-800-h Instruction manual and data sheet ipca-21-05-1000-800-h Broad area interdigital photoconductive THz antenna with microlens array and hyperhemispherical silicon

More information

IN-CHIP DEVICE-LAYER THERMAL ISOLATION OF MEMS RESONATOR FOR LOWER POWER BUDGET

IN-CHIP DEVICE-LAYER THERMAL ISOLATION OF MEMS RESONATOR FOR LOWER POWER BUDGET Proceedings of IMECE006 006 ASME International Mechanical Engineering Congress and Exposition November 5-10, 006, Chicago, Illinois, USA IMECE006-15176 IN-CHIP DEVICE-LAYER THERMAL ISOLATION OF MEMS RESONATOR

More information

Design of Infrared Wavelength-Selective Microbolometers using Planar Multimode Detectors

Design of Infrared Wavelength-Selective Microbolometers using Planar Multimode Detectors Design of Infrared Wavelength-Selective Microbolometers using Planar Multimode Detectors Sang-Wook Han and Dean P. Neikirk Microelectronics Research Center Department of Electrical and Computer Engineering

More information

From Extended Light Source to Collimated Illumination

From Extended Light Source to Collimated Illumination Chapter 2 From Extended Light Source to Collimated Illumination 2.1 Introduction The collimation obtained in the manner shown in Fig. 1.10(b) uses a suitable projection lens with diameter-to-focal-length

More information

IST IP NOBEL "Next generation Optical network for Broadband European Leadership"

IST IP NOBEL Next generation Optical network for Broadband European Leadership DBR Tunable Lasers A variation of the DFB laser is the distributed Bragg reflector (DBR) laser. It operates in a similar manner except that the grating, instead of being etched into the gain medium, is

More information

Supplementary Materials

Supplementary Materials Supplementary Materials In the supplementary materials of this paper we discuss some practical consideration for alignment of optical components to help unexperienced users to achieve a high performance

More information

Use of Computer Generated Holograms for Testing Aspheric Optics

Use of Computer Generated Holograms for Testing Aspheric Optics Use of Computer Generated Holograms for Testing Aspheric Optics James H. Burge and James C. Wyant Optical Sciences Center, University of Arizona, Tucson, AZ 85721 http://www.optics.arizona.edu/jcwyant,

More information

EE C245 ME C218 Introduction to MEMS Design Fall 2007

EE C245 ME C218 Introduction to MEMS Design Fall 2007 EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 1: Definition

More information

SiGe based Grating Light Valves: A leap towards monolithic integration of MOEMS

SiGe based Grating Light Valves: A leap towards monolithic integration of MOEMS SiGe based Grating Light Valves: A leap towards monolithic integration of MOEMS S. Rudra a, J. Roels a, G. Bryce b, L. Haspeslagh b, A. Witvrouw b, D. Van Thourhout a a Photonics Research Group, INTEC

More information

FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS. Application Area. Quality of Life

FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS. Application Area. Quality of Life FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS Application Area Quality of Life Overlay image of visible spectral range (VIS) and thermal infrared range (LWIR). Quality of Life With extensive experience

More information

( 2) ρ π V. Index Terms Sensor wafer, autonomous operation, in-situ data acquitsition, wireless communication INTRODUCTION

( 2) ρ π V. Index Terms Sensor wafer, autonomous operation, in-situ data acquitsition, wireless communication INTRODUCTION Real Time In-Situ Data Acquisition Using Autonomous On-Wafer Sensor Arrays Mason Freed, Michiel Krüger, Kameshwar Poolla, and Costas Spanos BCAM-Group, Univeristy of California at Berkeley, 5105 Etcheverry

More information

High-Coherence Wavelength Swept Light Source

High-Coherence Wavelength Swept Light Source Kenichi Nakamura, Masaru Koshihara, Takanori Saitoh, Koji Kawakita [Summary] Optical technologies that have so far been restricted to the field of optical communications are now starting to be applied

More information

2D silicon-based surface-normal vertical cavity photonic crystal waveguide array for high-density optical interconnects

2D silicon-based surface-normal vertical cavity photonic crystal waveguide array for high-density optical interconnects 2D silicon-based surface-normal vertical cavity photonic crystal waveguide array for high-density optical interconnects JaeHyun Ahn a, Harish Subbaraman b, Liang Zhu a, Swapnajit Chakravarty b, Emanuel

More information

Silicon on Insulator CMOS and Microelectromechanical Systems: Mechanical Devices, Sensing Techniques and System Electronics

Silicon on Insulator CMOS and Microelectromechanical Systems: Mechanical Devices, Sensing Techniques and System Electronics Silicon on Insulator CMOS and Microelectromechanical Systems: Mechanical Devices, Sensing Techniques and System Electronics Dissertation Defense Francisco Tejada Research Advisor A.G. Andreou Department

More information

Simple interferometric fringe stabilization by CCD-based feedback control

Simple interferometric fringe stabilization by CCD-based feedback control Simple interferometric fringe stabilization by CCD-based feedback control Preston P. Young and Purnomo S. Priambodo, Department of Electrical Engineering, University of Texas at Arlington, P.O. Box 19016,

More information

Wafer-level Vacuum Packaged X and Y axis Gyroscope Using the Extended SBM Process for Ubiquitous Robot applications

Wafer-level Vacuum Packaged X and Y axis Gyroscope Using the Extended SBM Process for Ubiquitous Robot applications Proceedings of the 17th World Congress The International Federation of Automatic Control Wafer-level Vacuum Packaged X and Y axis Gyroscope Using the Extended SBM Process for Ubiquitous Robot applications

More information

Properties of Interdigital Transducers for Lamb-Wave Based SHM Systems

Properties of Interdigital Transducers for Lamb-Wave Based SHM Systems Properties of Interdigital Transducers for Lamb-Wave Based SHM Systems M. MANKA, M. ROSIEK, A. MARTOWICZ, T. UHL and T. STEPINSKI 2 ABSTRACT Recently, an intensive research activity has been observed concerning

More information

Micro-Mechanical Slit Positioning System as a Transmissive Spatial Light Modulator

Micro-Mechanical Slit Positioning System as a Transmissive Spatial Light Modulator Micro-Mechanical Slit Positioning System as a Transmissive Spatial Light Modulator Rainer Riesenberg Institute for Physical High Technology, P.O.Box 100 239, 07702 Jena, Germany ABSTRACT Micro-slits have

More information

ADAPTIVE CORRECTION FOR ACOUSTIC IMAGING IN DIFFICULT MATERIALS

ADAPTIVE CORRECTION FOR ACOUSTIC IMAGING IN DIFFICULT MATERIALS ADAPTIVE CORRECTION FOR ACOUSTIC IMAGING IN DIFFICULT MATERIALS I. J. Collison, S. D. Sharples, M. Clark and M. G. Somekh Applied Optics, Electrical and Electronic Engineering, University of Nottingham,

More information

Fast, Two-Dimensional Optical Beamscanning by Wavelength Switching T. K. Chan, E. Myslivets, J. E. Ford

Fast, Two-Dimensional Optical Beamscanning by Wavelength Switching T. K. Chan, E. Myslivets, J. E. Ford Photonics Systems Integration Lab University of California San Diego Jacobs School of Engineering Fast, Two-Dimensional Optical Beamscanning by Wavelength Switching T. K. Chan, E. Myslivets, J. E. Ford

More information

Micro and Smart Systems

Micro and Smart Systems Micro and Smart Systems Lecture - 39 (1)Packaging Pressure sensors (Continued from Lecture 38) (2)Micromachined Silicon Accelerometers Prof K.N.Bhat, ECE Department, IISc Bangalore email: knbhat@gmail.com

More information

Switch-less Dual-frequency Reconfigurable CMOS Oscillator using One Single Piezoelectric AlN MEMS Resonator with Co-existing S0 and S1 Lamb-wave Modes

Switch-less Dual-frequency Reconfigurable CMOS Oscillator using One Single Piezoelectric AlN MEMS Resonator with Co-existing S0 and S1 Lamb-wave Modes From the SelectedWorks of Chengjie Zuo January, 11 Switch-less Dual-frequency Reconfigurable CMOS Oscillator using One Single Piezoelectric AlN MEMS Resonator with Co-existing S and S1 Lamb-wave Modes

More information

Investigation of an optical sensor for small angle detection

Investigation of an optical sensor for small angle detection Investigation of an optical sensor for small angle detection usuke Saito, oshikazu rai and Wei Gao Nano-Metrology and Control Lab epartment of Nanomechanics Graduate School of Engineering, Tohoku University

More information

Inspection of Flip Chip and Chip Scale Package Interconnects Using Laser Ultrasound and Interferometric Techniques

Inspection of Flip Chip and Chip Scale Package Interconnects Using Laser Ultrasound and Interferometric Techniques Inspection of Flip Chip and Chip Scale Package Interconnects Using Laser Ultrasound and Interferometric Techniques Turner Howard, Dathan Erdahl, I. Charles Ume Georgia Institute of Technology Atlanta,

More information

True Three-Dimensional Interconnections

True Three-Dimensional Interconnections True Three-Dimensional Interconnections Satoshi Yamamoto, 1 Hiroyuki Wakioka, 1 Osamu Nukaga, 1 Takanao Suzuki, 2 and Tatsuo Suemasu 1 As one of the next-generation through-hole interconnection (THI) technologies,

More information

CMP for More Than Moore

CMP for More Than Moore 2009 Levitronix Conference on CMP Gerfried Zwicker Fraunhofer Institute for Silicon Technology ISIT Itzehoe, Germany gerfried.zwicker@isit.fraunhofer.de Contents Moore s Law and More Than Moore Comparison:

More information

Large-scale metal MEMS mirror arrays with integrated

Large-scale metal MEMS mirror arrays with integrated Large-scale metal MEMS mirror arrays with integrated electronics Thomas Bifano', Paul Bierden2, Steven Cornelissen1, Clara Dimas2, Hocheol Lee1, Michele Miller3, and Julie Perreault1 'Boston University,

More information

LASER GENERATION AND DETECTION OF SURFACE ACOUSTIC WAVES

LASER GENERATION AND DETECTION OF SURFACE ACOUSTIC WAVES LASER GENERATION AND DETECTION OF SURFACE ACOUSTIC WAVES USING GAS-COUPLED LASER ACOUSTIC DETECTION INTRODUCTION Yuqiao Yang, James N. Caron, and James B. Mehl Department of Physics and Astronomy University

More information

Fabrication and application of a wireless inductance-capacitance coupling microsensor with electroplated high permeability material NiFe

Fabrication and application of a wireless inductance-capacitance coupling microsensor with electroplated high permeability material NiFe Journal of Physics: Conference Series Fabrication and application of a wireless inductance-capacitance coupling microsensor with electroplated high permeability material NiFe To cite this article: Y H

More information

attosnom I: Topography and Force Images NANOSCOPY APPLICATION NOTE M06 RELATED PRODUCTS G

attosnom I: Topography and Force Images NANOSCOPY APPLICATION NOTE M06 RELATED PRODUCTS G APPLICATION NOTE M06 attosnom I: Topography and Force Images Scanning near-field optical microscopy is the outstanding technique to simultaneously measure the topography and the optical contrast of a sample.

More information

Final Exam Topics. IC Technology Advancement. Microelectronics Technology in the 21 st Century. Intel s 90 nm CMOS Technology. 14 nm CMOS Transistors

Final Exam Topics. IC Technology Advancement. Microelectronics Technology in the 21 st Century. Intel s 90 nm CMOS Technology. 14 nm CMOS Transistors ANNOUNCEMENTS Final Exam: When: Wednesday 12/10 12:30-3:30PM Where: 10 Evans (last names beginning A-R) 60 Evans (last names beginning S-Z) Comprehensive coverage of course material Closed book; 3 sheets

More information

Electrostatic actuation of silicon optomechanical resonators Suresh Sridaran and Sunil A. Bhave OxideMEMS Lab, Cornell University, Ithaca, NY, USA

Electrostatic actuation of silicon optomechanical resonators Suresh Sridaran and Sunil A. Bhave OxideMEMS Lab, Cornell University, Ithaca, NY, USA Electrostatic actuation of silicon optomechanical resonators Suresh Sridaran and Sunil A. Bhave OxideMEMS Lab, Cornell University, Ithaca, NY, USA Optomechanical systems offer one of the most sensitive

More information

Surface Finish Measurement Methods and Instrumentation

Surface Finish Measurement Methods and Instrumentation 125 years of innovation Surface Finish Measurement Methods and Instrumentation Contents Visual Inspection Surface Finish Comparison Plates Contact Gauges Inductive / Variable Reluctance (INTRA) Piezo Electric

More information

High Sensitivity Interferometric Detection of Partial Discharges for High Power Transformer Applications

High Sensitivity Interferometric Detection of Partial Discharges for High Power Transformer Applications High Sensitivity Interferometric Detection of Partial Discharges for High Power Transformer Applications Carlos Macià-Sanahuja and Horacio Lamela-Rivera Optoelectronics and Laser Technology group, Universidad

More information

Micromachined Integrated Optics for Free-Space Interconnections

Micromachined Integrated Optics for Free-Space Interconnections Micromachined Integrated Optics for Free-Space Interconnections L. Y. Lin, S. S. Lee, M C. Wu, and K S. J. Pister Electrical Engineering Dept., University of California, Los Angeles, CA 90024, U. S. A.

More information

Out-of-plane translatory MEMS actuator with extraordinary large stroke for optical path length modulation in miniaturized FTIR spectrometers

Out-of-plane translatory MEMS actuator with extraordinary large stroke for optical path length modulation in miniaturized FTIR spectrometers P 12 Out-of-plane translatory MEMS actuator with extraordinary large stroke for optical path length modulation in miniaturized FTIR spectrometers Sandner, Thilo; Grasshoff, Thomas; Schenk, Harald; Kenda*,

More information

A MEMS Transducer for Ultrasonic Flaw Detection

A MEMS Transducer for Ultrasonic Flaw Detection A MEMS Transducer for Ultrasonic Flaw Detection by Akash Jain, David W. Greve, and Irving J. Oppenheim 1 ABSTRACT Metal structures can fail because of fatigue crack propagation or because of section loss

More information

SENSOR+TEST Conference SENSOR 2009 Proceedings II

SENSOR+TEST Conference SENSOR 2009 Proceedings II B8.4 Optical 3D Measurement of Micro Structures Ettemeyer, Andreas; Marxer, Michael; Keferstein, Claus NTB Interstaatliche Hochschule für Technik Buchs Werdenbergstr. 4, 8471 Buchs, Switzerland Introduction

More information

Industrialization of Micro-Electro-Mechanical Systems. Werner Weber Infineon Technologies

Industrialization of Micro-Electro-Mechanical Systems. Werner Weber Infineon Technologies Industrialization of Micro-Electro-Mechanical Systems Werner Weber Infineon Technologies Semiconductor-based MEMS market MEMS Market 2004 (total 22.7 BUS$) Others mostly Digital Light Projection IR Sensors

More information

Cavity with a deformable mirror for tailoring the shape of the eigenmode

Cavity with a deformable mirror for tailoring the shape of the eigenmode Cavity with a deformable mirror for tailoring the shape of the eigenmode Peter T. Beyersdorf, Stephan Zappe, M. M. Fejer, and Mark Burkhardt We demonstrate an optical cavity that supports an eigenmode

More information

Structure for Ultrasonic Suspension Gap Pressure Sensor

Structure for Ultrasonic Suspension Gap Pressure Sensor Sensors and Materials, Vol. 29, No. 6 (2017) 805 816 MYU Tokyo 805 S & M 1369 Structure for Ultrasonic Suspension Gap Pressure Sensor Masaya Takasaki, * Ryutaro Chida, Shota Chino, Satoshi Morishita, 1

More information

Active transverse mode control and optimisation of an all-solid-state laser using an intracavity adaptive-optic mirror

Active transverse mode control and optimisation of an all-solid-state laser using an intracavity adaptive-optic mirror Active transverse mode control and optimisation of an all-solid-state laser using an intracavity adaptive-optic mirror Walter Lubeigt, Gareth Valentine, John Girkin, Erwin Bente, David Burns Institute

More information

Outline: Introduction: What is SPM, history STM AFM Image treatment Advanced SPM techniques Applications in semiconductor research and industry

Outline: Introduction: What is SPM, history STM AFM Image treatment Advanced SPM techniques Applications in semiconductor research and industry 1 Outline: Introduction: What is SPM, history STM AFM Image treatment Advanced SPM techniques Applications in semiconductor research and industry 2 Back to our solutions: The main problem: How to get nm

More information

Deformable MEMS Micromirror Array for Wavelength and Angle Insensitive Retro-Reflecting Modulators Trevor K. Chan & Joseph E. Ford

Deformable MEMS Micromirror Array for Wavelength and Angle Insensitive Retro-Reflecting Modulators Trevor K. Chan & Joseph E. Ford Photonics Systems Integration Lab UCSD Jacobs School of Engineering Deformable MEMS Micromirror Array for Wavelength and Angle Insensitive Retro-Reflecting Modulators Trevor K. Chan & Joseph E. Ford PHOTONIC

More information

Characteristics of point-focus Simultaneous Spatial and temporal Focusing (SSTF) as a two-photon excited fluorescence microscopy

Characteristics of point-focus Simultaneous Spatial and temporal Focusing (SSTF) as a two-photon excited fluorescence microscopy Characteristics of point-focus Simultaneous Spatial and temporal Focusing (SSTF) as a two-photon excited fluorescence microscopy Qiyuan Song (M2) and Aoi Nakamura (B4) Abstracts: We theoretically and experimentally

More information

Real-time displacement measurement using VCSEL interferometer

Real-time displacement measurement using VCSEL interferometer Real-time displacement measurement using VCSEL interferometer Takamasa Suzuki, Noriaki Yamada, Osami Sasaki, and Samuel Choi Graduate School of Science and Technology, Niigata University, 8050, Igarashi

More information

Stability of a Fiber-Fed Heterodyne Interferometer

Stability of a Fiber-Fed Heterodyne Interferometer Stability of a Fiber-Fed Heterodyne Interferometer Christoph Weichert, Jens Flügge, Paul Köchert, Rainer Köning, Physikalisch Technische Bundesanstalt, Braunschweig, Germany; Rainer Tutsch, Technische

More information

Department of Mechanical Engineering and Automation, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen, , China

Department of Mechanical Engineering and Automation, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen, , China 6th International Conference on Machinery, Materials, Environment, Biotechnology and Computer (MMEBC 16) Precision Measurement of Displacement with Two Quasi-Orthogonal Signals for Linear Diffraction Grating

More information

Sinusoidal wavelength-scanning common-path interferometer with a beam-scanning system for measurement of film thickness variations

Sinusoidal wavelength-scanning common-path interferometer with a beam-scanning system for measurement of film thickness variations Sinusoidal wavelength-scanning common-path interferometer with a beam-scanning system for measurement of film thickness variations Osami Sasaki, Takafumi Morimatsu, Samuel Choi, and Takamasa Suzuki Faculty

More information

High Power RF MEMS Switch Technology

High Power RF MEMS Switch Technology High Power RF MEMS Switch Technology Invited Talk at 2005 SBMO/IEEE MTT-S International Conference on Microwave and Optoelectronics Conference Dr Jia-Sheng Hong Heriot-Watt University Edinburgh U.K. 1

More information

Design and Simulation of a Silicon Photomultiplier Array for Space Experiments

Design and Simulation of a Silicon Photomultiplier Array for Space Experiments Journal of the Korean Physical Society, Vol. 52, No. 2, February 2008, pp. 487491 Design and Simulation of a Silicon Photomultiplier Array for Space Experiments H. Y. Lee, J. Lee, J. E. Kim, S. Nam, I.

More information

Displacement sensor by a common-path interferometer

Displacement sensor by a common-path interferometer Displacement sensor by a common-path interferometer Kazuhide KAMIYA *a, Takashi NOMURA *a, Shinta HIDAKA *a, Hatsuzo TASHIRO **b, Masayuki MINO +c, Seiichi OKUDA ++d a Facility of Engineering, Toyama Prefectural

More information

Liquid sensor probe using reflecting SH-SAW delay line

Liquid sensor probe using reflecting SH-SAW delay line Sensors and Actuators B 91 (2003) 298 302 Liquid sensor probe using reflecting SH-SAW delay line T. Nomura *, A. Saitoh, T. Miyazaki Faculty of Engineering, Shibaura Institute of Technology, 3-9-14 Shibaura,

More information

Aluminum Nitride Reconfigurable RF-MEMS Front-Ends

Aluminum Nitride Reconfigurable RF-MEMS Front-Ends From the SelectedWorks of Chengjie Zuo October 2011 Aluminum Nitride Reconfigurable RF-MEMS Front-Ends Augusto Tazzoli University of Pennsylvania Matteo Rinaldi University of Pennsylvania Chengjie Zuo

More information