Lead Forming. Automatic Selective Soldering Systems. Since more than 25 years the cutting and forming of THT components is the core business of EBSO.

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1 Lead Forming Since more than 25 years the cutting and forming of THT components is the core business of EBSO. With over 20 standard preforming machines we can provide solutions to any kind of lead forming jobs. Despite of the SMT technology, THT components are still in use in reasonable quantities in the electronic industry hence makes a big portion of our business. Visit our website to learn more about EBSO products. Automatic Selective Soldering Systems EBSO Headquarter in Germany Over 25 years expierience in electronics EBSO GmbH Industriestrasse 15b D76767 Hagenbach, Germany Tel: +49(0) Fax: +49(0) info@ebso.com

2 Selective Soldering with the EBSO SPA Line SPAR Rework and Manual Soldering Miniwave with overflow wetable solder nozzle Many components can due to theire thermal sensitivity not be soldered with a traditional wave solder process (LCD displays). Other PCB s are due to SMD component layout issues also can t be soldered successfully using the traditional wave solder process. Further more often the very costly custom made solder masks to cover the SMD components are difficult to make and not justifiable so customers finish up hand soldering parts. To automate this process the answer is selective soldering. EBSO already had machines like SPA 300F and 400F developed in the year 2002, this machine concept also allows small to medium companies with smaller budgets and production lots to enter this attractive new technology. The SPA Line starts from manual machines all the way up to fully automatic solder centres. The bench top machine SPAR is a manual solder station to rework leaded components such as connectors etc. Due to RoHS conform electronics the lead free raised which made the rework of THT components with a solder iron even more difficult then it was before. The solution is the SPAR which makes this process less painless. Furthermore, for manual soldering of small and medium batches the SPAR can be used as well. Soldernozzle for rework system SPAR QUICK RELEASE solder pump With this particular product line up EBSO has become the world market leader. Product specific solder nozzles and masks round off the enormous knowhow EBSO has in this new emerging soldering technology. Selective soldering makes your THT solder process more efficient and safer due to exact control of flux quantity, preheat and. With over 30 well trained distributors world wide, EBSO can provide best service in pre and aftersales. XYTable with position fixing Different solder nozzle sizes and customized nozzles SPAR insight straightforward engineering SPAR with laserpointer to ease component centering over nozzle Simply turn pump 45 and the pump is ready to remove All SPA machines are built with the same solder pot technology made of fully titanium which is best for lead free solder alloys. The patented unique QUICK RE LEASE solder pump is a revolution in terms of maintenance time. This system allows full access to the solder pot within seconds, hence it increases your production efficiency. Product Highlights: Easy to operate Timerfunction Solder pump and solder bath made of fully titanium for lead free solder alloys equipped with the QUICK RELEASE pump technology On the fly wave hight regulation Wave standbyfunction to reduce tack time Save of 5 programs Easy solder nozzle interchange No limits in board size Optional N2supply Optional laserpointer to ease component centering over nozzle XYtable Solder pot with dual nozzle technology and IRpreheat The EBSO Offline programming software together with the integrated PhotoEditor allows fastest programming times. PhotoEditor makes programming easy and comfortable Soldering of a connector

3 SPA 200 The lowcost Solution for Selective Soldering SPA 300F / SPA 400F Etablished worldwide For PCB boards not larger then 200 x 200 mm this batch machine is the most costefficient solution for selective soldering but offers all advantages of the technology. The Technology: Very little footprint of 1m² only at lowest cost of ownership 220 V single phase power at 3,5 KW Solder area up to 200 x 200 Solder pot made of full titanium best for lead free Solder pump with unique QUICK RELEASE System Wide range of different solder nozzles 7 soldering to 0 possible Wetable and jet wave solder nozzles from 3 to Nitrogen inert Microdrop fluxing as standard for selective point and line fluxing Powerful 1,5 KW bottom IRpreheater Optional 40 program storage in machine Solder level Programming with comfortable Offline and PhotoEditor Since we introduced the SPA 300F / SPA 400F to the market in 2003 more then 250 machines has been installed so far. The concept of the machine allows many options for the requirements of the customers demand. The Technology: Small footprint at lowest cost of ownership ROI in one year Solder area up to 400 x 400 mm Full titanium solder pot best for lead free Pump unit with unique QUICK RELEASE System Wide range of solder nozzles Simultaious soldering due to smart dualnozzle technology doubles your throughput Wetable and jet wave nozzles from 3 to Customized nozzles N2 inert Single and dual sprayfluxer or microdrop fluxer Optional 2 fluxpots to run different fluxers (i.e.: VOC and VOCfree) Powerful IRpreheater Optional top site preheat 2,0 KW Easy change pot system for different alloys optional with 2 solder pots in machine (SPA 400F only) Saves up to 40 solder programs Closed loop drives incl. encoder at stepper motors reaches +/ 0,1 mm accuriacy in positioning Adjustable speed up to 20 m/min Automatic timer function Air and N2 Temperature Solder level control and automatic solder wire feeder Easy point and click programming with the smart Offline and PhotoEditor software DualNozzle with QUICKRELEASE Pump Custom made multi dip nozzle Soldering process with the wetable nozzle Inside view of the EBSO SPA 200 EBSO SPA 200 in use Production at Werma Signal Lights in Germany: 3 SPA machines, inbetween operator working place insures highest flexibiliy and throughput always 3 different (or same) products are in production at the same time

4 SPA 500 Modular Programming Indivudal Solutions for Highend Selective Soldering with the EBSO OfflineEditor The new modular plattform can be equipped for the individual product requirement in highend / highvolume selective soldering process. Unique Technology Advantages: The EBSO OfflineEditor is a windows based software to create a solder program for each individual solder joint. With an easy point & click tool a reliable solder program is made within minutes. Top site preheat Dual nozzle Soldering under 0 or 7 Closed loop XYZportalsystem with servodrives Solder angle under 0 and 7 free to program Max. PCB size 510 x 510 mm Max. solder mask size 550 x 550 mm Precisespray and/or microdrop fluxer for point and line fluxing incl. 2 l flux pot and flux Titanium solder pot and solder pump best for lead free Pump unit equipped with unique QUICK RELEASE design Solder frame reckognition with integrated collision avoidance Dual nozzle for simultaneaous soldering to double throughput Possibility of 4 fluxers (i.e.: 2 drop, 2 spray oder 4 spray fluxer) 2 Flux pots to run 2 differnet fluxers (i.e.: VOC and VOCfree) Top Site Preheat Optional Inline 2 solder pots in machine with max. solder area of 510 x 510 mm on both solder pots i.e.: 1 solder pot dipping process 2nd solder pot selective miniwave wave Wide range of solder nozzles and customized such as dipping nozzles Wetable and jet wave nozzles N2 inert Easy change pot option Saves up to 40 solder programs Travel speed up to 20 m/min Air and N2 supply Solder level and automatic solder wire feeder Wave height Easy point and click programming with the smart Offline and PhotoEditor software Offline means no programming on the machine (machine can work during setup of a new product) Open adjustments for all process parameters Demo mode Compatible to all EBSO selective soldering machines from SPA 200 to SPA 500 Modular The Gerber Import provides Features to Import Drill Gerber Files Many times Gerber datas are difficult to filter, EBSO offers the PhotoEditor. Simply scan the bare PCB board you want to solder or create an image file of your board out from your CAD program. Open the EBSO PhotoEditor, import this image and just click on the points where you want to solder. Coordinates will be calculated by the software. Advantages: You can consider neighbour SMD components Visual orientation on the board while programming Solder joint offsets are easier to control Program changes can be done quicker Programming can t be easier Simple editing with the OfflineEditor Gerber import SPA500 as inline with gripper unit PhotoEditor with a picture of the board from CAD Change pot system Keep the overview with neighbouring SMD components through the PhotoEditor The inside view of the SPA 500

5 Technical data Length Width Height Weight Colour Transportsystem Transportangle Max. PCB size Max. frame / fixture size Max. clearance on solder side Max. transportspeed Position accuracy over fluxer, Preheater and solder nozzle Fluxermodule Flux pot Fluxspeed Spray width (nozzle diameter 0,3 mm) Preheater Power Soldermodule Nozzles (refer to data sheet) Smallest nozzle diameter Min. neighbour component clearance Solder capacity Max. temperature Upheat time Solder time Position speed Nitrogen technology N2 N2 supply SPA 500 Modular 2000 mm 1950 mm 1350 mm kg XYZ axis carrier system with servo drives 0 or 7 free programmable 510 x 510 mm 550 x 550 mm X axis = 1850 cm/min Y axis = 1900 cm/min Z axis = 1000 cm/min + 0,1 mm Optional microdropfluxer Max. 19 m/min programmable 36 mm (Sprayfluxer) IRemmiters 1,53 mm (depends on nozzle type) Approx. 35 minutes 0,10,4 m/min programmable N2covering over solder bath and pump unit SPA 400F 1600 mm 1200 mm 1500 mm 400 kg and encoder 7 fix 400 x 400 mm 440 x 440 mm + 0,1 mm Optional microdropfluxer 36 mm (Sprayfluxer) IRemmiters 1,53 mm (depends on nozzle type) 0,10,4 m/min programmable N2covering over solder bath and pump unit SPA 300F 1150 mm 900 mm 1450 mm 250 kg and encoder 7 fix 300 x 300 mm 340 x 340 mm + 0,1 mm Optional microdropfluxer 2 l stainless steel flux pot and fittings incl. fux 36 mm (Sprayfluxer) IRemmiters 1,53 mm (depends on nozzle type) 0,10,4 m/min programmable N2covering over solder bath and pump unit SPA mm 800 mm 1450 mm 120 kg 7 fix /optional x 200 mm 230 x 230 mm + 0,1 mm Precise micro drop fluxer IRemmiters 1,5 KW 1,53 mm (depends on nozzle type and PCB design) Approx. 20 kg 0,10,4 m/min programmable N2covering over solder bath and pump unit SPA R 700 mm 400 mm 250 mm 35kg / 13 m³ adjustable Preasure Consumption N2 type Inline Air Pressure SPS Automatic timer Working hours counter Maintenance control Password protection Manual Operation Electrical data Power Power tolerance range Power consumption Fuse rate Exhaust Exhaust power Extension tube Enviroment temperature Permanent sound level Further Welded iron frame Safety emergency stop switch 1,53 m³/h adjustable 2.7 or 99,9 % N2 Standard SMEMA with conveyor and gripper Siemens S7200 SPS incl. touchscreen panel +6%, 10% Max. 15 KW 1530 C 1,53 m³/h adjustable Siemens S7200 SPS incl. touchscreen panel +6%, 10% Max. 5,5 KW 1530 C 1,53 m³/h adjustable Siemens S7200 SPS incl. touchscreen panel +6%, 10% Max. 5,5 KW 1530 C 1,53 m³/h Siemens S7200 SPS incl. panel 230 V, N, PE50 / 60 Hz +6%, 10% Max. 3,5 KW Max. 16 A 1530 C Technical subject to change. We don t take over adhesion for misprint