Innovative Soldering Technology for new Material Combinations

Transcription

1 13 th MST 4.0 Conference 20 th 21 st September 2016, Dortmund Innovative Soldering Technology for new Material Combinations Dr. Ino J. Rass, EUROMAT GmbH, Baesweiler b. Aachen

2 Contents of Presentation Introduction and historical view Features and definitions Description of ultrasonic soldering and examples Properties of active solder materials Industrial applications Summary

3 Historical View of Brazing Evaluated Datas (Source DVS 2010: Brazing - An Introduction) B.C. AD Mesopotamia: Soldering of jewelries and goods using gold and silver. Egypt: Soldering of jewelries and goods using gold and silver. Europe: soldering of tools and jewelries mad out of bronze. Rome: Soldering of weapons and chain mails with copper solders using fluxes like borax and soda. Europe: Using different kind of solders for professional service. Europe: Using solder alloys like AgCu and AuCu. Europe: The peak of goldsmith`s-arts. Production of weapons drove soldering. Europe: Use of CuSn and Ag-based solders for soldering of Fe-based materials. Europe: Soldering of copper steam vessels. Begin of scientific evaluations. Europe: Welding is established beneath soldering. First use of Al-solders. Use of Cd to reduce solder temperatures. Soldering and brazing for large-scale production in electronics. Using low melting Ag-solders for industrial applications and handcraft. High temperature brazing. Ni-based materials for aircraft and aerospace applications. Soldering/Brazing of new materials, glass, ceramics, composites. Development of nano solder materials. Using lead-free-solders (RoHS), Intermetallics etc.

4 Historical View of Brazing Evaluated Applications (Source DVS 2010: Brazing - An Introduction and Presentation* Dr. Rass at Materials Science Institute RWTH Aachen 1996) Etruscan Gold Pontic with Calve Teeth (400 B.C.)* Crown of an Egyptian Princess Gold-Laspis Lazuli-Turkey Stone Several Soldering Steps (1860 B.C.) Gold Bowl with solder loops Found in Iraq (2600 B.C.) Etruscan Gold Bowl made out of 137,000 Single Gold Pellets (600 B.C.) Rotating Table Soldering Machine for Continously Soldering of long Parts using Gas Robotic System for Soldering of Cu-Tubes of Heat Exchanger Using Inductive Heating Belt Furnace with Protection Air Gas Atmosphere

5 Definitions Soldering/Brazing (ISO 857-2) Joining processes in which a molten filler material is used that has a lower liquidus temperature than the solidus temperature of the parent material(s), which wets the surfaces of the heated parent material(s) and which, during or after heating, is drawn into (or, if pre-placed, is retained in) the narrow gap between the components being joined Note 1 to entry: These processes are generally carried out with metals but they can also be carried out with non-metallic materials. The filler material always has a different chemical composition from the components being joined. Note 2 to entry: If the process is carried out without capillary attraction, it is often described as braze welding. Soldering Joining process using filler metal with a liquidus temperature of 450 C or less Brazing Joining process using filler metal with a liquidus temperature above 450 C Coating Deposition of a layer or layers of material on a surface to obtain desired properties and/or dimensions

6 Definitions Joining Technologies Non Permanent Permanent Form Positive Bond Form-Positive Bonds Non-Positive Bond Example Rail Bolts and Nails Source: Wikipedia Substance-to-Substance Bonds Welding Glueing Soldering Brazing Non-Positive Bonds o C, 45 min Braze Material Ni102 Example Vacuum brazed St-TiAl Source: Material Science Institute Aachen

7 Brazing Application Heat Exchanger Part: Heat Exchanger for Sterling- Engine in Block Heat and Power Plant Material: austenitic CrNi-Steel Requirement: Gap free and He-density Braze Material: Ni-Base / 1050 C Realization only by Brazing Technology 900 Joints in one Process Step High Reproducibility High Reliability Source: Listemann Technology AG - Liechtenstein

8 Application SOFC Fuel Cells for Electro Mobility Source: Stephan Zügner, Dissertation 2009

9 Application Turbine Technology Turbine V2500 (e.g. Airbus A320) MCrAlY / CBN, brazed on tip of turbine blade - Dense gaps - Reduction of emissions and fuel consumption - Low wear Source: MTU München GmbH

10 Application Exhausting and Cooler Systems Reduction of Emissions Exhaust Catalysts SCR-Technology EGR-Cooler

11 Ultrasonic Soldering Technology (<450 o C) Properties Fluxless processing at air regarding RoHS-Rules using lead-free solder materials Creates strong, thermally conductive joints at relatively low temperatures -Joining temperatures 140 o C to 450 o C depending on used solder materials -Improvement over conductive adhesives -Higher joining temperatures than most solders (In-based) Allows joining of dissimilar materials/cte -Metals and Light Metals -MMC, Ceramic/Carbides/Carbon, Glass, Composites Al-SiC/SiSiC Process can be automated -Able to get economies of scale in high volume applications

12 Mechanical Activation - Principals Molten Solder Oxide Layer Pressure Brushing / Vibration Ultrasonic Agitation / Pressure

13 Ultrasonic Activation - Principals Soldering w/ flux No Flux Soldering A Solder iron tip B Solder C Flux D Oxide layers E Wetted/Bonded F Base material EUROMAT SBonder 57/150

14 Ultrasonic Soldering Process Options Process Options One Step Procedure Solder Contact Two Step Procedure Solder 1 Metallization Solder 2 Contact Three Step Procedure Solder 1 Metallization Solder 2 Solder 1 Metallization Contact Substrate Substrate Substrate Dipping Procedure Solder Substrate Sonotrode

15 Ultrasonic Horn Geometries for ID- and OD-Soldering O 0,8 10 mm 1x1 10x10 mm 10x50 mm 30x100 mm O 120 mm 10x50 mm Solder spots Base material Solder Base material 1 Base material 2 Solder Base material 1 Base Material 2 Base material 1

16 Ultrasonic Gap Soldering of Busbars CuSn-Solder Ultrasonic Horn Heat 260 o C 280 o C Copper Foil Thickness 0,5 mm CuSn Ultrasonic Solder Filled Gap Endless Copper Foil

17 Ultrasonic Soldering of Al-Al and Al-Cu Tubes Principle Ultrasonic Soldering Process with solder preform no flux + lead free Ultrasonic soldering with solder preform 1. Placing tubes 2. Placing solder preform 3. Heating up onto soldering temperature 3. Melting of solder preform 4. Starting ultrasonic energy 5. Molten solder wets surfaces and closes gaps Heat Tube 1 Heat Tube 1 Solder preform Ultrasonic horn Ultrasonic horn Tube 2 Molten solder ~ 260 o C Tube 2

18 Ultrasonic Soldering of Al-Al and Al-Cu Tubes Fluxless Process - Atmospheric at 260 o C Lead free Sn-based Solder

19 Ultrasonic Soldering of Heat Exchangers Round table production heat exchanger Indexing table Infrared Heating Pick & Place Ultrasonic soldering station

20 Metallizing with Ultrasonic Soldering Bath Ultrasonic bath metallized Al- and Cu-wires

21 Ultrasonic Solder Materials Properties of S-Bond Ultrasonic Solder Materials Metals Nonferrous- Metals Glasses Ceramics Composites S-Bond Solder Chemical Composition add. R.E.E. Wire D [mm] Ingot [mm] Foil S [mm] Suitable Ultrasonic Soldering Iron Suitable Ultrasonic Bath Melting Range C Recomme nded C SnBiAg 1,6 X /+++ +/ / SnZnSb 1 X / SnAgCu 3 X X /+++ -/+ -/+ ++/ SnAgTi 1,6-4,0 0,1-0,3 X / /50 SnAgTi 1,6-4,0 0,1-0,3 X /++ + -/+ -/ /M SnAgTiMg 1,6-4,0 0,1-0,3 X / SnSb 0,1-0,2 X / SnCu 20x9 x38 X / Sn 1,0-4,0 X 0,1-0,3 X X / ZnAgAl 1,8 0,5-1,0 X Tested with S-Bonder 57/150. Tip diametre 3 mm.

22 Application Focus of Ultrasonic Soldering Cooling plates Prewetting of Al-materials before casting Aluminum & Aluminum composites (e.g. Al:SiC, Al:Al 2 O 3 ) Lightweight Structures / Aluminum tools & molds Foams and porous materials Target materials

23 Ultrasonic Soldering of AlN Process Parameters: Temperature: o C/ o C Tip Diametre: 3 mm Materials: Solder Material: SB220-1/SB400-2 No. 1: Equipment S-Bonder SK-6015 No. 2: AlN-Segments onto Al-Cooling Plate No. 3: Cu-Wire contacted onto AlN-Plate Results: 1. Very good wettability 2. High adherence of metallization layer 3. CTE - If AlN plate is too thin cracks are occuring 4. Cable ends can soldered to ultrasonic metallized AlN 1 2 3

24 Ultrasonic Soldering of SiC to Invar Motivation: Low temperature joing techniques are needed due to thermal mismatch of materials to be soldered Ultrasonic soldering is a possible solution Results: 1. Ultrasonic soldering works 2. Good wettability of SiC and Invar surfaces 3. Soldering temperatures o C were tested 4. No flux needed Use of lead free solders possible 5. Shear strengths of the joints in the range of 30 MPa were achieved (Proofed at Fraunhofer IFAM Dresden according DIN EN 1465 and ASTM D905) 6. Dense joints with high hermal conductivity Properties of SiC: High temperature resistance High specific stuffness Low density Low CTE High thermal conductivity Corrosion and wear resistance Application: Cooling system

25 Ultrasonic Soldering - Thermal Management - Aluminum Fin-Plate Hx - Al-Cu tubing & joints - IC Processor Coolers - Graphite foam-al case - Cooling plates - Al to Al and Al to Cu - Power Electronics - Al-Cu Foam joints - Innovative coolers - Al-foam to Cu

26 Ultrasonic Soldering - Thermal Management Aluminum to Graphite Foams Aluminum-Copper Chip Package Base Al:SiC Active Cooled Electronic thermal base plate Aluminum Fins on Al

27 Ultrasonic Soldering Targets for Thin Film Technology Al2O3 - Copper Tungsten to Copper TiB 2 to Copper Chromium to Copper Invar to Copper ITO - Copper

28 Ultrasonic Soldering Electronic Applications Electronics / Optical Components Gr-foam onto Alumina Power electronics cooling Power IC attachments

29 Summary Soldering and metallization of metals, light metals, ceramics and composite materials is possible Ultrasonic soldering works without flux and leadfree solders can be used Soldering at low temperatures lowers thermal mismatch stresses Dense joints with high strenghts can be realized Process tools can be adapted to parts geometries Various ultrasonic solder alloys for process temperatures ranging from 150 up to 420 o C are available Suitable for electronic and industrial components Technology is conform to RoHS 2002/95/EC and WEEE (valid July 1st, 2006 in EC)

30 Thank you very much for your attention