HVQFN16; Reel pack, SMD, 13" Q2/T3 standard product orientation Orderable part number ending,128 or HP Ordering code (12NC) ending 128.
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1 Rev December 2015 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal Preprinted ESD warning Circular sprocket holes opposite the label side of reel PQ-label (permanent) Cover tape Carrier tape 001aak603 Fig 1. Reel pack for SMD
2 Table 1. Reel dimensions d w [1] 2. Product orientation Dimensions and quantities SPQ/PQ (pcs) [2] Reels per box Outer box dimensions l w h [1] d = reel diameter; w = tape width. [2] Packing quantity dependent on specific product type. View ordering and availability details at NXP order portal, or contact your local NXP representative. Fig 2. Carrier tape pocket quadrants. Product orientation in carrier tape Pin 1 is in quadrant Q2/T3. 3. Carrier tape dimensions 4 mm A 0 K 0 W B 0 P 1 direction of feed T 001aao148 Fig 3. Carrier tape dimensions Table 2. Carrier tape dimensions In accordance with IEC A 0 B 0 K 0 T P 1 W _128 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved. Packing information Rev December of 5
3 4. Reel dimensions A Z W2 B Ø C Ø D detail Z 001aao149 Fig 4. Schematic view of reel Table 3. Reel dimensions In accordance with IEC A [nom] W2 [max] B [min] C [min] D [min] _128 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved. Packing information Rev December of 5
4 5. Barcode label Fixed text Country of origin i.e. "Made in..." or "Diffused in EU [+] Assembled in... Packing unit (PQ) identification 2 nd traceability lot number* 2 nd (youngest) date code* 2 nd Quantity* Traceability lot number Date code Quantity Type number NXP 12NC NXP SEMICONDUCTORS MADE IN >COUNTRY< [PRODUCT INFO] (33T) PUID: B (30T) LOT2 (30D) DATE2 (30Q) QTY2 (1T) LOT (9D) DATE (31D) REDATE (32T) ORIG (31T) PMC (31P) MSL/PBT MSL/PBT (Q) QTY HALOGEN FREE (30P) TYPE RoHS compliant (1P) CODENO Optional product information* Re-approval date code* Origin code Product Manufacturing Code MSL at the Peak Body solder temperature with tin/lead* MSL at the higher lead-free Peak Body Temperature* 2D matrix with all data (including the data identifiers) Additional info if halogen free product Additional info on RoHS Lead-free symbol 001aak714 Fig 5. Example of typical box and reel information barcode label Table 4. Box barcode label l w Barcode label dimensions Reel barcode label l w _128 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved. Packing information Rev December of 5
5 6. Revision history Table 5. Revision history Document ID Release date Packing document status Change notice Supersedes _ Packing information - - Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors N.V All rights reserved. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 14 December 2015 Document identifier: _128
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More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
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