D (double) Package type descriptive code. SOD2 Package type industry code. DSN Package style descriptive code
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1 terminals; body 0.6 x 0.3 x 0.3 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code SOD2 Package type industry code DSN Package style descriptive code SOD (small outline diode) Package style suffix code NA (not applicable) Package body material type P (plastic) Mounting method type S (surface mount) Issue date Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length mm E package width mm A seated height mm e nominal pitch mm n 2 actual quantity of termination
2 2. Package outline Leadless ultra small package; 2 L 1 2 b e 1 A A 1 E D (2) mm Dimensions scale Unit A (1) A 1 b D E e 1 L mm max nom min Outline version Note 1. Dimension A is including coating foil thickness. 2. The marking bar indicates the cathode References IEC JEDEC JEITA Fig. 1. Package outline DSN () European projection Issue date sod962_po All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved Package information 8 February / 5
3 3. Soldering Footprint information for reflow soldering of leadless ultra small package; 2 terminals occupied area solder paste solder lands Dimensions in mm sod962_fr Fig. 2. Reflow soldering footprint for DSN () All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved Package information 8 February / 5
4 4. Legal information Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved Package information 8 February / 5
5 5. Contents 1. Package summary Package outline Soldering Legal information... 4 NXP Semiconductors N.V All rights reserved For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 8 February 2016 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved Package information 8 February / 5
D (double) Package type descriptive code. SMA; PMOS Package type industry code. SMA; PMOS Package style descriptive code
SMA PMOS rectangular surface mounted package; 2 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code SMA; PMOS Package type industry code
SOD323_fr SOD323_fw REL Major version date Minor version date Security status
plastic, surface-mounted package; 2 terminals; 1.7 mm x 1.25 mm x 0.95 mm body 9 January 2017 Package information 1. Package summary Table 1. Package summary Dimensions (mm) 1.7 x 1.25 x 0.95 Terminal
D (double) Package type descriptive code. SC-73 Package type industry code. SC-73 Package style descriptive code
heatsink; leads 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code Package type industry code Package style descriptive code SO (small
D (double) Package type descriptive code TSSOP8. TSSOP (thin shrink small outline package) Package style suffix code
TSSOP8 leads; body width 3 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code TSSOP8 Package type industry code TSSOP8 Package style
HVQFN (thermal enhanced very thin quad flatpack; no leads) P (plastic) MO-220 S (surface mount) Issue date Manufacturer package code
HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; 7 mm x 7 mm x 0.85 mm 5 February 2018 Package information 1. Package summary Table 1. Package summary Terminal position
DFN2020MD-6 HUSON (thermal enhanced ultra thin small outline; no leads) P (plastic) S (surface mount) Issue date Manufacturer package code
DFN2020MD-6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body 23 January 2017 Package information 1. Package summary Table 1.
D (double) Package type descriptive code XSON16. P (plastic) JEDEC package outline code. MO-252 Mounting method type
XSON16 plastic extremely thin small outline package; no leads; 16 terminals; body 2.5 x 3.2 x 0.5 mm 8 June 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive
SOT023_fr SOT023_fw REL Major version date Minor version date Security status
plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body 9 January 2017 Package information 1. Package summary Table 1. Package summary Dimensions (mm) 2.9 x 1.3 x 1 Terminal
B (bottom) Package type descriptive code. VFBGA176 Package style descriptive code
VFBGA176, plastic, very thin fine-pitch ball grid array; 176 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.86 mm 30 July 2018 Package information 1 Package summary Terminal position code B (bottom) Package type
D (double) Package type descriptive code TSSOP8. TSSOP (thin shrink small outline package) Package body material type
TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm 8 June 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive
D (double) Package type descriptive code. TSOP6 Package type industry code. TSOP6 Package style descriptive code
plastic, surface-mounted package (TSOP6); 6 leads; mm pitch; 2.9 mm x 1.5 mm x 1 mm body 5 May 2018 Package information 1. Package summary Terminal position code D (double) Package type descriptive code
D (double) Package type descriptive code VSSOP8. P (plastic) JEDEC package outline code. MO-187 Mounting method type
VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm 5 July 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code VSSOP8
SOT Package summary
1 Package summary HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body; 4.9 mm x 4.9 mm exposed pad 7 August 2018 Package information
D (double) Package type descriptive code SO8. SO (small outline) Package body material type. P (plastic) IEC package outline code
SO8 plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body 7 December 2018 Package information 1 Package summary Terminal position code D (double) Package type descriptive
Q (quad) Package type descriptive code. SQFP240 Package type industry code. SQFP240 Package style descriptive code
length 1.3 mm); body 32 x 32 x 3.4 mm; high 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code SQFP240 Package type industry code SQFP240
Q (quad) Package type descriptive code LQFP64. LQFP (low profile quad flat package) Package style suffix code
LQFP64 body 10 x 10 x 1.4 mm 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code LQFP64 Package type industry code LQFP64 Package style
Q (quad) Package type descriptive code LQFP32. LQFP (low profile quad flat package) Package body material type. P (plastic) IEC package outline code
LQFP32 plastic low profile quad flat package; 32 leads; body 7 mm x 7 mm x 1.4 mm 19 July 2017 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code LQFP32
D (double) Package type descriptive code TSSOP14. TSSOP (thin shrink small outline package) Package style suffix code
TSSOP14 leads; body width 4.4 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code TSSOP14 Package type industry code TSSOP14 Package
B (bottom) Package type descriptive code Package type industry code. VFBGA Package style descriptive code
VFG64 20 ecember 2016 Package information 1. Package summary Terminal position code (bottom) Package type descriptive code VFG64 Package type industry code VFG Package style descriptive code VFG (very
SOT1688-1(SC) 1 Package summary
1 Package summary HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.5 mm body 16 July 2018 Package information Terminal position code
B (bottom) Package type descriptive code. VFBGA144 Package type industry code. VFBGA144 Package style descriptive code
8 February 2016 Package information 1. Package summary Terminal position code (bottom) Package type descriptive code VFG144 Package type industry code VFG144 Package style descriptive code VFG (very thin
plastic ball grid array package; 426 balls B (bottom) Package type descriptive code BGA426 Package type industry code
8 February 2016 Package information 1. Package summary Terminal position code B (bottom) Package type descriptive code BG426 Package type industry code BG426 Package style descriptive code BG (ball grid
D (double) Package type descriptive code HSOP44. HSOP (heatsink small outline package) Package body material type. P (plastic) Mounting method type
HSOP44 plastic, heatsink small outline package; 44 leads; low standoff height, mm pitch, 15.9 mm x 11.0 21 ugust 2018 Package information 1 Package summary Terminal position code D (double) Package type
plastic leaded chip carrier; 44 leads Q (quad) Package type descriptive code PLCC44 PLCC (plastic leaded chip carrier) Package style suffix code
PLCC44 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code PLCC44 Package type industry code PLCC44 Package style descriptive code PLCC
D (double) Package type descriptive code. HSOP36 Package type industry code. HSOP36 Package style descriptive code
plastic, heatsink small outline package; 36 leads; low standoff height, mm pitch, 11 mm x 15.9 mm 21 ugust 2018 Package information 1 Package summary Terminal position code D (double) Package type descriptive
Q (quad) Package type descriptive code HUQFN32. QFP (quad flat package) Package style suffix code. NA (not applicable) Package body material type
HUQFN32 package; no leads; 32 terminals; body 5 x 5 x 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code HUQFN32 Package type industry
S (surface mount) Issue date
Plastic thermal enhanced very thin small outline package; no leads; 16 terminals 10 June 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive
HVQFN32 HVQFN (thermal enhanced very thin quad flatpack; no leads) P (plastic) MO-220 S (surface mount) Issue date
HVQFN32 DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 8 June 2016 Package information 1. Package summary Table 1. Package summary Terminal position
S (surface mount) Issue date
HVQFN40 package; no leads; 40 terminals 21 pril 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive code Package type industry code Package
HTQFP64 HTQFP (thermal enhanced thin quad flat package) NA (not applicable) P (plastic) MS-026 S (surface mount) Issue date
HTQFP64 64 leads; exposed die pad 8 February 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptie code Package type industry code Package
PTVS5V0Z1USKP. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data. 5. Pinning information
Transient voltage suppressor in DSN168-2 for mobile applications 9 June 217 Product data sheet 1. General description Unidirectional Transient Voltage Suppressor (TVS) in an ultra small leadless DSN168-2
PESD5V0F1BSF. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
Extremely low capacitance bidirectional ESD protection diode 10 April 2018 Product data sheet 1. General description Extremely low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode
PTVS12VZ1USK. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
Transient voltage suppressor in DSN168-2 for mobile applications 22 August 216 Product data sheet 1. General description Unidirectional Transient Voltage Suppressor (TVS) in a very small leadless DSN168-2
Ultra compact transient voltage supressor
23 March 218 Product data sheet 1. General description Transient voltage supressor in a DFN16-2 (SOD882) ultra small and leadless Surface-Mounted Device (SMD) package designed to protect one line against
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
PESD5V0F1BSF. 1. Product profile. 2. Pinning information. Extremely low capacitance bidirectional ESD protection diode. 1.1 General description
Rev. 1 10 December 2012 Product data sheet 1. Product profile 1.1 General description Extremely low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a DSN0603-2 (SOD962) leadless
VHF variable capacitance diode
Rev. 1 25 March 2013 Product data sheet 1. Product profile 1.1 General description The is a variable capacitance diode, fabricated in planar technology, and encapsulated in the SOD323 (SC-76) very small
Planar PIN diode in a SOD882D leadless ultra small plastic SMD package.
DFN1006D-2 Rev. 2 6 August 2013 Product data sheet 1. Product profile 1.1 General description Planar PIN diode in a SOD882D leadless ultra small plastic SMD package. 1.2 Features and benefits High voltage,
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
RB520CS30L. 1. Product profile. 100 ma low V F MEGA Schottky barrier rectifier. 1.1 General description. 1.2 Features and benefits. 1.
SOD882 Rev. 0 March 20 Product data sheet. Product profile. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress
BB Product profile. 2. Pinning information. 3. Ordering information. FM variable capacitance double diode. 1.1 General description
SOT23 Rev. 3 7 September 2011 Product data sheet 1. Product profile 1.1 General description The is a variable capacitance double diode with a common cathode, fabricated in silicon planar technology, and
Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit I F forward current T j = 25 C V RRM
29 June 2018 Product data sheet 1. General description, in an ultra small SOD523 (SC-72) flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits High switching speed: t rr 50 ns
Planar PIN diode in a SOD523 ultra small plastic SMD package.
Rev. 10 12 May 2015 Product data sheet 1. Product profile 1.1 General description Planar PIN diode in a SOD523 ultra small plastic SMD package. 1.2 Features and benefits High voltage, current controlled
Planar PIN diode in a SOD523 ultra small SMD plastic package.
Rev. 5 28 September 2010 Product data sheet 1. Product profile 1.1 General description Planar PIN diode in a SOD523 ultra small SMD plastic package. 1.2 Features and benefits High voltage, current controlled
General regulation functions ElectroStatic Discharge (ESD) ultra high-speed switching High-frequency applications
Rev. 4 23 March 2018 Product data sheet 1 Product profile 1.1 General description General-purpose Zener diodes in an SOD882 (DFN1006-2) leadless ultra small Surface- Mounted Device (SMD) plastic package.
BC857xMB series. 45 V, 100 ma PNP general-purpose transistors
SOT883B Rev. 1 21 February 2012 1. Product profile 1.1 General description PNP general-purpose transistors in a leadless ultra small SOT883B Surface-Mounted Device (SMD) plastic package. Table 1. Product
DISCRETE SEMICONDUCTORS DATA SHEET. BAP65-03 Silicon PIN diode. Product specification Supersedes data of 2001 May Feb 11
DISCRETE SEMICONDUCTORS DATA SHEET Supersedes data of 2001 May 11 2004 Feb 11 FEATURES PINNING High voltage, current controlled RF resistor for RF switches Low diode capacitance Low diode forward resistance
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
Two elements in series configuration in a small SMD plastic package Low diode capacitance Low diode forward resistance AEC-Q101 qualified
Rev. 2 25 October 2016 Product data sheet 1. Product profile 1.1 General description Two planar PIN diodes in series configuration in a SOT323 small SMD plastic package. 1.2 Features and benefits Two elements
RB521CS30L. 1. Product profile. 100 ma low V F MEGA Schottky barrier rectifier. 1.1 General description. 1.2 Features and benefits. 1.
Rev. 24 January 20 Product data sheet. Product profile. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection,
BAV70SRA. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
14 September 2018 Product data sheet 1. General description 2. Features and benefits 3. Applications 4. Quick reference data with common cathode configurations encapsulated in a leadless ultra small DFN1412-6
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
Symbol Parameter Conditions Min Typ Max Unit V F forward voltage I F =10mA
Rev. 3 11 October 2016 Product data sheet 1. Product profile 1.1 General description Low-power voltage regulator diodes in a small SOD323 (SC-76) Surface-Mounted Device (SMD) plastic package. The diodes
Symbol Parameter Conditions Min Typ Max Unit V F forward voltage I F =10mA V P ZSM. non-repetitive peak reverse power dissipation
Rev. 5 26 January 2011 Product data sheet 1. Product profile 1.1 General description Low-power voltage regulator diodes in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages.
DATA SHEET. BAP50-05 General purpose PIN diode DISCRETE SEMICONDUCTORS. Product specification Supersedes data of 1999 Feb May 10.
DISCRETE SEMICONDUCTORS DATA SHEET alfpage M3D088 Supersedes data of 1999 Feb 01 1999 May 10 FEATURES Two elements in common cathode configuration in a small-sized plastic SMD package Low diode capacitance
Four planar PIN diode array in SOT363 small SMD plastic package.
Rev. 4 7 March 2014 Product data sheet 1. Product profile 1.1 General description Four planar PIN diode array in SOT363 small SMD plastic package. 1.2 Features and benefits High voltage current controlled
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
PMEG3002AESF. 30 V, 0.2 A low VF MEGA Schottky barrier rectifier. Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit
March 27 Product data sheet. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection in a DSN63-2 (SOD962-2)
PTVS22VU1UPA. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data. 300 W Transient Voltage Suppressor
12 July 217 Product data sheet 1. General description 3 W unidirectional Transient Voltage Suppressor (TVS) in a DFN22-3 (SOT161) leadless medium power Surface-Mounted Device (SMD) plastic package, designed
Symbol Parameter Conditions Min Typ Max Unit V F forward voltage I F =10mA
SOT23 Rev. 6 6 March 2014 Product data sheet 1. Product profile 1.1 General description Low-power voltage regulator diodes in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. The
BAT54W series. 1. Product profile. 2. Pinning information. Schottky barrier diodes. 1.1 General description. 1.2 Features and benefits
SOT2 Rev. 20 November 2012 Product data sheet 1. Product profile 1.1 General description Planar with an integrated guard ring for stress protection, encapsulated in a very small SOT2 (SC-70) Surface-Mounted
High-speed switching in e.g. surface-mounted circuits
Rev. 3 22 July 2010 Product data sheet 1. Product profile 1.1 General description Two high-speed switching diodes fabricated in planar technology, and encapsulated in a small SOT143B Surface-Mounted Device
PTVS20VU1UPA. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data. 300 W Transient Voltage Suppressor
12 June 217 Product data sheet 1. General description 3 W unidirectional Transient Voltage Suppressor (TVS) in a DFN22-3 (SOT161) leadless medium power Surface-Mounted Device (SMD) plastic package, designed
BAP Product profile. 2. Pinning information. 3. Ordering information. Silicon PIN diode. 1.1 General description. 1.2 Features and benefits
Rev. 5 28 April 2015 Product data sheet 1. Product profile 1.1 General description Two planar PIN diodes in common cathode configuration in a SOT23 small plastic SMD package. 1.2 Features and benefits
ES_LPC1114. Errata sheet LPC1114. Document information
Rev. 2 15 November 2010 Errata sheet Document information Info Keywords Abstract Content LPC1114 errata This errata sheet describes both the known functional problems and any deviations from the electrical
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
DISCRETE SEMICONDUCTORS DATA SHEET. k, halfpage M3D102. BAP64-04W Silicon PIN diode Jan 29. Product specification Supersedes data of 2000 Jun 06
DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D12 Supersedes data of 2 Jun 6 21 Jan 29 FEATURES High voltage, current controlled RF resistor for RF attenuators and switches Low diode capacitance Low
High-speed switching diodes. Type number Package Configuration Package NXP JEITA JEDEC
Rev. 07 14 April 2010 Product data sheet 1. Product profile 1.1 General description, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number Package Configuration
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
BAV102; BAV103. Single general-purpose switching diodes
Rev. 4 6 August 2010 Product data sheet 1. Product profile 1.1 General description, fabricated in planar technology, and encapsulated in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD)
PDTC143Z series. NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k
PDTC4Z series NPN resistor-equipped transistors; R = 4.7 k, R2 = 47 k Rev. 8 5 December 20 Product data sheet. Product profile. General description NPN Resistor-Equipped Transistor (RET) family in Surface-Mounted
Single Schottky barrier diode
SOD23F Rev. 2 28 November 20 Product data sheet. Product profile. General description Single planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a small and
50 ma LED driver in SOT457
SOT457 in SOT457 Rev. 1 December 2013 Product data sheet 1. Product profile 1.1 General description LED driver consisting of resistor-equipped PNP transistor with two diodes on one chip in an SOT457 (SC-74)
BCP56H series. 80 V, 1 A NPN medium power transistors
SOT223 8 V, A NPN medium power transistors Rev. 23 November 26 Product data sheet. Product profile. General description NPN medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device
BCP55; BCX55; BC55PA
Rev. 8 24 October 2 Product data sheet. Product profile. General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number []
High-speed switching diode in dual series configuration, encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package.
Rev. 01 30 March 2010 Product data sheet 1. Product profile 1.1 General description in dual series configuration, encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package.
BAV756S; BAW56 series
Rev. 6 8 March 205 Product data sheet. Product profile. General description, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number Package Package Configuration
Digital applications Cost-saving alternative to BC847/BC857 series in digital applications Control of IC inputs Switching loads
50 V, 0 ma NPN/PNP Resistor-Equipped double Transistors (RET) 29 July 207 Product data sheet. General description NPN/PNP Resistor-Equipped double Transistors (RET) in an ultra small DFN42-6 (SOT268) leadless
High-speed switching diodes. Table 1. Product overview Type number Package Package Configuration Nexperia JEITA JEDEC
Rev. 8 8 March 205 Product data sheet. Product profile. General description, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number Package Package Configuration
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
Wide working voltage range: nominal 2.4 V to 75 V (E24 range) Two tolerance series: ± 2 % and ± 5 % AEC-Q101 qualified
Rev. 1 29 May 2018 Product data sheet 1 Product profile 1.1 General description General-purpose Zener diodes in an SOT323 (SC-70) leadless very small Surface- Mounted Device (SMD) plastic package. 1.2
PMEG4010ETP. 40 V, 1 A low VF MEGA Schottky barrier rectifier. Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply
Rev. 5 October 20 Product data sheet. Product profile. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection,
30 V, 0.1 A low VF MEGA Schottky barrier rectifier. Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit I F(AV)
12 October 218 Product data sheet 1. General description 2. Features and benefits 3. Applications 4. Quick reference data Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier
PMEG4010ESB. 1. General description. 2. Features and benefits. 3. Applications. Quick reference data
27 November 205 Product data sheet. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection in a leadless
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 27 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and
BAS116GW. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
5 April 208 Product data sheet. General description, encapsulated in an SOD23 small Surface-Mounted Device (SMD) plastic package. 2. Features and benefits High switching speed: t rr = 0.8 µs Low leakage
PMEG2020EPK. 1. General description. 2. Features and benefits. 3. Applications. Quick reference data
0 February 204 Product data sheet. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
PMEG4010ER. 1. Product profile. 1 A low V F MEGA Schottky barrier rectifier. 1.1 General description. 1.2 Features and benefits. 1.
Rev. 2 5 April 2 Product data sheet. Product profile. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection,
PNP 5 GHz wideband transistor. Oscilloscopes and spectrum analyzers Radar systems RF wideband amplifiers
Rev. 3 22 January 2016 Product data sheet 1. Product profile 1.1 General description PNP transistor in a plastic SOT23 envelope. It is primarily intended for use in RF wideband amplifiers, such as in aerial
PESD5V0X1UAB. Ultra low capacitance unidirectional ESD protection diode
Rev. 1 15 February 2011 Product data sheet 1. Product profile 1.1 General description Ultra low capacitance unidirectional ElectroStatic Discharge (ESD) protection diode in a SOD523 (SC-79) ultra small
BAS21GW. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
15 June 2017 Product data sheet 1. General description, encapsulated in an SOD123 small Surface-Mounted Device (SMD) plastic package. 2. Features and benefits High switching speed: t rr 50 ns Low leakage
IP4220CZ6. 1. Product profile. Dual USB 2.0 integrated ESD protection. 1.1 General description. 1.2 Features and benefits. 1.
SOT457 Rev. 5 8 July 2011 Product data sheet 1. Product profile 1.1 General description The is designed to protect I/O lines sensitive to capacitive load, such as USB 2.0, ethernet, Digital Video Interface
PMEG3050BEP. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
28 May 28 Product data sheet. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a
Single Zener diodes in a SOD123 package
Rev. 1 16 March 2017 Product data sheet 1 Product profile 1.1 General description General-purpose Zener diodes in a SOD123 small Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits
AN NHS3xxx Temperature sensor calibration. Document information
Rev. 2 12 September 2016 Application note Document information Info Keywords Abstract Content Temperature sensor, calibration This application note describes the user calibration of the temperature sensor.
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
BCP68; BC868; BC68PA
Rev. 8 8 October 2 Product data sheet. Product profile. General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number [] Package
ESD protection for In-vehicle network lines in automotive enviroments CAN LIN FlexRay SENT
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