Final Announcement. 12 th INTERNATIONAL SEMINAR ON POWER SEMICONDUCTORS ISPS'14

Transcription

1 Final Announcement 12 th INTERNATIONAL SEMINAR ON POWER SEMICONDUCTORS ISPS'14 Organised by the IET Czech Local Network in co-operation with the IEEE Czechoslovakia Section Co-sponsor: Faculty of Electrical Engineering (Department of Electrotechnology) Czech Technical University in Prague Prague, 26 August 29 August 2014

2 AREAS OF INTEREST: -power semiconductor devices (materials, physics, modelling, technology, diagnostics) -advanced device applications, reliability and diagnostics. 29 papers (4 invited papers, 15 regular papers for oral presentation and 10 papers for poster presentation) oriented in the field of power semiconductors will be presented. INVITED PAPERS Cosmic Ray Induced Single-Event Burnout in Power Devices Tomoyuki Shoji (Toyota Central R&D Labs., Inc.) High power IGBTs and diodes at the edge of the Safe Operating Area R. Baburske, H.-J. Schulze, F.-J. Niedernostheide, F. Pfirsch (all Infineon) Progress with GaN Power Devices (preliminary title) Tatsuo Morita (Panasonic) Photovoltaics towards Terrawatts Progress in photovoltaic cells and modules Vitezslav Benda (Czech Technical University in Prague) A round table discussion oriented on "Spreading results of university research into praxis", moderator Florin Udrea (Cambridge University), will be organised in the framework of the Seminar. Presented papers will be published in the Seminar proceedings, which will be distributed at the Seminar registration. Papers presented may be selected for possible inclusion in special issues of refereed journals. RELATED SCIENTIFIC EVENT: The technical programme of the ISPS 14 will be round by a Smart Grid Workshop consisting from short courses "DC micro grids challenges and perspectives " by Prof Martin Maerz (University of Erlangen-Nuremberg) Bidirectional isolating AC/DC converter for coupling DC grids with the AC mains based on a modular approach " by Dr. Stefan Zeltner (Fraunhofer Institute for Integrated Systems and Device Technology) and Power Semiconductor Devices for Smart Grid Applications an overview by E.M. Sankara Narayanan (Shefield University) The Workshop will take place on 26 August, Additional fee (for the ISPS'14 participants) of 40 EUR include admission, refreshments and the short course materials. WORKING LANGUAGE: The working language on the ISPS 14 Conference is English. It will be used in the printed material, presentations and discussion.

3 ORGANISING COMMITTEE: Chairman: Members: Prof. Vitezslav Benda, PhD, C.Eng., FIET Petr Cesak, MSc Dr. Karel Kuenzel Dr. Martin Molhanec INTERNATIONAL PROGRAMME COMMITTEE: Chairman: Prof. Josef Lutz, Chemnitz University of Technology, GER Co-chairmen: Prof. Sankara N. Ekkanath Madathil, University of Sheffield, UK Prof. Pavel Hazdra, Czech Technical University in Prague, CZE Members: Prof. Vítězslav Benda, Czech Technical University in Prague, CZE Prof. Giovanni Busatto, University of Cassino, ITA Prof. Merlyne De Souza, University of Sheffield, UK Dr. David Flores, CNM-CSIC Barcelona, ESP Prof. Min-Koo Han, Seoul National University, KOR Masayasu Ishiko, Toyota Central R&D Labs, JPN Prof. Nando Kaminski, University of Bremen, GER Prof. Zbygniew Lisik, University of Lodz, POL Prof. Phil Mawby, University of Warwick, UK Prof. Wai Tung Ng, University of Toronto, CAN Dr. Vaclav Papez, Czech Technical University in Prague, CZE Dr. Deva Pattanayak, Vishay Siliconix, USA Dr. Sameer Pendharkar, Texas Instruments, USA Dr. Munaf Rahimo, ABB, SUI Prof. Heinrich Schlangenotto, GER Dr. Hans-Joachim Schulze, Infineon, GER Prof. Siegfried Selberherr, TU Wien, AUT Prof. Noel Shammas, Staffordshire University, UK Prof. Krishna Shenai, The University of Toledo, USA Prof. Paolo Spirito, University of Naples, ITA Prof. Ninoslav Stojadinovic, University of Nis, SRB Dr. Marnix Tack, ON Semiconductors, BEL Dr. Ana Villamor Baliarda, ON Semiconductors, BEL Prof. Jan Vobecky, ABB, SUI Prof. Gerhard Wachutka, Munich University of Technology, GER Address: ISPS'14 Organising Committee CTU Prague, Department of Electrotechnology Technicka 2, Praha 6, Czech Republic tel , , fax or

4 REGISTRATION FEE: IET and IEEE members: EUR 270 Non-members EUR 300 (Students can apply for a 20% discount application and payment must be received by July 31, 2014) The registration fee will cover the cost of the seminar, documentation, proceedings, refreshments and social programme. Registration is possible before 15 August Accompanying persons EUR 70 (full social programme) Proceedings (extra copy) EUR 25 Payment should be made in EUR or in an equivalent amount in other convertible currency by bank remittance to the bank: CESKA SPORITELNA a.s., Dejvicka 50, Praha 6, Czech Republic (SWIFT: GIBACZPX), account No.: /0800 (name of the account is Ceske Centrum IET). IBAN: CZ Payment can be also done in cash at the conference desk. In this case on-site registration fees apply EUR 320. Please send fulfilled registration form to the ISPS 14 Organising Committee, no later than 15 August, Social Programme ISPS 14 Welcome Party on 27 August, 2014 ISPS 14 Social Dinner on 28 August, 2014 Prague Exursion on 28 August, 2014 INSURANCE The organisers cannot be held responsible for accidents to ISPS'14 attendants of for damage to, or loss of their personal property, howsoever caused. Attendants should therefore make their own insurance arrangements.

5 ISPS'14 REGISTRATION FORM Surname.... First Name Title... Organisation..... Address... Phone.... Fax I am going to attend the ISPS'14 Accompany person: I am going to attend the Workshop on Smart Grids yes no I will pay registration fee... IET/IEEE Membership No.: accompanying person's fee Proceedings extra copy.... Workshop... Total.... The payment will be realised by a bank transfer I will pay the registration fee at registration yes/no yes/no

6 Date Signature