DIM1800ESS12-A000. Single Switch IGBT Module DIM1800ESS12-A000 FEATURES KEY PARAMETERS V CES

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Transcription:

Single Switch IGBT Module Replaces DS5857-2 DS5857-3 August 2014 (LN31868) FEATURES 10µs Short Circuit Withstand Non Punch Through Silicon Isolated Cu Base with Al 2 O 3 Substrates Lead Free cotruction KEY PARAMETERS V CES 1200V V CE(sat) * (typ) 2.2V I C (max) 1800A I C(PK) (max) 3600A * Measured at the power busbars, not the auxiliary terminals APPLICATIONS Motor Controllers 9(C) 7(C) 5(C) Traction Drives 3(C) The Powerline range of high power modules includes half bridge, chopper, dual, single and bi-directional switch configuratio covering voltages from 1200V to 6500V and currents up to 2400A. 2(G) The DIM1800ESS12-A000 is a single switch 1200V, n-channel enhancement mode, iulated gate bipolar traistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) plus 10μs short circuit withstand. This device is optimised for traction drives and other applicatio requiring high thermal cycling capability. 1(E) 8(E) 6(E) Fig. 1 Circuit configuration 4(E) The module incorporates an electrically isolated base plate and low inductance cotruction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety. ORDERING INFORMATION Order As: DIM1800ESS12-A000 Note: When ordering, please use the complete part number Outline type code: E (See Fig. 11 for further information) Fig. 2 Package Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures 1/8

ABSOLUTE MAXIMUM RATINGS Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. In extreme conditio, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautio should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. T case = 25 C unless stated otherwise Symbol Parameter Test Conditio Max. Units V CES Collector-emitter voltage V GE = 0V 1200 V V GES Gate-emitter voltage ±20 V I C Continuous collector current T case = 85 C 1800 A I C(PK) Peak collector current 1ms, T case = 115 C 3600 A P max Max. traistor power dissipation T case = 25 C, T j = 150 C 15625 W I 2 t Diode I 2 t value V R = 0, t p = 10ms, T j = 125ºC 900 ka 2 s V isol Isolation voltage per module Commoned terminals to base plate. AC RMS, 1 min, 50Hz 2500 V THERMAL AND MECHANICAL RATINGS Internal iulation material: Al 2 O 3 Baseplate material: Cu Creepage distance: 33mm Clearance: 20mm CTI (Comparative Tracking Index): >600 Symbol Parameter Test Conditio Min Typ. Max Units R th(j-c) R th(j-c) R th(c-h) T j Thermal resistance traistor Thermal resistance diode Thermal resistance case to heatsink (per module) Junction temperature Continuous dissipation - junction to case Continuous dissipation - junction to case Mounting torque 5Nm (with mounting grease) - - 8 C/kW - - 13 C/kW - - 6 C/kW Traistor - - 150 C Diode - - 125 C T stg Storage temperature range - -40-125 C Mounting M6 - - 5 Nm Screw torque Electrical connectio M4 - - 2 Nm Electrical connectio M8 - - 10 Nm 2/8 Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures.

ELECTRICAL CHARACTERISTICS T case = 25 C unless stated otherwise. Symbol Parameter Test Conditio Min Typ Max Units I CES Collector cut-off current V GE = 0V, V CE = V CES 3 ma V GE = 0V, V CE = V CES, T case = 125 C 75 ma I GES Gate leakage current V GE = ± 20V, V CE = 0V 12 μa V GE(TH) Gate threshold voltage I C = 90mA, V GE = V CE 4.5 5.5 6.5 V V CE(sat) Collector-emitter saturation voltage V GE = 15V, I C = 1800A 2.2 2.8 V V GE = 15V, I C = 1800A, T j = 125 C 2.6 3.3 V I F Diode forward current DC 1800 A I FM Diode maximum forward current t p = 1ms 3600 A V F Diode forward voltage I F = 1800A 1.9 2.1 V I F = 1800A, T j = 125 C 1.8 2.1 V C ies Input capacitance V CE = 25V, V GE = 0V, f = 1MHz 200 nf Q g Gate charge ±15V 20 μc C res Reverse trafer capacitance V CE = 25V, V GE = 0V, f = 1MHz nf L M Module inductance 10 nh R INT Internal traistor resistance 90 μ T j = 125 C, V CC = 900V SC Data Short circuit current, I SC t p 10μs, V GE 15V V CE (max) = V CES L * x di/dt 10000 A IEC 60747-9 Note: * L is the circuit inductance + L M Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures 3/8

ELECTRICAL CHARACTERISTICS T case = 25 C unless stated otherwise Symbol Parameter Test Conditio Min Typ. Max Units t d(off) Turn-off delay time 1250 t f E OFF t d(on) t r Fall time Turn-off energy loss Turn-on delay time Rise time I C = 1800A V GE = ±15V V CE = 600V R G(ON) = 1.2 R G(OFF) = 1.2 L S ~ 60nH 190 330 220 200 mj E ON Turn-on energy loss 100 mj Q rr Diode reverse recovery charge I F = 1800A 210 μc I rr Diode reverse recovery current V CE = 600V 860 A E di F /dt = 9000A/μs rec Diode reverse recovery energy 110 mj T case = 125 C unless stated otherwise Symbol Parameter Test Conditio Min Typ. Max Units t d(off) Turn-off delay time 1450 t f E OFF t d(on) t r Fall time Turn-off energy loss Turn-on delay time Rise time I C = 1200A V GE = ±15V V CE = 600V R G(ON) = 1.2 R G(OFF) = 1.2 L S ~ 60nH 190 390 230 340 mj E ON Turn-on energy loss 180 mj Q rr Diode reverse recovery charge I F = 1800A 390 μc I rr Diode reverse recovery current V CE = 600V 1100 A E di F /dt = 8000A/μs rec Diode reverse recovery energy 200 mj 4/8 Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures.

Fig. 3 Typical output characteristics Fig. 4 Typical output characteristics Fig. 5 Typical switching energy vs collector current Fig. 6 Typical switching energy vs gate resistance Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures 5/8

Fig. 7 Diode typical forward characteristics Fig. 8 Reverse bias safe operating area Fig. 9 Diode reverse bias safe operating area Fig. 10 Traient thermal impedance 6/8 Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures.

PACKAGE DETAILS For further package information, please visit our website or contact Customer Services. All dimeio in mm, unless stated otherwise. DO NOT SCALE. 6 x M8 190 ±0.5 171 ±0.15 57 ±0.1 screwing depth max. 16 7 140 ±0.5 124 ±0.1 40 ±0.2 20 ±0.1 3 x M4 79.4 ±0.2 41.25 ±0.2 20.25 ±0.2 8 x Ø7 screwing depth max. 8 61.5 ±0.3 13 ±0.2 61.5 ±0.3 38 ±0.5 5 ±0.2 5.2 ±0.2 40 ±0.2 28 ±0.5 3(C) 5(C) 7(C) 9(C) 3(C) 7(C) 9(C) 5(C) 5(C) 7(C) 9(C) 2(G) 1(E) 1(E) 4(E) 6(E) Module 8(E) Outline Type 6(E) Code: 8(E) 2(G) Nominal Weight: 2250g Fig. 11 Module outline drawing 4(E) 6(E) DIM...ESM... DIM...ECM... DFM...EXM... E 4(E) 8(E) Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures 7/8

IMPORTANT INFORMATION: This publication is provided for information only and not for resale. The products and information in this publication are intended for use by appropriately trained technical personnel. Due to the diversity of product applicatio, the information contained herein is provided as a general guide only and does not cotitute any guarantee of suitability for use in a specific application.the user must evaluate the suitability of the product and the completeness of the product data for the application. The user is respoible for product selection and euring all safety and any warning requirements are met. Should additional product information be needed please contact Customer Service. Although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical errors. The information is provided without any warranty or guarantee of any kind. This publication is an uncontrolled document and is subject to change without notice. When referring to it please eure that it is the most up to date version and has not been superseded. The products are not intended for use in applicatio where a failure or malfunction may cause loss of life, injury or damage to property. The user must eure that appropriate safety precautio are taken to prevent or mitigate the coequences of a product failure or malfunction. The products must not be touched when operating because there is a danger of electrocution or severe burning. Always use protective safety equipment such as appropriate shields for the product and wear safety glasses. Even when disconnected any electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves. Extended exposure to conditio outside the product ratings may affect reliability leading to premature product failure. Use outside the product ratings is likely to cause permanent damage to the product. In extreme conditio, as with all semiconductors, this may include potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. Appropriate application design and safety precautio should always be followed to protect perso and property. Product Status & Product Ordering: We annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully approved for production. The annotatio are as follows:- Target Information: Preliminary Information: No Annotation: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. The product design is complete and final characterisation for volume production is in progress. The datasheet represents the product as it is now understood but details may change. The product has been approved for production and unless otherwise notified by Dynex any product ordered will be supplied to the current version of the data sheet prevailing at the time of our order acknowledgement. All products and materials are sold and services provided subject to Dynex s conditio of sale, which are available on request. Any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln, Lincolhire, LN6 3LF, United Kingdom CUSTOMER SERVICE DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln, Lincolhire, LN6 3LF, United Kingdom Fax: +44(0)1522 500550 Fax: +44(0)1522 500020 Tel: +44(0)1522 500500 Tel: +44(0)1522 502753 / 502901 Web: http:// Email: Power_solutio@dynexsemi.com Dynex Semiconductor Ltd. 2005. Technical Documentation Not for resale. 8/8 Caution: This device is seitive to electrostatic discharge. Users should follow ESD handling procedures.