MSRG, MSRFG Switch-mode Soft Recovery Power Rectifiers Plastic TO Package These state of the art devices are designed for use as free wheeling diodes in variable speed motor control applications and switching power supplies. Features Soft Recovery with Guaranteed Low Reverse Recovery Charge (Q RR ) and Peak Reverse Recovery Current (I RRM ) 5 C Operating Junction Temperature Epoxy meets UL 9 V @.5 in Low Forward Voltage Low Leakage Current These are Pb Free Devices Mechanical Characteristics: Case: Epoxy, Molded Weight:.9 Grams (pproximately) Finish: ll External Surfaces Corrosion Resistant and Terminal Leads Readily Solderable Lead Temperature for Soldering Purposes: C Max. for Seconds MXIMUM RTINGS Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage verage Rectified Forward Current (Rated V R, T C = 5 C) Rating Symbol Value Unit Peak Repetitive Forward Current (Rated V R, Square Wave, khz, T C = 5 C) Non Repetitive Peak Surge Current (Surge pplied at Rated Load Conditions Halfwave, Single Phase, Hz) V RRM V RWM V R V I O. I FRM I FSM Storage/Operating Case Temperature T stg, T C 5 to +5 C Operating Junction Temperature T J 5 to +5 C THERML CHRCTERISTICS Parameter Symbol Value Unit MSRG Thermal Resistance, Junction to Case Thermal Resistance, Junction to mbient MSRFG Thermal Resistance, Junction to Case Thermal Resistance, Junction to mbient R JC. R J 7. R JC.75 R J 75 C/W C/W Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. SOFT RECOVERY POWER RECTIFIER. MPERES, VOLTS TO C CSE B STYLE ORDERING INFORMTION Device Package Shipping MSRG MSRFG MRKING DIGRMS Y WWG MSR K Y WW G K = ssembly Location = Year = Work Week = Pb Free Package = Diode Polarity TO C (Pb Free) TO FP (Pb Free) Y WWG MSRF K TO FULLPK CSE G STYLE 5 Units / Rail 5 Units / Rail Semiconductor Components Industries, LLC, February, Rev. Publication Order Number: MSR/D
MSRG, MSRFG ELECTRICL CHRCTERISTICS Characteristic Symbol Value Unit Maximum Instantaneous Forward Voltage (I F =. ) (Note ) Maximum Typical Maximum Instantaneous Reverse Current (V R = V) Maximum Typical V F T J = 5 C T J = 5 C V.7... I R T J = 5 C T J = 5 C. Maximum Reverse Recovery Time (Note ) (V R = V, I F =., di/dt = / s) Maximum Typical Typical Recovery Softness Factor (V R = V, I F =., di/dt = / s) Maximum Peak Reverse Recovery Current (V R = V, I F =., di/dt = / s) Maximum Reverse Recovery Charge (V R = V, I F =., di/dt = / s) t rr T J = 5 C T J = 5 C ns 95 9 5 s = t b /t a.5. I RRM 5.. Q RR 5 7 nc Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.. Pulse Test: Pulse Width s, Duty Cycle %. T RR measured projecting from 5% of I RRM to zero current TYPICL ELECTRICL CHRCTERISTICS T J = 5 C I F, INSTNTNEOUS FORWRD CURRENT (MPS).5 T J = 5 C.7.9...5 5 C.7 C.9 I R, REVERSE CURRENT ( ) IF(V), VERGE FORWRD CURRENT (MPS). 5 C C 5 C 5 V R, REVERSE VOLTGE (VOLTS) Figure. Typical Reverse Current dc SQURE WVE RTED V R PPLIED V F, FORWRD VOLTGE DROP (VOLTS) T C, CSE TEMPERTURE ( C) Figure. Typical Forward Voltage Figure. Current Derating, Case
I I t t MSRG, MSRFG TYPICL ELECTRICL CHRCTERISTICS IF(V), VERGE FORWRD CURRENT (MPS)..5..5..5 dc SQURE WVE RTED V R PPLIED T, MBIENT TEMPERTURE ( C) P F(V), VERGE POWER DISSIPTION (WTTS) SQURE WVE dc T J = 5 C I F(V), VERGE FORWRD CURRENT (MPS) Figure. Current Derating, mbient Figure 5. Power Dissipation rr, REVERSE RECOVERY TIME (ns) T J = 5 C V R = V rr, REVERSE RECOVERY TIME (ns) 5 5 5 T J = 5 C V R = V 5 5 Figure. Typical Reverse Recovery Time Figure 7. Typical Reverse Recovery Time, PEK REVERSE RECOVERY CURRENT (MPS) RRM 5 T J = 5 C V R = V, PEK REVERSE RECOVERY CURRENT (MPS) RRM T J = 5 C V R = V 5 Figure. Typical Peak Reverse Recovery Current Figure 9. Typical Peak Reverse Recovery Current
MSRG, MSRFG TYPICL ELECTRICL CHRCTERISTICS 5 9 RR, REVERSE RECOVERY CHRGE (nc) Q 5 5 5 5 T J = 5 C V R = V Q RR, REVERSE RECOVERY CHRGE (nc) 7 5 5 T J = 5 C V R = V Figure. Typical Reverse Recovery Charge Figure. Typical Reverse Recovery Charge, SWITCHING OFF LOSSES ( J) OFF E 9 7 5 T J = 5 C V R = V 5 dl F /dt (/ S) E OFF, SWITCHING OFF LOSSES ( J) 5 5 5 T J = 5 C V R = V 5 Figure. Typical Switching Off Losses Figure. Typical Switching Off Losses r(t), TRNSIENT THERML RESPONSE (NORMLIZED).. D =.5..5. SINGLE PULSE P (pk) t t DUTY CYCLE, D = t /t Z JC (t) = r(t) R JC R JC =. C/W MX D CURVES PPLY FOR POWER PULSE TRIN SHOWN RED TIME T t T J(pk) - T C = P (pk) Z JC (t).... t, TIME (ms) Figure. Thermal Response (MSR)
MSRG, MSRFG r(t), TRNSIENT THERML RESPONSE (NORMLIZED) ( C/W)... D =.5...5.. SINGLE PULSE P (pk) t t DUTY CYCLE, D = t /t Z JC (t) = r(t) R JC R JC =. C/W MX D CURVES PPLY FOR POWER PULSE TRIN SHOWN RED TIME T t T J(pk) - T C = P (pk) Z JC (t)...... t, TIME (s).. Figure 5. Thermal Response, (MSRF) Junction to Case (R JC ) r(t), TRNSIENT THERML RESPONSE (NORMLIZED) ( C/W)..... D =.5...5.. SINGLE PULSE.... t, TIME (s) P (pk). t t DUTY CYCLE, D = t /t Z JC (t) = r(t) R JC R JC =. C/W MX D CURVES PPLY FOR POWER PULSE TRIN SHOWN RED TIME T t T J(pk) - T C = P (pk) Z JC (t). Figure. Thermal Response, (MSRF) Junction to mbient (R J ) 5
MSRG, MSRFG PCKGE DIMENSIONS TO TWO LED CSE B ISSUE F Q H L B G D K F T U R J C S NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y.5M, 9.. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MX MIN MX.595. 5. 5.75 B..5 9.5.9 C..9.. D.5.9.. F....9 G.9.. 5. H...79. J..5.. K.5.5.7.7 L.5...5 Q...5. R....79 S.5.55..9 T.5.55 5.97. U..5..7 STYLE : PIN. CTHODE. N/. NODE. CTHODE E/ Q L X b e e E L D X b C P. M B M.5 M B M TO FULLPK, LED CSE G ISSUE C H c B NOTE SETING PLNE STYLE : PIN. CTHODE. N/. NODE NOTES:. DIMENSIONING ND TOLERNCING PER SME Y.5M, 99.. CONTROLLING DIMENSION: MILLIMETERS.. CONTOUR UNCONTROLLED IN THIS RE.. DIMENSIONS D ND E DO NOT INCLUDE MOLD FLSH ND GTE PROTRUSIONS. MOLD FLSH ND GTE PROTRUSIONS NOT TO EXCEED. PER SIDE. THESE DIMENSIONS RE TO BE MESURED T OUTERMOST EXTREME OF THE PLSTIC BODY. 5. DIMENSION b DOES NOT INCLUDE DMBR PROTRUSION. LED WIDTH INCLUDING PROTRUSION SHLL NOT EXCEED.. MILLIMETERS DIM MIN MX..7.5.9.5.9 b.5. b.. c.9.79 D. 5. E 9.5.7 e.5 BSC e 5. BSC H 5.97. L.7.7 L ---. P.. Q.. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. listing of SCILLC s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICTION ORDERING INFORMTION LITERTURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5, Denver, Colorado 7 US Phone: 75 75 or Toll Free US/Canada Fax: 75 7 or 7 Toll Free US/Canada Email: orderlit@onsemi.com N. merican Technical Support: 955 Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: 79 9 Japan Customer Focus Center Phone: 57 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MSR/D