SEMATECH Symposium Japan September 15, 2010 Accelerating Manufacturing Productivity ISMI 450mm Transition Program Scott Kramer VP Manufacturing Technology SEMATECH Copyright 2010 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.
Wafer size the great cost equalizer 200mm 300mm 450mm ~1992 2000 >2012 History shows that increasing wafer surface area by ~2.25X yields a 30% cost reduction and enables the inexpensively part of Moore s Law 2
ISMI 450 mm program mission and organization ISMI s 450 mm mission statement Enable a cost-effective 450 mm transition through coordination and development of infrastructure, guidance, and industry readiness ISMI 450 mm organization 450 mm transition program Supplier engagement Factory integration readiness Test wafer operations Starting materials Vacuum platform development Equipment test methods and metrics 3
450mm progress 2007 through 2010 Wafers Mechanical Wafer Bank Single Crystal Wafer Bank Test Wafer Generation Improved Wafer quality supports equipment demonstrations Equipment Equipment concepts development Supplier engagement 1st 450mm Tool (Bare wafer particle detector) Equipment Demonstrations Factory integration Interoperability Test Bed (ITB) Prototype FI components Integrating components Full Interoperability testing with standard compliant components Standards First draft ballots proposed for FOUPs and Loadports Mech. Wfr standard completed FOUP and Loadport standards completed Developmental wafer Standard completed 2007 2008 2009 2010 4
450mm starting materials activities 5
Silicon industry update All major silicon suppliers are engaged in the 450mm program and manufacturing developmental test wafers Wafer quality is continuously improving: Scratches have been eliminated Particle levels have been reduced dramatically Surface metals metrology has been developed Inspection equipment is coming on line Wafer shipping methodology is in development ISMI is engaged with suppliers to close gaps in silicon manufacturing and inspection line 6
450mm surface quality improvements 450mm Surface Quality Improvement 16 14 12 Wafer Defects (Lower is Better) 10 8 6 4 Key Surface Parameter Target 2 0 Q3'09 Q4'09 Q1'10 Q2'10 Time 2009 - Polishing has been improved scratches have been eliminated 2010 Cleaning has been improved particle levels have been reduced 10X 7
ISMI test wafer operations 8
ISMI test wafer operations 450mm equipment installations continues Bare wafer particle/edge inspection Wafer cleaning Film thickness measurements EFEMs / Wafer Sorters FOUP Wash 450mm test wafer processing experiments are progressing Wafer Cleaning Metrology Inspections ISMI continues working with suppliers on test wafer capabilities 9
ISMI prototype wafer cleans tool SSEC Wet clean tool installation complete in SEMATECH cleanroom SC1 / SC2 cleaning capability 12mm pitch loadport Cleaning experiments underway Cleaner wafers becoming available in ISMI wafer bank Particle experiments with loadports / carriers underway 10
450mm test wafer utilities matrix Collecting early 450mm utility projections Inputs will be used for 450mm test wafer facility planning Supplier surveys Consolidate surveys Supplier estimates for 450mm equipment facility requirements are Requested 11
450mm demonstration test methodology 12
450 mm demonstration test methodology (450 DTM) The 450 DTM provides an efficient equipment demonstration model for the industry Consolidated inputs from IC makers and suppliers Clear and consistent procedures; standardized methodology for common equipment requirements Equipment demonstrations will focus on process repeatability, stability, and equipment reliability As demonstrations begin, engagement and input from IC maker and equipment suppliers is key 13
450mm factory integration 14
Reduced standards development time ISMI s ITB testing helped to enable a 60-65% time reduction in FI standards development vs. 300mm 300mm transition FI standards transition Org standards published Provisional or full standards published Decision to start wafer size transition and standards development Approved FI standards published 450mm transition Ongoing prototype testing 1995 1997 1999 2001 2007 2009 2011 15
ITB lab testing focused on the latest FOUPs, MACs and load ports FOUPs Carriers 12mm Pitch Std FOUPs MAC Carrier 12mm Pitch Std MACs TDK 12 mm pitch load port under continuous cycling Completed >268 k cycles with FOUPs Brooks 12mm pitch load port, compatible with FOUPs and MACs cycling at supplier site Completed >34 k cycles with FOUPs. Ongoing MAC testing in H2-2010 Sinfonia 12mm pitch load port cycling with latest FOUPs Testing Completed with >318 k cycles with a mixture of standard FOUPs Gudeng 12mm Pitch Latch Key FOUP Entegris 12mm Pitch Latch Key FOUP 16
AMHS testing planned for H2 2010 450mm OHT 450mm Stocker New 450mm stockers and transport systems are under advanced development at suppliers sites ISMI will assess systems in H2 10 against ISMI 450mm guidelines and interoperability with 450mm standard carriers and load ports Goal is to demonstrate AMHS will be ready for 450mm pilot lines 17
450mm vacuum platform development 18
450mm vacuum platform readiness 1st 450mm vacuum platform test is ongoing 450mm vacuum platform solutions are becoming available for EFEM and chamber integration ISMI will communicate additional guidelines to suppliers and industry organizations based on test results ISMI will continue to support the integration of process chamber and platform to enable prototype 450mm equipment development 19
1st 450mm platform configuration RORZE Type: Pentagon Interface # : 3 process chambers, 2 Load lock 300mm and 450mm wafer handling in the same platform 20
Thank You 21