MJE18008 MJF NPN Bipolar Power Transistor For Switching Power Supply Applications

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NPN Bipolar Power Transistor For Switching Power Supply Applications The MJE/MJF18008 have an applications specific state of the art die designed for use in 220 V line operated Switchmode Power supplies and electronic light ballasts. These high voltage/high speed transistors offer the following: Improved Efficiency Due to Low Base Drive Requirements: High and Flat DC Current Gain hfe Fast Switching No Coil Required in Base Circuit for Turn Off (No Current Tail) Tight Parametric Distributions are Consistent Lot to Lot Two Package Choices: Standard TO 220 or Isolated TO 220 MJF18008, Case 221D, is UL Recognized at 3500 VRMS: File #E69369 MAXIMUM RATINGS Rating Symbol MJE18008 MJF18008 Unit Collector Emitter Sustaining Voltage VCEO 450 Vdc Î Collector Emitter Breakdown Voltage VCES 1000 Vdc Emitter Base Voltage VEBO 9.0 Vdc Collector Current Continuous Î Peak(1) I C 8.0 ICM 16 Adc Î Base Current Continuous IB 4.0 Adc Peak(1) IBM 8.0 RMS Isolation Voltage(2) Î Test No. 1 Per Fig. 22a VISOL 4500 Volts Î (for 1 sec,] R.H. < 30%, Test No. 1 Per Fig. 22b 3500 Î TC = 25C) Test No. 1 Per Fig. 22c 1500 Total Device Dissipation (TC = 25 C) P D 125 45 Watts Derate above 25C 1.0 0.36 W/C TJ, Tstg 65 to 150 C Î Operating and Storage Temperature THERMAL CHARACTERISTICS Î Rating Symbol MJE18008 MJF18008 Unit Î Thermal Resistance Junction to Case RθJC Junction to Ambient RθJA 1.0 2.78 62.5 62.5 Î C/W Maximum Lead Temperature for Soldering T L 260 Î C Purposes: 1/8 from Case for 5 Seconds *ON Semiconductor Preferred Device POWER TRANSISTOR 8.0 AMPERES 1000 VOLTS 45 and 125 WATTS 1 2 3 1 2 3 CASE 221A 09 TO 220AB MJE18008 CASE 221D 02 ISOLATED TO 220 TYPE UL RECOGNIZED MJF18008 4 Preferred devices are ON Semiconductor recommended choices for future use and best overall value. Semiconductor Components Industries, LLC, 2002 April, 2002 Rev. 4 1 Publication Order Number: MJE18008/D

Î ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise specified) Characteristic Î Symbol Min Typ Max Unit Î OFF CHARACTERISTICS Collector Emitter Sustaining Voltage (IC = 100 ma, L = 25 mh) Î VCEO(sus) 450 Vdc Collector Cutoff Current (VCE = Rated VCEO, IB = 0) Î ICEO 100 µadc Collector Cutoff Current (VCE = Rated VCES, VEB = 0) Î ICES 100 µadc (TC = 125C) 500 Collector Cutoff Current (VCE = 800 V, VEB = 0) (TC = 125C) 100 Emitter Cutoff Current (VEB = 9.0 Vdc, IC = 0) Î IEBO 100 µadc ÎÎ ON CHARACTERISTICS Base Emitter Saturation Voltage (IC = 2.0 Adc, IB = 0.2 Adc) VBE(sat) 0.82 1.1 Vdc Base Emitter Saturation Voltage (IC = 4.5 Adc, IB = 0.9 Adc) 0.92 1.25 ÎÎ Collector Emitter Saturation Voltage VCE(sat) Vdc (IC = 2.0 Adc, IB = 0.2 Adc) 0.3 0.6 (TC = 125C) 0.3 0.65 (IC = 4.5 Adc, IB = 0.9 Adc) 0.35 0.7 (TC = 125C) 0.4 0.8 DC Current Gain (IC = 1.0 Adc, VCE = 5.0 Vdc) (TC = 125C) hfe 14 34 28 DC Current Gain (IC = 4.5 Adc, VCE = 1.0 Vdc) 6.0 9.0 (TC = 125C) 5.0 8.0 DC Current Gain (IC = 2.0 Adc, VCE = 1.0 Vdc) 11 15 (TC = 125C) 11 16 ÎÎ DC Current Gain (IC = 10 madc, VCE = 5.0 Vdc) (1) Pulse Test: Pulse Width = 5.0 ms, Duty Cycle 10%. (continued) (2) Proper strike and creepage distance must be provided. 10 20 2

Characteristic Symbol Min Typ Max Unit ÎÎ DYNAMIC CHARACTERISTICS Current Gain Bandwidth (IC = 0.5 Adc, VCE = 10 Vdc, f = 1.0 MHz) ft 13 MHz Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz) Cob 100 150 pf Input Capacitance (VEB = 8.0 V) Cib 1750 2500 pf Î Dynamic Saturation Voltage: ÎÎ (IC = 2.0 Adc Î VCE(dsat) 1.0 µs 5.5 ÎÎ Î (TC = 125 C) 11.5 ÎÎ Vdc Determined 1.0 µs and IB1 = 200 madc Î 3.0 µs respectively after Î VCC = 300 V) 3.0 µsî 3.5 rising (TC = 125 C) 6.5 Î IB1 reaches 90% of final IB1 Î (see Figure 18) ÎÎ (IC = 5.0 Adc 1.0 µsî (TC = 125 C) Î 11.5 14.5 =10Adc Î Î Î IB1 1.0 ÎÎ VCC = 300 V) Î 3.0 µs Î (TC = 125 C) 2.4 ÎÎ 9.0 ÎÎ SWITCHING CHARACTERISTICS: Resistive Load (D.C. 10%, Pulse Width = 20 µs) Turn On Time Î (IC = 2.0 Adc, IB1 = 0.2 Adc, Î ton 200 300 ns IB2 = 1.0 Adc, VCC = 300 V) (TC = 125 C) 190 Turn Off Time Î Î toff 1.2 Î (TC = 125 C) 1.5 2.5 µs Turn On Time Î (IC = 4.5 Adc, IB1 = 0.9 Adc, ton 100 ÎÎ IB2 = 2.25 Adc, VCC = 300 V) Î (TC = 125 C) 250 180 ns Turn Off Time Î toff 1.6 2.5 µs (TC = 125 C) 2.0 ÎÎ SWITCHING CHARACTERISTICS: Inductive Load (Vclamp = 300 V, VCC = 15 V, L = 200 µh) ÎÎ Fall Time (IC = 2.0 Adc, IB1 = 0.2 Adc, tfi 100 IB2 = 1.0 Adc) Î (TC = 125 C) 120 180 ns Storage Time Î Î tsi 1.5 ÎÎ Î (TC = 125 C) 1.9 2.75 µs Crossover Time Î tc 250 350 ns (TC = 125 C) 230 ÎÎ Fall Time (IC = 4.5 Adc, IB1 = 0.9 Adc, tfi 85 IB2 = 2.25 Adc) Î (TC = 125 C) 135 150 ns Storage Time Î Î tsi 2.0 ÎÎ Î (TC = 125 C) 2.6 3.2 µs Crossover Time Î tc 210 300 ns 250 (TC = 125 C) 3

TYPICAL STATIC CHARACTERISTICS Figure 1. DC Current Gain @ 1 Volt Figure 2. DC Current Gain @ 5 Volts Figure 3. Collector Saturation Region Figure 4. Collector Emitter Saturation Voltage Figure 5. Base Emitter Saturation Region Figure 6. Capacitance 4

TYPICAL SWITCHING CHARACTERISTICS (IB2 = IC/2 for all switching) µ µ Figure 7. Resistive Switching, ton Figure 8. Resistive Switching, toff µ µ Figure 9. Inductive Storage Time, tsi Figure 10. Inductive Storage Time, tsi(hfe) µ µ Figure 11. Inductive Switching, tc and tfi IC/IB = 5 Figure 12. Inductive Switching, tc and tfi IC/IB = 10 5

TYPICAL SWITCHING CHARACTERISTICS (IB2 = IC/2 for all switching) µ µ Figure 13. Inductive Fall Time Figure 14. Inductive Crossover Time 6

GUARANTEED SAFE OPERATING AREA INFORMATION µ µ µ Figure 15. Forward Bias Safe Operating Area Figure 16. Reverse Bias Switching Safe Operating Area Figure 17. Forward Bias Power Derating There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate IC VCE limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. The data of Figure 15 is based on TC = 25 C; TJ(pk) is variable depending on power level. Second breakdown pulse limits are valid for duty cycles to 10% but must be derated when TC > 25 C. Second breakdown limitations do not derate the same as thermal limitations. Allowable current at the voltages shown in Figure 15 may be found at any case temperature by using the appropriate curve on Figure 17. TJ(pk) may be calculated from the data in Figure 20 and 21. At any case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown. For inductive loads, high voltage and current must be sustained simultaneously during turn off with the base to emitter junction reverse biased. The safe level is specified as a reverse biased safe operating area (Figure 16). This rating is verified under clamped conditions so that the device is never subjected to an avalanche mode. 7

µ µ µ µ Figure 18. Dynamic Saturation Voltage Measurements Figure 19. Inductive Switching Measurements µ Ω Ω µ Ω µ Ω µ µ µ Table 1. Inductive Load Switching Drive Circuit 8

TYPICAL THERMAL RESPONSE Figure 20. Typical Thermal Response (ZθJC(t)) for MJE18008 θθ θ θ θθ θ θ Figure 21. Typical Thermal Response (ZθJC(t)) for MJF18008 9

TEST CONDITIONS FOR ISOLATION TESTS* Figure 22a. Screw or Clip Mounting Position for Isolation Test Number 1 Figure 22b. Clip Mounting Position for Isolation Test Number 2 Figure 22c. Screw Mounting Position for Isolation Test Number 3 *Measurement made between leads and heatsink with all leads shorted together MOUNTING INFORMATION** Figure 23a. Screw Mounted Figure 23b. Clip Mounted Figure 23. Typical Mounting Techniques for Isolated Package Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in. lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions. Destructive laboratory tests show that using a hex head 4 40 screw, without washers, and applying a torque in excess of 20 in. lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. Additional tests on slotted 4 40 screws indicate that the screw slot fails between 15 to 20 in. lbs without adversely affecting the package. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recommend exceeding 10 in. lbs of mounting torque under any mounting conditions. ** For more information about mounting power semiconductors see Application Note AN1040. 10

PACKAGE DIMENSIONS TO 220AB CASE 221A 09 ISSUE AA H Q Z L V G B N D A K F T U S R J C T CASE 221D 02 (ISOLATED TO 220 TYPE) UL RECOGNIZED: FILE #E69369 ISSUE D A K F Q H B G N L D 3 PL Y C U T S J R 11

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