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High Speed Characterization Report MMCX-P-P-H-ST-TH1 mated with MMCX-J-P-H-ST-TH1 MMCX-P-P-H-ST-MT1 mated with MMCX-J-P-H-ST-MT1 MMCX-P-P-H-ST-SM1 mated with MMCX-J-P-H-ST-SM1 MMCX-P-P-H-ST-EM1 mated with MMCX-J-P-H-ST-EM1 REVISION DATE: January 6, 2005

TABLE OF CONTENTS Introduction... 3 Product Description... 3 Results Summary... 4 Time Domain Data... 4 Impedance... 4 NEXT and FEXT... 4 Impedance Profiles... 5 Frequency Domain Data... 9 Insertion Loss... 9 Return Loss... 11 Near End Crosstalk... 13 Far End Crosstalk... 14 VSWR... 15 Test Procedures... 17 Fixturing... 17 Time Domain Testing... 18 Impedance... 18 NEXT and FEXT... 18 Frequency Domain Testing... 18 Insertion Loss... 18 Return Loss and VSWR... 18 NEXT and FEXT... 18 Equipment... 20 Time Domain Testing... 20 Frequency Domain Testing... 20 2

Introduction This testing was performed to evaluate the electrical performance of the MMCX Series RF Connectors. Testing was performed in accordance to the High Performance Electrical Interconnect (HPEI) SFF-8416, Level 1, testing standards when applicable. Figure 1: Sample Test Board Testing was performed to assess Insertion Loss, Return Loss, Impedance, VSWR, and where appropriate, Crosstalk. Testing was performed with TDR and VNA technology and the results are displayed in Time (Impedance) or Frequency Domain (Insertion Loss, Return Loss, NEXT, FEXT, and VSWR) as required. TDA Systems IConnect Software (V3.0.2) was employed to convert the raw TDR/TDT measurements into the displayed data. Arc RF Systems SPViewII was employed with the Frequency Domain information. A custom set of test boards supplied by Samtec was used for all measurements. See Figure 1. Product Description The samples consisted of four different variations of the PCB mounted, straight MMCX Series RF mated connector sets. The mounting scheme conventions included throughhole technology (MMCX-x-P-H-ST-TH1) to hybrid surface mount and through-hole (MMCX-x-P-H-ST-MT1), surface mount only (MMCX-x-P-H-ST-SM1), and edge launched surface mount connectors (MMCX-x-P-H-ST-EM1). Part Number - Plug Part Number - Jack Mounting Configuration MMCX-P-P-H-ST-TH1 MMCX-J-P-H-ST-TH1 Through-Hole MMCX-P-P-H-ST-MT1 MMCX-J-P-H-ST-MT1 Through-Hole/Surface Mount MMCX-P-P-H-ST-SM1 MMCX-J-P-H-ST-SM1 Surface Mount MMCX-P-P-H-ST-EM1 MMCX-J-P-H-ST-EM1 Flush Edge Mount Table 1: MMCX Sample Descriptions 3

Results Summary Time Domain Data Impedance Impedance measurements were performed using an input risetime of 30ps as launched into the test boards. The minimum and maximum impedances are for the mated MMCX connector region only. Connector Minimum Impedance Maximum Impedance MMCX-x-P-H-ST-TH1 35 Ohms 51 Ohms MMCX-x-P-H-ST-MT1 47 Ohms 54 Ohms MMCX-x-P-H-ST-SM1 48 Ohms 56 Ohms MMCX-x-P-H-ST-EM1 47 Ohms 60 Ohms Table 2: Impedance Measurements NEXT and FEXT Near End and Far End Crosstalk was measured in the time domain. In all cases, the percent time domain crosstalk was less than 1 %. Connector NEXT FEXT MMCX-x-P-H-ST-TH1 0.5 mv 0.20% 0.9 mv 0.36% MMCX-x-P-H-ST-MT1 0.3 mv 0.12% 1.1 mv 0.44% MMCX-x-P-H-ST-SM1 1.3 mv 0.52% 1.3 mv 0.52% MMCX-x-P-H-ST-EM1 (See Note 1) (See Note1) Table 3: Crosstalk Measurements (NOTE 1: Since only a single set of the edge-mount MMCX (MMCX-x-P-H-ST-EM1) was tested, crosstalk was not able to be measured.) 4

Impedance Profiles Figure 2: Impedance Profile - MMCX-x-P-H-ST-TH1 5

Figure 3: Impedance Profile - MMCX-x-P-H-ST-MT1 6

Figure 4: Impedance Profile - MMCX-x-P-H-ST-SM1 7

Figure 5: Impedance Profile - MMCX-x-P-H-ST-EM1 8

Frequency Domain Data Insertion Loss Figure 6: Insertion Loss - MMCX-x-P-H-ST-TH1 Figure 7: Insertion Loss - MMCX-x-P-H-ST-MT1 9

Figure 8: Insertion Loss - MMCX-x-P-H-ST-SM1 Figure 9: Insertion Loss - MMCX-x-P-H-ST-EM1 10

Return Loss Figure 10: Return Loss - MMCX-x-P-H-ST-TH1 Figure 11: Return Loss - MMCX-x-P-H-ST-MT1 11

Figure 12: Return Loss - MMCX-x-P-H-ST-SM1 Figure 13: Return Loss - MMCX-x-P-H-ST-EM1 12

Near End Crosstalk Figure 14: NEXT - MMCX-x-P-H-ST-TH1 Figure 15: NEXT - MMCX-x-P-H-ST-MT1 Figure 16: NEXT - MMCX-x-P-H-ST-SM1 13

Far End Crosstalk Figure 17: FEXT - MMCX-x-P-H-ST-TH1 Figure 18: FEXT - MMCX-x-P-H-ST-MT1 Figure 19: FEXT - MMCX-x-P-H-ST-SM1 14

VSWR Figure 20: VSWR - MMCX-x-P-H-ST-TH1 Figure 21: VSWR - MMCX-x-P-H-ST-MT1 15

Figure 22: VSWR - MMCX-x-P-H-ST-SM1 Figure 23: VSWR - MMCX-x-P-H-ST-EM1 16

Test Procedures Fixturing All measurements were performed using the RF Test Board, Rev. 0. The Test Board includes test traces and two printed circuit test boards. For measurements that required reference measurements, reference traces were utilized as shown in Figure 24 below. The reference board was used to compensate for the losses due to the coaxial test cables, SMA launch, and the trace routing of the test PCB during the measurement process. Reference Trace Coax Cable Coax Cable TDT/VNA TDR/VNA Tektronix 11800C SD24 HP 8720ES Port1 SMA Launches Tektronix 11800C SD24 HP 8720ES Port2 Figure 24: Test setup for reference acquisition. Measurements were then performed using the test PCBs as shown in Figure 25. Coax Cable Connector Under Test Coax Cable TDT/VNA TDR/VNA Fig 19 Tektronix 11800C SD26 8720ES VNA Figure 25: Characterization test setup. SMA Launches 17 Tektronix 11800C SD24 8720ES VNA

Time Domain Testing Impedance The Tektronix 11800C Oscilloscope was set up in TDR (Time Domain Reflectometry) mode using 128 averages and a 5000-point record length. The horizontal scale was set to 2ns/div to allow the near end connector and a portion of the cable to be displayed. No filtering function was set. NEXT and FEXT Near End Crosstalk (NEXT) and Far End Crosstalk (FEXT) measurements were made using the Tektronix 11800C with SD24 and SD26 Sampling Heads. A thru reference of the coaxial test cables, SMAs, and reference board was performed to compensate for the test setup losses and the routing layer differences in the PCBs (see Figure 24). To acquire Crosstalk, a signal line was driven using the TDR. NEXT was measured on an adjacent line at the near end. FEXT was measured on an adjacent line at the far end (see Figure 25). All adjacent lines were terminated, at both ends, with 50Ω SMA loads. Frequency Domain Testing Insertion Loss Insertion Loss measurements were made using the Hewlett Packard 8720ES. Testing was performed over a 50 MHz to 20GHz range. Test setup losses were compensated for by acquiring a thru measurement of the coaxial test cables, SMAs, and the reference board (see Figure 24). The reference trace was then replaced with the Test PCBs and the sample (see Figure 25). A thru measurement was taken and then post processed by using Arc RF System s SPViewII. The result is the insertion loss of the MMCX Connectors. Return Loss and VSWR Return Loss measurements were made using the Hewlett Packard 8720ES VNA. Testing was performed over a 50 MHz to 20GHz range. Test setup losses were compensated for by acquiring a thru measurement of the coaxial test cables, SMAs, and the reference board (see Figure 25). A matched reflection waveform of the connector assembly was acquired and then post processed by using Arc RF System s SPViewII. The result is the return loss and VSWR of the total test board and MMCX connectors. NEXT and FEXT NEXT and FEXT were measured in the Frequency Domain using the Hewlett Packard 8720ES VNA. 18

To acquire the NEXT, a line was driven using the VNA. NEXT was measured on an adjacent line (see Figure 26). NEXT was then post processed by using Arc RF System s SPViewII. The result is the NEXT of the MMCX connector in the Frequency Domain. FEXT was measured on an adjacent line at the far end (see Figure 27). FEXT was then post processed by using Arc RF System s SPViewII. The result is the FEXT of the MMCX connector in the Frequency Domain. All adjacent lines were terminated, at both ends, with 50Ω SMA loads. MMCX Port1 Port2 SMAs NEXT test board FEXT test board Hewlett Packard 8720ES Figure 26: NEXT Measurement Setup. Coax Cable MMCX Coax Cable VNA VNA Hewlett Packard 8720ES Port1 SMA Launches Hewlett Packard 8720ES Port2 Figure 27: FEXT Measurement Setup. 19

Equipment Time Domain Testing Tektronix 11800C Oscilloscope Tektronix SD26 Sampling Head Tektronix SD24 TDR/Sampling Head Frequency Domain Testing Hewlett Packard 8720ES VNA 20