Electrical Performance Report 85 ohm Reference Impedance
|
|
- Walter Green
- 6 years ago
- Views:
Transcription
1 ERM S-DV Mates with ERF S-DV Description: Edge Rate Strip Series, 0.8mm Centerline 16mm Stack Height Samtec, Inc All Rights Reserved
2 TABLE OF CONTENTS Connector Overview... 1 Purpose... 1 Differential Return Loss... 2 Differential Insertion Loss... 3 Differential Impedance Profile... 4 New Albany IN USA SIG@samtec.com Report Revision: Samtec, Inc Page:ii All Rights Reserved
3 Connector Overview Edge Rate Strip Series 0.8mm (.0315 ) pitch interfaces (ERF8/ERM8 Series) are available in increments of 10 positions per row from 10 up to 70. Seventy-five positions per row are also available. ERF8/ERM8 series board-to-board spacing is available in 7mm ( ), 10mm (0.3935"), or 16mm (0.630") stack heights. The data in this report is applicable only to the 16mm (0.630 ) board-to-board spacing in 2:1 signal to ground ratio. Purpose This report presents the results of the 16mm ERM8/ERF8 connector response acquired in a 100 ohm differential measurement system transformed to an 85 ohm measurement system. The purpose is to show how Samtec products will operate in an 85 ohm system. The transformation process is described in Samtec Technical Note Transformation of Samtec Connector Test Data for 85 ohm Differential Impedance Applications Samtec, Inc Page:1 All Rights Reserved
4 Differential Return Loss Figure 1 shows the differential return loss for the 16mm ERM8/ERF8 connector with 100 ohm reference impedance and with 85 ohm reference impedance. Notice that this connector has a better match in a 100 ohm system up to approximately 4 GHz. db(tda_import_85..s(1,1)) db(s(1,1)) Differential Return Loss freq, GHz Figure 1. Differential Return Loss of Samtec 16mm ERM8/ERF8 Red 100 ohm Reference Impedance, Blue 85 ohm reference Impedance Samtec, Inc Page:2 All Rights Reserved
5 Differential Insertion Loss Figure 2 shows the differential insertion loss of the 16mm ERM8/ERF8 connector with 100 ohm reference impedance and with 85 ohm reference impedance. Notice that the difference in transmission performance is fairly minor. db(tda_import_85..s(2,1)) db(s(2,1)) Differential Insertion Loss freq, GHz Figure 2. Differential Insertion Loss of Samtec 16mm ERM8/ERF8 Red 100 ohm Reference Impedance, Blue 85 ohm reference Impedance Samtec, Inc Page:3 All Rights Reserved
6 Differential Impedance Profile Figure 3 shows the differential impedance profile of the 16mm ERM8/ERF8 connector with 100 ohm reference impedance and with 85 ohm reference impedance. The short length of 100 ohm test traces are visible after the 85 ohm transformation (blue trace) at about 0.15 nsec. It is important to note that the connector impedance response (between 0.3 nsec and 0.45 nsec) is not affected by the choice of the reference impedance. This is the reason that a SPICE model of the connector can be used in systems with a non-standard reference impedance such as 85 ohm differential. 120 Differential Impedance Profile TDA_import_85..TDR TDR time, nsec Figure 3. Differential Impedance Profile of 16mm ERM8/ERF8 Red 100 ohm Reference Impedance, Blue 85 ohm reference Impedance Samtec, Inc Page:4 All Rights Reserved
High Speed Characterization Report
SSW-1XX-22-X-D-VS Mates with TSM-1XX-1-X-DV-X Description: Surface Mount Terminal Strip,.1 [2.54mm] Pitch, 13.59mm (.535 ) Stack Height Samtec, Inc. 25 All Rights Reserved Table of Contents Connector Overview...
More informationHigh Speed Characterization Report
QTH-030-01-L-D-A Mates with QSH-030-01-L-D-A Description: High Speed Ground Plane Header Board-to-Board, 0.5mm (.0197 ) Pitch, 5mm (.1969 ) Stack Height Samtec, Inc. 2005 All Rights Reserved Table of Contents
More informationHigh Speed Characterization Report
FTSH-115-03-L-DV-A Mated With CLP-115-02-L-D-A Description: Parallel Board-to-Board, 0.050 [1.27mm] Pitch, 5.13mm (0.202 ) Stack Height Samtec, Inc. 2005 All Rights Reserved Table of Contents Connector
More informationHigh Speed Characterization Report
ERCD_020_XX_TTR_TED_1_D Mated with: ERF8-020-05.0-S-DV-L Description: 0.8mm Edge Rate High Speed Coax Cable Assembly Samtec, Inc. 2005 All Rights Reserved Table of Contents Cable Assembly Overview... 1
More informationHigh Data Rate Characterization Report
High Data Rate Characterization Report EQRF-020-1000-T-L-SMA-P-1 Mated with: QSE-xxx-01-x-D-A and SMA-J-P-x-ST-TH1 Description: Cable Assembly, High Speed Coax, 0.8 mm Pitch Samtec, Inc. 2005 All Rights
More informationHigh Data Rate Characterization Report
High Data Rate Characterization Report ERDP-013-39.37-TTR-STL-1-D Mated with: ERF8-013-05.0-S-DV-DL-L and ERM8-013-05.0-S-DV-DS-L Description: Edge Rate Twin-Ax Cable Assembly, 0.8mm Pitch Samtec, Inc.
More informationHigh Speed Competitive Comparison Report. Samtec MMCX-J-P-H-ST-TH1 Mated With MMCX-P-P-H-ST-TH1 Competitor A (Mated Set) Competitor B (Mated Set)
High Speed Competitive Comparison Report Samtec MMCX-J-P-H-ST-TH1 Mated With MMCX-P-P-H-ST-TH1 Competitor A (Mated Set) Competitor B (Mated Set) REVISION DATE: January 6, 2005 TABLE OF CONTENTS Introduction...
More informationHigh Speed Characterization Report
LSHM-150-06.0-L-DV-A Mates with LSHM-150-06.0-L-DV-A Description: High Speed Hermaphroditic Strip Vertical Surface Mount, 0.5mm (.0197") Centerline, 12.0mm Board-to-Board Stack Height Samtec, Inc. 2005
More informationHigh Speed Characterization Report
QTE-020-02-L-D-A Mated With QSE-020-01-L-D-A Description: Parallel Board-to-Board, 0.8mm Pitch, 8mm (0.315 ) Stack Height Samtec, Inc. 2005 All Rights Reserved Table of Contents Connector Overview... 1
More informationHigh Speed Characterization Report
TMMH-115-05-L-DV-A Mated With CLT-115-02-L-D-A Description: Micro Surface Mount, Board-to Board, 2.0mm (.0787 ) Pitch, 4.77mm (0.188 ) Stack Height Samtec, Inc. 2005 All Rights Reserved Table of Contents
More informationHigh Speed Characterization Report
High Speed Characterization Report MMCX-P-P-H-ST-TH1 mated with MMCX-J-P-H-ST-TH1 MMCX-P-P-H-ST-MT1 mated with MMCX-J-P-H-ST-MT1 MMCX-P-P-H-ST-SM1 mated with MMCX-J-P-H-ST-SM1 MMCX-P-P-H-ST-EM1 mated with
More informationSPICE Model Validation Report
HFEM-SE High Speed Flex Data Link Mated with: QTE-xxx-01-x-D-A QSE-xxx-01-x-D-A Description: Flex Data Link, High Speed, 0.8mm Pitch New Albany IN 47151-1147 USA SIG@samtec.com Report Revision: 9/13/2007
More informationHigh Speed Characterization Report
ECDP-16-XX-L1-L2-2-2 Mated with: HSEC8-125-XX-XX-DV-X-XX Description: High-Speed 85Ω Differential Edge Card Cable Assembly, 30 AWG ACCELERATE TM Twinax Cable Samtec, Inc. 2005 All Rights Reserved Table
More informationHigh Speed Characterization Report
HDLSP-035-2.00 Mated with: HDI6-035-01-RA-TR/HDC-035-01 Description: High Density/High Speed IO Cable Assembly Samtec, Inc. 2005 All Rights Reserved Table of Contents Introduction...1 Product Description...1
More informationHigh Speed Characterization Report
PCRF-064-1000-SMA-P-1 Mated with: PCIE-XXX-02-X-D-TH and SMA-J-P-X-ST-TH1 Description: Cable Assembly, Low Loss Microwave Coax, PCI Express Breakout Samtec, Inc. 2005 All Rights Reserved Table of Contents
More informationHigh Speed Characterization Report
TCDL2-10-T-05.00-DP and TCDL2-10-T-10.00-DP Mated with: TMMH-110-04-X-DV and CLT-110-02-X-D Description: 2-mm Pitch Micro Flex Data Link Samtec, Inc. 2005 All Rights Reserved Table of Contents Introduction...1
More informationHigh Speed Characterization Report
HLCD-20-XX-TD-BD-2 Mated with: LSHM-120-XX.X-X-DV-A Description: 0.50 mm Razor Beam High Speed Hermaphroditic Coax Cable Assembly Samtec, Inc. 2005 All Rights Reserved Table of Contents Cable Assembly
More informationShielding Effectiveness Report HQCD
HQCD Mates with QSH, QTH, QSH-EM Description: 0.50mm Q Strip High Speed Coax Cable Assembly Samtec, Inc. 2005 All Rights Reserved Table of Contents Product Overview... 1 Test Overview... 1 Shielded Room
More informationValidation Report Comparison of Eye Patterns Generated By Synopsys HSPICE and the Agilent PLTS
Comparison of Eye Patterns Generated By Synopsys HSPICE and the Agilent PLTS Using: Final Inch Test/Eval Kit, Differential Pair - No Grounds Configuration, QTE-DP/QSE-DP, 5mm Stack Height (P/N FIK-QxE-04-01)
More informationHigh Speed Characterization Report. Contact Plating Effects on Signal Integrity Gold on Post / Gold on Tail vs. Gold on Post / Matte Tin on Tail
Contact Plating Effects on Signal Integrity Gold on Post / Gold on Tail vs. Gold on Post / Matte Tin on Tail QTE-028-01-L-D-DP-A Mated With QSE-028-01-L-D-DP-A Description: Parallel Board-to-Board, Q Pair,
More informationRF Characterization Report
RF178 Series Cable Assemblies RF178-2SJ1-2SJ1-35 RF178-2RP1-2RP1-35 RF178-2SP1-2SP1-36 RF178-3RP1-3RP1-36 RF178-S7RP4-S7RP4-35 RF178-S7SP4-S7SP4-35 Description: RF Cable Assembly, 5 Ohm, RG178 Cable Samtec
More informationRiseUp RU8-DP-DV Series 19mm Stack Height Final Inch Designs in Serial ATA Generation 1 Applications. Revision Date: March 18, 2005
RiseUp RU8-DP-DV Series 19mm Stack Height Final Inch Designs in Serial ATA Generation 1 Applications Revision Date: March 18, 2005 Copyrights and Trademarks Copyright 2005 Samtec, Inc. Developed in conjunction
More informationHigh Speed Characterization Report
MEC1-150-02-L-D-RA1 Description: Mini Edge-Card Socket Right Angle Surface Mount, 1.0mm (.03937 ) Pitch Samtec, Inc. 2005 All Rights Reserved Table of Contents Connector Overview... 1 Connector System
More informationRF Characterization Report
SMA-J-P-H-ST-MT1 Mated with: RF316-01SP1-01BJ1-0305 Description: 50-Ω SMA Board Mount Jack, Mixed Technology Samtec, Inc. 2005 All Rights Reserved Table of Contents Introduction...1 Product Description...1
More informationHigh Speed Characterization Report
ESCA-XX-XX-XX.XX-1-3 Mated with: SEAF8-XX-05.0-X-XX-2-K SEAM8-XX-S02.0-X-XX-2-K Description: 0.80 mm SEARAY High-Speed/High-Density Array Cable Assembly, 34 AWG Samtec, Inc. 2005 All Rights Reserved Table
More informationSTRADA Mesa Mezzanine Connectors
STRADA Mesa Mezzanine Connectors Table of Contents Product Line Information.................................................. 3 Technical Specifications...................................................
More informationShielding Effectiveness Report HQDP
HQDP Mates with QSH-DP, QTH-DP Description: 0.50mm 100Ω Differential 30 AWG Twinax Cable Assembly Samtec, Inc. 2005 All Rights Reserved Table of Contents Product Overview... 1 Test Overview... 1 Shielded
More informationHigh Speed Characterization Report
PCIEC-XXX-XXXX-EC-EM-P Mated with: PCIE-XXX-02-X-D-TH Description: 1.00 mm PCI Express Internal Cable Assembly, 30 AWG Twinax Ribbon Cable Samtec, Inc. 2005 All Rights Reserved Table of Contents Cable
More informationHigh Speed Characterization Report
PCRF-064-XXXX-EC-SMA-P-1 Mated with: PCIE-XXX-02-X-D-TH Description: PCI Express Cable Assembly, Low Loss Microwave Cable Samtec, Inc. 2005 All Rights Reserved Table of Contents Cable Assembly Overview...
More informationEQCD High Speed Characterization Summary
EQCD High Speed Characterization Summary PRODUCT DESCRIPTION: A length of coaxial ribbon cable is terminated to a transition PCB break-out region onto which respective connectors are soldered. Three such
More informationHigh Data Rate Characterization Report
High Data Rate Characterization Report EQCD-020-39.37-STR-TTL-1 EQCD-020-39.37-STR-TEU-2 Mated with: QTE-020-01-X-D-A and QSE-020-01-X-D-A Description: 0.8mm High-Speed Coax Cable Assembly Samtec, Inc.
More informationDP Array DPAM/DPAF Final Inch Designs in Serial ATA Generation 1 Applications 10mm Stack Height. REVISION DATE: January 11, 2005
Application Note DP Array DPAM/DPAF Final Inch Designs in Serial ATA Generation 1 Applications 10mm Stack Height REVISION DATE: January 11, 2005 Copyrights and Trademarks Copyright 2005 Samtec, Inc. Developed
More informationSIGNAL INTEGRITY ANALYSIS AND MODELING
1.00mm Pitch BGA Socket Adapter System SIGNAL INTEGRITY ANALYSIS AND MODELING Rev. 2 www.advanced.com Signal Integrity Data Reporting At Advanced Interconnections Corporation, our Signal Integrity reporting
More informationQ2 QMS-DP/QFS-DP Series 11 mm Stack Height Final Inch Designs in Serial ATA Generation 1 Applications. Revision Date: February 22, 2005
Q2 QMS-DP/QFS-DP Series 11 mm Stack Height Final Inch Designs in Serial ATA Generation 1 Applications Revision Date: February 22, 2005 Copyrights and Trademarks Copyright 2005 Samtec, Inc. Developed in
More informationHigh Data Rate Characterization Report
High Data Rate Characterization Report VPSTP-016-1000-01 Mated with: VRDPC-50-01-M-RA and VRDPC-50-01-M-RA Description: Plug Shielded Twisted Pair Cable Assembly, 0.8mm Pitch Samtec, Inc. 2005 All Rights
More informationRF Characterization Report
RF36 Series Cable Assemblies RF36-SJ-SJ-3 RF36-RP-RP-36 RF36-SP-SP-36 RF36-3SP-3SP-36 RF36-3RP-3RP-36 RF36-5SP-5SP-35 RF36-5BJ-5BJ-3 RF36-6BJ-6BJ-35 RF36-7SP-7SP-33 RF36-7RP-7RP-37 RF36-7BJ-7BJ-36 RF36-S7RP4-S7RP4-35
More informationQPairs QTE-DP/QSE-DP Final Inch Designs in Serial ATA Generation 1 Applications 5mm Stack Height. REVISION DATE: January 12, 2005
Application Note QPairs QTE-DP/QSE-DP Final Inch Designs in Serial ATA Generation 1 Applications 5mm Stack Height REVISION DATE: January 12, 2005 Copyrights and Trademarks Copyright 2005 Samtec, Inc. Developed
More informationKeysight MOI for USB Type-C Connectors & Cable Assemblies Compliance Tests (Type-C to Legacy Cable Assemblies)
Revision 01.01 Jan-21, 2016 Universal Serial Bus Type-C TM Specification Revision 1.1 Keysight Method of Implementation (MOI) for USB Type-C TM Connectors and Cables Assemblies Compliance Tests Using Keysight
More informationReport. Description: High Phone: Samtec Inc. New Albany. IN USA. All Rights Reserved
Characterization Report SIBF-2X-F-S-AD Description: High Speed One Piecee Interface Board-to-Board, 1.27mm (.050 ) Pitch, 3mmm Stack Height Report Revision: 5/ /8/2013 Table of Contents Connector Overview...
More informationHigh Speed Characterization Report MEC8-1XX-02-X-DV-A
MEC8-1XX-02-X-DV-A Description: Mini Edge Card Vertical Socket, 0.8mm (0.0315") Pitch, Mates with 1.60mm (0.062'') thick cards WWW.SAMTEC.COM Table of Contents High Speed Connector Overview... 1 Connector
More informationHow Return Loss Gets its Ripples
Slide -1 How Return Loss Gets its Ripples an homage to Rudyard Kipling Dr. Eric Bogatin, Signal Integrity Evangelist, Bogatin Enterprises @bethesignal Downloaded handouts from Fall 211 Slide -2 45 Minute
More informationKeysight MOI for USB Type-C Connectors & Cable Assemblies Compliance Tests (Type-C to Legacy Cable Assemblies)
Revision 01.00 Nov-24, 2015 Universal Serial Bus Type-C TM Specification Revision 1.1 Keysight Method of Implementation (MOI) for USB Type-C TM Connectors and Cables Assemblies Compliance Tests Using Keysight
More informationShielding Effectiveness Report
VRDPC-050-01-S-D-RA Mates with VPDP/VPLSP/VPSTP Description: Data Rate I/O Cable Assemblies Samtec, Inc. 2005 All Rights Reserved Table of Contents Product Overview... 1 Shielded Room Noise Floor Verification...
More informationRG142-TNMNM-3M. Jumper Assembly Sample Label. Product Classification. General Specifications. Return Loss/VSWR. Regulatory Compliance/Certifications
RG142-TNMNM-3M Product Classification Product Series Product Type RG142 CNT Jumper with interface types and, 3 m RG142 Braided cable assembly General Specifications Body Style, Connector A Body Style,
More informationMICTOR. High-Speed Stacking Connector
MICTOR High-Speed Stacking Connector Electrical Performance Report for the 0.260" (6.6-mm) Stack Height Connector.......... Connector With Typical Footprint................... Connector in a System Report
More informationFLYOVER QSFP APPLICATION DESIGN GUIDE
FLYOVER QSFP APPLICATION DESIGN GUIDE FLY CRITICAL DATA OVER THE BOARD Samtec s Flyover QSFP Systems provide improved signal integrity and architectural flexibility by flying critical high-speed signals
More informationCalibration and De-Embedding Techniques in the Frequency Domain
Calibration and De-Embedding Techniques in the Frequency Domain Tom Dagostino tom@teraspeed.com Alfred P. Neves al@teraspeed.com Page 1 Teraspeed Labs Teraspeed Consulting Group LLC 2008 Teraspeed Consulting
More informationHigh-Reliability and Environment Qualified Components
High-Reliability and Environment Qualified Components Introduction Ruggedness and reliability have been designed in across our product lines and proven in the field. This section of our catalog provides
More informationHigh Speed Characterization Report
SEAFP-XX-05.0-X-XX Mates with SEAMP-XX-02.0-X-XX Description: Open Pin Field Array, Press Fit, 1.27mm x 1.27mm Pitch 7 mm Stack Height WWW.SAMTEC.COM Table of Contents High Speed Connector Overview...
More informationMicro Coaxial Connector. Ultrasmall Series with mating height 1.00 mm
MCC Micro Coaxial Connector Ultrasmall Series with mating height 1.00 mm IEEE802.11a b g n WiMAX Bluetooth Zigbee MIMO (Multiple input and multiple output) 1 USS RF V Plug Cable Assembly Mating height
More informationHigh Speed, Matched-Impedance, Parallel Board-to-board Connector System
NEW High Speed, Matched-Impedance, Parallel Board-to-board Connector System IT Series (2 required) IT Series Outline High-speed matched-impedance parallel board-to-board connector designed for applications
More informationCustom Interconnects Fuzz Button with Hardhat Test Socket/Interposer 1.00 mm pitch
Custom Interconnects Fuzz Button with Hardhat Test Socket/Interposer 1.00 mm pitch Measurement and Model Results prepared by Gert Hohenwarter 12/14/2015 1 Table of Contents TABLE OF CONTENTS...2 OBJECTIVE...
More informationOptimization of Wafer Level Test Hardware using Signal Integrity Simulation
June 7-10, 2009 San Diego, CA Optimization of Wafer Level Test Hardware using Signal Integrity Simulation Jason Mroczkowski Ryan Satrom Agenda Industry Drivers Wafer Scale Test Interface Simulation Simulation
More informationVHDM & VHDM-L Series. High Speed. Electrical Characterization
VHDM & VHDM-L Series High Speed Electrical Characterization HDM, VHDM & VHDM-HSD are trademarks or registered trademarks of Teradyne, Inc. Date: 2/14/2003 SCOPE 1. The scope of this document is to define
More informationProbe Card Characterization in Time and Frequency Domain
Gert Hohenwarter GateWave Northern, Inc. Probe Card Characterization in Time and Frequency Domain Company Logo 2007 San Diego, CA USA Objectives Illuminate differences between Time Domain (TD) and Frequency
More informationElectromagnetic Analysis of AC Coupling Capacitor Mounting Structures
Simbeor Application Note #2008_02, April 2008 2008 Simberian Inc. Electromagnetic Analysis of AC Coupling Capacitor Mounting Structures Simberian, Inc. www.simberian.com Simbeor : Easy-to-Use, Efficient
More informationThe Reverse Polarity TNC(m) RF connector can be easily secured or removed from equipment in the field by a single gloved hand, no tools required.
Overview Southwest Antennas is a half wave dipole omni antenna with a frequency range of 1.35 to 1.40 GHz and 2.15 dbi of peak gain. This product features an integrated RF bandpass filter to help eliminate
More informationAries Kapton CSP socket
Aries Kapton CSP socket Measurement and Model Results prepared by Gert Hohenwarter 5/19/04 1 Table of Contents Table of Contents... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 4 Setup... 4 MEASUREMENTS...
More informationFeatures and Technical Specifications
Features and Technical Specifications PRODU C T SUM M AR Y The HL9402 is a signal splitter and combiner that offers industry-best amplitude and phase match over a bandwidth of 500 khz to 20 GHz (-3 db).
More informationBill Ham Martin Ogbuokiri. This clause specifies the electrical performance requirements for shielded and unshielded cables.
098-219r2 Prepared by: Ed Armstrong Zane Daggett Bill Ham Martin Ogbuokiri Date: 07-24-98 Revised: 09-29-98 Revised again: 10-14-98 Revised again: 12-2-98 Revised again: 01-18-99 1. REQUIREMENTS FOR SPI-3
More informationZ-Dok High-Performance Docking Connector
Z-Dok High-Performance Docking Connector Electrical Performance Report... Connector With Typical Footprint... Connector in a System Report #22GC007, Revision A May 2002 2002 Tyco Electronics, Inc., Harrisburg,
More informationHigh Speed Characterization Report
High Speed Characterization Report HDR-108449-01-HHSC HDR-108449-02-HHSC HDR-108449-03-HHSC HDR-108449-04-HHSC FILE: HDR108449-01-04-HHSC.pdf DATE: 03-29-04 Table of Contents Introduction. 1 Product Description.
More informationSignal Integrity Tips and Techniques Using TDR, VNA and Modeling. Russ Kramer O.J. Danzy
Signal Integrity Tips and Techniques Using TDR, VNA and Modeling Russ Kramer O.J. Danzy Simulation What is the Signal Integrity Challenge? Tx Rx Channel Asfiakhan Dreamstime.com - 3d People Communication
More informationPRODUCT SPECIFICATION
ipass TM 0.8 mm PITCH I/O CONNECTOR REVISION: ECR/ECN INFORMATION: EC No: UCP200-137 DATE: 200 / 02 / 08 TITLE: 1 of 14 TABLE OF CONTENTS 1.0 SCOPE 3 2.0 PRODUCT DESCRIPTION 3 2.1 PRODUCT NAME AND SERIES
More informationPRODUCT SPECIFICATION
i TM / i+ TM 0.8 mm PITCH I/O CONNECTOR SYSTEM of TABLE OF CONTENTS.0 SCOPE... 3.0 PRODUCT DESCRIPTION... 3. PRODUCT NAME AND SERIES NUMBER(S)... 3. DIMENSION, MATERIALS, PLATING AND MARKINGS... 3.3 SAFETY
More informationDemystifying Vias in High-Speed PCB Design
Demystifying Vias in High-Speed PCB Design Keysight HSD Seminar Mastering SI & PI Design db(s21) E H What is Via? Vertical Interconnect Access (VIA) An electrical connection between layers to pass a signal
More informationFeatures and Technical Specifications
Features and Technical Specifications PRODU C T SUM M AR Y The HL9404 is a signal splitter and combiner that offers industry-best amplitude and phase match over a bandwidth of 500 khz to 40 GHz (-3 db).
More informationSerial ATA International Organization
Serial ATA International Organization Version 1.0 May 29, 2008 Serial ATA Interoperability Program Revision 1.3 Tektronix MOI for Rx/Tx Tests (DSA/CSA8200 based sampling instrument with IConnect SW) This
More informationCALL (512 ) x6400
The AirBorn stackable compliant connector family is one of AirBorn s solutions for high-density, board-to-board stacking applications. This connector family is available in 0.075 contact spacing and 100
More informationSamtec MODS-LJ Series (LIFEJACK ) Category 5/5e Qualification
Samtec MODS-LJ Series (LIFEJACK ) Category 5/5e Qualification J. Ferry, C. Arroyo Copyright 2008 Samtec, Inc Page 1 Summary LIFEJACK met or exceeded TIA/EIA-568-B.2-2001 Category 5e requirements for Insertion
More informationSERIES YL-N DIVIDERS/COMBINER, POWER IN-PHASE 2-WAY SMA & TYPE N GHz ELECTRICAL PERFORMANCE MECHANICAL OUTLINES GENERAL SPECIFICATIONS
IN-PHASE 2-WAY & TYPE N DIVIDERS/COMBINER, POWER 0.5-18 GHz GENERAL SPECIFICATIONS RF Impedance: 0.5-18.0 GHz 50 Ohms The power handling capability for load VSWR s less than 1 is 1 watt CW and 1kW peak
More informationAries QFP microstrip socket
Aries QFP microstrip socket Measurement and Model Results prepared by Gert Hohenwarter 2/18/05 1 Table of Contents Table of Contents... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 4 Setup... 4
More informationThe GPO male interface is compliant to MIL-STD-348, and it is in accordance with MIL-PRF-39012a and DESC 94007/94008.
GPO, GPPO and G3PO Application Notes Corning Gilbert s push-on connector products allow users flexibility in modular and board layout (in high density situations), frequency bandwidths from DC to 100 GHz
More informationProducts. Dielectric Resonators. Description: Specifications: Attenuation:
Dielectric Resonators Products Description: K&L s Dielectric Resonator Bandpass Filters are available in standard packages with a basic Chebychev design. Connectors available are SMA and RF pins. Through
More information780-8 Series Constant Impedance FM Combiners
Features Cylindrical construction provides better mechanical and electrical stability than square or rectangular cavities Factory tuned to customer s specified channel, yet can be easily field converted
More informationConsiderations in High-Speed High Performance Die-Package-Board Co-Design. Jenny Jiang Altera Packaging Department October 2014
Considerations in High-Speed High Performance Die-Package-Board Co-Design Jenny Jiang Altera Packaging Department October 2014 Why Co-Design? Complex Multi-Layer BGA Package Horizontal and vertical design
More informationMinimization of Reflection from AC Coupling Capacitors
Simbeor Application Note #2008_04, September 2008 2008 Simberian Inc. Minimization of Reflection from AC Coupling Capacitors Simberian, Inc. www.simberian.com Simbeor : Easy-to-Use, Efficient and Cost-Effective
More informationCharacterization Methodology for High Density Microwave Fixtures. Dr. Brock J. LaMeres, Montana State University
DesignCon 2008 Characterization Methodology for High Density Microwave Fixtures Dr. Brock J. LaMeres, Montana State University lameres@ece.montana.edu Brent Holcombe, Probing Technology, Inc brent.holcombe@probingtechnology.com
More informationQuickSyn Lite mmw Frequency Synthesizer
FSL-2740, FSL-5067, FSL-7682 Features mmw frequency Fast switching speed Low phase noise Reference locking of multiple modules Soft front panel Frequency sweep & 32K-point LIST mode Interfaces: USB & SPI
More informationHow to anticipate Signal Integrity Issues: Improve my Channel Simulation by using Electromagnetic based model
How to anticipate Signal Integrity Issues: Improve my Channel Simulation by using Electromagnetic based model HSD Strategic Intent Provide the industry s premier HSD EDA software. Integration of premier
More informationWEINSCHEL ASSOCIATES
VARIABLE ATTENUATORS DC 40.0 GHz 0.3 5 WATTS Number Frequency Range (GHz) Continuously Variable Attenuators Average Power (W) Peak Power (kw) Residual Insertion Loss (db) Attenuation Range (db) Connectors
More informationABSTRACT. List of Figures
Application Report SLAA284 November 2005 Connecting ADS8410/13 With Long Cable Bhaskar Goswami, Rajiv Mantri... Data Acquisition Products ABSTRACT Many applications require that the analog-to-digital converter
More informationRESISTIVE POWER SPLITTERS AND DIVIDERS
RESISTIVE POWER SPLITTERS AND DIVIDERS DC 40.0 GHz S Resistive Power Splitters Usage: : Use in RF and wireless applications where one of the two outputs are included in a leveling loop or used as a reference
More informationCOMMUNICATIONS, DATA, CONSUMER DIVISION. Mezzanine High-Speed High-Density Connectors GIG-ARRAY and MEG-ARRAY Electrical Performance Data
COMMUNICATIONS, DATA, CONSUMER DIVISION Mezzanine High-Speed High-Deity Connectors GIG-ARRAY and MEG-ARRAY Electrical Performance Data FCI: SETTING THE STANDARD FOR CONNECTORS With operatio in 30 countries,
More informationPhysical Test Setup for Impulse Noise Testing
Physical Test Setup for Impulse Noise Testing Larry Cohen Overview Purpose: Use measurement results for the EM coupling (Campbell) clamp to determine a stable physical test setup for impulse noise testing.
More informationFMSW6124 DATA SHEET. Transfer Latching Electro-Mechanical Relay Switch From DC to 40 GHz, 5 Watts with Indicators, TTL, Self Cut Off, Diodes, 2.
Transfer Latching Electro-Mechanical Relay Switch From DC to 40 GHz, 5 Watts with Indicators, TTL, Self Cut Off, Diodes, 2.92mm The FMSW6124 is a Transfer Electromechanical Relay Switch that operates over
More informationTektronix Inc. DisplayPort Standard. Revision Tektronix MOI for Cable Tests (DSA8200 based sampling instrument with IConnect software)
DisplayPort Standard Revision 1.0 05-20-2008 DisplayPort Standard Tektronix MOI for Cable Tests (DSA8200 based sampling instrument with IConnect software) 1 Table of Contents: Modification Records... 4
More informationA review of a Universal Coaxial Test Socket s Performance David Mahoney, Xilinx, Samuel Halm, Xilinx,
A review of a Universal Coaxial Test Socket s Performance David Mahoney, Xilinx, david.mahoney@xilinx.com Samuel Halm, Xilinx, samuel.halm@xilinx.com Nick Lanston Jr., Yamaichi Electronics, nickl@yeu.com
More informationDigital to Analog Output Module (with IF Output Capability)
ICE-D2AWG-r2 Innovative Computer Engineering Digital to Analog Output Module (with IF Output Capability) This single-site module has three modes: I/Q modulation, interpolating DAC, and tone generator.
More informationCPDC2X1. 2X1 GPS Combiner Technical Product Data
CPDC2X1 2X1 GPS Combiner Technical Product Data Features Excellent Flatness Extremely Flat Group Delay Less that 1ns variation Low Insertion Loss Passes all GNSS Frequencies (Entire L-band) Provides Antenna
More informationDesignCon 2003 High-Performance System Design Conference (HP3-5)
DesignCon 2003 High-Performance System Design Conference (HP3-5) Logic Analyzer Probing Techniques for High-Speed Digital Systems Author/Presenter: Brock LaMeres Hardware Design Engineer Logic Analyzer
More informationAgilent MOI for MIPI D-PHY Conformance Tests Revision 1.00 Dec-1, 2011
Revision 1.00 Dec-1, 2011 Agilent Method of Implementation (MOI) for MIPI D-PHY Conformance Tests Using Agilent E5071C ENA Network Analyzer Option TDR 1 Table of Contents 1. Modification Record... 4 2.
More informationEffect of slots in reference planes on signal propagation in single and differential t-lines
Simbeor Application Note #2007_09, November 2007 2007 Simberian Inc. Effect of slots in reference planes on signal propagation in single and differential t-lines Simberian, Inc. www.simberian.com Simbeor:
More informationAgilent Correlation between TDR oscilloscope and VNA generated time domain waveform
Agilent Correlation between TDR oscilloscope and VNA generated time domain waveform Application Note Introduction Time domain analysis (TDA) is a common method for evaluating transmission lines and has
More informationHow to Read S-Parameters Like a Book or Tapping Into Some Of The Information Buried Inside S- Parameter Black Box Models
Slide -1 Bogatin Enterprises and LeCroy Corp No Myths Allowed Webinar Time before start: How to Read S-Parameters Like a Book or Tapping Into Some Of The Information Buried Inside S- Parameter Black Box
More informationActual Cable Data update
Actual Cable Data update Insertion loss, return loss, charcteristic impedance at worst case condition, propagation delay Coupling attenuation at different ageing conditions Screening attenuation at different
More informationInterposer MATED HEIGHT
Product Specification: FEATURES High Performance PCBeam Connector Technology Product options at 1.27mm, 1.0mm, and 0.8mm pitch Maximized pin count per form factor 3 form factor sizes available Standard
More informationAgilent MOI for MIPI M-PHY Conformance Tests Revision Mar 2014
Revision 1.10 20 Mar 2014 Agilent Method of Implementation (MOI) for MIPI M-PHY Conformance Tests Using Agilent E5071C ENA Network Analyzer Option TDR 1 Table of Contents 1. Modification Record... 4 2.
More informationFMSW6129 DATA SHEET. SP4T Normally Open Electro-Mechanical Relay Switch From DC to 22 GHz, 20 Watts with Indicators, TTL, Diodes, SMA.
SP4T Normally Open Electro-Mechanical Relay Switch From DC to 22 GHz, 20 Watts with Indicators, TTL, Diodes, SMA The FMSW6129 is an SP4T Electromechanical Relay Switch that operates over a wide frequency
More informationDL-150 The Ten Habits of Highly Successful Designers. or Design for Speed: A Designer s Survival Guide to Signal Integrity
Slide -1 Ten Habits of Highly Successful Board Designers or Design for Speed: A Designer s Survival Guide to Signal Integrity with Dr. Eric Bogatin, Signal Integrity Evangelist, Bogatin Enterprises, www.bethesignal.com
More information