19-3472; Rev ; 1/4 Quad SPST Switches General Description The quad single-pole/single-throw (SPST) switch operates from a single +2V to +5.5V supply and can handle signals greater than the supply rail. This switch features low on-resistance with 3pF oncapacitance, making it ideal for switching data signals. For over-rail applications, this device passes signals greater than the positive supply (up to +5.5V) through the switch without distortion. The is available in the space-saving, 16-pin, 3mm x 3mm thin QFN package and operates over the -4 C to +85 C extended temperature range. Features USB 2. Full Speed (12Mbps) and USB 1.1 Signal Switching Switches Signals Greater than VCC On-Resistance 3pF On-Capacitance 15MHz, -3dB Bandwidth 1.8V Logic Compatibility +2V to +5.5V Supply Range Low.1µA Supply Current Available in a Space-Saving, 3mm x 3mm, 16-Pin TQFN Package USB Switching Cellular Phones Notebook Computers PDAs and Other Handheld Devices Applications PART *EP = Exposed paddle. Ordering Information TEMP RANGE PIN- PACKAGE TOP MARK ETE -4 C to +85 C 16 TQFN-EP* ACE Block Diagram/Truth Table Pin Configuration TOP VIEW COM1 IN1 VCC IN4 16 15 14 13 NO1 1 12 COM4 TRUTH TABLE IN_ 1 NO_ OFF ON SWITCHES SHOWN FOR LOGIC "" INPUT NO1 NO2 NO3 COM1 IN1 COM2 IN2 COM3 IN3 N.C. IN2 COM2 2 3 4 5 6 7 8 11 1 9 N.C. NO4 IN3 NO4 COM4 IN4 NO2 GND NO3 COM3 3mm x 3mm THIN QFN CONNECT EXPOSED PADDLE TO PC BOARD GROUND. Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim s website at www.maxim-ic.com.
ABSOLUTE MAXIMUM RATINGS, IN_, COM_, NO_ to GND (Note 1)...-.3V to +6.V Closed-Switch Continuous Current COM_, NO_, NC_...±5mA Peak Current COM_, NO_ (pulsed at 1ms, 5% duty cycle)...±1ma Peak Current COM_, NO_ (pulsed at 1ms, 1% duty cycle)...±12ma Continuous Power Dissipation (T A = +7 C) 16-Pin Thin QFN (derate 2.8mW/ C above +7 C)...1667mW Operating Temperature Range...-4 C to +85 C Junction Temperature...+15 C Storage Temperature Range...-65 C to +15 C Lead Temperature (soldering, 1s)...+3 C Note 1: Signals on IN_, NO_, or COM_ below GND are clamped by internal diodes. Limit forward-diode current to maximum current rating. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS ( = +2.7V to +5.5V, T A = -4 C to +85 C, unless otherwise noted. Typical values are at = +3.V, T A = +25 C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage 2. 5.5 V Supply Current I CC = +5.5V, V IN_ = or.1 1 µa ANALOG SWITCH Analog Signal Range V NO_, V COM_ 5.5 V V T A = +25 C 7 9 On-Resistance R CC = +3V, I COM_ = 1mA, ON V NO_ = to +5.5V T A = -4 C to +85 C 1 Ω On-Resistance Match Between Channels (Notes 3, 4) R ON = +3V, I COM = 1mA, V NO_ = +1.5V T A = +25 C.2.4 T A = -4 C to +85 C.5 Ω On-Resistance Flatness (Note 5) NO_ Off-Leakage Current COM_ On-Leakage Current R FLAT I OFF I ON DYNAMIC CHARACTERISTICS = +3V; I COM_ = 1mA; T A = +25 C 2.5 3.75 V NO_ = +1V, +2V, +3V T A = -4 C to +85 C 4. = +5.5V, V NO_ = +1V or +4.5V, T A = +25 C - 2 +2 V COM_ = +4.5V or +1V T A = -4 C to +85 C -1 +1 = +5.5V; V NO_ = +1V, +4.5V, or T A = +25 C - 2 +2 floating; V COM_ = +1V, +4.5V, or floating T A = -4 C to +85 C - 12.5 +12.5 Skew (Note 3) t SKEW R S = 39Ω, C L = 5pF, Figure 2.1 1 ns Propagation Delay (Note 3) t PD R S = 39Ω, C L = 5pF, Figure 2.9 2 ns V T A = +25 C 4 6 Turn-On Time t CC = +3V, V NO_ = +1.5V, ON R L = 3Ω, C L = 5pF, Figure 1 T A = -4 C to +85 C 1 V T A = +25 C 3 4 Turn-Off Time t CC = +3V, V NO_ = +1.5V, OFF R L = 3Ω, C L = 5pF, Figure 1 T A = -4 C to +85 C 6 Charge Injection Q V COM_ = +1.5V, R S = Ω, C L = 1nF, Figure 3 8 pc Off-Isolation ( N ote 6) f = 1kH z, V C OM _ = 1V RM S, R L = 5Ω, C L = 5p F, Fi g ur e 4-8 db Crosstalk f = 1MHz, V COM_ = 1V RMS, R L = 5Ω, C L = 5pF, Figure 4-95 db -3dB Bandwidth BW Signal = dbm, R L = 5Ω, C L = 5pF, Figure 4 15 MHz Ω na na ns ns 2
ELECTRICAL CHARACTERISTICS (continued) ( = +2.7V to +5.5V, T A = -4 C to +85 C, unless otherwise noted. Typical values are at = +3.V, T A = +25 C, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NO_ Off-Capacitance C OFF f = 1MHz, Figure 5 13 pf COM On-Capacitance C ON f = 1MHz, Figure 5 3 pf Total Harmonic Distortion DIGITAL I/O (IN_) Input Logic High Voltage Input Logic Low Voltage THD f = 2Hz to 2kHz, V COM_ = 1V +2V P-P, R L = 6Ω.4 % = +2V to +3.6V 1.4 V IH = +3.6V to +5.5V 1.8 = +2V to +3.6V.5 V IL = +3.6V to +5.5V.8 Input Leakage I IN V IN_ = or +5.5V -.5 +.5 µa Note 2: Specifications are 1% tested at T A = +85 C only, and guaranteed by design and characterization over the specified temperature range. Note 3: Guaranteed by design and characterization; not production tested. Note 4: R ON = R ON(MAX) - R ON(MIN). Note 5: Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal ranges. Note 6: Off-isolation = 2log 1 (V COM_ / V NO_), V COM_ = output, V NO_ = input to off switch. V V ( = 3.V, T A = +25 C, unless otherwise noted.) Typical Operating Characteristics ON-RESISTANCE (Ω) 45 4 35 3 25 2 15 1 5 ON-RESISTANCE vs. COM VOLTAGE = 1.8V = 2.V = 2.3V = 2.5V = 3.V = 5.V 2 4 6 COM VOLTAGE (V) toc1 ON-RESISTANCE (Ω) 8 7 6 5 4 3 2 ON-RESISTANCE vs. COM VOLTAGE = 3.V T A = +85 C T A = +25 C T A = -4 C 2 4 6 COM VOLTAGE (V) toc2 ON-RESISTANCE (Ω) 5.5 5. 4.5 4. 3.5 3. 2.5 2. 1.5 ON-RESISTANCE vs. COM VOLTAGE = 5.V T A = +85 C T A = +25 C T A = -4 C 1 2 3 4 5 6 COM VOLTAGE (V) toc3 3
Typical Operating Characteristics (continued) ( = 3.V, T A = +25 C, unless otherwise noted.) SUPPLY CURRENT (na) SUPPLY CURRENT vs. SUPPLY VOLTAGE 1..8.6.4.2 T A = +85 C T A = +25 C T A = -4 C toc4 TURN-ON/TURN-OFF TIME (ns) 6 5 4 3 2 1 TURN-ON/TURN-OFF TIME vs. SUPPLY VOLTAGE t OFF t ON toc5 TURN-ON/TURN-OFF TIME (ns) 34 32 3 28 26 24 22 TURN-ON/TURN-OFF TIME vs. TEMPERATURE t ON t OFF toc6 1.5 2. 2.5 3. 3.5 4. 4.5 5. 5.5 SUPPLY VOLTAGE (V) 1.5 2.5 3.5 4.5 5.5 SUPPLY VOLTAGE (V) 2-4 -15 1 35 6 85 TEMPERATURE ( C) LOGIC THRESHOLD (V) LOGIC THRESHOLD vs. SUPPLY VOLTAGE 1.6 1.4 V IN RISING 1.2 1. V IN FALLING.8 toc7 CHARGE INJECTION (pc) 3 2 1 CHARGE INJECTION vs. COM VOLTAGE = 3V = 5V toc8 LEAKAGE CURRENT (na) 1.6 1.4 1.2 1..8.6.4.2 LEAKAGE CURRENT vs. TEMPERATURE COM ON-LEAKAGE COM OFF-LEAKAGE toc9.6 1.5 2.5 3.5 4.5 5.5 SUPPLY VOLTAGE (V) 1 2 3 4 5 COM VOLTAGE (V) -4-15 1 35 6 85 TEMPERATURE ( C) FREQUENCY RESPONSE (db) 2-2 -4-6 -8 FREQUENCY RESPONSE ON-RESPONSE OFF-RESPONSE CROSSTALK toc1 THD (%) 1.1 TOTAL HARMONIC DISTORTION vs. FREQUENCY R L = 6Ω toc11 V NC 2V/div V V COM V SWITCH PASSING SIGNALS ABOVE SUPPLY VOLTAGE toc12 = 3.V -1.1 1 1 1 1 FREQUENCY (MHz).1 1 1 1k 1k 1k FREQUENCY (Hz) 2µs/div 4
PIN NAME FUNCTION 1 NO1 Normally Open Terminal for Analog Switch 1 2, 11 N.C. No Connection. Not internally connected. Pin Description 3 IN2 Digital Control Input for Analog Switch 2. A logic-low on IN2 disconnects COM2 from NO2 and a logic-high connects COM2 to NO2. 4 COM2 Common Terminal for Analog Switch 2 5 NO2 Normally Open Terminal for Analog Switch 2 6 GND Ground 7 NO3 Normally Open Terminal for Analog Switch 3 8 COM3 Common Terminal for Analog Switch 3 9 IN3 Digital Control Input for Analog Switch 3. A logic-low on IN3 disconnects COM3 from NO3 and a logic-high connects COM3 to NO3. 1 NO4 Normally Open Terminal for Analog Switch 4 12 COM4 Common Terminal for Analog Switch 4 13 IN4 Digital Control Input for Analog Switch 4. A logic-low on IN4 disconnects COM4 from NO4 and a logic-high connects COM4 to NO4. 14 Supply Voltage. Bypass to GND with a.1µf capacitor as close to the pin as possible. 15 IN1 Digital Control Input for Analog Switch 1. A logic-low on IN1 disconnects COM1 from NO1 and a logic-high connects COM1 to NO1. 16 COM1 Common Terminal for Analog Switch 1 EP GND Exposed Pad. Connect to ground. 5
Detailed Description The low on-resistance, low-voltage, analog switch is designed to operate from a +2V to +5.5V single supply and is fully specified for nominal +3.V applications. The device features over-rail signal capability that allows signals up to +5.5V with supply voltages down to +2.V to pass through without distortion. This quad SPST switch has low on-channel capacitance, which allows switching of the data signals for USB 2./1.1 applications (12Mbps). It is designed to switch D+ and D- USB signals with a guaranteed skew of less than 1ns (see Figure 2) as measured from 5% of the input signal to 5% of the output signal. Applications Information Digital Control Inputs The logic inputs (IN_) accept up to +5.5V even if the supply voltages are below this level. For example, with a +3.3V supply, IN_ can be driven low to GND and high to +5.5V, allowing for mixing of logic levels in a system. Driving IN_ rail-to-rail minimizes power consumption. For a +2V supply voltage, the logic thresholds are +.5V (low) and +1.4V (high); for a +5V supply voltage, the logic thresholds are +.8V (low) and +1.8V (high). Analog Signal Levels The on-resistance of these switches changes very little for analog input signals across the entire supply voltage range (see the Typical Operating Characteristics). The switches are bidirectional; therefore, NO_ and COM_ can be either inputs or outputs. Power-Supply Sequencing Caution: Do not exceed the absolute maximum ratings because stresses beyond the listed ratings may cause permanent damage to the device. Proper power-supply sequencing is recommended for all CMOS devices. Always apply before applying analog signals, especially if the analog signal is not current limited. Typical Operating Circuit DATA SOURCE 1 (USB) D+ D- NO1 NO2 COM1 IN1 COM2 IN2 DATA 1 ENABLE D+ DATA SOURCE 2 (USB) D+ D- NO3 NO4 COM3 IN3 COM4 IN4 D- USB CONNECTOR DATA 2 ENABLE 6
V NO NO_ IN_ COM_ R L C L V OUT Test Circuits/Timing Diagrams LOGIC INPUT SWITCH OUTPUT V V OUT V 5% t ON toff tr < 2ns tf < 2ns.9 x V UT.9 x V OUT LOGIC INPUT GND C L INCLUDES FIXTURE AND STRAY CAPACITANCE. V OUT = V NO ( R L R L + R ON ) Figure 1. Switching Time t ri 9% TxD+ R s A B C L INPUT A INPUT A- 1% 9% 5% 5% t skew_i 1% t fi t ro 9% TxD- R s R s = 39Ω C L = 5pF A- B- C L OUTPUT B OUTPUT B- 1% 9% 5% 5% t skew_o 1% t ro - t ri DELAY DUE TO SWITCH FOR RISING INPUT AND RISING OUTPUT SIGNALS. t fo t fo - t fi t skew_o t skew_i DELAY DUE TO SWITCH FOR FALLING INPUT AND FALLING OUTPUT SIGNALS. CHANGE IN SKEW THROUGH THE SWITCH FOR OUTPUT SIGNALS. CHANGE IN SKEW THROUGH THE SWITCH FOR INPUT SIGNALS. Figure 2. Input/Output Skew Timing Diagram 7
R GEN NO_ Test Circuits/Timing Diagrams (continued) V OUT V OUT COM_ V OUT V GEN GND IN_ V IL TO V IH C L IN OFF ON Q = ( V OUT )(C L ) OFF Figure 3. Charge Injection V OR IN_ +5V 1nF COM1 V IN NETWORK ANALYZER 5Ω 5Ω OFF-ISOLATION = 2log V OUT V IN ON-LOSS = 2log V OUT V IN NO1* V OUT MEAS REF CROSSTALK = 2log V OUT V IN GND 5Ω 5Ω MEASUREMENTS ARE STANDARDIZED AGAINST SHORTS AT IC TERMINALS. OFF-ISOLATION IS MEASURED BETWEEN COM_ AND OFF NO_ TERMINAL ON EACH SWITCH. ON-LOSS IS MEASURED BETWEEN COM_ AND ON NO_ TERMINAL ON EACH SWITCH. CROSSTALK IS MEASURED FROM ONE CHANNEL TO THE OTHER CHANNEL. SIGNAL DIRECTION THROUGH SWITCH IS REVERSED; WORST VALUES ARE RECORDED. *FOR CROSSTALK, THIS PIN IS NO2. COM2 IS OPEN. Figure 4. On-Loss, Off-Isolation, and Crosstalk 8
Test Circuits/ Timing Diagrams (continued) 1nF TRANSISTOR COUNT: 735 PROCESS: CMOS Chip Information COM_ CAPACITANCE METER f = 1MHz NO_ GND IN V IL OR V IH Figure 5. Channel Off-/On-Capacitance 9
Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) LC D D/2 E/2 E (NE - 1) X e D2/2 D2 b.1 M C A B E2/2 E2 12x16L QFN THIN.EPS LC e k L (ND - 1) X e LC C L.1 C.8 C A A2 A1 L L e e PACKAGE OUTLINE 12, 16L, THIN QFN, 3x3x.8mm 21-136 E 1 2 1
Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) EXPOSED PAD VARIATIONS DOWN BONDS ALLOWED NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-12. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN.2 mm AND.25 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO22 REVISION C. PACKAGE OUTLINE 12, 16L, THIN QFN, 3x3x.8mm 21-136 E 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 12 San Gabriel Drive, Sunnyvale, CA 9486 48-737-76 11 24 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.